Heat dissipation structure and servo driver

Abstract

The utility model provides a heat dissipation structure and a servo driver, the heat dissipation structure comprises a first heat dissipation channel and a second heat dissipation channel, the first heat dissipation channel is internally provided with a heat dissipation module, the second heat dissipation channel and the first heat dissipation channel are arranged side by side, and the second heat dissipation channel is internally provided with a capacitor; a heat insulation part is arranged between the first heat dissipation channel and the second heat dissipation channel and used for isolating the first heat dissipation channel from the second heat dissipation channel so as to prevent heat of the heat dissipation module from being transmitted into the second heat dissipation channel; thus, in the heat dissipation process, the heat dissipation module in the first heat dissipation channel can be prevented from heating the capacitor in the second heat dissipation channel, then the capacitor is prevented from aging at high temperature, and the service life of the capacitor can be effectively prolonged.

Description

Technical Field

[0001] The present application relates to the field of industrial automation technology, and in particular to a heat dissipation structure and a servo drive. Background Art

[0002] In related technologies, some servo drives place capacitors and heat dissipation modules adjacent to each other. However, with the development of industrial automation, the power of servo drives is increasing, which also makes the temperature of the heat dissipation module inside the servo drive higher and higher, thereby affecting the service life of the capacitor. Utility Model Content

[0003] In view of this, the present application provides a heat dissipation structure to solve the problem in the prior art that the heat of the heat dissipation module affects the service life of the capacitor. In addition, the present application also provides a servo drive including the above heat dissipation structure.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A heat dissipation structure, applicable to a servo drive, comprising:

[0006] A first heat dissipation channel, wherein a heat dissipation module is provided inside;

[0007] a second heat dissipation channel, arranged side by side with the first heat dissipation channel, and having a capacitor disposed inside the second heat dissipation channel;

[0008] A thermal insulation component is provided between the first heat dissipation channel and the second heat dissipation channel for isolating the first heat dissipation channel from the second heat dissipation channel to prevent heat from the heat dissipation module from being transferred to the second heat dissipation channel.

[0009] Optionally, a fan is included, and the fan is arranged on the air inlet side and / or the air outlet side of the first heat dissipation channel, and can at least induce airflow to pass through the first heat dissipation channel.

[0010] Optionally, the second heat dissipation channel includes:

[0011] a first air inlet, located on an air inlet side of the heat dissipation module and connecting the first heat dissipation channel and the second heat dissipation channel, so that part of the airflow driven by the fan can flow into the second heat dissipation channel;

[0012] The second air inlet is used to connect the second heat dissipation channel with the external environment so that natural air flow can enter the second heat dissipation channel.

[0013] Optionally, a flow guide component is included, and the flow guide component is arranged on a side of the capacitor away from the heat dissipation module;

[0014] The flow guiding component, the heat insulating component and the housing of the servo driver form a flow guiding structure of the second heat dissipation channel to guide the heat dissipation airflow in the second heat dissipation channel to the outlet of the second heat dissipation channel.

[0015] Optionally, the guide component is made of a heat-insulating material and is used to isolate the second heat dissipation channel from a functional module area in the servo driver to prevent heat in the second heat dissipation channel from being transferred to the functional module area.

[0016] Optionally, a U-shaped guide plate is included, wherein the bottom wall of the U-shaped guide plate is provided with a plurality of through holes allowing the pins of the capacitor to pass through;

[0017] Furthermore, the heat-insulating component is a portion of the U-shaped guide plate close to the heat dissipation module, and the second heat dissipation channel is formed by the U-shaped guide plate and the housing of the servo driver.

[0018] Optionally, both the thermal insulation component and the flow guide component are provided with reinforcing ribs extending along a first direction, and the first direction is a thickness direction of the heat dissipation module.

[0019] Optionally, the air guide component and the heat insulation component are arranged along the second direction to form the second heat dissipation channel extending along the second direction, and the plurality of capacitors are arranged in the second heat dissipation channel along the second direction.

[0020] Optionally, in the second direction, the second heat dissipation channel includes an inlet area, a layout area, and a outlet area, and the capacitor is arranged in the layout area of ​​the second heat dissipation channel;

[0021] In the inlet area of ​​the second heat dissipation channel, the air guide component has a bent portion, and the bent portion extends to the air outlet side of the fan;

[0022] In the outlet area of ​​the second heat dissipation channel, the air guide component has an arc-shaped portion, and the arc-shaped portion is bent toward the heat dissipation module.

[0023] A servo drive, comprising:

[0024] case;

[0025] A mainboard is disposed inside the housing and includes a functional module assembly area, a capacitor assembly area, and a chip assembly area;

[0026] A functional module is provided in the functional module area of ​​the main board;

[0027] A capacitor is provided in a capacitor assembly area of ​​the mainboard;

[0028] A chip is arranged in the chip assembly area of ​​the mainboard;

[0029] The heat dissipation structure is any of the heat dissipation structures mentioned above, and the heat dissipation module in the heat dissipation structure is connected to the chip in a heat transfer manner.

[0030] The heat dissipation structure provided by the present application has the capacitor and the heat dissipation module located in different heat dissipation channels respectively. During the heat dissipation process, the heat dissipation efficiency of the corresponding heat dissipation channel can be adjusted in a targeted manner according to the temperature of the capacitor and the heat dissipation module, which is beneficial to improving the heat dissipation effect of the heat dissipation structure; in addition, the thermal insulation component between the first heat dissipation channel and the second heat dissipation channel can prevent the heat dissipation module in the first heat dissipation channel from heating the capacitor in the second heat dissipation channel, thereby preventing the capacitor from aging at high temperature, which can effectively improve the service life of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0032] Figure 1 A schematic structural diagram of a servo drive provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 The main view of the servo drive shown;

[0034] Figure 3 A schematic structural diagram of another servo drive provided in an embodiment of the present application;

[0035] Figure 4 for Figure 3 The front view of the servo drive is shown.

[0036] exist Figures 1-4 middle:

[0037] 1. Heat dissipation module; 2. Fan; 3. Air guide component; 4. Thermal insulation component; 5. Capacitor; 6. First heat dissipation channel; 7. Second heat dissipation channel; 8. Mainboard; 9. Housing; 10. Wire trough. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0039] An embodiment of the present application provides a heat dissipation structure, which is suitable for dissipating heat for a servo drive, and is particularly suitable for separately dissipating heat for a micro-heat generating structure (such as a capacitor) and a large-scale heat generating structure (such as a chip) in a servo drive.

[0040] In related technologies, some servo drives place capacitors and heat dissipation modules adjacent to each other. However, with the development of industrial automation, the power of servo drives is increasing, which also makes the temperature of the heat dissipation module inside the servo drive higher and higher, thereby affecting the service life of the capacitor.

[0041] Based on the above problems, the heat dissipation structure in the present application sets up multiple heat dissipation channels (i.e., channels that allow heat dissipation airflow to pass through), and sets the capacitor 5 and the heat dissipation module 1 in different heat dissipation channels, and the adjacent heat dissipation channels are separated by a thermal insulation component 4 (a structural part or structural component that can block heat transfer, such as an insulation board). In this way, while ensuring that the heat in the capacitor 5 and the heat dissipation module 1 can be discharged in time, the heat of the heat dissipation module 1 is prevented from being transferred to the capacitor 5, thereby ensuring the service life of the capacitor 5.

[0042] Specifically, such as Figures 1-4 As shown, the heat dissipation structure includes a first heat dissipation channel 6 and a second heat dissipation channel 7, wherein the first heat dissipation channel 6 is provided with a heat dissipation module 1, the second heat dissipation channel 7 is arranged side by side with the first heat dissipation channel 6, and the second heat dissipation channel 7 is provided with a capacitor 5; further, as shown Figure 3 and Figure 4 As shown, a thermal insulation component 4 is provided between the first heat dissipation channel 6 and the second heat dissipation channel 7 to isolate the first heat dissipation channel 6 from the second heat dissipation channel 7 and prevent heat from the heat dissipation module 1 from being transferred to the second heat dissipation channel 7. In this way, the capacitor 5 and the heat dissipation module 1 are respectively located in different heat dissipation channels. During the heat dissipation process, the heat dissipation efficiency of the corresponding heat dissipation channel can be adjusted in a targeted manner according to the temperature of the capacitor 5 and the heat dissipation module 1, which is conducive to improving the heat dissipation effect of the heat dissipation structure. In addition, the thermal insulation component 4 between the first heat dissipation channel 6 and the second heat dissipation channel 7 can prevent the heat dissipation module 1 in the first heat dissipation channel 6 from heating the capacitor 5 in the second heat dissipation channel 7, thereby preventing the capacitor 5 from aging at high temperatures, which can effectively increase the service life of the capacitor 5.

[0043] It should be understood that in some application scenarios, when the heat dissipation module 1 is surrounded by not only capacitors 5 but also other structures that generate a small amount of heat and whose service life is reduced at high temperatures, the heat dissipation structure can also include a third heat dissipation channel and a fourth heat dissipation channel, etc., that is, the specific number of heat dissipation channels is not limited in this application, but there should be a thermal insulation component 4 structure between adjacent heat dissipation channels to avoid heat from the high-temperature heat dissipation area (such as the area where the heat dissipation module 1 is located) to be transferred to the low-temperature heat dissipation area (such as the area where the capacitor 5 is located).

[0044] Continue as Figures 1-4 As shown, the heat dissipation structure in the present application includes a fan 2, which uses the fan 2 to disturb the airflow and accelerate the flow of gas, which can effectively improve the heat dissipation efficiency of the heat dissipation structure. In some preferred embodiments, such as Figure 2 and Figure 4 As shown, only one fan 2 is provided, and is located on the air inlet side of the first heat dissipation channel 6; under this setting mode, on the one hand, the number of fans 2 is small, which is conducive to optimizing the internal structural layout of the servo drive; on the other hand, during the heat dissipation process, the low-temperature gas outside the servo drive is blown into the first heat dissipation channel 6 under the action of the fan 2, and exchanges heat with the heat dissipation module 1 in the first heat dissipation channel 6, and is heated to high-temperature gas, and flows out from the air outlet of the first heat dissipation channel 6. Compared with setting the fan 2 on the air outlet side of the first heat dissipation channel 6, this embodiment sets the fan on the air inlet side of the first heat dissipation channel 6, so that the temperature of the air flow passing through the fan 2 is lower, which can avoid the shortening of the service life of the fan 2 due to high temperature; in addition, as mentioned above, the temperature inside the first heat dissipation channel 6 is higher. Setting the fan 2 on the air inlet side of the first heat dissipation channel 6 can improve the heat dissipation efficiency in the first heat dissipation channel 6 in a targeted manner, which is more conducive to the uniformity of overall heat dissipation, thereby improving the heat dissipation effect.

[0045] Furthermore, based on the placement of the fan 2 on the air inlet side of the first heat dissipation channel 6, an opening is provided between the first heat dissipation channel 6 and the second heat dissipation channel 7, connecting the first heat dissipation channel 6 and the second heat dissipation channel 7, and the opening is located on the air inlet side of the heat dissipation module 1. It is understandable that the range of the airflow disturbed by the fan 2 will gradually increase as it moves away from the fan 2. Therefore, when the opening is located on the air outlet side of the fan 2 and is a certain distance away from the air outlet of the fan 2, part of the airflow driven by the fan 2 will flow into the second heat dissipation channel 7 and remove heat from the capacitor 5 in the second heat dissipation channel 7. In addition, because the heat dissipation module 1 is disposed within the first heat dissipation channel 6, when the airflow driven by the fan 2 reaches the air inlet end of the heat dissipation module 1, most of the airflow will pass through the heat dissipation module 1 through the gaps between adjacent fins of the heat dissipation module 1. However, a small amount of airflow will change direction due to obstruction by the heat dissipation module 1, which will also cause part of the airflow driven by the fan 2 to enter the second heat dissipation channel 7 and remove heat from the capacitor 5 in the second heat dissipation channel 7. Under this setting, a fan 2 can be used to simultaneously draw the low-temperature gas outside the servo drive to the first heat dissipation channel 6 and the second heat dissipation channel 7 without affecting the heat dissipation efficiency of the first heat dissipation channel, thereby simultaneously improving the heat dissipation efficiency of the first heat dissipation channel 6 and the second heat dissipation channel 7.

[0046] Furthermore, in some preferred embodiments, in addition to the aforementioned opening serving as the first air inlet, the second heat dissipation channel 7 is further provided with a second air inlet directly connected to the external environment of the servo drive, thereby allowing natural airflow to enter the second heat dissipation channel 7. This increases the source of heat dissipation airflow within the second heat dissipation channel 7, promotes the flow of air within the second heat dissipation channel 7, and thereby improves the heat dissipation efficiency of the second heat dissipation channel 7, thereby facilitating the extension of the service life of the capacitor 5.

[0047] It should be understood that the above is only an exemplary embodiment of the setting position and setting number of the fan 2, but the present application is not limited to this. During specific implementation, the setting position and setting number of the fan 2 can be adaptively adjusted according to the heat dissipation requirements and space layout requirements. For example: under the premise that space permits, the setting number of the fan 2 can be adjusted to two, and the two fans 2 are respectively set on the air inlet side and the air outlet side of the first heat dissipation channel 6. During the heat dissipation process, the fan 2 located on the air inlet side of the first heat dissipation channel 6 blows the low-temperature gas outside the servo drive into the first heat dissipation channel 6, and the fan 2 located on the air outlet side of the first heat dissipation channel 6 draws the high-temperature gas inside the first heat dissipation channel 6 out of the first heat dissipation channel 6. In this way, the fluidity of the gas can be further improved, thereby improving the heat dissipation effect. In addition, under the premise of setting up a fan 2, the air outlet of the fan 2 can correspond to the air inlet of the first heat dissipation channel 6 and the air inlet of the second heat dissipation channel 7 at the same time. In this way, during the heat dissipation process, a fan 2 can be used to simultaneously guide the low-temperature gas outside the servo drive to the first heat dissipation channel 6 and the second heat dissipation channel 7, thereby simultaneously improving the heat dissipation efficiency of the first heat dissipation channel 6 and the second heat dissipation channel 7.

[0048] like Figures 1-4 As shown, the heat dissipation structure in the present application includes a guide component 3 (i.e., a component that guides the airflow so that the airflow flows in a preset direction, such as an air guide plate), and the guide component 3 is arranged on the side of the capacitor 5 away from the heat dissipation module 1; the guide component 3, the heat insulation component 4 and the housing of the servo drive form a guide structure of the second heat dissipation channel 7 to guide the heat dissipation airflow in the second heat dissipation channel 7 to the outlet of the second heat dissipation channel 7. Specifically, in an exemplary implementation, the guide component 3 is located between the capacitor 5 and the functional module of the servo drive, and the guide component 3 is fixedly connected to the housing 9 of the servo drive to achieve the fixation of the guide component 3 in the servo drive; as for the specific position where the guide component 3 is connected to the housing 9, it can be adaptively designed according to the specific structure of the guide component 3. For example, the guide component 3 can be set in the first direction (i.e., the thickness direction of the servo drive, see the appendix of the specification for details). Figure 1 ) is fixedly connected to the housing; or the guide component 3 can be set in the second direction (ie, the extension direction of the second heat dissipation channel, see the attached manual for details Figure 1) are fixedly connected to the shell 9 at both ends. The thermal insulation component 4 is located between the capacitor 5 and the heat dissipation module 1, and the connection method of the thermal insulation component 4 and the shell 9 is the same as the connection method of the flow guide component 3 and the shell 9, so it will not be repeated here; in this way, the flow guide component 3 and the thermal insulation component 4 located on both sides of the capacitor 5 cooperate with the shell of the servo driver to form a flow guide structure of the second heat dissipation channel 7. After the gas enters the second heat dissipation channel 7, it flows to the outlet of the second heat dissipation channel 7 under the constraint of the flow guide structure. As for the fixing method of the flow guide component 3 and the thermal insulation component 4, this application does not make specific restrictions on this. For example, it can be detachably connected to the shell 9 of the servo driver through structures such as screws.

[0049] Furthermore, in some preferred embodiments, the flow guide member 3 is made of a heat-insulating material (e.g., polyurethane foam or vacuum insulation material) to isolate the second heat dissipation channel 7 from the functional module area of ​​the servo drive (i.e., the area within the servo drive where the functional modules are located, including the display panel, network interface, DB interface, and communication circuits, etc.), thereby preventing heat from the second heat dissipation channel 7 from being transferred to the functional module area. In this way, during the heat dissipation process, the heat within the second heat dissipation channel 7 is dissipated to the outside of the servo drive without thermally affecting the servo drive's functional modules, thereby facilitating the improvement of the functional modules' service life.

[0050] In addition, in other preferred embodiments, a U-shaped guide plate is used in conjunction with the housing 9 of the servo drive to form a second heat dissipation channel 7, and the U-shaped guide plate is made of a heat-insulating material (such as polyurethane foam or vacuum insulation material). Specifically, Figure 3 As shown, the U-shaped guide plate refers to a plate with a U-shaped end face in the second direction, which includes a bottom wall and two side walls integrally formed with the bottom wall, and there is a gap between the bottom wall of the U-shaped guide plate and the main board 8 of the servo drive to reduce or even avoid the heat in the second heat dissipation channel 7 being transferred to the main board 8, thereby ensuring a low-temperature operating environment for the main board 8.

[0051] Furthermore, one side of the two side walls of the U-shaped guide plate, which is away from the bottom wall, is connected to the housing 9 of the servo drive, or the end of the U-shaped guide plate in the second direction is connected to the housing 9, so as to fix the U-shaped guide plate inside the servo drive and cooperate with the housing 9 to form a second heat dissipation channel 7. It should be noted that under the above arrangement, the part of the U-shaped guide plate close to the heat dissipation module 1 (i.e., the side wall of the U-shaped guide plate close to the heat dissipation module 1) is the thermal insulation component 4 of the heat dissipation structure, and the part of the U-shaped guide plate away from the heat dissipation module 1 (i.e., the side wall of the U-shaped guide plate away from the heat dissipation module 1) is the guide component 3 of the heat dissipation structure. Since the U-shaped guide plate is a monolithic structure, its structural strength is higher and it is easier to assemble.

[0052] Furthermore, to facilitate the installation of capacitor 5, a plurality of through holes are provided at the bottom of the U-shaped guide plate, and the through holes allow the pins of capacitor 5 to pass through. When installing capacitor 5, the pins of capacitor 5 are controlled to pass through the through holes and then soldered to the corresponding positions of mainboard 8.

[0053] In addition, if Figure 3 As shown, the guide component 3 and the insulation component 4 are both provided with reinforcing ribs extending along the first direction. This can enhance the structural strength of the heat dissipation channel, reduce the probability of deformation of the heat dissipation channel under stress, and thus help to increase the service life of the entire heat dissipation structure.

[0054] In addition, if Figure 1 and Figure 3 As shown, the guide component 3 is provided with a wire groove 10 to facilitate the arrangement of wires inside the servo drive (for example, connecting wires used to achieve electrical connection of structures such as the fan 2).

[0055] Further, continue as Figure 1 and Figure 3 As shown, in the second direction, the wire groove 10 is located on the air inlet side of the second heat dissipation channel 7 and on the side of the capacitor 5 close to the air inlet. In this way, the temperature of the gas flowing through the wire is lower, which can effectively improve the service life of the wire; at the same time, the influence of the wire groove 10 on the guiding and heat insulation capabilities of the guide component 3 can be reduced. In addition, the shape of the wire groove 10 can be adaptively designed according to needs. For example, it can be as follows Figure 1 and Figure 3 The U-shaped groove shown may also be a circular through hole on the flow guide component 3 .

[0056] like Figures 1-4 As shown, the flow guide component 3 and the heat insulation component 4 in the present application are arranged along the second direction to form a second heat dissipation channel 7 extending along the second direction, and multiple capacitors 5 are arranged along the second direction in the second heat dissipation channel 7. This is more conducive to optimizing the internal layout of the servo drive.

[0057] Furthermore, in some embodiments, in the extension direction of the second heat dissipation channel 7, the second heat dissipation channel 7 includes an inlet area, an arrangement area and an outlet area, wherein the inlet area is an area for introducing the heat dissipation airflow into the second heat dissipation channel 7, the arrangement area is an area in the second heat dissipation channel 7 where the capacitor 5 is arranged, and the outlet area is an area for exporting the heated heat dissipation airflow out of the second heat dissipation channel 7.

[0058] like Figure 1 and Figure 2As shown, in the introduction area of ​​the second heat dissipation channel 7, the guide component 3 has a bent part, and the bent part extends to the air outlet side of the fan 2, so as to facilitate the introduction of part of the heat dissipation airflow generated by the fan 2 into the second heat dissipation channel 7. The specific shape of the bent part can be L-shaped, etc., which is not specifically limited in this application. The capacitor 5 is located in the layout area of ​​the second heat dissipation channel 7 (and when the number of capacitors 5 is two, the two capacitors 5 are distributed along the second direction). In the derivation area of ​​the second heat dissipation channel, the guide component has an arc-shaped part, and the arc-shaped part is bent in the direction of the heat dissipation module. In this way, on the basis of ensuring the gas fluidity in the second heat dissipation channel 7, the occupied space of the second heat dissipation channel 7 can also be reduced, which is more conducive to optimizing the internal layout of the servo drive.

[0059] In other embodiments, Figure 3 and Figure 4 As shown, multiple capacitors 5 are distributed along the second direction, and the air guide component 3 is set as a straight plate. This is conducive to increasing the air intake and air outlet of the second heat dissipation channel 7, thereby improving the heat dissipation efficiency.

[0060] Based on the above-mentioned heat dissipation structure, an embodiment of the present application also provides a servo drive, which includes a shell 9, and a mainboard 8, a functional module, a capacitor 5, a chip and a heat dissipation structure arranged inside the shell 9, wherein the mainboard 8 is arranged on one side of the inner cavity of the shell 9 in the first direction, and the mainboard 8 includes a functional module assembly area, a capacitor assembly area and a chip assembly area, which are used to install functional modules, capacitors 5 and chips respectively. The heat dissipation structure is the above-mentioned heat dissipation structure, and the heat dissipation module 1 in the heat dissipation structure is heat-transfer connected to the above-mentioned chip so as to be able to timely dissipate the heat generated by the chip to ensure the normal operation of the servo drive. It should be noted that since the servo drive has the above-mentioned heat dissipation structure, the beneficial effects brought by the heat dissipation structure of the servo drive can be referred to the above content and will not be repeated here.

[0061] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0062] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0063] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0064] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0065] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly illustrate the technical solutions and cannot be used to limit the scope of protection of the present application.

[0066] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A heat dissipation structure, characterized in that: Suitable for servo drives, including: A first heat dissipation channel, wherein a heat dissipation module is provided inside; a second heat dissipation channel, arranged side by side with the first heat dissipation channel, and having a capacitor disposed inside the second heat dissipation channel; A thermal insulation component is provided between the first heat dissipation channel and the second heat dissipation channel for isolating the first heat dissipation channel from the second heat dissipation channel to prevent heat from the heat dissipation module from being transferred to the second heat dissipation channel.

2. The heat dissipation structure according to claim 1, characterized in that: A fan is included, and the fan is arranged on the air inlet side and / or the air outlet side of the first heat dissipation channel, and can at least induce airflow to pass through the first heat dissipation channel.

3. The heat dissipation structure according to claim 2, characterized in that: The second heat dissipation channel includes: a first air inlet, located on an air inlet side of the heat dissipation module and connecting the first heat dissipation channel and the second heat dissipation channel, so that part of the airflow driven by the fan can flow into the second heat dissipation channel; The second air inlet is used to connect the second heat dissipation channel with the external environment so that natural air flow can enter the second heat dissipation channel.

4. The heat dissipation structure according to claim 1, characterized in that: A flow guide component is included, and the flow guide component is arranged on a side of the capacitor away from the heat dissipation module; The flow guiding component, the heat insulating component and the housing of the servo driver form a flow guiding structure of the second heat dissipation channel to guide the heat dissipation airflow in the second heat dissipation channel to the outlet of the second heat dissipation channel.

5. The heat dissipation structure according to claim 4, characterized in that: The guide component is made of heat-insulating material and is used to isolate the second heat dissipation channel from the functional module area in the servo driver to prevent heat in the second heat dissipation channel from being transferred to the functional module area.

6. The heat dissipation structure according to claim 1, characterized in that: It includes a U-shaped guide plate, wherein the bottom wall of the U-shaped guide plate is provided with a plurality of through holes allowing the pins of the capacitor to pass through; Furthermore, the heat-insulating component is a portion of the U-shaped guide plate close to the heat dissipation module, and the second heat dissipation channel is formed by the U-shaped guide plate and the housing of the servo driver.

7. The heat dissipation structure according to claim 4 or 6, characterized in that: The heat insulation component and the flow guide component are both provided with reinforcing ribs extending along a first direction, and the first direction is the thickness direction of the heat dissipation module.

8. The heat dissipation structure according to claim 4, characterized in that: The air guide component and the heat insulation component are arranged along the second direction to form the second heat dissipation channel extending along the second direction, and the plurality of capacitors are arranged in the second heat dissipation channel along the second direction.

9. The heat dissipation structure according to claim 8, characterized in that: In the second direction, the second heat dissipation channel includes an inlet area, a layout area, and a outlet area, and the capacitor is arranged in the layout area of ​​the second heat dissipation channel; In the inlet area of ​​the second heat dissipation channel, the air guide component has a bent portion, and the bent portion extends to the air outlet side of the fan; In the outlet area of ​​the second heat dissipation channel, the air guide component has an arc-shaped portion, and the arc-shaped portion is bent toward the heat dissipation module.

10. A servo drive, characterized in that: include: case; A mainboard is disposed inside the housing and includes a functional module assembly area, a capacitor assembly area, and a chip assembly area; A functional module is provided in the functional module area of ​​the main board; A capacitor is provided in a capacitor assembly area of ​​the mainboard; A chip is arranged in the chip assembly area of ​​the mainboard; The heat dissipation structure is the heat dissipation structure according to any one of claims 1 to 9, and the heat dissipation module in the heat dissipation structure is heat-conductingly connected to the chip.

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