Wafer MARK mark erasing jig

Abstract

The utility model discloses a wafer MARK mark erasing jig. The wafer MARK mark erasing jig comprises a bottom plate; the device comprises a bottom plate, a placement seat is installed at the center of the surface of the bottom plate, a fixing mechanism is installed on the side face of the placement seat, wiping positioning plates are movably installed at the positions, close to the two ends of the placement seat, of the surface of the bottom plate, limiting windows are formed in the wiping positioning plates, and adjusting mechanisms are installed in the limiting windows. The fixing groove, the boss and the connecting frame are used in cooperation, the boss at the bottom of the connecting frame is clamped in the fixing groove, the area of the limiting window can be reduced, and therefore the pollution area generated when mark pen marks on the surface of the disc are wiped can be reduced, and use by personnel is facilitated; the wiping strip is arranged at one end of the bottom of the wiping positioning plate, and the wiping strip can be in contact with the surface of the disc by moving the wiping positioning plate, so that residual liquid or residues after the surface of the disc is wiped can be wiped and cleaned, and the disc can be cleaned conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of jigs, in particular to a wafer MARK erasing jig. Background Art

[0002] In the semiconductor manufacturing process, wafer MARK marking is a reliable marking technology performed on wafer chips, which is used to identify and track wafers during the production process. The erasing fixture is used to position the wafer when erasing MARK marking during the wafer production process.

[0003] By placing a disc with a mark on the surface of the jig and fixing it with the jig, the worker can then erase the mark on the disc surface in the wiping window of the jig. However, the erasing area in the wiping window is fixed and cannot be adjusted during use. The erasing area cannot be reduced according to the marker mark, which will increase the contaminated area and is not conducive to human use. Utility Model Content

[0004] The purpose of the present utility model is to provide a wafer MARK mark erasing jig to solve the problem proposed in the above background technology that a disc with a mark is placed on the surface of the jig and fixed by the jig, and then the worker can erase the mark on the surface of the disc in the wiping window in the jig. However, the erasing area in the wiping window is fixed and cannot be adjusted during use. The erasing area cannot be reduced according to the marker mark, which will increase the contaminated area and is not conducive to human use.

[0005] The utility model provides the following technical solution: a wafer MARK mark erasing jig, comprising a base plate; a placement seat is installed at the central position of the base plate surface, a fixing mechanism is installed on the side of the placement seat, and a wiping positioning plate is movably installed on the base plate surface near both ends of the placement seat, a limiting window is provided inside the wiping positioning plate, and an adjustment mechanism is installed inside the limiting window;

[0006] The adjustment mechanism includes a fixing groove, a boss and a connecting frame. The wiping positioning plate is provided with a fixing groove near the inner portion of the limit window. The boss is mounted on the inner portion of the fixing groove, and the connecting frame is mounted on the outer side of the boss.

[0007] Preferably, a wiping strip is provided at one end of the bottom of the wiping positioning plate.

[0008] Preferably, the fixing mechanism includes a suction port and a negative pressure pipeline, the suction port is provided inside the placement seat, and the negative pressure pipeline is installed on the side of the placement seat.

[0009] Preferably, guide rails are installed on the surface of the bottom plate near both ends of the placement seat, and the wiping positioning plate is slidably located on the outside of the guide rails.

[0010] Preferably, a support block is installed on one side of the top of the base plate close to the guide rail, and a fixing bolt is installed inside the wiping positioning plate close to the top of the support block.

[0011] Preferably, an L-shaped limiting plate is installed on the side of the bottom plate surface away from the fixing bolt.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The utility model cooperates with the fixing groove, the boss and the connecting frame. By clamping the boss at the bottom of the connecting frame into the inside of the fixing groove, the area of ​​the limit window can be reduced, thereby reducing the contaminated surface when wiping the marker pen mark on the surface of the disc, which is convenient for personnel to use.

[0014] 2. The utility model provides a wiping strip at one end of the bottom of the wiping positioning plate. By moving the wiping positioning plate, the wiping strip can be brought into contact with the surface of the disc, thereby wiping and cleaning the liquid or residue remaining on the surface of the disc, thereby facilitating the cleaning of the disc. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the top structure of the utility model;

[0016] Figure 2 It is a side structural diagram of the utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of the front part of the utility model;

[0018] Figure 4 This is a schematic diagram of the expanded structure of the adjustment mechanism of the utility model.

[0019] In the figure: 1. Base plate; 2. Placement seat; 3. Guide rail; 4. Wiping positioning plate; 401. Limiting window; 5. Support block; 501. Fixing bolt; 6. L-shaped limiting plate; 7. Fixing mechanism; 701. Adsorption port; 702. Negative pressure pipeline; 8. Adjustment mechanism; 801. Fixing groove; 802. Boss; 803. Connecting frame; 9. Wiping strip. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0023] The following is a further detailed description of the technical solution of the present invention in conjunction with the accompanying drawings and specific embodiments;

[0024] Example 1:

[0025] The present application provides a wafer MARK erasing jig, comprising a base plate 1; a placement seat 2 is mounted at the center of the base plate 1, a fixing mechanism 7 is mounted on the side of the placement seat 2, and a wiping positioning plate 4 is movably mounted on the surface of the base plate 1 near both ends of the placement seat 2, a limiting window 401 is provided inside the wiping positioning plate 4, and an adjustment mechanism 8 is mounted inside the limiting window 401;

[0026] The adjustment mechanism 8 includes a fixing groove 801, a boss 802 and a connecting frame 803. The fixing groove 801 is provided inside the wiping positioning plate 4 near the limit window 401. The boss 802 is mounted inside the fixing groove 801. The connecting frame 803 is mounted outside the boss 802.

[0027] Specifically, such as Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, the placement seat 2 is used to place the disc with a mark, and the fixing mechanism 7 is used to fix the disc to facilitate wiping later. By moving the wiping positioning plate 4, the limiting window 401 inside the wiping positioning plate 4 is located at the position with the mark on the surface of the disc, and the wiping position of the disc can be limited. The adjustment mechanism 8 is used to adjust the area of ​​the limiting window 401 inside the wiping positioning plate 4. By clamping the boss 802 at the bottom of the connecting frame 803 inside the fixing groove 801, the area of ​​the limiting window 401 can be reduced, thereby reducing the contaminated surface when wiping the marker mark on the surface of the disc.

[0028] Furthermore, a wiping strip 9 is provided at one end of the bottom of the wiping positioning plate 4;

[0029] Specifically, such as Figure 1 As shown, in order to wipe the liquid or residue remaining after wiping the surface of the disc, the wiping strip 9 is located at one end of the bottom of the wiping positioning plate 4. By moving the wiping positioning plate 4, the wiping strip 9 can be brought into contact with the surface of the disc, thereby wiping and cleaning the liquid or residue remaining after wiping the surface of the disc.

[0030] Furthermore, the fixing mechanism 7 includes a suction port 701 and a negative pressure pipeline 702. The suction port 701 is provided inside the placement seat 2, and the negative pressure pipeline 702 is installed on the side of the placement seat 2.

[0031] Specifically, such as Figure 3 As shown, in order to fix the disc, an external negative pressure device is connected through the negative pressure pipeline 702, and then the disc is placed on the surface of the adsorption port 701. At this time, the adsorption force generated by the external negative pressure device through the negative pressure pipeline 702 and the adsorption port 701 can directly fix the disc on the surface of the adsorption port 701 through negative pressure, which is convenient for the worker to wipe the mark on the surface of the disc later.

[0032] Furthermore, guide rails 3 are installed on the surface of the bottom plate 1 near both ends of the placement seat 2, and the wiping positioning plate 4 is slidably located on the outside of the guide rails 3;

[0033] Specifically, such as Figure 2 As shown, in order to adjust the position of the internal limit window 401 of the wiping positioning plate 4, the wiping positioning plate 4 is moved so that the wiping positioning plate 4 moves along the outside of the guide rail 3. The guide rail 3 can keep the movement of the wiping positioning plate 4 horizontal, thereby adjusting the position of the internal limit window 401 of the wiping positioning plate 4 on the surface of the disc.

[0034] Furthermore, a support block 5 is installed on one side of the top of the bottom plate 1 near the guide rail 3, and a fixing bolt 501 is installed inside the wiping positioning plate 4 near the top of the support block 5;

[0035] Specifically, such as Figure 2As shown, in order to fix the use position of the wiping positioning plate 4, the wiping positioning plate 4 is moved to a fixed position, and then the fixing bolt 501 is rotated, one end of the fixing bolt 501 is moved, so that a relative force is formed between the support block 5 and the wiping positioning plate 4, and the use position of the wiping positioning plate 4 can be fixed.

[0036] Furthermore, an L-shaped limiting plate 6 is installed on the side of the bottom plate 1 away from the fixing bolt 501;

[0037] Specifically, such as Figure 1 As shown, in order to limit the moving position of the wiping positioning plate 4, an L-shaped limiting plate 6 is provided on the surface of the bottom plate 1, and the moving position of the wiping positioning plate 4 can be limited by the L-shaped limiting plate 6.

[0038] Working principle: By placing the disc on the surface of the adsorption port 701, the adsorption force generated by the external negative pressure device through the negative pressure pipeline 702 and the adsorption port 701 can directly fix the disc on the surface of the adsorption port 701 through negative pressure, and then by moving the wiping positioning plate 4, the wiping positioning plate 4 is moved along the outside of the guide rail 3, so that the internal limit window 401 of the wiping positioning plate 4 is located on the surface of the disc. At this time, the worker can wipe the mark on the surface of the disc.

[0039] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to the embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified and replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A wafer MARK erasing jig, comprising a base plate (1); characterized in that: A placement seat (2) is installed at the center of the surface of the base plate (1), a fixing mechanism (7) is installed on the side of the placement seat (2), and a wiping positioning plate (4) is movably installed on the surface of the base plate (1) near both ends of the placement seat (2), a limiting window (401) is provided inside the wiping positioning plate (4), and an adjustment mechanism (8) is installed inside the limiting window (401); The adjustment mechanism (8) comprises a fixing groove (801), a boss (802) and a connecting frame (803); the wiping positioning plate (4) is provided with a fixing groove (801) near the inner portion of the limiting window (401); the boss (802) is mounted in engagement with the inner portion of the fixing groove (801); and the connecting frame (803) is mounted on the outer side of the boss (802).

2. The wafer MARK erasing jig according to claim 1, characterized in that: A wiping strip (9) is provided at one end of the bottom of the wiping positioning plate (4).

3. The wafer MARK erasing jig according to claim 1, characterized in that: The fixing mechanism (7) comprises an adsorption port (701) and a negative pressure pipeline (702); the adsorption port (701) is provided inside the placement seat (2); and the negative pressure pipeline (702) is installed on the side of the placement seat (2).

4. The wafer MARK erasing jig according to claim 1, characterized in that: Guide rails (3) are installed on the surface of the bottom plate (1) at both ends close to the placement seat (2), and the wiping positioning plate (4) is slidably located outside the guide rails (3).

5. The wafer MARK erasing jig according to claim 1, characterized in that: A support block (5) is installed on one side of the top of the base plate (1) close to the guide rail (3), and a fixing bolt (501) is installed inside the wiping positioning plate (4) close to the top of the support block (5).

6. The wafer MARK erasing jig according to claim 1, characterized in that: An L-shaped limiting plate (6) is installed on the side of the bottom plate (1) surface away from the fixing bolt (501).

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