PCB packaging structure

Abstract

The utility model relates to a PCB packaging structure. The PCB packaging structure comprises a base, a PCB and a colloid. A groove is formed in the base; the PCB is arranged above the groove, the PCB is provided with a glue pouring port, and the glue pouring port is communicated with the groove; the surface, deviating from the groove, of the PCB is covered with the colloid, and the colloid is further filled in the groove and enables the PCB and the groove to be connected together. According to the PCB packaging structure provided by the invention, after the glue injection is completed, the two side surfaces of the PCB are covered with the glue in the direction perpendicular to the PCB. As one surface of the PCB is connected with the groove through the colloid, and the other surface of the PCB is completely covered with the colloid, the waterproof performance of the PCB can be improved, and meanwhile, the dosage of the colloid can be reduced as much as possible.

Description

Technical Field

[0001] The present application relates to the technical field of display screens, and in particular to a PCB board packaging structure. Background Art

[0002] PCBs have solder pins on both sides, so when assembling them, both sides must be potted with glue to achieve good waterproof and dustproof performance. Currently, this process requires two potting steps, which is time-consuming and requires a large amount of glue, reducing PCB packaging efficiency and increasing packaging costs. Utility Model Content

[0003] This application addresses the problem that a large amount of glue is required for packaging existing PCB boards, and proposes a PCB board packaging structure, which has the technical effect of reducing the amount of glue used.

[0004] A PCB board packaging structure, comprising:

[0005] A base with a groove inside;

[0006] A PCB board is arranged above the groove, and the PCB board is provided with a glue filling port, and the glue filling port is communicated with the groove;

[0007] The colloid covers the surface of the PCB board facing away from the groove. The colloid also fills the groove and connects the PCB board and the groove together.

[0008] In one embodiment, in a direction perpendicular to the PCB, the projection of the groove on the PCB is annular.

[0009] In one embodiment, the groove is arranged near the edge of the PCB board, and in a direction perpendicular to the PCB board, the orthographic projection contour of the groove on the PCB board coincides with the contour of the PCB board.

[0010] In one embodiment, the PCB board is provided with a plurality of the glue filling ports distributed at intervals.

[0011] In one embodiment, each side of the PCB board is provided with a plurality of the glue filling ports.

[0012] In one embodiment, the base includes a bottom plate, a first wall, and a second wall. The first wall is provided at an edge of the bottom plate and surrounds the edge of the bottom plate. The second wall is provided at the bottom plate and spaced apart from the first wall. The first wall, the second wall, and the bottom plate together enclose the groove.

[0013] Wherein, along a direction perpendicular to the PCB board, the height of the first wall is greater than that of the second wall, and the PCB board is confined within the first wall.

[0014] In one embodiment, the first wall and the PCB board together enclose a receiving space, and the receiving space receives the colloid covering the side of the PCB board away from the groove.

[0015] In one embodiment, in a direction perpendicular to the PCB board, the orthographic projection of the glue filling port on the PCB board falls within the orthographic projection of the groove on the PCB board.

[0016] In one embodiment, the base further includes a body, a mounting cavity is provided in the body, the groove is located in the mounting cavity, a connecting portion is further provided in the mounting cavity, and the connecting portion is detachably connected to the PCB board.

[0017] In one embodiment, the connecting portion is connected to the PCB board via a locking member. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of the PCB board packaging structure provided in some embodiments of the present application.

[0019] Figure 2 A cross-sectional view of a PCB board packaging structure provided in some embodiments of the present application.

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0021] Figure 4 An exploded view of the PCB board packaging structure provided in some embodiments of the present application.

[0022] Figure 5 for Figure 4 Enlarged view of point B in the middle.

[0023] Figure 6 for Figure 4 Enlarged view of point C in the middle.

[0024] Description of reference numerals:

[0025] 10. Base; 11. Groove; 12. Bottom plate; 13. First wall; 14. Second wall; 15. Main body; 151. Mounting cavity; 152. Connecting portion; 20. PCB board; 21. Glue filling port; 30. Colloid; 100. PCB board packaging structure. DETAILED DESCRIPTION

[0026] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referenced. Thus, a feature qualifier labeled "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise specified.

[0029] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0030] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0032] See also Figures 1 to 6 Some embodiments of the present application provide a PCB packaging structure 100, which includes a base 10, a PCB 20, and a colloid 30. A recess 11 is defined within the base 10; the PCB 20 is positioned above the recess 11 and has a glue injection port 21 that communicates with the recess 11; the colloid 30 covers the surface of the PCB 20 facing away from the recess 11 and also fills the recess 11, connecting the PCB 20 and the recess 11.

[0033] The base 10 is used to support components such as a PCB 20. A colloid 30 is injected into the groove 11 within the base 10 to prevent the glue from flowing into other areas of the base 10. The PCB 20, also known as a printed circuit board (PCB), is equipped with various electronic components, such as power cables and various connectors.

[0034] The material used for the colloid 30 can be potting glue, which is mainly used for bonding, sealing, potting and coating protection of electronic components. Potting glue is in liquid form before solidification and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. The potting glue can only realize its use value after it is completely solidified. After solidification, it can play the role of waterproof, moisture-proof, dust-proof, insulating, heat-conductive, confidential, corrosion-resistant, temperature-resistant and shock-proof. There are many types of electronic potting glue. From the type of material, the most commonly used are mainly three types, namely epoxy resin potting glue, silicone resin potting glue and polyurethane potting glue. These three types of potting glue can be subdivided into hundreds of different products.

[0035] The PCB board packaging structure 100 is introduced below in conjunction with the process of sealing and assembling the PCB board 20 on the base 10 .

[0036] First, place the PCB 20 on the base 10. The groove 11 of the base 10 can support the PCB 20. At this point, the glue filling port 21 of the PCB 20 needs to be connected to the groove 11. During glue injection, the glue 30 is injected into the surface of the PCB 20 facing away from the groove 11. The glue 30 flows on the PCB 20. When it reaches the glue filling port 21 of the PCB 20, it flows along the glue filling port 21 into the groove 11. When the groove 11 is completely filled with glue 30 and the surface of the PCB 20 facing away from the groove 11 is also completely covered with glue 30, glue injection can be stopped.

[0037] After the glue injection is complete, both sides of the PCB 20 are covered with glue 30 in a direction perpendicular to the PCB 20. Because one surface of the PCB 20 is connected to the groove 11 via the glue 30, while the other surface of the PCB 20 is completely covered with the glue 30, the waterproof performance of the PCB 20 is improved while minimizing the amount of glue used.

[0038] In some embodiments, as Figure 4 and Figure 5 As shown, in a direction perpendicular to the PCB board 20 , the projection of the groove 11 on the PCB board 20 is annular.

[0039] For example, the PCB board 20 is placed above the groove 11. When the groove 11 is filled with the colloid 30, the colloid 30 can contact more parts of the PCB board 20, thereby increasing the contact area between it and the PCB board 20, and further increasing the connection stability between the groove 11 and the PCB board 20.

[0040] In some embodiments, the groove 11 is disposed near an edge of the PCB board 20 , and in a direction perpendicular to the PCB board 20 , an orthographic projection contour of the groove 11 on the PCB board 20 coincides with a contour of the PCB board 20 .

[0041] For example, the PCB 20 is rectangular, and the recess 11 may also be rectangular. When the PCB 20 is placed in the recess 11, the edge of the PCB 20 contacts the recess 11. When the recess 11 is fully filled with the colloid 30, the colloid 30 in the recess 11, combined with the colloid 30 located on the PCB 20 facing away from the recess 11, seals both surfaces and all sides of the PCB 20, reducing the possibility of moisture infiltration through the connection between the PCB 20 and the base 10 and improving the waterproof capability of the PCB 20.

[0042] Specifically, in some embodiments, Figure 6 As shown, the PCB board 20 is provided with a plurality of glue injection ports 21 distributed at intervals.

[0043] During glue injection, the glue 30 that falls on the surface of the PCB board 20 can flow into the groove 11 from different glue injection ports 21 at the same time when flowing on the surface of the PCB board 20, thereby improving the efficiency of injecting the glue 30 into the groove 11 and shortening the time taken to fill the groove 11 with the glue 30.

[0044] More specifically, in some embodiments, each side of the PCB board 20 is provided with a plurality of glue injection ports 21 .

[0045] For example, the PCB board 20 is in a rectangular shape and includes four sides. Each side of the PCB board 20 is provided with a plurality of glue injection ports 21, and the number of glue injection ports 21 provided on each side may be unequal.

[0046] With this arrangement, during glue injection, the glue 30 that falls on the surface of the PCB board 20 can flow into the groove 11 from different glue injection ports 21 at the same time when flowing on the surface of the PCB board 20, thereby improving the efficiency of injecting the glue 30 into the groove 11 and shortening the time taken to fill the groove 11 with the glue 30.

[0047] like Figure 3 As shown, in some embodiments, the base 10 includes a bottom plate 12, a first wall 13 and a second wall 14. The first wall 13 is arranged at the edge of the bottom plate 12 and is arranged around the edge of the bottom plate 12. The second wall 14 is arranged on the bottom plate 12 and is spaced apart from the first wall 13. The first wall 13, the second wall 14 and the bottom plate 12 together enclose a groove 11; wherein, along the direction perpendicular to the PCB board 20, the height of the first wall 13 is greater than that of the second wall 14, and the PCB board 20 is confined within the first wall 13.

[0048] In other words, the bottom plate 12 and the first wall 13 together enclose a housing cavity, which is divided by the second wall 14 into a first sub-cavity and a second sub-cavity, with the second sub-cavity surrounding the first sub-cavity. The second sub-cavity is composed of the first wall 13, the second wall 14, and the bottom plate 12, and is equivalent to the groove 11.

[0049] When the PCB board 20 is placed on the groove 11 , the annular structure formed by the second wall 14 supports the PCB board 20 , and the annular structure formed by the first wall 13 limits the position of the PCB board 20 .

[0050] With this arrangement, the first wall 13 can be used to limit the position of the PCB board 20 , thereby reducing the probability that the PCB board 20 will be impacted by external forces and deviate from the preset position when glue is injected into the PCB board 20 .

[0051] Further, see Figure 3In some embodiments, the first wall 13 and the PCB board 20 together enclose a receiving space, and the receiving space accommodates the colloid 30 covering the side of the PCB board 20 away from the groove 11.

[0052] That is, when the glue is injected onto the surface of the PCB 20, a portion of the injected glue 30 flows through the glue injection port 21 into the groove 11, while the remaining portion is completely accumulated within the accommodating space, that is, accumulated on the surface of the PCB 20. This arrangement can limit the glue 30 covering the surface of the PCB 20, reducing the possibility of the glue 30 overflowing onto the outside of the base 10.

[0053] In some embodiments, in a direction perpendicular to the PCB board 20 , the orthographic projection of the glue filling port 21 on the PCB board 20 falls within the orthographic projection of the groove 11 on the PCB board 20 .

[0054] The PCB board 20 is placed above the groove 11, and the glue filling port 21 of the PCB board 20 is connected to the groove 11. Taking a single glue filling port 21 as an example, in the direction perpendicular to the PCB board 20, the orthographic projection of the glue filling port 21 completely falls within the groove 11.

[0055] Compared with setting the size of a single glue filling port 21 to be equal to a partial area of ​​the groove 11, that is, the orthographic projection of the glue filling port 21 coincides with the groove 11, the contact area between the glue 30 in the groove 11 and the PCB board 20 can be increased, thereby increasing the stability of the PCB board 20 installed on the groove 11.

[0056] In some embodiments, as Figure 5 As shown, the base 10 further includes a body 15 , a mounting cavity 151 is defined in the body 15 , the groove 11 is located in the mounting cavity 151 , a connecting portion 152 is further defined in the mounting cavity 151 , and the connecting portion 152 is detachably connected to the PCB board 20 .

[0057] For example, the inner wall of the mounting cavity 151 is provided with a groove 11, and the center of the mounting cavity 151 is provided with a connecting portion 152. When the PCB board 20 is placed on the base 10, the connecting portion 152 primarily supports the center of the PCB board 20, while the groove 11 primarily supports the edges of the PCB board 20. The contact points between the PCB board 20, the groove 11, and the connecting portion 152 are approximately coplanar, and the PCB board 20 and the groove 11 are generally aligned. When the groove 11 is filled with the colloid 30, the probability of the colloid 30 in the groove 11 overflowing into the mounting cavity 151 is reduced. Furthermore, the probability of the center of the PCB board 20 collapsing or breaking due to external impact is reduced.

[0058] In some embodiments, the connecting portion 152 is connected to the PCB board 20 via a locking member.

[0059] For example, the connection portion 152 may be, but is not limited to, a cylindrical shape. Multiple connection portions 152 are provided within the mounting cavity 151, and all connection portions 152 may be arranged in an array. Each connection portion 152 has a threaded hole on the side facing the PCB 20, and corresponding through-holes are provided on the PCB 20. Fastening members, such as screws, can be inserted through the PCB 20 and connected to the connection portions 152, thereby securing the PCB 20 to the base 10 and improving the mounting stability of the PCB 20.

[0060] Furthermore, when the PCB 20 is damaged, the locking member can be removed from the PCB 20 and then the PCB 20 can be removed from the base 10. A new PCB 20 can then be installed on the base 10. This reduces maintenance costs compared to replacing both the PCB 20 and the base 10 at the same time.

[0061] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A PCB board packaging structure, comprising: A base with a groove inside; A PCB board is arranged above the groove, and the PCB board is provided with a glue filling port, and the glue filling port is communicated with the groove; The colloid covers the surface of the PCB board facing away from the groove. The colloid also fills the groove and connects the PCB board and the groove together.

2. The PCB board packaging structure according to claim 1, characterized in that: In a direction perpendicular to the PCB board, the projection of the groove on the PCB board is annular.

3. The PCB board packaging structure according to claim 2, characterized in that: The groove is arranged close to the edge of the PCB board, and in a direction perpendicular to the PCB board, the orthographic projection contour of the groove on the PCB board coincides with the contour of the PCB board.

4. The PCB board packaging structure according to claim 3, characterized in that: The PCB board is provided with a plurality of glue injection ports distributed at intervals.

5. The PCB board packaging structure according to claim 4, characterized in that: Each side of the PCB board is provided with a plurality of glue injection ports.

6. The PCB board packaging structure according to claim 3, characterized in that: The base includes a bottom plate, a first wall, and a second wall. The first wall is provided at an edge of the bottom plate and surrounds the edge of the bottom plate. The second wall is provided at the bottom plate and spaced apart from the first wall. The first wall, the second wall, and the bottom plate together enclose the groove. Wherein, along a direction perpendicular to the PCB board, the height of the first wall is greater than that of the second wall, and the PCB board is confined within the first wall.

7. The PCB board packaging structure according to claim 6, characterized in that: The first wall and the PCB board are jointly enclosed to form an accommodating space, and the accommodating space accommodates the colloid covering the side of the PCB board away from the groove.

8. The PCB board packaging structure according to any one of claims 1 to 7, characterized in that: In a direction perpendicular to the PCB board, the orthographic projection of the glue filling port on the PCB board falls within the orthographic projection of the groove on the PCB board.

9. The PCB board packaging structure according to any one of claims 1 to 7, characterized in that: The base further includes a body, a mounting cavity is provided in the body, the groove is located in the mounting cavity, a connecting portion is further provided in the mounting cavity, and the connecting portion is detachably connected to the PCB board.

10. The PCB board packaging structure according to claim 9, characterized in that: The connecting portion is connected to the PCB board via a locking member.

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