Heating type coaxial packaging laser

Abstract

The utility model relates to the technical field of lasers, in particular to a heating type coaxial packaging laser, which comprises a tube seat, a tube cap arranged on the tube seat, a heating carrier, a laser chip and a thermistor arranged in the tube cap, a support table integrally connected with the tube seat, the heating carrier arranged on the support table, a heating body arranged on the heating carrier, and a laser chip arranged on the heating body. The heating body is in direct contact with the laser chip, the thermistor is located on one side of the laser chip, the heating body comprises a heating layer arranged on a heating carrier, a metal layer is arranged on the heating layer, an insulating layer is arranged between the metal layer and the heating layer, and the metal layer is in contact with the laser chip. The supporting table and the heating carrier which are connected into a whole are adopted, connecting parts are reduced, the connecting strength of all the devices is greatly improved, and the technological process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a heating type coaxial packaged laser. Background Art

[0002] The Chinese patent "A coaxial laser with self-heating function" (publication number: CN220857220U) disclosed on April 26, 2024, includes: a laser body, a first pad, a chip, a second pad, and a thermistor, wherein the first pad and the second pad are both arranged on the laser body, and the first pad and the second pad are fixed to each other; the chip is fixed to the first pad and fits with the second pad; the heating wire fits with the second pad for powering on and self-heating; the second pad is an integrated high thermal conductivity insulating pad for transferring the heat generated by the heating wire to the chip, and the first pad is a thermal insulation pad. This patent solution requires two pads to fix the chip and the heating wire respectively, and the first pad needs to be bonded to the tube seat for connection, which greatly reduces the connection strength of the chip in the tube shell. At the same time, the mutual bonding between the three components also reduces production efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a heated coaxial packaged laser, which solves the problems of multiple connection points, low structural strength and more production processes in the prior art.

[0004] To achieve one purpose of the utility model, it includes: a tube seat, a tube cap is provided on the tube seat, a heating carrier, a laser chip and a thermistor are provided in the tube cap, the tube seat is provided with an integral support platform, the heating carrier is provided on the support platform, a heating body is provided on the heating carrier, the heating body is in direct contact with the laser chip, the thermistor is located on one side of the laser chip, and the heating body includes: a heating layer provided on the heating carrier, a metal layer is provided on the heating layer, an insulating layer is provided between the metal layer and the heating layer, and the metal layer is in contact with the laser chip.

[0005] The heating carrier is a ceramic substrate.

[0006] A heat insulating device is provided between the heating carrier and the tube base support platform.

[0007] The heating layer and the metal layer are both deposited on a heating carrier.

[0008] The heating layer is a metal heating layer.

[0009] The heating layer is electrically connected to the pins through a wire.

[0010] The heat insulation device is a heat insulation layer or a gasket.

[0011] The metal layer is bonded to the laser chip.

[0012] The heating carrier is located above the tube seat and does not contact the tube seat.

[0013] The support platform is L-shaped.

[0014] This utility model utilizes an integrated support platform and heating carrier, reducing the number of connecting components and significantly improving the connection strength of each device. This also reduces the process flow and improves production efficiency. Furthermore, the heating element serves as a heating layer. Secondly, a thermal insulation device is provided between the heating carrier 3 and the support platform to effectively isolate heat. Thirdly, the heating carrier is suspended in the air, away from direct contact with the tube socket and gasket, preventing heat from being directly transferred to the package housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the overall structure of a heated coaxial packaged laser provided by the present invention;

[0016] Figure 2 A schematic diagram of the internal structure of a heated coaxial packaged laser provided by the utility model;

[0017] Figure 3 for Figure 2 Left view of;

[0018] Figure 4 A schematic diagram of the heating carrier provided by the utility model;

[0019] Illustration: tube base 1; gasket 2; heating carrier 3; laser chip 4; thermistor 5; tube cap 6; support platform 7; heating layer 8; metal layer 9. DETAILED DESCRIPTION

[0020] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4The universal joint of the present invention shown in FIG. 1 includes a tube base 1, a tube cap 6 mounted on the tube base, and a heating carrier 3, a laser chip 4, and a thermistor 5 mounted within the tube cap. The tube base is provided with an integral L-shaped support platform 7. The heating carrier is mounted on the support platform, positioned above the tube base but not in contact with the tube base. A heating element is mounted on the heating carrier, and is in direct contact with the laser chip. The heating element comprises a heating layer 8 deposited on the heating carrier, a metal layer 9 deposited on the heating layer 8, an insulating layer of silicon dioxide disposed between the metal layer 9 and the heating layer 8, the metal layer being bonded to the laser chip, and a metal heating layer electrically connected to the tube pins via wires. The heating carrier is a ceramic substrate. A thermal insulation device, in the form of a gasket 2, is provided between the heating carrier and the support platform. The thermistor is located on one side of the laser chip. The temperature of the laser chip 4 is detected in real time through the thermistor 5, and the current and voltage applied to the heating layer 9 on the heating carrier 3 are adjusted according to the feedback of the thermistor 5 to ensure that the laser chip 4 is stable within the specified temperature range and the emission wavelength of the laser chip 4 reaches the specified wavelength.

[0021] The above-described embodiments represent only a few implementation methods of the present invention and should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A heated coaxial packaged laser, comprising: A tube base is provided with a tube cap on the tube base, and a heating carrier, a laser chip and a thermistor are provided in the tube cap. The characteristic is that the tube base is provided with an integral support platform, the heating carrier is provided on the support platform, a heating body is provided on the heating carrier, the heating body is in direct contact with the laser chip, the thermistor is located on one side of the laser chip, and the heating body includes: a heating layer provided on the heating carrier, a metal layer provided on the heating layer, an insulating layer provided between the metal layer and the heating layer, and the metal layer is in contact with the laser chip.

2. The heated coaxial packaged laser according to claim 1, characterized in that: The heating carrier is a ceramic substrate.

3. A heated coaxial packaged laser according to claim 1 or 2, characterized in that: A heat insulating device is provided between the heating carrier and the tube base support platform.

4. The heated coaxial packaged laser according to claim 1, characterized in that: The heating layer and the metal layer are both deposited on a heating carrier.

5. A heated coaxial packaged laser according to claim 1, 2 or 4, characterized in that: The heating layer is a metal heating layer.

6. The heated coaxial packaged laser according to claim 5, characterized in that: The heating layer is electrically connected to the pins through a wire.

7. The heated coaxial packaged laser according to claim 3, characterized in that: The heat insulation device is a heat insulation layer or a gasket.

8. The heated coaxial packaged laser according to claim 1, characterized in that: The metal layer is bonded to the laser chip.

9. A heated coaxial packaged laser according to any one of claims 1, 2, 4 or 6 to 8, characterized in that: The heating carrier is located above the tube seat and does not contact the tube seat.

10. A heated coaxial packaged laser according to any one of claims 1, 2, 4 or 6 to 8, characterized in that: The support platform is L-shaped.

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