Protective sheet assembly, display module and electronic equipment

Abstract

The utility model relates to a protection sheet assembly, a display module and electronic equipment. The protection sheet assembly comprises a metal substrate, the metal substrate comprises a first area and a second area, and the second area is arranged around the first area; the protective film is arranged perpendicular to the thickness direction of the metal base body, and the protective film is located on one side of the metal base body; the first bonding layer is arranged perpendicular to the thickness direction of the metal matrix; the barrier layer is arranged perpendicular to the thickness direction of the metal base body, the barrier layer and the first bonding layer are both located between the protective film and the metal base body, the first bonding layer is bonded with the protective film and the first area, the barrier layer is bonded with the protective film, and the barrier layer is arranged perpendicular to the thickness direction of the metal base body. The barrier layer is in contact with the second region.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a protective sheet assembly, a display module, and an electronic device. Background Art

[0002] In some related technologies, in order to achieve a narrow-frame design for a display module, a glue potting solution is used to fix the display module, which requires sufficient bonding strength between the metal protective sheet on the back of the display module and the glue potting.

[0003] To protect the material, the metal protection sheet is typically protected by an adhesive protective film before being assembled to the display module. The protective film is then removed before assembly. The adhesive used in the protective film can leave residual silicone oil on the metal protection sheet, affecting the bond strength between the adhesive and the metal protection sheet. Utility Model Content

[0004] The present disclosure provides a protective sheet assembly, a display module, and an electronic device to address deficiencies in the related art.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a protection sheet assembly, comprising:

[0006] a metal substrate, the metal substrate comprising a first region and a second region, wherein the second region is arranged around the first region;

[0007] A protective film, wherein the protective film is arranged perpendicular to the thickness direction of the metal substrate and is located on one side of the metal substrate;

[0008] a first adhesive layer, the first adhesive layer being arranged perpendicular to the thickness direction of the metal substrate;

[0009] A barrier layer is arranged perpendicular to the thickness direction of the metal substrate, the barrier layer and the first adhesive layer are both located between the protective film and the metal substrate, the first adhesive layer is respectively bonded to the protective film and the first area, the barrier layer is bonded to the protective film, and the barrier layer is in contact with the second area.

[0010] Optionally, the second region is arranged along the circumferential edge of the metal substrate.

[0011] Optionally, in the thickness direction of the metal substrate, the projection area of ​​the protective film covers the projection area of ​​the metal substrate.

[0012] Optionally, the barrier layer and the protective film are bonded together via the first adhesive layer; or, further comprising a second adhesive layer, the second adhesive layer bonding the barrier layer to the protective film.

[0013] Optionally, the barrier layer and the protective film are bonded together via the first adhesive layer;

[0014] The first bonding layer includes an inner ring colloid and an outer ring colloid, the outer ring colloid bonds the barrier layer and the protective film, the inner ring colloid bonds the first region and the protective film, and cutting seams are provided between the inner ring colloid and the outer ring colloid.

[0015] Optionally, the sum of the thicknesses of the barrier layer and the outer ring colloid is equal to the thickness of the inner ring colloid.

[0016] Optionally, the thickness of the inner ring colloid is greater than or equal to 0.03 mm and less than or equal to 0.07 mm.

[0017] According to a third aspect of an embodiment of the present disclosure, a process for processing a display module is provided, comprising:

[0018] Get the display panel;

[0019] removing the barrier layer and the protective film of the protective sheet assembly according to any one of the above embodiments;

[0020] The first adhesive layer of the protection sheet assembly and the display panel are bonded together.

[0021] According to a third aspect of the embodiments of the present disclosure, a display module is provided, which is formed using the processing technology described in any of the above embodiments.

[0022] According to a fourth aspect of the embodiments of the present disclosure, there is provided an electronic device, including:

[0023] A display module as described in any one of the above embodiments.

[0024] Optional, including:

[0025] A glue potting member, a portion of which is bonded to the second area. The technical solution provided by the embodiment of the present disclosure may have the following beneficial effects:

[0026] It can be seen from the above embodiments that, on the one hand, the present disclosure can protect the metal substrate through the protective film, and on the other hand, through the design of the barrier layer, it can avoid direct adhesion of the colloid to the second area. After the protective film and the barrier layer are subsequently removed, no silicone will remain in the second area, which is beneficial to improving the dyne value of the metal substrate and improving the bonding strength between the second area and the glue.

[0027] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0029] Figure 1 is a schematic cross-sectional view of a protection sheet assembly according to an exemplary embodiment.

[0030] Figure 2 It is a schematic structural diagram of a metal substrate according to an exemplary embodiment.

[0031] Figure 3 is a schematic cross-sectional view of a protection sheet assembly according to an exemplary embodiment.

[0032] Figure 4 FIG. 4 is a schematic structural diagram of a first adhesive layer according to an exemplary embodiment.

[0033] Figure 5 The figure is a flowchart of a processing process of a display module according to an exemplary embodiment.

[0034] Figure 6 is a schematic cross-sectional view of a display module according to an exemplary embodiment. DETAILED DESCRIPTION

[0035] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0036] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0037] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0038] Figure 1 is a cross-sectional schematic diagram of a protective sheet assembly according to an exemplary embodiment. Figure 2 FIG. 1 is a schematic diagram showing the structure of a metal substrate according to an exemplary embodiment. Figure 1 and Figure 2 As shown, the protective sheet assembly includes a metal substrate 1, a protective film 2, a first adhesive layer 3 and a barrier layer 4, wherein the metal substrate 1 may include a first region 11 and a second region 12, the second region 12 being arranged around the first region 11, such as Figure 2 As shown in , the second region 12 can be provided along the circumferential edge of the metal substrate 1, and the first region is located in the middle of the metal substrate 1. The widths of the various regions of the second region 12 can be equal or unequal, and can be specifically designed as needed. The protective film 2 is provided on one side of the metal substrate 1 to protect the metal substrate 1 from scratches. In particular, the side of the metal substrate 1 covered by the protective film 2 can subsequently be provided toward the display panel of the display module to which it belongs, thereby preventing impurities or dust from being present on the surface of the metal substrate 1 and affecting the display effect of the display module.

[0039] The first adhesive layer 3 and the barrier layer 4 are both arranged between the metal substrate 1 and the protective film 2. The first adhesive layer 3 is bonded to the protective film 2 and the first region 11 respectively, thereby fixing the protective film 2. The barrier layer 4 is bonded to the protective film 2, and the barrier layer 4 is in contact with the second region 12. Based on this, on the one hand, the metal substrate 1 can be protected by the protective film 2. On the other hand, the design of the barrier layer 4 can protect the metal substrate 1 while avoiding direct bonding between the colloid and the second region 12. After the protective film 2 is subsequently removed, no silicone residue will remain in the second region 12, which is beneficial to improving the dyne value of the metal substrate 1. By reasonably setting the position of the second region 12, such as Figure 2 The second region 12 is arranged along the circumferential edge of the metal substrate 1 , which can improve the bonding strength between the second region 12 and the potting glue.

[0040] The protective film 2 and the barrier layer 4 can be made of the same material, such as a PVC film layer, or can be made of different materials, which is not limited in the present disclosure. Figure 1 In the up and down directions, the projection area of ​​the protective film 2 can cover the projection area of ​​the metal substrate 1, thereby achieving all-round protection of the metal substrate 1. Figure 1 As shown in , the projection area of ​​the protective film 2 may coincide with the projection area of ​​the metal substrate 1 , or in other embodiments, the projection area of ​​the protective film 2 may be slightly larger than the projection area of ​​the metal substrate 1 .

[0041] In some embodiments, as Figure 1 As shown, the barrier layer 4 and the protective film 2 are bonded together by the first adhesive layer 3, which is beneficial to simplify the assembly process of the protective sheet assembly; in other embodiments, such as Figure 3 As shown, the protective sheet assembly also includes a second adhesive layer 5, which bonds the protective film 2 and the barrier layer 4. The second adhesive layer 5 and the first adhesive layer 3 can be made of the same or different adhesives, and this disclosure does not limit this. Moreover, based on the separate design of the first adhesive layer 3 and the second adhesive layer 5, when the protective film 2 is subsequently torn off, it is convenient to remove the protective film 2, the second adhesive layer 5 and the barrier layer 4 at the same time. Only the first adhesive layer 3 is bonded to the metal substrate 1 and the display panel of the display module to which it belongs. The tearing process is simple, especially when the first adhesive layer 3 is a light-shielding layer, the light can be blocked by the first adhesive layer 3, which is beneficial to ensure the accuracy of the under-screen light sensor of the display module.

[0042] In some embodiments, the barrier layer 4 and the protective film 2 may be bonded together by a first bonding layer 3, such as Figure 4 As shown, the first adhesive layer 3 includes an inner ring colloid 31 and an outer ring colloid 32. The first area 11 of the metal substrate 1 and the protective film 2 are bonded by the inner ring colloid 31, and the barrier layer 4 and the protective film 2 are bonded by the outer ring colloid 32. A cutting seam is provided between the inner ring colloid 31 and the outer ring colloid 32, so that when the protective film 2 is subsequently torn off, the inner ring colloid 31 can be left on the metal substrate 1 to achieve preliminary bonding between the metal substrate 1 and the display panel.

[0043] Furthermore, the thickness of the inner ring colloid 31 is equal to the sum of the thicknesses of the outer ring colloid 32 and the barrier layer 4, preventing overprinting caused by misalignment. The thickness of the inner ring colloid 31 is greater than or equal to 0.03 mm and less than or equal to 0.07 mm. For example, the thickness of the inner ring colloid 31 can be 0.05 mm. The specific design can be customized and is not limited in this disclosure.

[0044] Based on the technical solution disclosed in this disclosure, Figure 5 As shown, a processing technology for display module is also provided, and the processing technology includes the following steps:

[0045] Step 501: Obtain a display panel.

[0046] Step 502 : removing the barrier layer 4 and the protective film 2 of the protective sheet assembly described in any one of the aforementioned embodiments.

[0047] Step 502 : Bond the first adhesive layer 3 of the protection sheet assembly and the display panel.

[0048] Based on this, by removing the barrier layer 4 and the protective film 2 , the second area 12 of the metal substrate 1 can be exposed, which is beneficial for the subsequent bonding of the display module with the colloid injected into the back of the display module using the second area 12 .

[0049] Based on the technical solution disclosed in the present invention, a display module is also provided, such as Figure 6 As shown, the display module includes a display panel 101 and the protective sheet assembly described in any of the aforementioned embodiments. The metal base 1 of the protective sheet assembly is bonded to the display panel 101 through a first adhesive layer 3, and the barrier layer 4 and the protective film 2 of the protective assembly are removed to leave a second area 12 for bonding with the glue-filled part.

[0050] Based on the technical solution of the present disclosure, an electronic device is also provided, which includes the electronic device as described in any of the aforementioned embodiments. Furthermore, the electronic device also includes a glue potting part, a portion of which is bonded to the second area of ​​the metal base 1. Since there is no silicone oil residue related to the first adhesive layer 3 in the second area, the connection stability between the metal base 1 and the glue potting part can be guaranteed. In addition to being bonded to the metal base 1, the glue potting part can also be bonded to the middle frame of the electronic device to achieve sealing and waterproofing of the electronic device.

[0051] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0052] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A protective sheet assembly, characterized in that: include: a metal substrate, the metal substrate comprising a first region and a second region, wherein the second region is arranged around the first region; A protective film, wherein the protective film is arranged perpendicular to the thickness direction of the metal substrate and is located on one side of the metal substrate; a first adhesive layer, the first adhesive layer being arranged perpendicular to the thickness direction of the metal substrate; A barrier layer is arranged perpendicular to the thickness direction of the metal substrate, the barrier layer and the first adhesive layer are both located between the protective film and the metal substrate, the first adhesive layer is respectively bonded to the protective film and the first area, the barrier layer is bonded to the protective film, and the barrier layer is in contact with the second area.

2. The protective sheet assembly according to claim 1, wherein: The second region is arranged along a circumferential edge of the metal substrate.

3. The protective sheet assembly according to claim 1, wherein: In the thickness direction of the metal substrate, the projection area of ​​the protection film covers the projection area of ​​the metal substrate.

4. The protective sheet assembly according to claim 1, wherein: The barrier layer and the protective film are bonded together by the first adhesive layer; or, the film further includes a second adhesive layer, the second adhesive layer bonding the barrier layer and the protective film together.

5. The protective sheet assembly according to claim 4, wherein: The first bonding layer includes an inner ring colloid and an outer ring colloid, the outer ring colloid bonds the barrier layer and the protective film, the inner ring colloid bonds the first region and the protective film, and cutting seams are provided between the inner ring colloid and the outer ring colloid.

6. The protective sheet assembly according to claim 5, wherein: The sum of the thicknesses of the barrier layer and the outer ring colloid is equal to the thickness of the inner ring colloid.

7. The protective sheet assembly according to claim 6, wherein: The thickness of the inner ring colloid is greater than or equal to 0.03 mm and less than or equal to 0.07 mm.

8. A display module, characterized in that: The invention comprises a display panel and a protective sheet assembly according to any one of claims 1 to 7, wherein the metal substrate of the protective sheet assembly is bonded to the display panel via a first adhesive layer, and the barrier layer and the protective film of the protective sheet assembly are removed.

9. An electronic device, characterized in that: include: The display module as claimed in claim 8.

10. The electronic device according to claim 9, characterized in that include: A glue-filling component, a portion of which is bonded to the second area.

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