RDT test board

By designing a multi-interface RDT test board and a two-stage step-down solution, the problem of high cost of existing equipment is solved, and efficient testing of multi-spec solid-state drives and cost-reducing effects are achieved.

CN223284746UActive Publication Date: 2025-08-29SHENZHEN CITY TECHWIN SEMICONDUCTOR COMPANY LIMITED
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Patent Information

Application Number
CN202422583361.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-24
Publication Date
2025-08-29
Estimated Expiration
2034-10-24

AI Technical Summary

Technical Problem

Existing RDT testing equipment faces the problem of high equipment costs due to diversity of interfaces, and it is difficult to take into account the testing needs of multiple interfaces.

Method used

An RDT test board was designed, which integrates multiple interfaces through the combination of test upper and lower boards, and achieves two-stage step-down through the USB power module board, reducing equipment costs and improving applicability.

Benefits of technology

Simultaneous testing of SSDs with multiple specifications is realized, reducing testing costs, improving applicability, and improving the durability and reliability of the equipment through efficient step-down.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an RDT test board. The RDT test board comprises a test lower board, a test upper board, a USB power supply module board, isolation columns, fastening screws and connecting ends. The lower testing plate is arranged under the upper testing plate, a plurality of upper mounting holes are formed in the upper testing plate, lower mounting holes are formed in the positions, corresponding to the upper mounting holes, of the lower testing plate respectively, and the isolation columns are inserted into the upper mounting holes and the lower mounting holes and fixed through fastening screws. And the lower test plate is fixedly connected with the upper test plate. According to the utility model, the test upper plate and the test lower plate are combined to form a plurality of interfaces, so that the solid state disks of various different specifications can be tested at the same time, the test cost is reduced, the applicability is improved, the first-stage voltage reduction from DC12V to DC5V is realized through the USB power supply module plate, the second-stage voltage reduction from DC5V to DC3.3 V is realized in cooperation with the test upper plate, the voltage reduction efficiency ratio is high, and the delay is low.
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Description

Technical Field

[0001] The utility model relates to the technical field of testing equipment, in particular to an RDT testing board. Background Art

[0002] The RDT (Reliability Demonstration Testing) test is a reliability and durability test for solid-state drives (SSDs). The principle is to pre-open the card and burn the RDT self-running program, then place the solid-state drive in a temperature-controlled environment, turn on the power, and the RDT self-running program erases, writes, saves, and reads each storage block of the flash memory chip, and generates data. Finally, the card is opened a second time to identify and isolate the bad blocks. The RDT test is a mandatory test item for solid-state drives. Its characteristic is that it only needs to be powered on without connecting the data interface. However, in a high-temperature environment, it has extremely high requirements for the durability of its power supply and test board.

[0003] There are many physical interfaces for solid-state drives, such as 7+15P interface, Mini PCIe (mSATA) interface, M.2 interface, Mini SATA interface, 7P interface, etc. Among them, 7+15P interface, Mini PCIe (mSATA) interface and M.2 interface are mainstream interfaces.

[0004] The current difficulties are that there are many interfaces and the equipment is expensive. How to take all interfaces into account and reduce testing costs is a technical problem that needs to be solved urgently. Utility Model Content

[0005] In view of the above problems, the present invention is proposed to provide an RDT test board that overcomes the above problems or at least partially solves the above problems.

[0006] The utility model provides an RDT test board, which includes: a test lower board, a test upper board, a USB power module board, an isolation column, a fastening screw and a connection end; the test lower board is arranged directly below the test upper board, and a plurality of upper mounting holes are provided on the test upper board, and lower mounting holes are respectively provided at positions corresponding to the upper mounting holes on the test lower board, the isolation column is inserted into the upper mounting hole and the lower mounting hole, and is fixed by a fastening screw, so that the test lower board is fixedly connected to the test upper board; a detachable connection end is provided on one side of the test lower board; and a plurality of USB power module boards are mounted on the test lower board.

[0007] Optionally, the test lower board includes a first circuit board and a lower interface component, and a plurality of groups of the lower interface components are arranged on the first circuit board.

[0008] Optionally, the lower interface component consists of a 7+15P female lower connector and a USB power module female socket, and the 7+15P female lower connector and the USB power module female socket are arranged in parallel and spaced apart.

[0009] Optionally, the length of the test lower plate is 350 mm.

[0010] Optionally, the test upper board includes a second circuit board and an upper interface component, and multiple groups of the upper interface components are arranged at intervals on the second circuit board, and the setting positions and setting quantities of the upper interface components match the setting positions and setting quantities of the upper interface components.

[0011] Optionally, the upper interface component is composed of an M.2 female connector, an mSATA female connector, a 7+15P female upper connector, a 7+15P male connector and a DC5V to DC3.3V circuit component. The M.2 female connector, the mSATA female connector and the 7+15P female upper connector are arranged in parallel at intervals, and the DC5V to DC3.3V circuit component is respectively arranged close to the M.2 female connector, the mSATA female connector and the 7+15P female upper connector.

[0012] Optionally, the M.2 female connector, the mSATA female connector, the 7+15P female upper connector and the DC5V to DC3.3V circuit assembly are arranged above the second circuit board, and the 7+15P male connector is arranged on the second circuit board directly below the 7+15P female upper connector, and the setting position of the 7+15P male connector corresponds to the 7+15P female lower connector, and the 7+15P male connector is plugged into the 7+15P female lower connector, so that the 7+15P female upper connector, the 7+15P male connector and the 7+15P female lower connector are electrically connected in sequence.

[0013] Optionally, the USB power module board is provided with a USB male connector and a DC12V to DC5V circuit component, and the USB power module board is plugged into the USB power module female socket through the USB male connector.

[0014] Optionally, the connection end includes a wiring copper nose, a connecting screw and a cable, the wiring copper nose is welded on the test lower plate, and the cable is screwed onto the wiring copper nose through the connecting screw.

[0015] Optionally, a gasket is sleeved on the connecting screw, and the gasket is arranged between the connecting screw and the cable.

[0016] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0017] The RDT test board of the utility model is formed with multiple interfaces by combining a test upper board and a test lower board, so that multiple solid-state hard drives of different specifications can be tested at the same time, which reduces the test cost and improves the applicability. At the same time, the first-level voltage reduction of DC12V to DC5V is realized through the USB power module board, and the second-level voltage reduction of DC5V to DC3.3V is realized in conjunction with the test upper board, with high voltage reduction efficiency and low delay.

[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic structural diagram of the RDT test board of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of the test board;

[0022] Figure 3 This is a structural diagram of the test board;

[0023] Figure 4 This is a structural diagram of the USB power module board;

[0024] Figure 5 A schematic diagram of the structure of the connection end.

[0025] Description of reference numerals:

[0026] 1. Test lower board; 2. Test upper board; 3. USB power module board; 4. Isolation column; 5. Fastening screws; 6. Connection end; 11. First circuit board; 12. 7+15P female lower connector; 13. USB power module female; 14. Lower mounting hole; 21. Second circuit board; 22. M.2 female connector; 23. mSATA female connector; 24. 7+15P female upper connector; 25. DC5V to DC3.3V circuit assembly; 26. Upper mounting hole; 31. USB male connector; 32. DC12V to DC5V circuit assembly; 61. Wiring copper nose; 62. Gasket; 63. Connecting screws; 64. Cable. DETAILED DESCRIPTION

[0027] Exemplary embodiments of the present disclosure will be described below in more detail with reference to the accompanying drawings.

[0028] In order to enable those skilled in the art to better understand the present invention, the following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. The accompanying drawings show preferred embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] Unless otherwise specified, various raw materials, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0030] Figure 1 This is a schematic diagram of the structure of the RDT test board of the utility model, see Figure 1 As shown, the RDT test board includes a test lower board 1, a test upper board 2, a USB power module board 3, an isolation column 4, a fastening screw 5 and a connection terminal 6; the test lower board 1 is arranged directly below the test upper board 2, and a plurality of upper mounting holes 26 are provided on the test upper board 2. Lower mounting holes 14 are respectively provided at positions corresponding to the upper mounting holes 26 on the test lower board 1, and the isolation column 4 is inserted into the upper mounting hole 26 and the lower mounting hole 14, and is fixed by a fastening screw 5, so that the test lower board 1 is fixedly connected to the test upper board 2; a detachable connection terminal 6 is provided on one side of the test lower board 1, which is electrically connected to an external device through the connection terminal 6; a plurality of the USB power module boards 3 are installed on the test lower board 1; in an embodiment of the utility model, the test upper board 2 is used to provide a 7+15P interface, a Mini PCIe (mSATA) interface, and an M.2 interface, and the test lower board 1 is used to provide a 7+15P interface and a USB interface.

[0031] Figure 2 This is a schematic diagram of the structure of the test lower plate 1, combined with Figure 2 As shown, the test lower board 1 includes a first circuit board 11 and a lower interface component, and multiple groups of the lower interface components are arranged on the first circuit board 11. Figure 2 As shown, for example, there are 15 groups, and the lower interface component is composed of a 7+15P female lower connector 12 and a USB power module female socket 13. The 7+15P female lower connector 12 is arranged in parallel and spaced apart from the USB power module female socket 13. The first circuit board 11 is used to provide physical support and electrical signal transmission functions, and the USB power module board 3 is respectively plugged into the USB power module female socket 13.

[0032] In the embodiment of the present invention, the length of the test lower plate 1 is 350 mm, while taking into account the number of corresponding lower interface components, and the installation operation is convenient within this length range.

[0033] Figure 3 This is a schematic diagram of the structure of the test board 2, combined with Figure 3 As shown, the test upper board 2 includes a second circuit board 21 and an upper interface component. Multiple groups of the upper interface components are spaced apart on the second circuit board 21. The setting positions and setting quantities of the upper interface components match the setting positions and setting quantities of the upper interface components. Figure 3As shown, the upper interface component is, for example, 15 groups, and the upper interface component is composed of an M.2 female connector 22, an mSATA female connector 23, a 7+15P female connector 24, a 7+15P male connector (not shown) and a DC5V to DC3.3V circuit component 25. The M.2 female connector 22, the mSATA female connector 23 and the 7+15P female connector 24 are arranged in parallel at intervals, and the DC5V to DC3.3V circuit component 25 is respectively arranged close to the M.2 female connector 22, the mSATA female connector 23 and the 7+15P female connector 24 to reduce the wiring distance and reduce the power supply voltage drop; the second circuit board 21 is used to provide physical support and electrical signal transmission function; wherein, the M.2 female connector 22, the mSATA female connector 23, the 7+15P female connector 2 4 and the DC5V to DC3.3V circuit component 25 is arranged above the second circuit board 21, the 7+15P male connector is arranged on the second circuit board 21 and is located directly below the 7+15P female upper connector 24, and the setting position of the 7+15P male connector corresponds to the 7+15P female lower connector 12, the 7+15P male connector can be plugged into the 7+15P female lower connector 12, so that the 7+15P female upper connector 24, the 7+15P male connector and the 7+15P female lower connector 12 are electrically connected in sequence to power the 7+15P female upper connector 24 through the 7+15P female lower connector 12; the M.2 female connector 22 and the mSATA female connector 23 provide an M.2 interface and an mSATA interface, respectively; the DC5V to DC3.3V circuit component 25 is used to step down the DC5V input to DC3.3V.

[0034] Figure 4 This is a structural diagram of the USB power module board 3, combined with Figure 4As shown, the USB power module board 3 is provided with a USB male connector 31 and a DC12V to DC5V circuit component 32. The USB power module board 3 is plugged into the USB power module female socket 13 through the USB male connector 31 to achieve electrical connection with the test lower board 1. The DC12V to DC5V circuit component 32 is used to reduce the DC12V input to DC5V, so that it can cooperate with the DC5V to DC3.3V circuit component 25 to achieve two-stage voltage reduction. Even if the DC12V voltage reduction exceeds 10%, it will not affect the DC5V. The voltage difference between DC12V and DC5V is smaller than that between DC24V and DC5V, the voltage reduction efficiency ratio is higher, and the delay is lower. The embodiment of the utility model selects DC12V as the input voltage. Through the detachable installation method of the USB power module board 3, it can be quickly replaced and maintained, thereby improving the anti-interference ability of the function.

[0035] Figure 5 is a structural diagram of the connection end 6, combined with Figure 5 As shown, the connecting end 6 includes a wiring copper nose 61, a gasket 62, a connecting screw 63 and a cable 64. The wiring copper nose 61 is welded on the test lower plate 1, and the cable 64 is screwed to the wiring copper nose 61 through the connecting screw 63; in order to further improve the structural stability of the connection, a gasket 62 is also provided on the connecting screw 63, and the gasket 62 is arranged between the connecting screw 63 and the cable 64; compared with the existing method of directly welding the cable 64 to the test lower plate 1, it can be easily disassembled and assembled, reducing the cost and process difficulty.

[0036] The RDT test board of the present invention is combined with a test upper board 2 and a test lower board 1 to form multiple interfaces, so that multiple solid-state hard drives with different specifications can be tested at the same time, which reduces the test cost and improves the applicability. At the same time, the first-level voltage reduction of DC12V to DC5V is realized through the USB power module board 3, and the second-level voltage reduction of DC5V to DC3.3V is realized in conjunction with the test upper board 2. The voltage reduction efficiency is high and the delay is low. On the other hand, by adjusting the layout of each interface and performing high-density setting, the wiring distance is reduced, and the number of test interfaces can be increased, which has a better application prospect.

[0037] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0038] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various invention aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed approach should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims, the invention aspects lie in less than all of the features of the individual embodiments previously disclosed. Accordingly, the claims that follow the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the invention.

[0039] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. An RDT test board, characterized in that: The RDT test board includes: a test lower board, a test upper board, a USB power module board, an isolation column, a fastening screw and a connection end; the test lower board is arranged directly below the test upper board, and a plurality of upper mounting holes are provided on the test upper board, and lower mounting holes are respectively provided at positions corresponding to the upper mounting holes on the test lower board, the isolation column is inserted into the upper mounting hole and the lower mounting hole, and is fixed by a fastening screw so that the test lower board is fixedly connected to the test upper board; a detachable connection end is provided on one side of the test lower board; a plurality of the USB power module boards are installed on the test lower board.

2. The RDT test board according to claim 1, characterized in that: The test lower board shown includes a first circuit board and a lower interface component, and multiple groups of the lower interface components are arranged on the first circuit board.

3. The RDT test board according to claim 2, characterized in that: The lower interface component consists of a 7+15P female lower connector and a USB power module female socket. The 7+15P female lower connector and the USB power module female socket are arranged in parallel and spaced apart.

4. The RDT test board according to claim 1, wherein: The length of the test lower plate is 350 mm.

5. The RDT test board according to claim 3, characterized in that: The test upper board includes a second circuit board and an upper interface component. Multiple groups of the upper interface components are arranged at intervals on the second circuit board, and the setting positions and setting quantities of the upper interface components match the setting positions and setting quantities of the upper interface components.

6. The RDT test board according to claim 5, characterized in that: The upper interface component consists of an M.2 female connector, an mSATA female connector, a 7+15P female upper connector, a 7+15P male connector and a DC5V to DC3.3V circuit component. The M.2 female connector, the mSATA female connector and the 7+15P female upper connector are arranged in parallel at intervals, and the DC5V to DC3.3V circuit component is respectively arranged close to the M.2 female connector, the mSATA female connector and the 7+15P female upper connector.

7. The RDT test board according to claim 6, characterized in that: The M.2 female connector, the mSATA female connector, the 7+15P female upper connector and the DC5V to DC3.3V circuit assembly are arranged above the second circuit board, the 7+15P male connector is arranged on the second circuit board directly below the 7+15P female upper connector, and the setting position of the 7+15P male connector corresponds to the 7+15P female lower connector. The 7+15P male connector is plugged into the 7+15P female lower connector, so that the 7+15P female upper connector, the 7+15P male connector and the 7+15P female lower connector are electrically connected in sequence.

8. The RDT test board according to claim 3, characterized in that: The USB power module board is provided with a USB male connector and a DC12V to DC5V circuit component, and the USB power module board is plugged into the USB power module female socket through the USB male connector.

9. The RDT test board according to claim 1, characterized in that: The connection end includes a wiring copper nose, a connection screw, and a cable. The wiring copper nose is welded to the test lower plate, and the cable is screwed to the wiring copper nose through the connection screw.

10. The RDT test board according to claim 9, characterized in that: A gasket is also sleeved on the connecting screw, and the gasket is arranged between the connecting screw and the cable.