Anti-static heat-dissipation chip protection device of unmanned mine car

Abstract

The utility model relates to an anti-static heat-dissipation chip protection device of an unmanned mine car. The anti-static heat-dissipation chip protection device comprises a shell and a fan. A circuit board can be detachably arranged in an inner cavity of the shell, and the chip is fixed to the circuit board. A fan is detachably arranged in the shell, and heat dissipation holes are formed in the shell. The inner wall and the outer wall of the shell are both provided with anti-static coatings. The chip protection device has the beneficial effects that the impedance layers formed by the anti-static coatings arranged on the inner wall and the outer wall of the shell can reduce accumulation and release of electrostatic charges, so that the whole chip protection device has conductive performance, and the chip is prevented from being influenced by static electricity. And meanwhile, the fan can dissipate heat of the chip, so that the chip is prevented from being damaged due to overheating.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to an anti-static and heat-dissipating chip protection device. Background Art

[0002] Unmanned mining vehicles have a wide range of applications. They perform autonomous navigation, data collection, and processing in mining environments. Their chip processing modules must operate under high loads for extended periods. Consequently, chip overheating is a common problem, impacting chip performance and data processing speed, and shortening the chip's lifespan. Frequent chip overheating not only affects the vehicle's stable operation but can also cause sudden failures of the chip processing module, increasing maintenance costs and downtime.

[0003] Static electricity accumulation is also a significant factor affecting chip stability. Mining environments are dusty and dry, creating static electricity. Static electricity discharge not only accelerates chip aging but can also cause short circuits or other malfunctions.

[0004] Therefore, there is an urgent need for a chip protection device that can simultaneously dissipate heat and prevent static electricity for the chip. Utility Model Content

[0005] (1) Technical issues to be resolved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an anti-static and heat-dissipating chip protection device, which can dissipate heat and prevent static electricity for the chip at the same time.

[0007] (2) Technical solution

[0008] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0009] The present invention provides an anti-static and heat-dissipating chip protection device, comprising a housing and a fan;

[0010] The inner cavity of the housing can be detachably provided with a circuit board, and the chip is fixed on the circuit board;

[0011] The fan is detachably mounted inside the housing, and heat dissipation holes are provided on the housing.

[0012] The inner wall and the outer wall of the shell are both provided with antistatic coatings.

[0013] According to the utility model, it also includes a heat sink;

[0014] The circuit board is detachably fixed to the bottom of the inner wall of the housing;

[0015] The heat sink is attached to the top of the chip and is detachably fixed to the circuit board. The top surface of the heat sink is an inclined surface, and the heat sink is located below the fan.

[0016] The heat dissipation holes include air inlet holes provided on the top wall of the shell and air outlet holes provided on the side wall of the shell;

[0017] The heat sink can guide the airflow entering through the air inlet to flow through the top surface of the heat sink and then be discharged through the air outlet.

[0018] According to the present invention, the middle portion of the top surface of the heat sink is protruding and both sides are inclined downward;

[0019] The air outlet holes are provided on two opposite side walls of the shell;

[0020] Both sides of the heat sink correspond to the two air outlet holes one by one.

[0021] According to the utility model, the air inlet is located above the fan.

[0022] According to the present invention, there are a plurality of air outlet holes, and the plurality of air outlet holes are arranged at intervals on the side wall of the shell.

[0023] According to the utility model, the antistatic coating is an antistatic mixed coating of polyaniline and epoxy resin, and the thickness of the antistatic coating is 0.025-0.075 mm.

[0024] According to the present invention, the housing includes a bottom plate and a cover body, the cover body is detachably connected to the top of the bottom plate, and the bottom plate and the cover body enclose the inner cavity;

[0025] The circuit board is detachably fixed to the base plate;

[0026] The fan is detachably fixed to the bottom of the cover.

[0027] According to the present invention, the cover is detachably connected to the base plate by screws;

[0028] The circuit board is detachably connected to the base plate by screws;

[0029] The fan is detachably connected to the cover body via screws.

[0030] According to the present invention, the inner cavity of the housing can accommodate a plurality of circuit boards in parallel and at intervals, and each circuit board is provided with a corresponding chip;

[0031] There are multiple fans, and the multiple fans are arranged above the multiple chips in a one-to-one correspondence.

[0032] According to the present invention, a data transmission interface and a power supply interface are provided on the side wall of the shell, and both the data transmission interface and the power supply interface are electrically connected to the circuit board.

[0033] (3) Beneficial effects

[0034] The beneficial effects of the present invention are as follows: the anti-static and heat-dissipating chip protection device of the present invention places the circuit board and chip within the inner cavity of the housing. When the chip is operating, the impedance layer formed by the anti-static coating provided on the inner and outer walls of the housing can reduce the accumulation and release of static charge, thereby making the entire chip protection device conductive and protecting the chip from static electricity. At the same time, the fan can cool the chip to prevent the chip from overheating and damage, and the fan is disposed within the housing to reduce the overall volume of the chip protection device. Furthermore, the circuit board and fan are detachably disposed within the housing for easy loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the assembly of the anti-static and heat-dissipating chip protection device of the present invention;

[0036] Figure 2 for Figure 1 Schematic diagram of the decomposition (the top surface of the heat sink is a slope);

[0037] Figure 3 for Figure 1 Schematic diagram from another perspective (the top surface of the heat sink is a slope);

[0038] Figure 4 for Figure 1 Schematic diagram of the exploded middle cover and bottom plate;

[0039] Figure 5 for Figure 1 Schematic diagram of the decomposition (the middle of the top surface of the heat sink protrudes and the two sides are inclined downward);

[0040] Figure 6 for Figure 1 Schematic diagram of another perspective decomposition (the middle part of the top surface of the heat sink protrudes and the two sides tilt downward).

[0041] [Description of Reference Numerals]

[0042] 1: Shell; 11: Cover; 12: Bottom plate; 13: Air inlet; 14: Air outlet; 15: Interface;

[0043] 2: Fan;

[0044] 3: heat sink;

[0045] 4: Circuit board;

[0046] 5: Chip. DETAILED DESCRIPTION

[0047] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Figure 2 The orientation is referenced.

[0048] See also Figure 1-6 The anti-static and heat-dissipating chip protection device proposed in the embodiment of the present invention includes a housing 1 and a fan 2.

[0049] The inner cavity of the housing 1 can be detachably provided with a circuit board 4, and the chip 5 is fixed on the circuit board 4. The inner cavity of the housing 1 can be detachably provided with a fan 2, and heat dissipation holes are provided on the housing 1. The inner and outer walls of the housing 1 are provided with an antistatic coating.

[0050] This chip protection device places the circuit board 4 and chip 5 in the inner cavity of the housing 1. When the chip 5 is in operation, the impedance layer formed by the antistatic coating provided on the inner and outer walls of the housing 1 can reduce the accumulation and release of electrostatic charges, so that the chip protection device as a whole has conductive properties and prevents the chip from being affected by static electricity. At the same time, the fan 2 can cool the chip 5 with air, preventing the chip 5 from overheating and damage, and can also reduce the heat dissipation power consumption of the chip 5. The fan 2 is arranged inside the housing to reduce the overall volume of the chip protection device. Furthermore, the circuit board 4 and the fan 2 can be detachably arranged inside the housing 1 for easy loading and unloading.

[0051] Specifically, the chip 5 is fixed on a slot of the circuit board 4 .

[0052] Furthermore, the antistatic coating is an antistatic mixed coating of polyaniline and epoxy resin. Specifically, the antistatic coating is a mixed coating of polyaniline and epoxy resin in a 1:1 ratio.

[0053] Specifically, the thickness of the antistatic coating is 0.025-0.075 mm, so that the housing 1 has an antistatic effect and is easy to dry after the antistatic coating is applied.

[0054] Furthermore, the chip protection device further includes a heat sink 3 .

[0055] Circuit board 4 is removably fixed to the bottom of the inner wall of housing 1. Heat sink 3 is attached to the top of chip 5 and removably fixed to circuit board 4. The top surface of heat sink 3 is inclined, and heat sink 3 is located below fan 2. The heat dissipation holes include air inlet holes 13 on the top wall of housing 1 and air outlet holes 14 on the side walls of housing 1.

[0056] The heat sink 3 can guide the airflow entering through the air inlet 13 on the top wall of the shell 1 to flow through the inclined top surface of the heat sink 3 and then be discharged from the air outlet 14 on the side wall of the shell 1, so as to increase the airflow velocity flowing through the heat sink 3 and thereby improve the heat dissipation performance of the chip 5.

[0057] Preferably, the middle portion of the top surface of the heat sink 3 is protruding and the two sides are inclined downward. Air outlet holes 14 are provided on the opposite side walls of the housing 1. There are two air outlet holes 14 corresponding to each other on both sides of the heat sink 3.

[0058] The heat sink 3 can guide the airflow entering through the air inlet hole 13 to flow through the top surface of the heat sink 3 to both sides and be discharged through the air outlet holes 14 on the opposite side walls of the shell 1, so as to increase the flow rate of the airflow flowing through the heat sink 3 while making the flow rate of the airflow flowing through both sides of the top surface of the heat sink 3 similar, thereby improving the heat dissipation uniformity of the heat sink 3 and further improving the heat dissipation uniformity of the chip 5.

[0059] Specifically, there are a plurality of air outlet holes 14 , which are spaced apart on the side wall of the housing 1 to facilitate the circulation of air.

[0060] Furthermore, the housing 1 includes a bottom plate 12 and a cover 11 .

[0061] The cover body 11 is detachably connected to the top of the bottom plate 12 , and the bottom plate 12 and the cover body 11 enclose an inner cavity.

[0062] The circuit board 4 is detachably fixed to the bottom plate 12. The fan 2 is detachably fixed to the bottom of the cover 11 for easy assembly and disassembly and maintenance.

[0063] Optionally, the cover 11 is detachably connected to the base plate 12 by screws, the circuit board 4 is detachably connected to the base plate 12 by screws, and the fan 2 is detachably connected to the cover 11 by screws.

[0064] Preferably, the inner cavity of the housing 1 can accommodate a plurality of circuit boards 4 spaced apart in parallel, and a chip 5 is correspondingly provided on each circuit board 4 .

[0065] There are multiple fans 2 , and the multiple fans 2 are arranged above the multiple chips 5 in a one-to-one correspondence to dissipate heat for the multiple chips 5 at the same time.

[0066] Specifically, the fan 2 is detachably fixed to the bottom of the cover 11 through a hollow bracket 21 .

[0067] Specifically, the air inlet 13 is located above the fan 2 to shorten the distance between the air inlet 13 and the fan 2 so that the external air flow is introduced into the interior of the housing 1 through the air inlet 13 when the fan 2 is running.

[0068] Preferably, when there are multiple fans 2, there are also multiple air inlet holes 13, and multiple fans 2 correspond one to one with multiple air inlet holes 13, so that when each fan 2 is running, the external air flow is introduced into the interior of the shell 1 through the corresponding air inlet hole 13.

[0069] More preferably, the number of the circuit board 4, the chip 5, the fan 2 and the air inlet 13 is three, which can meet the actual working conditions.

[0070] Furthermore, a plurality of interfaces 15 are provided on the side wall of the housing 1 , including a data transmission interface and a power supply interface. Both the data transmission interface and the power supply interface are electrically connected to the circuit board 4 to facilitate data transmission and charging.

[0071] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0072] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An anti-static and heat-dissipating chip protection device for an unmanned mining vehicle, characterized in that: It comprises a housing (1) and a fan (2); The inner cavity of the housing (1) can be detachably provided with a circuit board (4), and the chip (5) is fixed on the circuit board (4); The fan (2) is detachably arranged inside the housing (1), and heat dissipation holes are provided on the housing (1); The inner wall and the outer wall of the housing (1) are both provided with antistatic coatings; and further comprising a heat sink (3); The circuit board (4) is detachably fixed to the bottom of the inner wall of the housing (1); The heat sink (3) is attached to the top of the chip (5) and is detachably fixed to the circuit board (4); the middle portion of the top surface of the heat sink (3) is protruding and both sides are inclined downward, and the heat sink (3) is located below the fan (2); The heat dissipation holes include an air inlet hole (13) provided on the top wall of the housing (1) and an air outlet hole (14) provided on opposite side walls of the housing (1); two sides of the heat sink (3) correspond to the two air outlet holes (14) one by one; The heat sink (3) can guide the airflow entering through the air inlet (13) on the top wall of the shell (1) to flow through the top surface of the heat sink (3) toward both sides and then be discharged through the air outlet (14) on the two side walls of the shell (1).

2. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: The air inlet (13) is located above the fan (2).

3. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: The air outlet holes (14) are provided in a plurality, and the plurality of air outlet holes (14) are arranged at intervals on the side wall of the housing (1).

4. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: The thickness of the antistatic coating is 0.025-0.075 mm.

5. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: The housing (1) comprises a bottom plate (12) and a cover body (11), wherein the cover body (11) is detachably connected to the top of the bottom plate (12), and the bottom plate (12) and the cover body (11) enclose the inner cavity; The circuit board (4) is detachably fixed on the base plate (12); The fan (2) is detachably fixed to the bottom of the cover (11).

6. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 5, characterized in that: The cover (11) is detachably connected to the base plate (12) by screws; The circuit board (4) is detachably connected to the base plate (12) via screws; The fan (2) is detachably connected to the cover (11) via screws.

7. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: The inner cavity of the housing (1) is capable of placing a plurality of circuit boards (4) in parallel and at intervals, and each circuit board (4) is provided with a corresponding chip (5); The number of fans (2) provided is multiple, and the multiple fans (2) are provided above the multiple chips (5) in a one-to-one correspondence.

8. The anti-static and heat-dissipating chip protection device for an unmanned mining vehicle according to claim 1, characterized in that: A data transmission interface and a power supply interface are provided on the side wall of the housing (1), and both the data transmission interface and the power supply interface are electrically connected to the circuit board (4).

Images