Sensor housing and laser radar
By setting up a micro-heat pipe structure between the bracket and the shell of the lidar, the problem of increasing volume and noise in the existing lidar heat dissipation method is solved, and efficient and noise-free heat dissipation effect and lightweight structure are achieved.
Patent Information
- Application Number
- CN202421400746.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-06-19
AI Technical Summary
The existing laser radar heat dissipation method increases the size, weight and noise of the equipment, making it difficult to meet actual use needs.
A micro-heat pipe structure is used to set up between the bracket and the shell, and its high thermal conductivity and temperature uniformity are used to dissipate heat, and are connected through glue, welding, fasteners, etc. to form an integrated structure.
It achieves efficient and noise-free heat dissipation, improves heat dissipation uniformity and structural mechanical properties, extends service life, and reduces the weight and volume of the shell.
Smart Images
Figure CN223284371U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of heat dissipation technology, and specifically relates to a sensor housing and a laser radar. Background Art
[0002] LiDAR power directly impacts its performance, such as range and accuracy. Therefore, heat dissipation remains a core issue for LiDAR. Existing LiDAR heat dissipation methods primarily employ passive cooling (using fins) or active cooling (using fans). However, the addition of fins increases the size and weight of the LiDAR, shortening its lifespan. Active cooling methods like air and water cooling also increase noise and size, making them difficult to meet practical requirements. Utility Model Content
[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technologies.
[0004] To this end, a first aspect of the present invention provides a sensor housing.
[0005] A second aspect of the present invention provides a laser radar.
[0006] In view of this, according to a first aspect of an embodiment of the present application, a sensor housing is provided, comprising:
[0007] Bracket, the bracket is used to protect the heat dissipation device;
[0008] The housing is sleeved on the outside of the bracket and connected to the bracket;
[0009] The micro heat pipe structure is arranged between the shell and the bracket, and the micro heat pipe structure is fitted with the shell and the bracket at the same time.
[0010] In a feasible embodiment, the micro heat pipe structure includes:
[0011] A micro heat pipe assembly, which includes several micro heat pipe bodies;
[0012] The protective shell is arranged on the outside of the micro heat pipe assembly, the protective shell is fitted with the micro heat pipe assembly, and the protective shell is connected to the micro heat pipe assembly.
[0013] In a feasible embodiment, the micro heat pipe bodies are arranged in an array form within the protective shell.
[0014] In a feasible embodiment, the sensor housing further includes:
[0015] The accommodating groove is arranged on the side of the bracket close to the shell, and the micro heat pipe structure is embedded in the accommodating groove.
[0016] In a feasible implementation manner, the micro heat pipe structure and the bracket are integrally die-casted, so that the micro heat pipe structure is embedded in the receiving groove.
[0017] In a feasible implementation, the housing is fitted with both the micro heat pipe structure and the bracket.
[0018] In a feasible implementation manner, the micro heat pipe structure is connected to the bracket, and the micro heat pipe structure is connected to the housing.
[0019] In a feasible embodiment, the micro heat pipe structure and the bracket are connected by one or more methods including gluing, welding, fastener connection or stamping; the micro heat pipe structure and the shell are connected by one or more methods including gluing, welding, fastener connection or stamping.
[0020] In a feasible implementation manner, a clearance opening is provided on the bracket, the interior of the bracket is hollow, and the bracket cover is provided on the outside of the heat dissipation device.
[0021] According to a second aspect of an embodiment of the present application, a laser radar is proposed, comprising: a sensor housing as described in any of the above technical solutions.
[0022] Compared with the prior art, the sensor housing and laser radar of the present application have the following beneficial effects:
[0023] The sensor housing provided in the embodiment of the present application includes a bracket, a shell and a micro heat pipe structure. The micro heat pipe structure is arranged between the bracket and the shell, and the micro heat pipe structure is simultaneously bonded to the bracket and the shell. On the one hand, the micro heat pipe structure has good thermal conductivity and good temperature uniformity of the heat dissipation surface, which helps the bracket to dissipate heat, improves the uniformity and heat dissipation efficiency of the bracket, and allows the heat of the heat dissipation device absorbed by the bracket to be discharged through the micro heat pipe structure and the shell, so as to efficiently dissipate heat for the heat dissipation device inside the bracket. At the same time, the micro heat pipe structure is used as the heat dissipation structure of the outer shell structure, which can make the outer shell structure itself dissipate heat almost without noise. On the other hand, the micro heat pipe structure is simultaneously bonded to the bracket and the shell, which can play a structural support role. Compared with the traditional heat dissipation structure, it is not only simple in structure and lighter in weight, but also can make the outer shell structure have better mechanical properties, thereby extending the service life of the outer shell structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:
[0025] Figure 1 A schematic structural diagram of a sensor housing according to an embodiment of the present application from a first angle;
[0026] Figure 2 A schematic structural diagram of a sensor housing according to an embodiment of the present application from a second angle;
[0027] Figure 3 A schematic structural diagram of a sensor housing according to another embodiment of the present application;
[0028] in, Figures 1 to 3 The corresponding relationship between the reference numerals and component names is as follows:
[0029] 10. Bracket; 11. Shell; 12. Micro heat pipe structure; 13. Receiving groove; 14. Yield. DETAILED DESCRIPTION
[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0032] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0033] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application.
[0034] like Figures 1 to 3 As shown, according to the first aspect of the embodiment of the present application, a sensor housing is proposed, including: a bracket 10, a shell 11 and a micro heat pipe structure 12; the bracket 10 is used to protect the heat dissipation device; the shell 11 is mounted on the outside of the bracket 10, and the shell 11 is connected to the bracket 10; the micro heat pipe structure 12 is arranged between the shell 11 and the bracket 10, and the micro heat pipe structure 12 is simultaneously fitted with the shell 11 and the bracket 10.
[0035] The sensor housing provided by the embodiment of the present application includes a bracket 10, a shell 11 and a micro heat pipe structure 12. The micro heat pipe structure 12 is arranged between the bracket 10 and the shell 11, and the micro heat pipe structure 12 is simultaneously bonded to the bracket 10 and the shell 11. On the one hand, the micro heat pipe structure 12 has good thermal conductivity and good temperature uniformity of the heat dissipation surface, so as to help the bracket 10 dissipate heat, improve the uniformity and heat dissipation efficiency of the bracket 10, and make the heat of the heat dissipation device absorbed by the bracket 10 be discharged through the micro heat pipe structure 12 and the shell 11, so as to efficiently dissipate heat for the heat dissipation device inside the bracket 10. At the same time, the micro heat pipe structure 12 is used as the heat dissipation structure of the outer shell structure, so that the outer shell structure itself dissipates heat almost without noise; on the other hand, the micro heat pipe structure 12 is simultaneously bonded to the bracket 10 and the shell 11, which can play a structural support role. Compared with the traditional heat dissipation structure, it is not only simple in structure and lighter in weight, but also can make the outer shell structure have better mechanical properties, thereby extending the service life of the outer shell structure.
[0036] Furthermore, the micro heat pipe structure 12 is connected to at least one side surface of the bracket 10, and the micro heat pipe structure 12 extends along the length and width directions of the side surface, so that the micro heat pipe structure 12 is adapted to the shape of the side surface, thereby ensuring that the micro heat pipe structure 12 has a sufficiently large contact area with the side surface to improve the heat conduction efficiency between the micro heat pipe structure 12 and the bracket 10, while improving the temperature uniformity of the surface of the bracket 10, preventing the local temperature from being too high or too low, and facilitating the normal operation of the heat dissipation device.
[0037] In a feasible embodiment, the micro heat pipe structure 12 includes: a micro heat pipe assembly and a protective shell; the micro heat pipe assembly includes a plurality of micro heat pipe bodies; the protective shell is arranged on the outside of the micro heat pipe assembly, the protective shell is fitted with the micro heat pipe assembly, and the protective shell is connected to the micro heat pipe assembly.
[0038] In this technical solution, the micro heat pipe assembly is composed of a plurality of micro heat pipe bodies. By connecting the micro heat pipe body to the protective shell, the plurality of micro heat pipe bodies are integrated on the protective shell to improve the stability of the micro heat pipe assembly, which helps to improve the reliability of the connection between the micro heat pipe assembly and the bracket 10; at the same time, by fitting the micro heat pipe body to the protective shell, the heat conduction effect between the micro heat pipe body and the protective shell is ensured, thereby ensuring the overall heat conduction efficiency of the micro heat pipe structure 12 and further improving the surface temperature uniformity of the micro heat pipe structure 12.
[0039] It can be understood that the micro heat pipe adopts capillary and gravity self-circulation, the temperature response is less than 5 seconds, and the temperature uniformity of the entire heat dissipation surface is good; at the same time, the micro heat pipe can be bent, cut, and welded at will so that the micro heat pipe can better adapt to the shape of the corresponding surfaces of the bracket 10, thereby increasing the contact area between the micro heat pipe structure 12 and the bracket 10, thereby improving the heat dissipation efficiency and reliability of the bracket 10 for the heat dissipation device through the cooperation of the micro heat pipe and the bracket 10.
[0040] In a feasible embodiment, the micro heat pipe bodies are arranged in an array form within the protective shell.
[0041] In this technical solution, the micro heat pipe bodies in each micro heat pipe assembly are arranged in an array form in the corresponding protective shell. On the one hand, it can ensure that the temperature of the entire heat dissipation surface of the micro heat pipe structure 12 is evenly distributed, avoiding local overheating or uneven temperature. The structure is more compact, which can save space and fit more closely with the bracket 10 and the shell 11, thereby improving the heat dissipation effect of the micro heat pipe structure 12. On the other hand, through the coordinated work of a large number of micro heat pipe bodies arranged in an array, heat transfer can be accelerated, the heat dissipation efficiency of the micro heat pipe structure 12 can be improved, and the actual needs of heat dissipation devices with high power density and high heat load can be better met.
[0042] like Figure 1 and Figure 3 As shown, in a feasible embodiment, the sensor housing further includes: a receiving groove 13 ; the receiving groove 13 is provided on a side of the bracket 10 close to the housing 11 , and the micro heat pipe structure 12 is embedded in the receiving groove 13 .
[0043] In this technical solution, the accommodating groove 13 is arranged on the side of the bracket 10 close to the shell 11, and the micro heat pipe structure 12 is embedded in the accommodating groove 13. On the one hand, the accommodating groove 13 plays a role in positioning the micro heat pipe structure 12, ensuring the accuracy of the installation position of the micro heat pipe structure 12; on the other hand, arranging the accommodating groove 13 on the bracket 10 can reduce the wall thickness of the bracket 10, reduce the weight of the bracket 10, and reduce the overall volume and weight of the shell structure. It can also shorten the distance between the micro heat pipe structure 12 and the heat dissipation device inside the bracket 10, so that the micro heat pipe structure 12 can be closer to the heat dissipation device, thereby improving the heat dissipation efficiency of the micro heat pipe structure 12 to the heat dissipation device, and preventing the heat dissipation device from having a reduced performance and life due to excessive temperature.
[0044] Furthermore, the micro heat pipe structure 12 can be filled at the location with higher temperature gradient on the bracket 10 according to actual heat dissipation requirements, and the micro heat pipe structure 12 and the bracket 10 can jointly dissipate heat. In locations where heat dissipation is not required or where screw holes need to be avoided, only the bracket 10 structure can be used for heat dissipation.
[0045] It can be understood that the thickness of the micro heat pipe structure 12 can be designed according to actual needs so that the micro heat pipe structure 12 can be completely embedded in the accommodating groove 13, and thus fit with the bracket 10 through the shell 11. On the one hand, the heat of the bracket 10 can be discharged through the shell 11, thereby improving the heat dissipation efficiency of the heat dissipation device inside the bracket 10; on the other hand, the fit between the bracket 10 and the shell 11 can improve the sealing between the shell 11 and the bracket 10, thereby improving the overall protection capability of the shell structure.
[0046] In a feasible implementation, the micro heat pipe structure 12 and the bracket 10 are integrally die-cast, so that the micro heat pipe structure 12 is embedded in the receiving groove 13 .
[0047] In this technical solution, during the die-casting process of the bracket 10, the micro heat pipe structure 12 and the bracket 10 are die-cast as one piece, so that the micro heat pipe structure 12 can be directly embedded in the bracket 10 during the manufacturing process of the bracket 10, thereby improving the integrity of the bracket 10 and the micro heat pipe structure 12, and no additional shape design is required, thereby reducing the overall manufacturing difficulty of the shell structure and helping to improve the production efficiency of the shell structure.
[0048] In some examples, when die-casting the bracket 10, the sizes of the positions on the bracket 10 that do and do not need to dissipate heat are designed according to actual conditions. The micro heat pipe structure 12 is placed at a suitable position in the die-casting mold according to the design. After the die-casting material is poured in, it is waited for cooling and demolding to form an integrated structure of the bracket 10 and the micro heat pipe structure 12.
[0049] Specifically, the bracket 10 is made of aluminum alloy, and the housing is made of aluminum alloy, so that the bracket 10 and the housing themselves also have high thermal conductivity.
[0050] like Figure 2 As shown, in a feasible embodiment, the housing 11 is fitted with the micro heat pipe structure 12 and the bracket 10 at the same time.
[0051] In this technical solution, the micro heat pipe structure 12 is completely embedded in the accommodating groove 13 of the bracket 10, and the exposed side of the micro heat pipe structure 12 is flush with the side of the corresponding bracket 10, so that the shell 11 is tightly fitted with the micro heat pipe structure 12 and the bracket 10 at the same time. On the one hand, it ensures that the shell 11 has a sufficiently large contact area with the micro heat pipe structure 12 and the bracket 10, thereby improving the temperature uniformity and heat dissipation efficiency of the heat dissipation surface; on the other hand, the shell 11 is tightly fitted with the bracket 10, which can ensure the sealing of the shell 11 and the bracket 10 after assembly, and can avoid the micro heat pipe structure 12 from being exposed to the air, preventing the micro heat pipe structure 12 from being eroded, and at the same time ensuring the thermal conductivity between the micro heat pipe structure 12, the bracket 10 and the shell 11.
[0052] like Figure 2 As shown, in a feasible implementation manner, the micro heat pipe structure 12 is connected to the bracket 10 , and the micro heat pipe structure 12 is connected to the housing 11 .
[0053] In this technical solution, by connecting the micro heat pipe structure 12 to the bracket 10 and the shell 11 at the same time, the micro heat pipe structure 12 is prevented from escaping from the accommodating groove 13 before connecting to the shell 11, thereby improving the firmness of the connection between the micro heat pipe structure 12, the bracket 10 and the shell 11; after connecting to the shell 11, it is ensured that the micro heat pipe structure 12 will not move, thereby ensuring the stability of the micro heat pipe structure 12 between the bracket 10 and the shell 11.
[0054] In a feasible embodiment, the micro heat pipe structure 12 and the bracket 10 are connected by one or more methods including gluing, welding, fastener connection or stamping; the micro heat pipe structure 12 and the shell 11 are connected by one or more methods including gluing, welding, fastener connection or stamping.
[0055] In this technical solution, the connection methods between the micro heat pipe structure 12 and the bracket 10, and between the micro heat pipe structure 12 and the shell 11 can be selected and / or combined according to actual use requirements to ensure the overall stability and reliability of the shell structure.
[0056] In some examples, for scenarios requiring high sealing and corrosion resistance, glue bonding or welding can be chosen; for scenarios requiring frequent disassembly and repair, fastener connection can be chosen; for scenarios requiring metal materials and high-strength connection, stamping connection can be chosen, or multiple connection methods can be combined to meet the actual needs of lidar in different application scenarios.
[0057] As a preferred solution, the micro heat pipe structure 12 and the bracket 10, and the micro heat pipe structure 12 and the shell 11 are bonded by thermal conductive glue, which can not only fill the gaps, but also improve the direct thermal conductivity efficiency and effect of the bracket 10, the micro heat pipe structure 12 and the shell 11.
[0058] like Figure 2 and Figure 3 As shown, in a feasible embodiment, a clearance opening 14 is provided on the bracket 10, the interior of the bracket 10 is hollow, and the bracket 10 is covered on the outside of the heat dissipation device.
[0059] In this technical solution, the interior of the bracket 10 is hollow, leaving space for accommodating the heat dissipation device. By covering the bracket 10 on the outside of the heat dissipation device, the heat dissipation device is protected; at the same time, the micro heat pipe structure 12 is fitted with the bracket 10 to dissipate heat for the bracket 10, thereby ensuring the heat dissipation efficiency and uniformity of the outer shell structure to the heat dissipation device inside the bracket 10.
[0060] According to a second aspect of the present application, a laser radar is proposed, comprising: a sensor housing as described in any one of the above technical solutions.
[0061] The laser radar provided in the embodiment of the present application includes a sensor housing as described in any of the above technical solutions. Therefore, the laser radar has all the beneficial effects of the sensor housing of the above technical solutions, which will not be elaborated here.
[0062] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.
[0063] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application. The above are merely preferred embodiments of the present application. It should be noted that those skilled in the art may make various improvements and variations without departing from the technical principles of the present application, and such improvements and variations shall also be considered within the scope of protection of the present application.
Claims
1. A sensor housing, characterized in that: The sensor housing comprises: A bracket, the bracket being used to protect the heat dissipation device; A shell, the shell being sleeved on the outside of the bracket and connected to the bracket; A micro heat pipe structure is provided between the housing and the bracket, and the micro heat pipe structure is fitted with both the housing and the bracket.
2. A sensor housing according to claim 1, characterized in that: The micro heat pipe structure comprises: A micro heat pipe assembly, comprising a plurality of micro heat pipe bodies; A protective shell is arranged on the outside of the micro heat pipe assembly, the protective shell is fitted with the micro heat pipe assembly, and the protective shell is connected to the micro heat pipe assembly.
3. A sensor housing according to claim 2, characterized in that: The micro heat pipe bodies are arranged in an array form inside the protective shell.
4. The sensor housing according to claim 1, wherein: The sensor housing further comprises: The accommodating groove is arranged on the side of the bracket close to the shell, and the micro heat pipe structure is embedded in the accommodating groove.
5. The sensor housing according to claim 4, characterized in that: The micro heat pipe structure and the bracket are integrally die-casted so that the micro heat pipe structure is embedded in the accommodating groove.
6. The sensor housing according to claim 4, characterized in that: The shell is fitted with the micro heat pipe structure and the bracket at the same time.
7. The sensor housing according to claim 1, characterized in that: The micro heat pipe structure is connected to the bracket, and the micro heat pipe structure is connected to the shell.
8. The sensor housing according to claim 7, characterized in that: The micro heat pipe structure and the bracket are connected by one or more methods including gluing, welding, fastener connection or stamping; The micro heat pipe structure is connected to the shell by one or more of gluing, welding, fastener connection or stamping.
9. The sensor housing according to claim 1, characterized in that: The bracket is provided with a clearance opening, the interior of the bracket is hollow, and the bracket cover is arranged on the outside of the heat dissipation device.
10. A laser radar, characterized in that: The sensor housing comprises the sensor housing according to any one of claims 1 to 9.