Semiconductor laser

Abstract

The utility model relates to the technical field of lasers, in particular to a semiconductor laser. The semiconductor laser provided by the utility model comprises a housing, a COS, a pedestal and a heat radiation device. Wherein a containing cavity with an opening in the upper end is formed in the shell, a mounting hole which penetrates through the bottom wall and is communicated with the containing cavity is formed in the bottom wall of the containing cavity, the base is mounted on the heat dissipation device and located in the mounting hole, and the heat dissipation device is located on the outer side of the containing cavity; as the base is mounted in the mounting hole and does not occupy the internal space of the accommodating cavity, miniaturization and integration of the semiconductor laser can be realized; and meanwhile, heat generated when the COS works is directly transferred to the heat dissipation device through the base, and heat of the base does not need to be transferred to the heat dissipation device through the bottom wall of the shell, so that the heat transfer efficiency can be improved, and the heat dissipation effect is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a semiconductor laser. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, long life, low power consumption, good reliability and small size. Therefore, they are widely used in technical fields such as laser processing of precision mechanical parts, printing industry and medicine.

[0003] The main component of a semiconductor laser is a COS (Chip on Substrate), where the laser chip is directly packaged on a heat sink. To ensure the normal operation of a semiconductor laser, the temperature of the laser chip must be strictly controlled within a certain range. Otherwise, the laser chip will not work properly and the desired laser light will not be produced. However, the laser chip generates a large amount of heat during operation. As the semiconductor laser operates, the temperature of the laser chip will continue to rise. If the temperature of the laser chip cannot be effectively reduced, the semiconductor laser will not work.

[0004] Existing semiconductor lasers typically include a housing, a base, and a COS. The housing forms a cavity, the base is located within the housing, and the COS is mounted on the base. The base transfers heat to the housing, which then transfers it to the outside of the cavity for dissipation. However, the base and other components located within the housing occupy a significant amount of space within the housing, increasing the size of the semiconductor laser and hindering its integration and miniaturization. Furthermore, the base dissipates heat outward through the housing, resulting in poor heat transfer and thus impacting heat dissipation. Utility Model Content

[0005] (1) The technical problem to be solved by the present invention is that: the existing semiconductor laser has a base arranged in a shell, and the COS transfers heat to the shell through the base, and dissipates heat to the outside through the shell, which has the disadvantages of occupying a large space and having a poor heat dissipation effect.

[0006] (2) Technical solution

[0007] In order to solve the above technical problems, an embodiment of the present invention provides a semiconductor laser, comprising a housing, a COS, a base and a heat sink, wherein the base is mounted on the upper end of the heat sink;

[0008] A receiving cavity with an upper end opening is formed in the shell, and a mounting hole penetrating the bottom wall of the shell is formed;

[0009] The base is installed in the installation hole, the COS is installed on the base and located in the accommodating cavity; and the heat dissipation device is located outside the accommodating cavity.

[0010] According to an embodiment of the present invention, the heat dissipation device includes a heat dissipation plate and a first heat dissipation fin group, the base is installed on the upper surface of the heat dissipation plate, and the first heat dissipation fin group is installed on the lower surface of the heat dissipation plate.

[0011] According to an embodiment of the present invention, a limiting groove is formed on the outer wall surface of the bottom wall of the shell at a position corresponding to the mounting hole, and the heat sink is embedded in the limiting groove; and the heat sink is detachably connected to the bottom wall of the shell.

[0012] According to one embodiment of the present invention, the first heat sink group includes a plurality of first heat sink fins, the upper ends of the plurality of first heat sink fins are respectively connected to the lower surface of the heat sink, and the lower ends form pointed ends; and the plurality of first heat sink fins are arranged at intervals and parallel to each other.

[0013] According to one embodiment of the present utility model, a first fixing groove with an upper opening is provided in the accommodating cavity, and the semiconductor laser further includes a fixing block and a glass tube. A second fixing groove with an upper opening is formed on the fixing block, the glass tube is embedded in and fixed in the second fixing groove, and the fixing block is embedded in the first fixing groove.

[0014] According to one embodiment of the present invention, the glass tube has a first end and a second end opposite to each other, and the first end is higher than the second end;

[0015] A light inlet communicating with the second fixing groove is provided on the side wall of the fixing block, and the first end of the glass tube is arranged corresponding to the light inlet; a light outlet is provided on the shell, and the second end is arranged corresponding to the light outlet.

[0016] According to one embodiment of the present invention, a first groove is formed on the outer side wall of the housing near the first fixing groove;

[0017] A plurality of first protrusions extending along the height direction of the shell are provided in the first groove. The plurality of first protrusions are arranged at intervals and parallel to each other, and a first flow guide gap is formed between two adjacent first protrusions.

[0018] According to one embodiment of the present invention, a second groove is formed on the outer bottom wall of the housing near the first fixing groove;

[0019] A plurality of second protrusions extending along the width direction of the housing are provided in the second groove. The plurality of second protrusions are arranged at intervals and parallel to each other, and a second guide gap is formed between two adjacent second protrusions.

[0020] According to an embodiment of the present invention, the first protrusions and the second protrusions are arranged in a one-to-one correspondence; the first flow guide gaps and the second flow guide gaps are arranged in a one-to-one correspondence and are connected to each other.

[0021] According to one embodiment of the present utility model, a stray light absorption mechanism is further provided in the shell, and a first notch is provided on the bottom wall of the shell near the stray light absorption mechanism, and a plurality of third heat dissipation fins arranged at intervals and parallel to each other are provided in the first notch, and the third heat dissipation fins extend along the height direction of the shell; a third guide gap is formed between two adjacent third heat dissipation fins.

[0022] According to one embodiment of the present invention, the semiconductor laser comprises a plurality of bases, and the bases, the heat sinks and the mounting holes are arranged in a one-to-one correspondence;

[0023] The plurality of mounting holes are arranged at intervals, and a reinforcement block protruding downward is provided on the outer bottom wall of the shell between two adjacent mounting holes.

[0024] According to one embodiment of the present invention, the side walls of the reinforcement block facing the two mounting holes on both sides form inclined guide surfaces, and the distance between the two guide surfaces gradually increases from bottom to top. The guide surfaces are used to guide the airflow to the mounting holes.

[0025] According to an embodiment of the present invention, the semiconductor laser further comprises a cover plate, the cover plate covers the open end of the accommodating cavity, and a second heat sink group is provided on the upper surface of the cover plate.

[0026] According to one embodiment of the present invention, the second heat sink group includes a plurality of second heat sink fins, the lower ends of the plurality of second heat sink fins are respectively connected to the upper surface of the cover plate, and the plurality of second heat sink fins are spaced apart and parallel to each other.

[0027] According to an embodiment of the present invention, a light absorption area is provided on the lower surface of the cover plate at a position corresponding to the first fixing groove, and a plurality of light absorption grooves are provided in the light absorption area at intervals.

[0028] The beneficial effects of the present invention are as follows: the semiconductor laser provided by the present invention includes a shell, a COS, a base and a heat dissipation device; a housing cavity with an upper opening is formed in the shell, a mounting hole penetrating the bottom wall and communicating with the housing cavity is formed on the bottom wall of the housing cavity, the base is mounted on the heat dissipation device and located in the mounting hole, and the heat dissipation device is located outside the housing cavity; since the base is mounted in the mounting hole and does not occupy the internal space of the housing cavity, the miniaturization and integration of the semiconductor laser can be achieved; at the same time, the heat generated by the COS during operation is directly transferred to the heat dissipation device through the base, and the heat of the base does not need to be transferred to the heat dissipation device through the bottom wall of the shell, thereby improving the heat dissipation efficiency and enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A three-dimensional diagram of a semiconductor laser provided in one embodiment of the present utility model;

[0031] Figure 2 A schematic diagram of the exploded structure of a semiconductor laser provided in one embodiment of the present utility model;

[0032] Figure 3 A three-dimensional diagram of a housing provided in one embodiment of the present invention from one viewing angle;

[0033] Figure 4 for Figure 3 A magnified view of part A;

[0034] Figure 5 A three-dimensional diagram of a housing provided in another embodiment of the present invention;

[0035] Figure 6 for Figure 5 A magnified view of part B;

[0036] Figure 7 for Figure 5 Magnified view of part C;

[0037] Figure 8 A three-dimensional view of a cover plate provided in one embodiment of the present invention;

[0038] Figure 9 A three-dimensional view of a cover plate provided in another embodiment of the present invention;

[0039] Figure 10 A schematic structural diagram of a heat dissipation device provided in one embodiment of the present invention;

[0040] Figure 11 This is a structural diagram of a fixing block provided in one embodiment of the utility model.

[0041] Icons: 1-semiconductor laser; 11-housing; 111-accommodation cavity; 1111-first fixing groove; 1112-fixing block; 11121-second fixing groove; 11122-glue dispensing groove; 1113-glass tube; 1114-baffle; 1115-COS; 1116-base;

[0042] 112 - stray light absorption mechanism; 113 - mounting hole; 1131 - limiting groove; 114 - first groove; 1141 - first protrusion; 115 - second groove; 1151 - second protrusion; 116 - notch; 1161 - third heat dissipation fin; 117 - reinforcement block; 1171 - guide surface;

[0043] 12-cover plate; 121-light absorption area; 1211-light absorption groove; 122-second heat sink group; 1221-second heat sink fin;

[0044] 13-heat dissipation device; 131-heat dissipation plate; 132-first heat dissipation fin group; 1321-chamfered portion; 1322-first heat dissipation fin. DETAILED DESCRIPTION

[0045] In order to more clearly understand the above-mentioned purposes, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0046] like Figures 1 to 11 As shown, one embodiment of the present invention provides a semiconductor laser 1, including a shell 11, a COS1115, a base 1116 and a heat dissipation device 13, wherein the base 1116 is installed at the upper end of the heat dissipation device 13; a receiving cavity 111 with an upper end opening is formed in the shell 11, and a mounting hole 113 passing through the bottom wall of the shell 11 is formed, the base 1116 is installed in the mounting hole 113, the COS1115 is installed on the base 1116, and is located in the receiving cavity 111; the heat dissipation device 13 is located outside the receiving cavity 111.

[0047] The semiconductor laser 1 provided by the present invention includes a shell 11, a COS1115, a base 1116 and a heat sink 13; wherein a accommodating cavity 111 with an upper end opening is formed in the shell 11, and a mounting hole 113 penetrating the bottom wall and communicating with the accommodating cavity 111 is formed on the bottom wall of the accommodating cavity 111, the base 1116 is mounted on the heat sink 13 and located in the mounting hole 113, and the heat sink 13 is located outside the accommodating cavity 111; since the base 1116 is mounted in the mounting hole 113 and does not occupy the internal space of the accommodating cavity 111, the semiconductor laser 1 can be miniaturized and integrated; at the same time, the heat generated by the COS1115 during operation is directly transferred to the heat sink 13 through the base 1116, and the heat of the base 1116 does not need to pass through the bottom wall of the shell 11 to be transferred to the heat sink 13, thereby improving the heat dissipation efficiency and enhancing the heat dissipation effect.

[0048] According to one embodiment of the present invention, Figure 1 、 Figure 2 and Figure 10 As shown, the heat dissipation device 13 includes a heat sink 131 and a first heat sink group 132. The base 1116 is mounted on the upper surface of the heat sink 131, and the first heat sink group 132 is mounted on the lower surface of the heat sink 131. The heat generated by the COS 1115 during operation is directly transferred to the base 1116, which is mounted on the upper surface of the heat sink 131. Therefore, the heat can be transferred directly to the heat sink 131 without passing through the housing 11. The heat sink 131 then transfers the heat to the first heat sink group 132 connected to its lower side. The first heat sink group 132 increases the contact area with the air, thereby increasing the heat dissipation area and improving heat dissipation efficiency.

[0049] According to one embodiment of the present invention, Figure 5 and Figure 6As shown, a limiting groove 1131 is formed on the outer wall surface of the bottom wall of the housing 11 at a position corresponding to the mounting hole 113, and the heat sink 131 is embedded in the limiting groove 1131; and the heat sink 131 is detachably connected to the bottom wall of the housing 11. In this embodiment, the area of ​​the limiting groove 1131 is larger than the area of ​​the mounting hole 113, and the limiting groove 1131 can cover the mounting hole 113, that is, a recessed groove structure is formed by extending outward from the edge of the mounting hole 113 to form the limiting groove 1131. When the heat sink 131 is embedded in the limiting groove 1131, the lower surface of the heat sink 131 is flush with the outer wall surface of the bottom wall of the housing 11, ensuring the beautiful structure of the housing 11. At the same time, through holes are provided on the bottom wall of the limiting groove 1131 and the heat sink 131, so that the heat sink 131 and the housing 11 are detachably connected by the cooperation of bolts and nuts. Of course, in this embodiment, screw holes may be provided on the bottom wall of the housing 11, and through holes may be provided on the heat sink 131. In this case, screws passing through the through holes of the heat sink 131 cooperate with the screw holes on the bottom wall of the housing 11 to achieve a detachable connection between the housing 11 and the heat sink 131. It should be noted that other detachable connection methods may be used between the housing 11 and the heat sink 131 in this application, such as a snap-fit ​​connection between the heat sink 131 and the housing 11.

[0050] In the above embodiment, the lower end of the base 1116 is mounted on the upper surface of the heat sink 131, and the COS 1115 is mounted on the upper end of the base 1116. The base 1116 can be completely located within the mounting hole 113, in which case the upper surface of the base 1116 is lower than the upper surface of the inner bottom wall of the housing 11, or the upper surface of the base 1116 is flush with the upper surface of the inner bottom wall of the housing 11. In this case, the COS 1115 located on the base 1116 is located within the accommodating cavity 111. The light emitted by the COS 1115 can be transmitted through the optical device within the accommodating cavity 111 and ultimately output to the outside through the optical fiber. The base 1116 can also be partially located within the mounting hole 113. In this case, the upper end of the base 1116 is located within the accommodating cavity 111, and the upper surface of the base 1116 is higher than the inner bottom wall surface of the housing 11, which can also achieve the purpose of the COS 1115 being located within the accommodating cavity 111.

[0051] According to one embodiment of the present invention, Figure 1 、 Figure 2 、 Figure 7 and Figure 10As shown, the first heat sink group 132 includes a plurality of first heat sink fins 1322, the upper ends of the plurality of first heat sink fins 1322 are respectively connected to the lower surface of the heat sink 131, and the lower ends form a pointed end; and the plurality of first heat sink fins 1322 are spaced apart and parallel to each other; in this embodiment, the first heat sink fins 1322 extend along the height direction of the shell 11 (that is, extend along the up and down direction), and the plurality of first heat sink fins 1322 are spaced apart and parallel to each other, and a gap is formed between two adjacent first heat sink fins 1322, so that airflow can flow in the gap, thereby increasing the contact surface between the air and the first heat sink fins 1322, thereby improving the heat dissipation efficiency. In this application, the cooling airflow is blown upward from the lower side of the heat sink fins, and the lower end of the first heat sink fin 1322 is set to a pointed end, which can reduce the contact area between the first heat sink fin 1322 and the airflow, play a role in breaking wind resistance, and the airflow can flow smoothly and contact the surface of the first heat sink fin 1322 for heat exchange.

[0052] According to one embodiment of the present invention, Figure 10 As shown, a chamfered portion 1321 is formed at one end of the first heat sink group 132; the height of the plurality of first heat dissipating fins 1322 of the chamfered portion 1321 gradually decreases from the outside to the inside; wherein in the length direction of the heat sink 131, the one close to the end is the outside, and since the chamfered portion 1321 is formed at one end of the first heat sink group 132, the material of the first heat dissipating fin 1322 can be reduced, thereby saving costs; and in the present application, the first heat sink group 132 is provided with a chamfered portion 1321 only at one end, and the other end is a flush structure, that is, the height of the first heat dissipating fins 1322 of the first heat sink group 132 is consistent except for the chamfered portion 1321; since the first heat sink group 132 is provided with a chamfered portion 1321 only at one end, when assembling the heat sink 131 and the housing 11, the operator can intuitively identify the installation direction, which is convenient for operation. Figure 10 As shown, one end of the base 1116 is provided with a chamfered structure. By providing the chamfered structure, the operator can intuitively identify the installation direction, which is convenient for modular installation. At the same time, it can also play a fool-proof role, avoiding the left and right sides of the heat dissipation device 13 from being installed upside down, making the installation of the heat dissipation device 13 simpler and more convenient.

[0053] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the semiconductor laser 1 includes a plurality of bases 1116, and the bases 1116, the heat sink 13 and the mounting holes 113 are arranged in a one-to-one correspondence; Figure 5As shown, the plurality of mounting holes 113 are spaced apart, and a reinforcement block 117 protruding downward is provided on the outer bottom wall of the housing 11 between two adjacent mounting holes 113. In this embodiment, the structural strength of the housing 11 can be enhanced by providing the reinforcement block 117 on the outer bottom wall of the housing 11 between the two mounting holes 113. Preferably, as Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown, in this embodiment, there are two bases 1116, and two corresponding heat sinks 13 and mounting holes 113 are also provided. The two mounting holes 113 are spaced apart, and a limiting groove 1131 is formed on the edge of each mounting hole 113. At the same time, a baffle 1114 is provided between the two mounting holes 113 in the accommodating cavity 111. The baffle 1114 can ensure the consistency of the COS1115 mounting position and effectively block the laser irradiated from the COS1115 on the other side. Figure 3 and Figure 5 As shown, the COS1115 is arranged at intervals along the length direction of the base 1116, and the length direction of the COS1115 is perpendicular to the length direction of the base 1116, that is, the COS1115 extends along the width direction of the base 1116, and a baffle 1114 is provided between the two corresponding mounting holes 113 in the accommodating cavity 111. The COS1115 on the two bases 1116 on both sides emit light toward the baffle 1114. If the baffle 1114 is not provided, the laser of the COS1115 on one side may irradiate the COS1115 on the other side, causing the glue to fail. In the present application, the baffle 1114 is provided between the two mounting holes 113, which can effectively block the laser irradiated from the front and prevent the glue below from failing.

[0054] According to one embodiment of the present invention, Figure 5 As shown, the sidewalls of the reinforcement block 117 facing the two mounting holes 113 on both sides form inclined guide surfaces 1171. The distance between the two guide surfaces 1171 gradually increases from bottom to top. The guide surfaces 1171 are used to guide airflow to the mounting holes 113. In this embodiment, the side surfaces of the reinforcement block 117 on both sides serve as guide surfaces 1171. When the airflow blowing upward from the bottom hits the guide surfaces 1171, the guide surfaces 1171, as inclined surfaces, guide the airflow toward the mounting holes 113. More airflow is blown toward the heat sink 131, thereby better dissipating heat from the base 1116 connected to the heat sink 131 and the COS 1115 on the base 1116.

[0055] According to one embodiment of the present invention, Figure 1 、 Figure 2 、 Figure 8 and Figure 9As shown, the semiconductor laser 1 further includes a cover plate 12, which covers the open end of the accommodating cavity 111. The cover plate 12 is connected to the upper end of the housing 11, forming the accommodating cavity 111 therebetween. A second heat sink group 122 is provided on the upper surface of the cover plate 12. Heat generated during operation of the COS 1115 can be dissipated outward through the cover plate 12. Multiple second heat sink groups 122 are provided on the cover plate 12. The second heat sinks increase the contact area with the air, effectively reducing the temperature of the cover plate 12.

[0056] Optionally, in this embodiment, if Figure 8 As shown, the second heat sink group 122 includes a plurality of second heat sink fins 1221, the lower ends of the plurality of second heat sink fins 1221 are respectively connected to the upper surface of the cover plate 12, and the plurality of second heat sink fins 1221 are spaced apart and parallel to each other; wherein gaps are formed between adjacent second heat sink fins 1221, and air flows in the gaps, exchanges heat with the second heat sink fins 1221, and removes heat from the second heat sink fins 1221. It should be noted that in this embodiment, the plurality of second heat sink fins 1221 in the second heat sink group 122 may not be arranged in parallel. For example, the plurality of second heat sink groups 122 are arranged in an irregular shape. Although the irregular second heat sink group 122 affects the flow of air, it can still increase the contact area between the second heat sink fins 1221 and the air flow, and can also improve the heat dissipation efficiency to a certain extent.

[0057] According to one embodiment of the present invention, Figure 3 and Figure 4As shown, the accommodating cavity 111 is provided with a first fixing groove 1111 with an upper opening, and the semiconductor laser 1 further includes a fixing block 1112 and a glass tube 1113. The fixing block 1112 is formed with a second fixing groove 11121 with an upper opening, and the glass tube 1113 is embedded in the second fixing groove 11121 and fixed, while the fixing block 1112 is embedded in the first fixing groove 1111. In semiconductor lasers, optical fibers are usually provided with end caps at their ends to protect the output end face. Compared to existing semiconductor lasers in which the end caps are directly fixed, the present application provides a glass tube 1113 to secure the end caps and the output optical fiber, protecting the end caps and the fusion splice from breakage. It also prevents contamination at the fusion splice between the end cap and the optical fiber, which could cause the optical fiber to burn. The use of the glass tube 1113 allows for a longer fixed length, reducing errors caused by assembly. In this embodiment, a first fixing groove 1111 is provided on the bottom wall of the shell 11. The first fixing groove 1111 is in the shape of an elongated strip. A fixing block 1112 is provided in the first fixing groove 1111. A second fixing groove 11121 is provided on the fixing block 1112. A glass tube 1113 is embedded in the second fixing groove 11121. An optical fiber is provided in the glass tube 1113. The lasers emitted by the plurality of COS 1115 are transmitted to one side of the first fixing groove 1111 through a fast-axis collimator, a slow-axis collimator, a reflector, a focusing lens, etc., and pass into the optical fiber and are transmitted outward through the optical fiber. In this application, since the glass tube 1113 is fixed in the fixing block 1112, and the fixing block 1112 is embedded in the first fixing groove 1111, it is convenient for product installation. Moreover, if the glass tube 1113 is damaged during testing or use, the fixing block 1112 can be easily removed and repaired together, so as not to cause extensive repairs or even scrapping of the entire shell 11. In addition, in the present application, after the glass tube 1113 is embedded in the second fixing groove 11121 of the fixing block 1112, the glass tube 1113 is fixed by glue, and the glass tube 1113 is fixed more firmly. Figure 4 and Figure 11 As shown, a blind hole extending toward the light outlet is provided on the side wall of the first groove 114 close to the light outlet, and a glue dispensing groove 11122 connected to the blind hole is provided on the upper surface of the fixing block 1112. When installing the glass tube 1113, one end of the glass tube 1113 is inserted into the blind hole. At this time, the glass tube 1113 can be seen through the glue dispensing groove 11122, and the other end is embedded in the second fixing groove 11121. Then, the glass tube 1113 is fixed by dispensing glue into the glue dispensing groove 11122, and the glass tube 1113 is fixed more firmly.

[0058] Specifically, in this embodiment, the glass tube 1113 has a first end and a second end relative to each other, and the first end is higher than the second end; a light inlet connected to the second fixing groove 11121 is provided on the side wall of the fixed block 1112, and the first end of the glass tube 1113 is arranged corresponding to the light inlet; a light outlet is provided on the shell 11, and the second end is arranged corresponding to the light outlet; the light inlet corresponds to the light outlet side of the optical transmission path, that is, the laser emitted by multiple COS1115 is focused and faces the light inlet of the fixed block 1112, and enters the optical fiber, and the other end of the optical fiber is aligned with the light outlet provided on the shell 11, and the laser is transmitted to the outside through the light outlet, wherein the optical fiber can extend through the light outlet to the outside of the shell 11, and then transmit the laser to the outside through the optical fiber; in this embodiment, the glass tube 1113 is arranged at an angle, which can make the end face of the optical fiber perpendicular to the optical path, thereby improving the transmission efficiency.

[0059] According to one embodiment of the present invention, Figure 1 、 Figure 2 、 Figure 4 and Figure 5 As shown, a first groove 114 is formed on the outer wall of the housing 11 near the first fixing groove 1111. A plurality of first protrusions 1141 extending along the height of the housing 11 are disposed within the first groove 114. These first protrusions 1141 are spaced apart and parallel to each other, forming a first flow-guiding gap between adjacent first protrusions 1141. Because a glass tube 1113 is secured within the first fixing groove 1111, housing an optical fiber, and thus generates significant heat, in this embodiment, a first groove 114 is disposed on the outer wall of the housing 11 corresponding to the first fixing groove 1111. These first grooves 114 are spaced apart and parallel to each other, forming a first flow-guiding gap between adjacent first protrusions 1141. As air flows upward from bottom to top, it passes through the first flow-guiding gap, removing heat from the housing 11. The presence of the first protrusions 1141 increases the contact area between the outer wall of the housing 11 and the airflow, thereby increasing the heat exchange area and improving heat dissipation efficiency.

[0060] Preferably, in this embodiment, Figure 1 、 Figure 2 、 Figure 4 and Figure 5As shown, a second groove 115 is formed on the outer bottom wall of the housing 11 near the first fixing groove 1111. A plurality of second protrusions 1151 extending along the width of the housing 11 are disposed within the second groove 115. These second protrusions 1151 are spaced apart and parallel to each other, with a second flow-guiding gap formed between adjacent second protrusions 1151. In other words, a protrusion structure is also provided on the bottom wall of the housing 11, further increasing the contact area between the outer wall of the housing 11 and the airflow in the area corresponding to the glass tube 1113, thereby improving heat dissipation efficiency.

[0061] Preferably, Figure 5 As shown, the first protrusion 1141 and the second protrusion 1151 are arranged in a one-to-one correspondence; the first guide gap and the second guide gap are in a one-to-one correspondence and are interconnected; in this embodiment, since the first guide gap and the second guide gap are in a one-to-one correspondence and are interconnected, when the airflow blows to the second guide gap, the bottom wall of the shell 11 blocks the airflow from continuing to flow upward. At this time, the airflow can flow along the second guide gap into the first guide gap, reducing the influence of the bottom wall of the shell 11 on the airflow velocity, and can increase the airflow flow into the first guide gap, thereby increasing the heat dissipation efficiency. At the same time, since the first guide gap and the second guide gap are in a one-to-one correspondence and are interconnected, the first guide gap and the second guide gap can be formed in one cutting operation during the preparation process, reducing the forming steps and improving manufacturing efficiency.

[0062] According to one embodiment of the present invention, Figure 2 、 Figure 3 and Figure 5As shown, the housing 11 is further provided with a stray light absorption mechanism 112. A first notch 116 is provided on the bottom wall of the housing 11 near the stray light absorption mechanism 112. A plurality of third heat dissipation fins 1161 are provided in the first notch 116. The third heat dissipation fins 1161 are arranged at intervals and parallel to each other. The third heat dissipation fins 1161 extend along the height direction of the housing 11; a third guide gap is formed between two adjacent third heat dissipation fins 1161. When the light beams generated by the COS 1115 in the semiconductor laser 1 are combined, a portion of stray harmful light will be generated. During the process of reflection, transmission, and absorption of the inner wall of the laser housing 11, local high temperature will be generated, which will damage the light-emitting unit, the bottom glue layer of the lens, the output optical fiber, etc. inside the laser. Therefore, in this application, a stray light absorption mechanism 112 is provided in the accommodating cavity 111 to absorb stray light, thereby preventing the stray light from generating local high temperature during reflection, transmission, and absorption of the inner wall of the laser housing 11. This can better protect the components inside the laser housing 11 and improve the service life of the laser. At the same time, since the stray light absorption mechanism 112 generates a large amount of heat when absorbing stray light, a first notch 116 is provided on the bottom wall of the shell 11, and a plurality of third heat dissipation fins 1161 are provided in the first notch 116. The third heat dissipation fins 1161 increase the contact area between the region and the external airflow, thereby improving the heat dissipation efficiency of the stray light absorption mechanism 112 at the position corresponding to the shell 11, thereby avoiding local high temperature.

[0063] According to one embodiment of the present invention, Figure 9 As shown, a light absorption area 121 is provided on the lower surface of the cover plate 12 at a position corresponding to the first fixed groove 1111, and a plurality of spaced light absorption grooves 1211 are provided in the light absorption area 121. In this embodiment, the position of the first fixed groove 1111 corresponds to that for fixing the second fixed block 1112, and a glass tube 1113 is installed on the second fixed block 1112. In this application, the lasers generated by the multiple COS1115 will be focused in the optical fiber and transmitted outward, and the glass tube 1113 will scatter stray light outward. Therefore, a light absorption area 121 is provided on the lower surface of the cover plate 12, and a plurality of spaced light absorption grooves 1211 are provided in the light absorption area 121. The size of the light absorption area 121 is greater than or equal to the size of the first fixed groove 1111. When stray light is irradiated into the light absorption groove 1211, it is reflected in the light absorption groove 1211, and the energy of the stray light is absorbed by reflection, thereby preventing the stray light from being reflected onto the COS1115 or other optical devices, causing damage to the optical devices. As shown Figure 9 As shown, the light absorbing grooves 1211 are in the shape of long strips, and a plurality of long strip-shaped light absorbing grooves 1211 are arranged side by side at intervals and parallel to each other.

[0064] In the description of this utility model, it should be noted that the terms "upper" and "lower" and other terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0065] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor laser, characterized in that It comprises a housing (11), a COS (1115), a base (1116) and a heat sink (13), wherein the base (1116) is mounted on the upper end of the heat sink (13); An accommodating cavity (111) with an upper end opening is formed in the shell (11), and a mounting hole (113) penetrating the bottom wall of the shell (11) is provided. The base (1116) is installed in the installation hole (113), the COS (1115) is installed on the base (1116) and is located in the accommodating cavity (111); and the heat dissipation device (13) is located outside the accommodating cavity (111).

2. The semiconductor laser according to claim 1, wherein The heat dissipation device (13) comprises a heat dissipation plate (131) and a first heat dissipation fin group (132); the base (1116) is mounted on the upper surface of the heat dissipation plate (131); and the first heat dissipation fin group (132) is mounted on the lower surface of the heat dissipation plate (131).

3. The semiconductor laser according to claim 2, wherein A limiting groove (1131) is formed on the outer wall surface of the bottom wall of the housing (11) at a position corresponding to the mounting hole (113), and the heat dissipation plate (131) is embedded in the limiting groove (1131); and the heat dissipation plate (131) is detachably connected to the bottom wall of the housing (11).

4. The semiconductor laser according to claim 2, wherein The first heat sink group (132) comprises a plurality of first heat sink fins (1322), the upper ends of the plurality of first heat sink fins (1322) are respectively connected to the lower surface of the heat sink (131), and the lower ends form pointed ends; and the plurality of first heat sink fins (1322) are arranged at intervals and parallel to each other.

5. The semiconductor laser according to any one of claims 2 to 4, characterized in that A first fixing groove (1111) with an upper opening is provided in the accommodating cavity (111), and the semiconductor laser further comprises a fixing block (1112) and a glass tube (1113). A second fixing groove (11121) with an upper opening is formed on the fixing block (1112), the glass tube (1113) is embedded in the second fixing groove (11121) and fixed, and the fixing block (1112) is embedded in the first fixing groove (1111).

6. The semiconductor laser according to claim 5, characterized in that The glass tube (1113) has a first end and a second end opposite to each other, wherein the first end is higher than the second end; A light inlet communicating with the second fixing groove (11121) is provided on the side wall of the fixing block (1112), and the first end of the glass tube (1113) is arranged corresponding to the light inlet; a light outlet is provided on the housing (11), and the second end is arranged corresponding to the light outlet.

7. The semiconductor laser according to claim 5, wherein A first groove (114) is formed on the outer side wall of the housing (11) near the first fixing groove (1111); A plurality of first protrusions (1141) extending in the height direction of the housing (11) are provided in the first groove (114); the plurality of first protrusions (1141) are arranged at intervals and parallel to each other, and a first flow guide gap is formed between two adjacent first protrusions (1141).

8. The semiconductor laser according to claim 7, wherein: A second groove (115) is formed on the outer bottom wall of the housing (11) near the first fixing groove (1111); A plurality of second protrusions (1151) extending along the width direction of the housing (11) are provided in the second groove (115); the plurality of second protrusions (1151) are arranged at intervals and parallel to each other, and a second flow guide gap is formed between two adjacent second protrusions (1151).

9. The semiconductor laser according to claim 8, characterized in that The first protrusion (1141) and the second protrusion (1151) are arranged in a one-to-one correspondence; the first flow-guiding gap and the second flow-guiding gap are arranged in a one-to-one correspondence and are connected to each other.

10. The semiconductor laser according to any one of claims 1 to 4 or any one of claims 6 to 9, characterized in that: A stray light absorption mechanism (112) is further provided in the housing (11); a first notch (116) is provided on the bottom wall of the housing (11) near the stray light absorption mechanism (112); a plurality of third heat dissipation fins (1161) arranged at intervals and parallel to each other are provided in the first notch (116); the third heat dissipation fins (1161) extend along the height direction of the housing (11); and a third flow guide gap is formed between two adjacent third heat dissipation fins (1161).

11. The semiconductor laser according to claim 1, wherein The semiconductor laser comprises a plurality of bases (1116), and the bases (1116), the heat sink (13) and the mounting holes (113) are arranged in a one-to-one correspondence; The plurality of mounting holes (113) are arranged at intervals, and a reinforcement block (117) protruding downward is provided on the outer bottom wall of the housing (11) between two adjacent mounting holes (113).

12. The semiconductor laser according to claim 11, wherein The side walls of the reinforcement block (117) facing the two mounting holes (113) on both sides form inclined guide surfaces (1171), and the distance between the two guide surfaces (1171) gradually increases from bottom to top. The guide surfaces (1171) are used to guide airflow toward the mounting holes (113).

13. The semiconductor laser according to claim 6, wherein The semiconductor laser further comprises a cover plate (12), the cover plate (12) covering the open end of the accommodating cavity (111), and a second heat sink group (122) is provided on the upper surface of the cover plate (12).

14. The semiconductor laser according to claim 13, wherein The second heat sink group (122) comprises a plurality of second heat sink fins (1221), the lower ends of the plurality of second heat sink fins (1221) are respectively connected to the upper surface of the cover plate (12), and the plurality of second heat sink fins (1221) are arranged at intervals and parallel to each other.

15. The semiconductor laser according to claim 13, wherein A light absorption area (121) is provided on the lower surface of the cover plate (12) at a position corresponding to the first fixing groove (1111), and a plurality of light absorption grooves (1211) arranged at intervals are provided in the light absorption area (121).

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