Chip packaging body

Abstract

The utility model discloses a chip packaging body, and particularly relates to the technical field of chip packaging, which comprises a top packaging cover, a bottom packaging cover arranged outside the lower end of the top packaging cover, a chip base arranged at the upper end of the bottom packaging cover, a chip groove arranged in the middle of the upper end of the chip base, a chip main body arranged inside the chip groove, and a chip cover arranged on the chip main body, a pin limiting groove is formed in the outer side end surface of the chip base; a concave limiting groove is formed in the outer side of the lower end of the chip base. In actual use, the chip pins and the welding support plate can be conveniently installed and fixed in a state that the pin limiting grooves, the concave installation grooves, the chip pins and the welding support plate are correspondingly arranged, and meanwhile, the installation stability of the chip pins and the welding support plate can be effectively improved; therefore, when the chip main body and the chip pins are welded by the welding wire, the stability of the welding support plate is prevented from being influenced, deformation is generated, and the stability of chip packaging is influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and more specifically, to a chip packaging body. Background Art

[0002] Chips, also known as integrated circuits, are a technology that miniaturizes circuits and are typically manufactured on the surface of semiconductor wafers. Chips play a core role in electronic devices, performing a variety of functions such as data processing, storage, control, communication, and sensing. Chips are widely used. From computers and smartphones to cars and medical devices, almost all modern electronic devices rely on chips. Most existing chips use a bare die (wafer) structure. To ensure the chip's lifespan, the chip needs to be packaged. For example, patented technology disclosed in prior art publication No. CN218568051U discloses a chip package comprising one first pin pad pair and two second pin pad pairs. The first pin pad pair is located in the center of the back surface of a substrate, and the two pairs of second pin pad pairs are symmetrically arranged on either side of the first pin pad pair. The package also includes a first extension wire and a second extension wire, which are electrically connected to the second positive electrode pad and the second negative electrode pad, respectively. The first and second extension wires have two ends extending along the sides of the first pin pad pair toward the edge of the front surface of the substrate. The first and second extension wires are electrically connected to the two pairs of second pin pad pairs through conductive through-holes in the substrate. With this structure, electrical connection is more convenient during subsequent use without having to identify the direction.

[0003] When the above device is in use, after the chip packaging is completed, it is not easy to be crushed and damaged, is impact-resistant, has good weather resistance, high reliability, large capacity, and is compatible with more different chips. However, when the chip pins are welded and packaged, the chip pins are easily displaced, thereby affecting the stability of the chip after packaging. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a chip package. The technical problem to be solved by the present invention is: how to increase the stability of chip pin packaging.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a chip package, comprising a top package cover, a bottom package cover provided on the outside of the lower end of the top package cover, a chip base provided on the upper end of the bottom package cover, a chip slot provided in the middle of the upper end of the chip base, a chip body provided in the interior of the chip slot, and a pin limiting groove provided on the outer end surface of the chip base;

[0006] A concave limiting groove is provided on the outer side of the lower end of the chip base, a limiting support plate is provided inside the concave limiting groove, a concave mounting groove is provided on the lower end of the limiting support plate, and chip pins are provided inside the concave mounting groove.

[0007] In a preferred embodiment, a welding support plate is provided on one side of the upper end of the chip pins, and a welding wire is provided on the outer side of the upper end of the chip body.

[0008] In a preferred embodiment, the chip pins and the bonding wires are both provided in plural numbers and are arranged in a mirror image on both sides of a vertical central axis in a top view of the top package cover.

[0009] In a preferred embodiment, the outer end surface of the chip base in the top view direction is coplanar with the outer end surface of the limiting support plate in the top view direction, and the outer end surface of the chip body is matched with the inner end surface of the chip slot.

[0010] In a preferred embodiment, the inner end surface of the pin limiting groove is matched with the outer end surface of the chip pin, and the outer end surface of the chip pin is matched with the outer end surface of the concave mounting groove.

[0011] In a preferred embodiment, the inner end surface of the concave limiting groove is matched with the outer end surface of the limiting support plate, and the cross-section of the chip pins and the welding support plate in the main viewing direction is arranged in a C-shape.

[0012] The technical effects and advantages of this utility model are:

[0013] When the utility model is actually used, the chip pins and the welding support plate can be conveniently installed and fixed by correspondingly setting the pin limiting grooves, the concave mounting grooves, the chip pins and the welding support plate. At the same time, the stability of the installation of the chip pins and the welding support plate can be effectively increased, thereby avoiding that when the welding line is used to weld the chip body and the chip pins, the stability of the welding support plate is affected and deformation occurs, thereby affecting the stability of the chip package. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 This is a schematic diagram of the overall main cross-sectional structure of the utility model.

[0016] Figure 3 This is a schematic diagram of the overall connection structure of the utility model.

[0017] Figure 4 This is a schematic diagram of the connection structure of the limiting support plate of the utility model.

[0018] The figures are marked as: 1 top packaging cover, 2 bottom packaging cover, 3 chip pins, 4 welding support plate, 5 limit support plate, 6 chip base, 7 chip slot, 8 welding line, 9 chip body, 10 pin limit slot, 11 concave mounting slot, 12 concave limit slot. DETAILED DESCRIPTION

[0019] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of this disclosure will be more comprehensive and complete, and will fully convey the concepts of the example embodiments to those skilled in the art. The accompanying drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. Identical reference numerals in the figures indicate identical or similar parts, and thus repeated descriptions thereof will be omitted.

[0020] In addition, the described features, structures or characteristics can be combined in any suitable manner in one or more example embodiments. In the following description, many specific details are provided to provide a full understanding of the example embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced while omitting one or more of the specific details, or other methods, components, steps, etc. can be adopted. In other cases, well-known structures, methods, implementations or operations are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

[0021] The utility model provides a chip package, such as Figure 1 and 2 As shown, it includes a top packaging cover 1, a bottom packaging cover 2 is provided on the outside of the lower end thereof, a chip base 6 is provided on the upper end of the bottom packaging cover 2, a welding support plate 4 is provided on one side of the upper end of the chip pin 3, the outer end surface of the chip base 6 in the top view direction and the outer end surface of the limiting support plate 5 in the top view direction are arranged in a coplanar state, and the cross-section of the chip pin 3 and the welding support plate 4 in the main viewing direction is arranged in a C-shaped state.

[0022] like Figure 3 and 4 As shown, a chip slot 7 is provided in the middle of the upper end of the chip base 6, a chip body 9 is provided inside the chip slot 7, a pin limiting slot 10 is provided on the outer end surface of the chip base 6, and a concave limiting slot 12 is provided on the outer side of the lower end of the chip base 6;

[0023] A limiting support plate 5 is provided inside the concave limiting groove 12, which can facilitate the installation and fixation of the limiting support plate 5, thereby facilitating the installation of the chip pins 3, thereby ensuring stability when welding the welding support plate 4, welding 8 and the chip body 9. A concave mounting groove 11 is provided at the lower end of the limiting support plate 5, and the chip pins 3 are provided inside the concave mounting groove 11. A welding line 8 is provided on the outer side of the upper end of the chip body 9. The number of chip pins 3 and welding lines 8 is multiple, and they are arranged in a mirror image on both sides of the vertical central axis of the top packaging cover 1 in the top view direction;

[0024] The outer end face of the chip body 9 is adapted to the inner end face of the chip slot 7, the inner end face of the pin limiting slot 10 is adapted to the outer end face of the chip pin 3, the outer end face of the chip pin 3 is adapted to the outer end face of the concave mounting slot 11, and the inner end face of the concave limiting slot 12 is adapted to the outer end face of the limiting support plate 5.

[0025] Working principle of this utility model:

[0026] When using the present invention, the staff installs the chip pin 3 on the inner end face of the concave mounting groove 11, and fits the chip pin 3 with the inner end face of the limiting support plate 5. Then the staff places the chip base 6 on the upper end of the limiting support plate 5. Then the staff can insert the welding support plate 4 into the pin limiting groove 10, and put the limiting support plate 5 on the outer end face of the concave limiting groove 12. Then the staff can place the chip body 9 inside the chip groove 7. Then the staff can weld and fix the welding support plate 4 and the chip body 9 through the welding wire 8. Then the staff can encapsulate the top packaging cover 1 and the bottom packaging cover 2 on the outer end face of the chip body 9.

[0027] Finally, a few points should be explained: the drawings of the embodiments disclosed in this utility model only involve structures related to the embodiments disclosed in this utility model. Other structures can refer to common designs. In the absence of conflicts, the same embodiment and different embodiments of the utility model can be combined with each other.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip package, characterized in that: include: A top packaging cover (1) is provided with a bottom packaging cover (2) on the outside of its lower end, a chip base (6) is provided on the upper end of the bottom packaging cover (2), a chip slot (7) is provided in the middle of the upper end of the chip base (6), a chip body (9) is provided inside the chip slot (7), and a pin limiting slot (10) is provided on the outer end surface of the chip base (6); A concave limiting groove (12) is provided on the outer side of the lower end of the chip base (6), a limiting support plate (5) is provided inside the concave limiting groove (12), a concave mounting groove (11) is provided on the lower end of the limiting support plate (5), and a chip pin (3) is provided inside the concave mounting groove (11).

2. The chip package according to claim 1, wherein: A welding support plate (4) is provided on one side of the upper end of the chip pin (3), and a welding line (8) is provided on the outer side of the upper end of the chip body (9).

3. The chip package according to claim 2, wherein: The chip pins (3) and welding wires (8) are both provided in plural numbers and are arranged in a mirror image state on both sides of the vertical central axis in the top packaging cover (1) in the top view direction.

4. The chip package according to claim 1, wherein: The outer end surface of the chip base (6) in the top view direction and the outer end surface of the position limiting support plate (5) in the top view direction are arranged in a coplanar state, and the outer end surface of the chip body (9) is adapted to the inner end surface of the chip slot (7).

5. The chip package according to claim 1, wherein: The inner end surface of the pin limiting groove (10) is matched with the outer end surface of the chip pin (3), and the outer end surface of the chip pin (3) is matched with the outer end surface of the concave mounting groove (11).

6. The chip package according to claim 2, wherein: The inner end surface of the concave limiting groove (12) is adapted to the outer end surface of the limiting support plate (5), and the chip pins (3) and the welding support plate (4) are arranged in a C-shaped state in a cross section in the main viewing direction.

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