Electronic device

Abstract

The present disclosure relates to an electronic device divided into a folding region foldable with respect to a folding axis extending in a direction, a first non-folding region adjacent to one side of the folding region, and a second non-folding region adjacent to the other side of the folding region, the electronic device includes a lower module, a display panel disposed on the lower module, and a window disposed on the display panel. In a first cross-sectional view parallel to a thickness direction of the display panel and perpendicular to the folding axis, a first side surface of the display panel is inclined with respect to a lower surface of the display panel. Accordingly, the electronic device may exhibit excellent display quality.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0124658 filed in the Korean Intellectual Property Office on September 19, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to foldable electronic devices and methods of manufacturing foldable electronic devices. Background Art

[0004] Various electronic devices, such as televisions, mobile phones, tablet computers, and game consoles, have been developed. Recently, flexible electronic devices, including flexible display panels that can slide or fold, have been developed. Unlike rigid electronic devices, flexible electronic devices can be folded, rolled, or bent. Because flexible electronic devices can be deformed into various shapes, they can be carried regardless of the size of the existing screen, improving user convenience.

[0005] Foldable electronic devices, among flexible electronic devices, need to maintain the reliability and safety of their components when folded. With this in mind, peripheral areas where images are not displayed are designed. This peripheral area of ​​the electronic device can degrade display quality, and therefore, measures are needed to reduce it. Utility Model Content

[0006] The present disclosure provides an electronic device with improved display quality and a method of manufacturing the electronic device.

[0007] According to an embodiment of the present disclosure, an electronic device is provided, the electronic device being divided into a folding region foldable relative to a folding axis extending in one direction, a first non-folding region adjacent to one side of the folding region, and a second non-folding region adjacent to the other side of the folding region. The electronic device may include a lower module, a display panel disposed on the lower module, and a window disposed on the display panel. In a first cross-sectional view parallel to the thickness direction and perpendicular to the folding axis, a first side surface of the display panel may be inclined relative to a lower surface of the display panel.

[0008] In an embodiment, an angle formed between the first side surface and the lower surface may be in the range of about 65° to about 80° in the first cross-sectional view.

[0009] In an embodiment, in a second cross-sectional view parallel to the thickness direction and the folding axis, the second side surface of the display panel may be perpendicular to the lower surface of the display panel.

[0010] In an embodiment, the first side surface of the display panel may intersect with the second side surface of the display panel in a view perpendicular to the thickness direction.

[0011] In an embodiment, the electronic device may further include a protective layer disposed on the window. In the first cross-sectional view, the first side surface of the protective layer may be inclined relative to the lower surface of the protective layer.

[0012] In an embodiment, in the first cross-sectional view, an angle formed between the first side surface of the protective layer and the lower surface of the protective layer may be in the range of about 65° to about 80°.

[0013] In an embodiment, in a second cross-sectional view parallel to the thickness direction and the folding axis, the second side surface of the protective layer may be perpendicular to the lower surface of the protective layer.

[0014] In an embodiment, in a view perpendicular to the thickness direction, the first side surface of the protective layer may intersect with the second side surface of the protective layer.

[0015] In an embodiment, the electronic device can be folded in a first mode so that the first non-folding area overlaps the second non-folding area in the thickness direction, and the electronic device can be unfolded in a second mode so that the first non-folding area is spaced apart from the second non-folding area. In the second mode, the first side surface of the display panel can be parallel to the first side surface of the protective layer.

[0016] In an embodiment, in the first mode, the first side surface of the display panel may not be parallel to the first side surface of the protection layer.

[0017] In an embodiment, the window may include a glass substrate, and in a first cross-sectional view, a side surface of the window may be perpendicular to a lower surface of the window.

[0018] In an embodiment, the electronic device may further include an optical layer disposed between the display panel and the window. In the first cross-sectional view, a side surface of the optical layer may be inclined relative to a lower surface of the optical layer.

[0019] In an embodiment, the lower module may include a support plate and a lower film disposed between the support plate and the display panel.

[0020] In an embodiment, in the first cross-sectional view, a side surface of the support plate may be inclined with respect to a lower surface of the support plate.

[0021] In an embodiment of the present disclosure, a method for manufacturing an electronic device is provided, the method including: preparing a preliminary lower module; providing a preliminary display panel on the preliminary lower module; providing a window on the preliminary display panel; and forming a display panel by applying a laser and removing an edge region of the preliminary display panel. The preliminary display panel may be divided into a folding portion foldable relative to a folding axis extending in one direction and a non-folding portion adjacent to the folding portion, the edge region of the preliminary display panel may correspond to a portion of the non-folding portion, and in a cross-sectional view parallel to a thickness direction of the display panel and perpendicular to the folding axis, a side surface of the display panel may be inclined relative to a lower surface of the display panel.

[0022] In an embodiment, the laser may be provided in a state of being inclined at an angle in a range of about 10° to about 25° with respect to the thickness direction.

[0023] In an embodiment, the method may further include providing a preliminary protective layer on the window between providing the window and forming the display panel. When forming the display panel, the protective layer may be formed by removing an edge region of the preliminary protective layer, and the edge region of the preliminary protective layer may overlap with a portion of the non-folding portion in a thickness direction.

[0024] In an embodiment, the window may include a glass substrate, and the laser may not be provided to the window.

[0025] In an embodiment, an angle formed between a side surface and a lower surface of the display panel in a cross-sectional view may be in a range of about 65° to about 80°.

[0026] In an embodiment, when forming the display panel, the lower module may be formed by removing an edge region of the preliminary lower module using a laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings:

[0028] Figure 1A is a perspective view showing an electronic device according to an embodiment;

[0029] Figure 1B is a perspective view showing an electronic device according to an embodiment;

[0030] Figure 1C is a plan view showing an electronic device according to an embodiment;

[0031] Figure 1D is a perspective view showing an electronic device according to an embodiment;

[0032] Figure 2A is a perspective view showing an electronic device according to an embodiment;

[0033] Figure 2B is a perspective view showing an electronic device according to an embodiment;

[0034] Figure 2C is a perspective view showing an electronic device according to an embodiment;

[0035] Figure 3 is an exploded perspective view showing an electronic device according to an embodiment;

[0036] Figure 4 It is along Figure 3 A schematic cross-sectional view taken along line II';

[0037] Figure 5 It is along Figure 3 A schematic cross-sectional view taken along line II-II';

[0038] Figure 6 It is along Figure 3 A schematic cross-sectional view taken along line III-III';

[0039] Figure 7 is a plan view showing a portion of an electronic device according to an embodiment;

[0040] Figure 8 is a plan view showing a portion of an electronic device according to an embodiment;

[0041] Figure 9 It is along Figure 1C A schematic cross-sectional view taken along line XX';

[0042] Figure 10 is a schematic cross-sectional view showing an electronic device according to an embodiment;

[0043] Figure 11 is a flowchart illustrating a method of manufacturing an electronic device according to an embodiment;

[0044] Figure 12 is a schematic cross-sectional view schematically illustrating an operation of manufacturing an electronic device according to an embodiment; and

[0045] Figure 13 is a schematic cross-sectional view schematically illustrating an operation of manufacturing an electronic device according to an embodiment. DETAILED DESCRIPTION

[0046] The present disclosure may be implemented in various modifications and in various forms, and specific embodiments are shown in the drawings and described in detail in the text. However, it will be understood that the present disclosure is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure.

[0047] When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be intervening elements or layers. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers. For purposes of this disclosure, the term “connected” may refer to a physical connection, an electrical connection, and / or a fluid connection, with or without intervening elements.

[0048] The same mark or symbol represents the same element throughout the text. In addition, in the accompanying drawings, the thickness, ratio and size of the elements are exaggerated in order to effectively describe the technical content. In the specification and claims, the phrase "at least one of..." is intended to include the meaning of "at least one of the group selected from..." for the purpose of its meaning and interpretation. For example, "at least one of A and B" can be understood to mean "A, B, or A and B". In the specification and claims, the term "and / or" is intended to include any combination of the terms "and" and "or", for the purpose of its meaning and interpretation. For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in a combined or separate sense and can be understood to be equivalent to "and / or".

[0049] Although the terms first, second, etc. may be used to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of this disclosure. Singular forms also include plural forms, unless the context clearly indicates otherwise.

[0050] For descriptive purposes, spatially relative terms such as "below," "beneath," "under," "lower," "above," "upper," "above," "higher," "side," (e.g., as in "sidewall"), etc. may be used herein and thereby describe the relationship of one element to another (or multiple) element(s) as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "beneath" other elements or features will then be oriented "above" the other elements or features. Thus, the term "below" can encompass both the orientations of above and below. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and thus the spatially relative descriptors used herein should be interpreted accordingly.

[0051] It will be understood that when used in this specification, the terms “include” or “comprises” specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. In addition, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless clearly defined as such herein.

[0053] Hereinafter, an electronic device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings. Figure 1A is a perspective view showing a deployed state of the electronic device ED according to the embodiment.

[0054] The electronic device ED according to the embodiment may be activated in response to an electrical signal. For example, the electronic device ED may be a mobile phone, a tablet PC, a car navigation system, a game console, or a wearable device, but the present disclosure is not limited thereto. Figure 1A In FIG. 1 , the electronic device ED is shown as a mobile phone.

[0055] The electronic device ED may include a first display surface FS defined by a first direction axis DR1 and a second direction axis DR2 intersecting the first direction axis DR1. The electronic device ED may provide an image IM through the first display surface FS. The electronic device ED may display the image IM on a third direction axis DR3 on the first display surface FS that is parallel to each of the first direction axis DR1 and the second direction axis DR2.

[0056] In the present specification, the first direction axis DR1 and the second direction axis DR2 may be perpendicular to each other, and the third direction axis DR3 may be a normal direction to a plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device ED may be parallel to the third direction axis DR3. The front surface (or top surface) and the rear surface (or bottom surface) may be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or top surface) and the rear surface (or bottom surface) may be parallel to the third direction axis DR3. The front surface (or top surface) may be a surface close to the first display surface FS, and the rear surface (or bottom surface) may be a surface spaced apart from the first display surface FS. The rear surface (or bottom surface) may be a surface close to the second display surface RS to be described below. The top (or upper portion) may be a direction closer to the first display surface FS, and the bottom (or lower portion) may be a direction farther away from the first display surface FS.

[0057] The cross section may be a surface parallel to the thickness direction DR3, and the plane may be a surface perpendicular to the thickness direction DR3. The plane may be a surface defined by the first direction axis DR1 and the second direction axis DR2.

[0058] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 described in this specification may be relative concepts and thus may be changed to other directions. The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction, the second direction to the third direction (thickness direction), and thus may be represented by the same reference numerals or symbols.

[0059] The electronic device ED can sense external input applied from the outside. The external input can include various forms of input provided from outside the electronic device ED. For example, the external input can include external input applied close to the electronic device ED or applied adjacent to the electronic device ED at a certain distance (e.g., hovering), as well as touch by a body part of the user (such as a hand). The external input can take various forms, such as physical force, pressure, heat, light, etc.

[0060] The electronic device ED may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be a surface facing at least a portion of the first display surface FS. For example, the second display surface RS may be part of the rear surface of the electronic device ED.

[0061] The first active area F-AA may be activated in response to an electrical signal. The first active area F-AA may be an area in which an image IM is displayed and various forms of external inputs may be sensed.

[0062] The first peripheral area F-NAA may be an area in which the image IM is not displayed. The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a color. In a plan view, the first peripheral area F-NAA may surround the first active area F-AA. Therefore, the shape of the first active area F-AA may be substantially defined by the first peripheral area F-NAA. However, the present disclosure is not limited thereto, and the first peripheral area F-NAA may be provided adjacent to only one side of the first active area F-AA, or may be omitted.

[0063] Various electronic modules may be provided in the electronic module area EMA. For example, the electronic module may include at least one of a camera, a speaker, a light detection sensor, and a heat detection sensor. The electronic module area EMA may sense external objects received through the display surfaces FS and RS, or may provide audio signals such as voice to the outside through the display surfaces FS and RS. The electronic module may include multiple components, but the present disclosure is not limited to any one embodiment.

[0064] In a plan view, the electronic module area EMA may be surrounded by the first peripheral area F-NAA. However, the present disclosure is not limited thereto. For example, in a plan view, the electronic module area EMA may be surrounded by the first active area F-AA and the first peripheral area F-NAA, and the electronic module area EMA may be disposed in the first active area F-AA.

[0065] The electronic device ED according to an embodiment may be divided into at least one folding area FA and a plurality of non-folding areas NFA1 and NFA2 extending from the folding area FA. For example, a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 may be defined along a second direction DR2. The electronic device ED may be divided into a first non-folding area NFA1 and a second non-folding area NFA2 spaced apart from each other, with the folding area FA being between the first non-folding area NFA1 and the second non-folding area NFA2 in the second direction DR2. For example, the first non-folding area NFA1 may be arranged on one side of the folding area FA along the second direction DR2, and the second non-folding area NFA2 may be arranged on the other side of the folding area FA along the second direction DR2.

[0066] Figure 1A, etc. schematically illustrate an embodiment of an electronic device ED including one folding area FA, but the present disclosure is not limited thereto. In another embodiment, multiple folding areas may be defined in the electronic device ED. For example, an electronic device according to an embodiment may include two or more folding areas, or may include three or more non-folding areas, with the folding areas respectively located between the non-folding areas.

[0067] Figure 1B is a perspective view illustrating a folding operation of the electronic device ED according to the embodiment. Figure 1C is a plan view showing a folded state of the electronic device ED according to the embodiment. Figure 1D is a perspective view illustrating a folding operation of the electronic device ED according to the embodiment.

[0068] refer to Figure 1B The electronic device ED according to an embodiment can be folded about a first folding axis FX1 extending along a first direction DR1. When the electronic device ED is folded, the folding area FA can have a curvature and a radius of curvature. The electronic device ED can be folded about the first folding axis FX1 and deformed into an inwardly folded state, such that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display surface FS is not exposed to the outside.

[0069] refer to Figure 1C In the inwardly folded state of the electronic device ED according to an embodiment, a user can view the second display surface RS. The second display surface RS may include a second active area R-AA that displays an image. The second active area R-AA may be activated in response to an electrical signal. The second active area R-AA may be an area in which an image is displayed and various forms of external input may be sensed.

[0070] The second display surface RS may include a second peripheral area R-NAA. The second peripheral area R-NAA may be adjacent to the second active area R-AA. The second peripheral area R-NAA may have a color. In a plan view, the second peripheral area R-NAA may surround the second active area R-AA. Although not shown herein, the electronic device ED may further include an electronic module area in the second display surface RS in which an electronic module having various components is disposed, but the present disclosure is not limited thereto.

[0071] refer to Figure 1DAccording to an embodiment, the electronic device ED can be folded about a second folding axis FX2 extending along the first direction DR1. The electronic device ED can be folded about the second folding axis FX2 and deformed to an outwardly folded state, such that the first display surface FS is exposed to the outside. In an embodiment, the electronic device ED can be configured to alternately repeat an inwardly folding operation or an outwardly folding operation from an unfolding operation, but the present disclosure is not limited thereto.

[0072] In a plan view, the folded state in which the electronic device ED is folded so that the first non-folding area NFA1 and the second non-folding area NFA2 overlap each other can be defined as a first mode. The unfolded state in which the first non-folding area NFA1 and the second non-folding area NFA2 are spaced apart from each other can be defined as a second mode. Figure 1C The electronic device ED is schematically shown in a first mode. Figure 1A The electronic device ED is schematically shown in a second mode.

[0073] Figures 1B to 1D The electronic device ED is schematically shown folded about one folding axis FX1 or FX2, but the number of folding axes and the corresponding non-folding areas are not limited thereto. For example, the electronic device can be folded about multiple folding axes, and a portion of the first display surface FS and a portion of the second display surface RS can face each other. The first folding axis FX1 and the second folding axis FX2 are shown as being parallel to the long sides of the electronic device ED, but the present disclosure is not limited thereto. In another embodiment, the first folding axis FX1 and the second folding axis FX2 can be parallel to the short sides of the electronic device ED.

[0074] In electronic equipment ED, such as Figure 1C As shown in , in the folded state, the first non-folding area NFA1 and the second non-folding area NFA2 can be defined as portions having display surfaces FS and RS, which are parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2. The folding area FA can be defined as the area between the first non-folding area NFA1 and the second non-folding area NFA2. In the folded state, the folding area FA can include a curved portion that can be curved to have a curvature.

[0075] Figures 2A to 2C is a perspective view showing an electronic device ED-a according to another embodiment of the present disclosure. Figure 2A It is a perspective view showing the electronic device ED-a in an expanded state.

[0076] Figure 2B and Figure 2C 1 is a perspective view showing a folding operation of the electronic device ED-a. Figure 2B It shows Figure 2AA stereoscopic view of the inward folding operation of the electronic device ED-a shown in FIG. Figure 2C It shows Figure 2A A stereoscopic view of the outward folding operation of the electronic device ED-a shown in FIG. Figure 2A The electronic device ED-a is schematically shown in a second mode.

[0077] The electronic device ED-a can be folded about a third folding axis FX3 parallel to the first direction axis DR1. Figure 2A , the extension direction of the third folding axis FX3 can be parallel to the extension direction of the short side of the electronic device ED-a.

[0078] The electronic device ED-a may be divided into a folding area FA-a, a first non-folding area NFA1-a adjacent to one side of the folding area FA-a, and a second non-folding area NFA2-a adjacent to the other side of the folding area FA-a. The first non-folding area NFA1-a and the second non-folding area NFA2-a may be spaced apart from each other, with the folding area FA-a between the first non-folding area NFA1-a and the second non-folding area NFA2-a.

[0079] The folding area FA-a may be an area foldable about a third folding axis FX3. When the electronic device ED-a is folded, the folding area FA-a may have a curvature and a radius of curvature. The first non-folding area NFA1-a and the second non-folding area NFA2-a may face each other, and the electronic device ED-a may be folded inward so that the display surface FS-a is not exposed to the outside.

[0080] refer to Figure 2A In an embodiment, in the unfolded state of the electronic device ED-a (eg, a state in which the electronic device ED-a is not folded), the user can view the display surface FS-a. Figures 1A to 1D As described above, the display surface FS-a of the electronic device ED-a may include an active area F-AAa and a peripheral area F-NAAa. The active area F-AAa may be an area in which an image IM is displayed and various forms of external inputs may be sensed.

[0081] refer to Figure 2B In the inwardly folded state of the electronic device ED-a according to an embodiment, the user can view the rear surface RS-a. For example, the rear surface RS-a can be used as a second display surface for displaying videos or images. Although not shown, an electronic module area in which an electronic module having various components is disposed can be provided in the rear surface RS-a.

[0082] refer to Figure 2C, the electronic device ED-a can be folded relative to the third folding axis FX3 and deformed into an outward folded state, in which an area of ​​the rear surface RS-a overlapping with the first non-folding area NFA1-a and another area overlapping with the second non-folding area NFA2-a face each other.

[0083] Figure 3 yes Figure 1A Hereinafter, the description of the electronic device ED may be similarly applied to Figures 2A to 2C The electronic device ED-a is shown in FIG.

[0084] refer to Figure 3 The electronic device ED may include a lower module LM, a display module DM disposed on the lower module LM, and a window WL disposed on the display module DM. The electronic device ED may further include a housing HAU, an optical layer RPL, and a protective layer PF.

[0085] The housing HAU can be disposed on the underside of the lower module LM. The housing HAU can be made of a relatively rigid material. For example, the housing HAU can include multiple frames and / or panels made of glass, plastic, or metal. The housing HAU provides a storage space. The display module DM can be housed in the storage space and protected from external impacts.

[0086] The lower module LM may include a support plate SP (see Figure 5 ) and the lower membrane PM (see Figure 5 Although not shown herein, the lower module LM may further include a cushion layer, a shielding layer, etc. The cushion layer may prevent the support plate SP (see Figure 5 ) is squeezed and plastically deformed due to external impact and force. The cushion layer may include an elastomer such as sponge, foam or polyurethane resin. The cushion layer may include at least one of an acrylate-based polymer, a urethane-based polymer, a silicone-based polymer and an imide-based polymer. The shielding layer may be an electromagnetic shielding layer or a heat dissipation layer.

[0087] The display module DM may be activated in response to an electrical signal. The display module DM may be activated and may be displayed in the first active area F-AA (see FIG. Figure 1A ) displays the image IM (see Figure 1A A display area DM-AA and a non-display area DM-NAA may be defined in the display module DM. The display area DM-AA may be activated in response to an electrical signal. The non-display area DM-NAA may be located adjacent to at least one side of the display area DM-AA. Circuits, wiring, etc. for driving the display area DM-AA may be disposed in the non-display area DM-NAA.

[0088] The optical layer RPL may be disposed between the display module DM and the window WL. The optical layer RPL may be an anti-reflection layer that reduces the reflectivity of external light from outside the display module DM. The optical layer RPL may be formed on the display module DM through a continuous process. The optical layer RPL may include a polarizer or a color filter layer. For example, the optical layer RPL may include at least one of a phase retarder, a polarizer, a polarizing film, and a polarizing filter. In another embodiment, the optical layer RPL may include a plurality of color filters arranged in a specific arrangement and a black matrix adjacent to the color filters.

[0089] The image IM generated in the display module DM (see Figure 1A ) can pass through the window WL and can be provided to the user. The window WL may include an optically transparent insulating material. The window WL may include a polymer substrate or a glass substrate. The window WL may be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer or a combination thereof. However, the material included in the window WL is not limited thereto. For example, the window WL may be a tempered glass substrate that has been strengthened. The window WL may include ultra-thin glass (UTG).

[0090] The protective layer PF may be a functional layer for protecting the surface of the window WL. The protective layer PF may include a polymer film. The protective layer PF may include an anti-fingerprint coating agent, a hard coating agent, an antistatic agent, and the like.

[0091] The electronic device ED may further include a first adhesive layer AD1, a second adhesive layer AD2, and a third adhesive layer AD3. The first adhesive layer AD1 may be disposed between the window WL and the protective layer PF. The second adhesive layer AD2 may be disposed between the optical layer RPL and the window WL. The third adhesive layer AD3 may be disposed between the display module DM and the optical layer RPL. The first adhesive layer AD1, the second adhesive layer AD2, and the third adhesive layer AD3 may each include an adhesive such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), an optically clear resin (OCR), etc., but the present disclosure is not limited thereto. In another embodiment, at least one of the first adhesive layer AD1, the second adhesive layer AD2, and the third adhesive layer AD3 may be omitted.

[0092] Figure 4 It is along Figure 3 Schematic cross-sectional view taken along line II'. Figure 4 is a schematic cross-sectional view showing the display module DM.

[0093] refer to Figure 4The display module DM may include a display panel DP and an input sensing layer ISP disposed on the display panel DP. The display panel DP may be configured to generate an image. The display panel DP may be a light-emitting display panel. For example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro-LED display panel, a micro-OLED display panel, or a nano-LED display panel.

[0094] The display panel DP may include a base layer BS, a circuit layer DP-CL, a display element layer DP-EL, and an encapsulation layer TFE stacked in sequence. In an embodiment, a functional layer may be further provided between two adjacent layers among the base layer BS, the circuit layer DP-CL, the display element layer DP-EL, and the encapsulation layer TFE.

[0095] The base layer BS may provide a base surface on which the circuit layer DP-CL is disposed. The base layer BS may be a flexible substrate that can be bent, folded, rolled, etc. The base layer BS may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the present disclosure is not limited thereto, and the base layer BS may include an inorganic layer, an organic layer, or a composite material layer.

[0096] The base layer BS may include a single layer or multiple layers. For example, the base layer BS may include a first synthetic resin layer, a multi-layer or single-layer inorganic layer disposed on the first synthetic resin layer, and a second synthetic resin layer disposed on the multi-layer or single-layer inorganic layer. The first synthetic resin layer and the second synthetic resin layer may each include a polyimide-based resin. In another embodiment, the first synthetic resin layer and the second synthetic resin layer may each include at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, an ethylene-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In this specification, a resin “based on” may be considered to include a functional group of “…”.

[0097] The circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, and the like. The display element layer DP-EL may be disposed on the circuit layer DP-CL. The display element layer DP-EL may include a light-emitting element (not shown). For example, the light-emitting element may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0098] The encapsulation layer TFE may be disposed on the display element layer DP-EL. The encapsulation layer TFE may protect the display element layer DP-EL from impurities such as moisture, oxygen, and dust particles. The encapsulation layer TFE may include at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence.

[0099] The input sensing layer ISP may be disposed on the display panel DP. The input sensing layer ISP may be disposed (eg, directly disposed) on the encapsulation layer TFE. In another embodiment, an adhesive member may be disposed between the input sensing layer ISP and the display panel DP.

[0100] In this specification, the phrase "one component is directly disposed on another component" means that a third component is not disposed between one component and another component. In other words, the phrase "one component is directly disposed" on another component means that one component is "in contact with" another component.

[0101] The input sensing layer ISP may sense external input and convert it into an input signal, and provide the input signal to the display panel DP. For example, the input sensing layer ISP may be a touch sensing layer that detects touch. The input sensing layer ISP may sense a user's direct touch, a user's indirect touch, an object's direct touch, an object's indirect touch, and the like.

[0102] The input sensing layer ISP can sense at least one of the position and strength (pressure) of a touch applied from the outside. The input sensing layer ISP can have various structures or can be composed of various materials and is not limited to any one embodiment. For example, the input sensing layer ISP can sense external input in a capacitive manner. The display panel DP can receive an input signal from the input sensing layer ISP and can generate an image corresponding to the input signal.

[0103] Figure 5 It is along Figure 3 Schematic cross-sectional view taken along line II-II'. Figure 5 It may be a schematic cross-sectional view showing the configuration of the electronic device ED in the first cross section. In this specification, the first cross section may be a cross section parallel to the thickness direction DR3 and perpendicular to the direction extending in the first folding axis FX1 (eg, the first direction DR1). Figure 5 It may be a schematic cross-sectional view showing the configuration of the electronic device ED in the second mode. For example, Figure 5 It can be shown that the electronic device ED is unfolded so that the first non-folding area NFA1 (see Figure 1A ) and the second unfolded region NFA2 (see Figure 1A ) is a schematic cross-sectional view of the configuration of the electronic device ED when the electronic devices ED are spaced apart from each other. For ease of explanation, Figure 5The following figures show a display panel DP, wherein the input sensing layer ISP (see Figure 4 ) is excluded from the display module DM (see Figure 4 ) configuration.

[0104] refer to Figure 5 The electronic device ED may further include a printed layer BM. The printed layer BM may be provided on the surface of the protective layer PF. In an embodiment, the printed layer BM may also be provided on the surface of the window WL. The printed layer BM may correspond to the first peripheral area F-NAA (see Figure 1A ). For example, the printing layer BM may include a black pigment or a black dye.

[0105] The lower module LM may include a support plate SP and a lower film PM. The lower film PM may be disposed between the support plate SP and the display panel DP. Although not shown herein, an adhesive member may be disposed between the display panel DP and the lower film PM and / or between the lower film PM and the support plate SP.

[0106] The support plate SP may be disposed on the lower side of the display panel DP. The support plate SP may include a metal material or a polymer material. For example, the support plate SP may include stainless steel, aluminum, or an alloy thereof. In another embodiment, the support plate SP may include a polymer material.

[0107] The lower film PM may protect the lower portion of the display panel DP. The lower film PM may include a flexible plastic material. For example, the lower film PM may include polyethylene terephthalate.

[0108] In an embodiment, the first side surface DP_S1 of the display panel DP may be inclined relative to the first lower surface DP_DF of the display panel DP. The first lower surface DP_DF may be adjacent to the lower module LM. The first side surface DP_S1 may be parallel to the first folding axis FX1 (see FIG. 1 ). Figure 4 ) extends in the direction of extension. Figure 5 , the first side surface DP_S1 may be inclined with respect to the thickness direction DR3 .

[0109] In a plan view, when the first folding axis FX1 (see Figure 3 ) is inclined in the extending direction of the first side surface DP_S1, the first peripheral area F-NAA (see Figure 1A As mentioned above, the first peripheral area F-NAA (see Figure 1A ) may be an area in which no image is displayed.

[0110] When the electronic device ED is folded, sliding may occur in at least some of the components constituting the electronic device ED (e.g., the display panel DP, the protective layer PF, etc.). When the electronic device ED is folded, the components constituting the electronic device ED may slide in a direction (e.g., the second direction DR2) perpendicular to the extension direction (e.g., the first direction DR1) of the first folding axis FX1. Taking the sliding into consideration, a space PS may be left so that the components constituting the electronic device ED are not affected by the impact caused by contact with the housing HAU. Therefore, the components constituting the electronic device ED (such as the display panel DP, etc.) may be spaced apart from the housing HAU in the second direction DR2 by a distance DT1 (hereinafter referred to as the first distance). The space PS may correspond to the first peripheral area F-NAA (see Figure 1A ) part.

[0111] Since the display panel DP according to the embodiment includes the first side surface DP_S1 inclined relative to the first lower surface DP_DF, in the event of sliding during folding, the display panel DP can be relatively more spaced apart from the housing HAU than a display panel including a first side surface perpendicular to the first lower surface. The display panel DP according to the embodiment can be relatively more spaced apart from the housing HAU by including the inclined first side surface DP_S1. The first side surface DP_S1 inclined relative to the first lower surface DP_DF can be relatively more spaced apart from the housing HAU than the first side surface perpendicular to the first lower surface. Here, the word "spaced apart" means "spaced apart in a direction perpendicular to the extension direction of the first folding axis FX1 (for example, the second direction DR2)". Therefore, the space PS of the electronic device ED according to the embodiment can be minimized, and thus the first peripheral area F-NAA (see Figure 1A ), thereby ensuring improved display quality.

[0112] The first angle θ1 formed between the first side surface DP_S1 and the first lower surface DP_DF may be in the range of about 65° to about 80°. In the method for manufacturing an electronic device according to an embodiment to be described below, the preliminary display panel P-DP (see FIG. 1 ) may be removed. Figure 12 ) of the first edge region RA1 (see Figure 12 ) to form the display panel DP, and the first edge area RA1 (see Figure 12 ) provides laser LAR (see Figure 12 ). Laser LAR (see Figure 12 ) can be expressed as an angle θ L (See Figure 12 ) provides, the angle θ LThe first side surface DP_S1 is inclined relative to the first lower surface DP_DF in a range of about 10° to about 25° relative to the thickness direction DR3 to form a first side surface DP_S1 inclined relative to the first lower surface DP_DF. Therefore, a first angle θ1 formed between the first side surface DP_S1 and the first lower surface DP_DF may be in a range of about 65° to about 80°.

[0113] When the first angle θ1 is less than about 65°, the laser LAR (see Figure 12 ) may be at an angle θ greater than about 25° L (See Figure 12 ) is provided, and thus the window WL may be damaged because the window WL including the glass substrate is irradiated by the laser LAR. In the case where the first angle θ1 is greater than about 80°, the inclination of the first side surface DP_S1 may be reduced, and the spacing distance between the display panel DP and the housing HAU may be insufficient, and thus an impact may be applied to the display panel DP during folding. On the contrary, in an embodiment, the display panel DP including the first side surface DP_S1 and the first lower surface DP_DF satisfying the first angle θ1 in the range of about 65° to about 80° can exhibit excellent reliability and help reduce the first peripheral area F-NAA of the electronic device ED (see Figure 1A ).

[0114] In the electronic device ED according to the embodiment, the members (e.g., the optical layer RPL, the protective layer PF, etc.) provided on the upper portion of the display panel DP may each include an inclined side surface. The second side surface PF_S1 of the protective layer PF may be inclined relative to the second lower surface PF_DF of the protective layer PF. In a direction parallel to the thickness direction DR3 and perpendicular to the first folding axis FX1 (see FIG. 2 ), the first folding axis FX1 may be inclined relative to the second lower surface PF_DF of the protective layer PF. Figure 3 ), the second side surface PF_S1 may be inclined relative to the second lower surface PF_DF. In a plan view, the second side surface PF_S1 of the protective layer PF may be parallel to the first folding axis FX1 (see FIG. Figure 3 ) extends in the direction of the first direction DR1 extending. In the protective layer PF, the second angle θ2 formed between the second side surface PF_S1 and the second lower surface PF_DF may be in the range of about 65° to about 80°. In the case where the second angle θ2 is less than about 65°, the laser LAR (see Figure 12 ) may be at an angle θ greater than about 25° L (See Figure 12) is provided, and thus the window WL may be damaged because the window WL including the glass substrate may be irradiated by the laser LAR. In the case where the second angle θ2 is greater than about 80°, the spacing distance between the protection layer PF and the housing HAU may be insufficient, and thus when the electronic device ED is folded, an impact may be applied to the protection layer PF. On the contrary, in an embodiment, the protection layer PF including the second side surface PF_S1 and the second lower surface PF_DF satisfying the second angle θ2 in the range of about 65° to about 80° can exhibit excellent reliability and help reduce the first peripheral area F-NAA of the electronic device ED (see Figure 1A ).

[0115] exist Figure 5 In the second mode shown in FIG, the first side surface DP_S1 of the display panel DP may be parallel to the second side surface PF_S1 of the protection layer PF. In the first cross section in the second mode, the first side surface DP_S1 of the display panel DP and the second side surface PF_S1 of the protection layer PF may be parallel to each other.

[0116] The window WL may include a glass substrate. The third side surface WL_S1 of the window WL may be perpendicular to the third lower surface WL_DF of the window WL. As described above, the window WL including the glass substrate may not be formed by the laser LAR (see Figure 12 ) is illuminated, and the third side surface WL_S1 of the window WL may not be inclined. The third side surface WL_S1 of the window WL may be disposed more inward than the second side surface PF_S1 of the protection layer PF. The third side surface WL_S1 of the window WL may be disposed more inward than the first side surface DP_S1 of the display panel DP.

[0117] The optical layer RPL may be disposed between the display panel DP and the window WL. The fourth side surface RPL_S1 of the optical layer RPL may be inclined relative to the fourth lower surface RPL_DF of the optical layer RPL. Figure 3 ), the fourth side surface RPL_S1 may be inclined relative to the fourth lower surface RPL_DF. In a plan view, the fourth side surface RPL_S1 of the optical layer RPL may be parallel to the first folding axis FX1 (see Figure 3 ). In the optical layer RPL, a third angle θ3 formed between the fourth side surface RPL_S1 and the fourth lower surface RPL_DF may be in the range of about 65° to about 80°. The fourth side surface RPL_S1 of the optical layer RPL may be disposed further outward than the third side surface WL_S1 of the window WL.

[0118] exist Figure 5In the second mode of the electronic device ED shown in FIG, the first side surface DP_S1 of the display panel DP may be parallel to the fourth side surface RPL_S1 of the optical layer RPL. The second side surface PF_S1 of the protection layer PF may be parallel to the fourth side surface RPL_S1 of the optical layer RPL. In the first cross section in the second mode, the first side surface DP_S1 of the display panel DP, the second side surface PF_S1 of the protection layer PF, and the fourth side surface RPL_S1 of the optical layer RPL may be parallel to each other.

[0119] The fifth side surface PM_S1 of the lower film PM may be perpendicular to the fifth lower surface PM_DF of the lower film PM. Figure 3 ), the fifth side surface PM_S1 may be perpendicular to the fifth lower surface PM_DF.

[0120] The sixth side surface SP_S1 of the support plate SP may be perpendicular to the sixth lower surface SP_DF of the support plate SP. Figure 3 ), the sixth side surface SP_S1 may be perpendicular to the sixth lower surface SP_DF.

[0121] In the method for manufacturing an electronic device according to an embodiment to be described below, the film to be provided to the preliminary lower film P-PM (see Figure 12 ) and preliminary support plate P-SP (see Figure 12 ) laser LAR (see Figure 12 ). Therefore, the fifth side surface PM_S1 of the lower film PM may be formed perpendicular to the fifth lower surface PM_DF of the lower film PM, and the sixth side surface SP_S1 of the support plate SP may be formed perpendicular to the sixth lower surface SP_DF of the support plate SP. However, the present disclosure is not limited thereto.

[0122] The seventh side surface AD1_S1 of the first adhesive layer AD1 may be inclined relative to the seventh lower surface AD1_DF of the first adhesive layer AD1. Figure 3 ), the seventh side surface AD1_S1 may be inclined relative to the seventh lower surface AD1_DF. The eighth side surface AD2_S1 of the second adhesive layer AD2 may be inclined relative to the eighth lower surface AD2_DF of the second adhesive layer AD2. Figure 3 ), the eighth side surface AD2_S1 may be inclined relative to the eighth lower surface AD2_DF. The ninth side surface AD3_S1 of the third adhesive layer AD3 may be inclined relative to the ninth lower surface AD3_DF of the third adhesive layer AD3. Figure 3 ), the ninth side surface AD3_S1 may be inclined with respect to the ninth lower surface AD3_DF.

[0123] In the first cross-section in the second mode, the seventh side surface AD1_S1 of the first adhesive layer AD1, the eighth side surface AD2_S1 of the second adhesive layer AD2, and the ninth side surface AD3_S1 of the third adhesive layer AD3 may be parallel to each other. In the first cross-section in the second mode, the seventh side surface AD1_S1 of the first adhesive layer AD1, the eighth side surface AD2_S1 of the second adhesive layer AD2, the ninth side surface AD3_S1 of the third adhesive layer AD3, and the first side surface DP_S1 of the display panel DP may be parallel to each other.

[0124] Figure 6 It is along Figure 3 Schematic cross-sectional view taken along line III-III'. Figure 6 It may be a schematic cross-sectional view showing the configuration of the electronic device ED on the second cross-sectional view. In this specification, the second cross-sectional view may be parallel to the thickness direction DR3 and parallel to the first folding axis FX1 (see Figure 3 ) extending in a direction (eg, a first direction DR1).

[0125] refer to Figure 6 The tenth side surface DP_S2 of the display panel DP may be perpendicular to the first lower surface DP_DF of the display panel DP. Figure 3 ) extends in a direction (e.g., the second direction DR2) perpendicular to the direction (e.g., the first direction DR1) extending in the display panel DP. Therefore, the tenth side surface DP_S2 of the display panel DP may not be tilted. As described above, when the electronic device ED is folded, the components constituting the electronic device ED may slide in a direction (e.g., the second direction DR2) perpendicular to the direction (e.g., the first direction DR1) extending in the first folding axis FX1. Since the tenth side surface DP_S2 of the display panel DP is a portion that substantially does not slide during the folding of the electronic device ED, the tenth side surface DP_S2 may not be formed to be tilted.

[0126] Figure 7 1 is a plan view showing the display panel DP. Figure 7In a plan view, the first side surface DP_S1 of the display panel DP may extend in a first direction DR1 parallel to the direction in which the first folding axis FX1 extends. In a plan view, the tenth side surface DP_S2 of the display panel DP may extend in a second direction DR2 perpendicular to the direction in which the first folding axis FX1 extends. In a plan view, the first side surface DP_S1 of the display panel DP may intersect with the tenth side surface DP_S2 of the display panel DP. In the display panel DP, the first side surface DP_S1 (see Figure 5 ) can be relative to the first lower surface DP_DF (see Figure 5 ) is inclined, and the tenth side surface DP_S2 (see Figure 6 ) may be perpendicular to the first lower surface DP_DF (see Figure 6 ).

[0127] Reference again Figure 6 The eleventh side surface PF_S2 of the protective layer PF may be perpendicular to the second lower surface PF_DF of the protective layer PF. The eleventh side surface PF_S2 of the protective layer PF may not be inclined. In a plan view, the eleventh side surface PF_S2 may be perpendicular to the first folding axis FX1 (see FIG. Figure 3 ) extends in a direction (e.g., second direction DR2) perpendicular to the direction (e.g., first direction DR1) in which the electronic device ED extends. As described above, when the electronic device ED is folded, the components constituting the electronic device ED can slide in a direction (e.g., second direction DR2) perpendicular to the direction (e.g., first direction DR1) in which the first folding axis FX1 extends. Since the eleventh side surface PF_S2 of the protective layer PF is a portion that substantially does not slide during folding of the electronic device ED, the eleventh side surface PF_S2 does not need to be formed to be inclined.

[0128] Figure 8 : is a plan view showing the protective layer PF. Figure 8 , in a plan view, the second side surface PF_S1 of the protective layer PF may extend in a direction parallel to the direction extending the first folding axis FX1 (e.g., the first direction DR1). The eleventh side surface PF_S2 of the protective layer PF may extend in a second direction DR2 perpendicular to the direction extending the first folding axis FX1 (e.g., the first direction DR1). In a plan view, the second side surface PF_S1 of the protective layer PF may intersect with the eleventh side surface PF_S2 of the protective layer PF. In the protective layer PF, the second side surface PF_S1 (see Figure 5 ) can be relative to the second lower surface PF_DF (see Figure 5 ) is inclined, and the eleventh side surface PF_S2 (see Figure 6 ) can be perpendicular to the second lower surface PF_DF (see Figure 6 ).

[0129] Reference again Figure 6 , the twelfth side surface WL_S2 of the window WL may be perpendicular to the third lower surface WL_DF of the window WL. In a plan view, the twelfth side surface WL_S2 of the window WL may be perpendicular to the third side surface WL_S1 of the window WL (see Figure 5 )intersect.

[0130] The thirteenth side surface RPL_S2 of the optical layer RPL may be perpendicular to the fourth lower surface RPL_DF of the optical layer RPL. In a plan view, the thirteenth side surface RPL_S2 of the optical layer RPL may be perpendicular to the fourth side surface RPL_S1 of the optical layer RPL (see FIG. 1 ). Figure 5 ) intersects. As described above, when the electronic device ED is folded, the members constituting the electronic device ED can slide in a direction (e.g., a second direction DR2) perpendicular to the direction extending from the first folding axis FX1 (e.g., the first direction DR1). Since the thirteenth side surface RPL_S2 of the optical layer RPL is a portion that does not substantially slide during folding of the electronic device ED, the thirteenth side surface RPL_S2 may not be formed to be inclined.

[0131] The fourteenth side surface PM_S2 of the lower film PM may be perpendicular to the fifth lower surface PM_DF of the lower film PM. In a plan view, the fourteenth side surface PM_S2 of the lower film PM may be perpendicular to the fifth side surface PM_S1 of the lower film PM (see FIG. Figure 5 )intersect.

[0132] The fifteenth side surface SP_S2 of the support plate SP may be perpendicular to the sixth lower surface SP_DF of the support plate SP. In a plan view, the fifteenth side surface SP_S2 of the support plate SP may be perpendicular to the sixth side surface SP_S1 of the support plate SP (see FIG. Figure 5 ) intersect. In a plan view, the fourteenth side surface PM_S2 of the lower film PM may overlap with the fifteenth side surface SP_S2 of the support plate SP. In the thickness direction DR3, the fourteenth side surface PM_S2 of the lower film PM may be parallel to the fifteenth side surface SP_S2 of the support plate SP.

[0133] The sixteenth side surface AD1_S2 of the first adhesive layer AD1 may be perpendicular to the seventh lower surface AD1_DF of the first adhesive layer AD1. In a plan view, the sixteenth side surface AD1_S2 of the first adhesive layer AD1 may be perpendicular to the seventh side surface AD1_S1 of the first adhesive layer AD1 (see FIG. Figure 5 )intersect.

[0134] The seventeenth side surface AD2_S2 of the second adhesive layer AD2 may be perpendicular to the eighth lower surface AD2_DF of the second adhesive layer AD2. In a plan view, the seventeenth side surface AD2_S2 of the second adhesive layer AD2 may be aligned with the eighth side surface AD2_S1 of the second adhesive layer AD2 (see FIG. Figure 5 )intersect.

[0135] The eighteenth side surface AD3_S2 of the third adhesive layer AD3 may be perpendicular to the ninth lower surface AD3_DF of the third adhesive layer AD3. In a plan view, the eighteenth side surface AD3_S2 of the third adhesive layer AD3 may be perpendicular to the ninth lower surface AD3_DF of the third adhesive layer AD3. Figure 5 )intersect.

[0136] Figure 9 It is along Figure 1C A schematic cross-sectional view taken along line XX'. Figure 9 It may be a schematic cross-sectional view showing the configuration of the electronic device ED in the first mode. For example, Figure 9 It may be shown that the electronic device ED is folded so that the first non-folding area NFA1 (see Figure 1A ) in the thickness direction DR3 and the second unfolded area NFA2 (see Figure 1A ) is a schematic cross-sectional view of the configuration of the electronic device ED in an overlapping state. Figure 9 It is schematically shown that when the electronic device ED is folded, sliding may occur in members constituting the electronic device ED (eg, the display panel DP, the optical layer RPL, the protection layer PF, etc.), and these members may move adjacent to the housing HAU.

[0137] Figure 9 The second distance DT2 between the display panel DP and the housing HAU shown in FIG may be shorter than Figure 5 The first distance DT1 between the display panel DP and the housing HAU is shown in FIG. The second distance DT2 may be a distance between the first folding axis FX1 (see FIG. Figure 3 ) in a second direction DR2 perpendicular to the first direction DR1 extending from the electronic device ED. When the electronic device ED is folded, sliding may occur in the display panel DP, and the display panel DP may move adjacent to the housing HAU, resulting in a decrease in the spacing distance (i.e., the second distance DT2) between the display panel DP and the housing HAU. In an embodiment, the electronic device ED may include a display panel DP having an inclined first side surface DP_S1, and thus a space PS for preventing an impact applied to the display panel DP when the display panel DP is folded (see Figure 5 ) can be minimized. Therefore, the electronic device ED according to the embodiment can be minimized by reducing the first peripheral area F-NAA (see Figure 1A ) and show excellent display quality.

[0138] The protection layer PF according to the embodiment may include an inclined second side surface PF_S1, and the optical layer RPL may include an inclined fourth side surface RPL_S1. Therefore, the electronic device ED according to the embodiment may be configured to reduce the first peripheral area F-NAA (see FIG. Figure 1A ) and show excellent display quality.

[0139] In the first mode in which the electronic device ED is folded, the second side surface PF_S1 of the protection layer PF may not be parallel to the first side surface DP_S1 of the display panel DP. In the first mode in which the electronic device ED is folded, the second side surface PF_S1 of the protection layer PF may be positioned further outward than the first side surface DP_S1 of the display panel DP. In the case where the flexibility of the protection layer PF is greater than the flexibility of the display panel DP, slippage may be more likely to occur in the protection layer PF having the greater flexibility. Therefore, in the first mode in which the electronic device ED is folded, the second side surface PF_S1 of the protection layer PF may be positioned further outward than the first side surface DP_S1 of the display panel DP.

[0140] Figure 10 is a schematic cross-sectional view showing an electronic device ED- 1 according to another embodiment of the present disclosure. Figure 10 The electronic device ED-1 may be shown in a manner perpendicular to the first folding axis FX1 (see Figure 3 ) is a schematic cross-sectional view of the configuration on the first section. Figure 10 It can be a schematic cross-sectional view showing the configuration of the electronic device ED-1 in the second mode. For example, Figure 10 The electronic device ED-1 may be shown as unfolded so that the first non-folding area NFA1 (see Figure 1A ) and the second unfolded region NFA2 (see Figure 1A ) is a schematic cross-sectional view of the configuration of the electronic device ED-1 in a spaced-apart state.

[0141] and Figure 5 Compared to the electronic devices shown in ED, Figure 10 The electronic device ED-1 shown in FIG can have differences in the support plate SP-1 and the lower membrane PM-1. Figure 10 In the description, with reference Figures 1A to 9 The same contents as those described above will not be described again, but the following description will focus on the differences.

[0142] refer to Figure 10, the fifth side surface PM_S1a of the lower film PM-1 may be inclined relative to the fifth lower surface PM_DF of the lower film PM-1. The fifth side surface PM_S1a of the lower film PM-1 may be parallel to the first side surface DP_S1 of the display panel DP. In an embodiment, the electronic device ED-1 may include the lower film PM-1 having the inclined fifth side surface PM_S1a, thereby reducing the first peripheral area F-NAA (see Figure 1A ) and exhibits excellent display quality.

[0143] The sixth side surface SP_S1a of the support plate SP-1 may be inclined relative to the sixth lower surface SP_DF of the support plate SP-1. The sixth side surface SP_S1a of the support plate SP-1 may be parallel to the first side surface DP_S1 of the display panel DP. In an embodiment, the electronic device ED-1 may include the support plate SP-1 having the inclined sixth side surface SP_S1a, thereby reducing the first peripheral area F-NAA (see Figure 1A ) and exhibits excellent display quality.

[0144] Figures 5 to 9 The description has been Figure 1A The electronic devices shown in ED are performed, but can also be similarly applied to Figure 2A Description of the electronic device ED-a shown in FIG. Figure 2A The electronic device ED-a shown in FIG may include Figure 3 and Figure 4 The components such as the display panel DP and the protective layer PF shown in FIG. The display panel DP and the protective layer PF may each have a plurality of folding axes parallel to the third folding axis FX3 (see FIG. Figure 2A ) extending in a direction (eg, the first direction DR1) perpendicular to a direction (eg, the second direction DR2). Therefore, by reducing the peripheral area F-NAAa, Figure 2A The electronic device ED-a shown in FIG can exhibit excellent display quality.

[0145] The electronic device according to the embodiment can be manufactured by the method for manufacturing the electronic device according to the embodiment. Figure 11 is a flowchart illustrating a method of manufacturing an electronic device according to an embodiment. Figure 12 is a schematic cross-sectional view schematically illustrating an operation of manufacturing an electronic device according to an embodiment. Figure 13 is a schematic cross-sectional view schematically illustrating an operation of manufacturing an electronic device according to an embodiment. Figure 12 and Figure 13 The operation of manufacturing an electronic device according to an embodiment is schematically shown. Figures 11 to 13In the description of FIG. 1 to FIG. Figure 10 The content described is the same content, but the description will focus on the differences.

[0146] refer to Figure 11 According to an embodiment, a method for manufacturing an electronic device may include: preparing a preliminary lower module (S100); providing a preliminary display panel on the preliminary lower module (S200); providing a window on the preliminary display panel (S300); and forming a display panel by removing an edge area of ​​the preliminary display panel (S400).

[0147] refer to Figure 12 , the preliminary lower module P-LM may include a preliminary supporting plate P-SP and a preliminary lower film P-PM. A preliminary display panel P-DP may be provided on the preliminary lower module P-LM, and a window WL may be provided on the preliminary display panel P-DP. Before providing the window WL, a preliminary third adhesive layer P-AD3, a preliminary optical layer P-RPL, and a preliminary second adhesive layer P-AD2 may be provided in sequence on the preliminary display panel P-DP. A preliminary first adhesive layer P-AD1, a preliminary printing layer P-BM, and a preliminary protective layer P-PF may be provided in sequence on the window WL. Laser LAR may be provided to the preliminary display panel P-DP, the preliminary protective layer P-PF, etc. Laser LAR may be provided to the preliminary display panel P-DP, the preliminary protective layer P-PF, etc. Figure 13 ), display panel DP (see Figure 13 ) etc. are provided. In the following, reference will be made to Figure 12 and Figure 13 Provide a description.

[0148] The laser LAR can be used at an angle θ L Provided to the preliminary display panel P-DP and components disposed above the preliminary display panel P-DP (eg, the optical layer RPL, the protective layer PF, etc.), the angle θ L In the range of about 10° to about 25° with respect to the thickness direction DR3. Considering that the electronic device ED (see Figure 3 ) can change the tilt angle θ of the laser LAR L For example, the laser LAR can be used at a more inclined angle θ L Provided to the electronic equipment ED (see Figure 3 ) is a relatively more flexible component in the component. The laser LAR can be tilted at a smaller angle θ L Provided to the electronic equipment ED (see Figure 3 ) is a relatively small flexible component in the components of electronic equipment. Figure 3) is folded, more sliding occurs in the member with higher flexibility than in the member with lower flexibility, so a larger tilt angle θ can be provided. L Laser LAR.

[0149] Figure 12 The line TR may be an imaginary line parallel to the thickness direction DR3 and is shown to indicate an angle θ L The laser LAR can be tilted at an angle θ L The display panel DP formed by the preliminary display panel P-DP includes an inclined first side surface DP_S1. The laser LAR may be inclined at an angle θ L Provided to the preliminary lower surface DP-DFp of the preliminary display panel P-DP. When the laser LAR is provided, the first edge area RA1 of the preliminary display panel P-DP may be removed, and thereby Figure 13 The first edge area RA1 of the preliminary display panel P-DP may correspond to a portion of the non-folding portions NP1 and NP2 of the preliminary display panel P-DP.

[0150] The preliminary display panel P-DP may be divided into a folding portion FP, a first non-folding portion NP1 adjacent to one side of the folding portion FP, and a second non-folding portion NP2 adjacent to the other side of the folding portion FP. The folding portion FP may correspond to Figure 1A The folding area FA shown in FIG, the first non-folding portion NP1 may correspond to Figure 1A The first non-folding area NFA1 shown in FIG, and the second non-folding part NP2 may correspond to Figure 1A The second non-folding area NFA2 shown in FIG. The folding portion FP can be folded relative to the folding axis FX. The folding axis FX can correspond to Figure 1B The first folding axis FX1 shown in Figure 1D The first edge area RA1 removed by providing the laser LAR may be a portion of the first non-folding portion NP1 and the second non-folding portion NP2.

[0151] The protective layer PF may be formed by removing the second edge region RA2 of the preliminary protective layer P-PF while providing the laser LAR. The laser LAR may be formed at an inclined angle θ L The protective layer PF formed of the preliminary protective layer P-PF includes an inclined second side surface PF_S1. The second edge region RA2 of the preliminary protective layer P-PF may overlap a portion of the non-folding portions NP1 and NP2 of the preliminary display panel P-DP in the thickness direction DR3.

[0152] The lower module LM can be formed by removing edge regions RA3 and RA4 of the preliminary lower module P-LM while applying laser light LAR. The preliminary lower module P-LM may include a preliminary support plate P-SP and a preliminary lower film P-PM. The lower film PM may be formed by removing the third edge region RA3 of the preliminary lower film P-PM. The support plate SP may be formed by removing the fourth edge region RA4 of the preliminary support plate P-SP.

[0153] The laser LAR supplied to the preliminary lower module P-LM may be supplied in a direction parallel to the thickness direction DR3. The laser LAR supplied to the preliminary lower module P-LM may not be tilted. Figure 13 In the lower module LM shown in FIG, the support plate SP and the lower membrane PM may include non-inclined side surfaces SP_S1 and PM_S1, respectively. In another embodiment, the laser LAR is inclined at an angle θ L Provided that the preliminary lower module P-LM can be formed as Figure 10 The support plate SP-1 and the lower membrane PM-1 are shown in FIG.

[0154] The laser light LAR may not be supplied to the window WL. Since the window WL includes a glass substrate, the glass substrate may be damaged when irradiated with the laser light LAR. Therefore, the laser light LAR may not be supplied to the window WL.

[0155] The laser LAR can also be tilted at an angle θ L Provided to the preliminary optical layer P-RPL. Therefore, the optical layer RPL formed by the preliminary optical layer P-RPL may include an inclined fourth side surface RPL_S1. The first adhesive layer AD1, the second adhesive layer AD2, and the third adhesive layer AD3 may be formed by the preliminary first adhesive layer P-AD1, the preliminary second adhesive layer P-AD2, and the preliminary third adhesive layer P-AD3, respectively. The laser LAR may be formed at an inclined angle θ L A preliminary first adhesive layer P-AD1, a preliminary second adhesive layer P-AD2, and a preliminary third adhesive layer P-AD3 are provided. Thus, the first adhesive layer AD1, the second adhesive layer AD2, and the third adhesive layer AD3 may include inclined seventh, eighth, and ninth side surfaces AD1_S1, AD2_S1, respectively. Laser light LAR may be provided to the preliminary printed layer P-BM, and a printed layer BM may be formed from the preliminary printed layer P-BM.

[0156] The method for manufacturing an electronic device according to an embodiment may include forming a component (e.g., a display panel, a protective layer, etc.) constituting the electronic device by providing a laser. The laser may be provided at an angle inclined relative to the thickness direction. Therefore, the electronic device according to the embodiment manufactured by the method for manufacturing an electronic device according to an embodiment may include a display panel having an inclined side surface.

[0157] An electronic device according to an embodiment may include a folding region that is foldable relative to a folding axis, and a side surface of a display panel may be inclined relative to a lower surface of the display panel in a cross section perpendicular to the folding axis. In an embodiment, an electronic device including a display panel having an inclined side surface may have a reduced peripheral area in which an image is not displayed, thereby exhibiting excellent display quality.

[0158] A method for manufacturing an electronic device according to an embodiment may include providing a laser to form a display panel having an inclined side surface, thereby manufacturing the electronic device having a reduced peripheral area.

[0159] The electronic device according to the embodiment may exhibit excellent display quality due to a reduced peripheral area.

[0160] The above description is an example of the technical features of the present disclosure, and those skilled in the art will be able to make various modifications and changes. Therefore, the embodiments of the present disclosure described above can be implemented individually or in combination with each other.

[0161] Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical spirit of the present disclosure, but to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The scope of protection of the present disclosure should be interpreted by the appended claims, and it should be understood that all technical spirits within the equivalent scope are included in the scope of the present disclosure.

Claims

1. An electronic device, characterized in that: The electronic device is divided into a folding area that can be folded about a folding axis extending in one direction, a first non-folding area adjacent to one side of the folding area, and a second non-folding area adjacent to the other side of the folding area, the electronic device comprising: Lower module; a display panel disposed on the lower module; and a window disposed on the display panel, Wherein, in a first cross-sectional view parallel to the thickness direction of the display panel and perpendicular to the folding axis, the first side surface of the display panel is inclined relative to the lower surface of the display panel.

2. The electronic device according to claim 1, wherein In the first cross-sectional view, an angle formed between the first side surface and the lower surface is in the range of 65° to 80°.

3. The electronic device according to claim 1, wherein In a second cross-sectional view parallel to the thickness direction and the folding axis, the second side surface of the display panel is perpendicular to the lower surface of the display panel, and Wherein, in a view perpendicular to the thickness direction, the first side surface of the display panel intersects with the second side surface of the display panel.

4. The electronic device according to claim 1, wherein: Also includes: a protective layer disposed on the window, wherein, in the first cross-sectional view, the first side surface of the protective layer is inclined relative to the lower surface of the protective layer, and Wherein, in the first cross-sectional view, an angle formed between the first side surface of the protective layer and the lower surface of the protective layer is in a range of 65° to 80°.

5. The electronic device according to claim 4, characterized in that In a second cross-sectional view parallel to the thickness direction and the folding axis, the second side surface of the protective layer is perpendicular to the lower surface of the protective layer.

6. The electronic device according to claim 5, characterized in that In a view perpendicular to the thickness direction, the first side surface of the protective layer intersects with the second side surface of the protective layer.

7. The electronic device according to claim 4, wherein: In a first mode, the electronic device is folded so that the first non-folding area overlaps the second non-folding area in the thickness direction, and in a second mode, the electronic device is unfolded so that the first non-folding area is spaced apart from the second non-folding area, and In the second mode, the first side surface of the display panel is parallel to the first side surface of the protection layer, and Wherein, in the first mode, the first side surface of the display panel is not parallel to the first side surface of the protection layer.

8. The electronic device according to claim 1, wherein: The window includes a glass substrate, and In the first cross-sectional view, the side surface of the window is perpendicular to the lower surface of the window.

9. The electronic device according to claim 1, wherein: Also includes: an optical layer disposed between the display panel and the window, Wherein, in the first cross-sectional view, the side surface of the optical layer is inclined relative to the lower surface of the optical layer.

10. The electronic device according to claim 1, wherein The lower module includes a support plate and a lower film disposed between the support plate and the display panel, and Wherein, in the first cross-sectional view, the side surface of the support plate is inclined relative to the lower surface of the support plate.

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