Jig for repairing edge defects of copper foil of substrate
By designing the substrate copper foil edge defect repair tool, and using the combination of sliding guide rails and polishing pens, the problem of uneven polishing of copper foil edge defects is solved, achieving efficient and unified copper foil edge repair effect.
Patent Information
- Application Number
- CN202422489606.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-10-15
AI Technical Summary
In the prior art, copper foil substrates have solder overflow and edge defects during the press-brazing process, and manual grinding efficiency is low and uneven, which affects product quality.
A fixture for repairing edge defects of substrate copper foil is designed, including sliding guide rails, sliders, grinding pens and grinding heads. The sliding guides realize the front and back movement of the grinding pens, combined with the adjustment of the positioning plate and platform, ensuring consistency in the width of the grinding edge and controllable depth.
It realizes efficient and unified polishing of copper foil edge defects, avoids manual alignment process, improves grinding efficiency and margin consistency, and ensures smoothing.
Smart Images
Figure CN223287070U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of copper foil repair of copper-clad substrates and relates to a jig for repairing edge defects of the copper foil of a substrate. Background Art
[0002] Copper clad laminate, also known as copper foil substrate, is the basic material of the electronics industry and is mainly used for processing and manufacturing PCB printed circuit boards. It provides a conductive layer and insulation support for electrical connections, laying the foundation for the birth of PCB printed circuit boards.
[0003] Currently, copper foil substrates undergo a press-brazing process, which can cause solder overflow, solder diffusion, and edge defects on the substrate's copper foil. Manual polishing is usually performed using a small pneumatic grinding pen. However, manual polishing with a pneumatic grinding pen is inefficient and prone to uneven polishing and non-uniform margins, affecting the actual use of the product. Utility Model Content
[0004] In response to the above-mentioned problems existing in the prior art, the present application provides a jig for repairing edge defects of substrate copper foil.
[0005] The technical solution of the utility model is as follows:
[0006] A jig for repairing edge defects of copper foil of a substrate comprises a sliding guide rail, the sliding guide rail is equipped with a slider, a grinding pen is installed on the top of the slider, and a grinding head is provided on the top of the grinding pen. The grinding pen and the slider move back and forth on the sliding guide rail. The substrate to be processed is placed on a platform, and the substrate to be processed is positioned by the cooperation of a first positioning plate and a second positioning plate. The platform is positioned on a positioning block by a fixing screw, and the height of the platform is adjusted by a top screw so that the grinding head and the substrate to be processed maintain an appropriate height. The substrate to be processed is turned by adjusting the first positioning plate and the second positioning plate, so as to process each edge of the substrate to be processed.
[0007] As a preferred embodiment of the present invention, there are two groups of sliding guide rails.
[0008] As a preferred embodiment of the present invention, the number of the top screws is four.
[0009] As a preferred embodiment of the present invention, the number of fixing screws is four.
[0010] As a preferred embodiment of the present invention, the widths of the first positioning plate and the second positioning plate are equal.
[0011] The beneficial effects of the utility model are:
[0012] The utility model discloses a jig for repairing edge defects of copper foil of substrate. The sliding guide rail is used to realize forward and backward operation, the consistency of the width of the polished edge is guaranteed, and the polishing depth is controllable. By adjusting the height of the positioning block and the platform, substrates to be processed with different specifications and lengths can be processed; the manual polishing alignment process is omitted, and batch operations of the same specifications can be carried out through the positioning of the jig; the operation is effectively controlled, avoiding manual visual operation, and can ensure the effective distance of the polishing margin, polishing is smooth and the margin is made uniform, which is convenient and efficient. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 The utility model is a structural schematic diagram of a jig for repairing edge defects of substrate copper foil.
[0014] In the figure: 1-sliding guide rail; 2-slider; 3-grinding pen; 4-grinding head; 5-platform; 6-positioning block; 7-top screw; 8-fixing screw; 9-positioning plate 1; 10-positioning plate 2; 11-substrate to be processed. DETAILED DESCRIPTION
[0015] The present invention is described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the embodiments described are merely a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.
[0016] like Figure 1 As shown, a jig for repairing edge defects of copper foil of a substrate includes a sliding guide rail 1, the sliding guide rail 1 is equipped with a slider 2, a grinding pen 3 is installed on the top of the slider 2, and a grinding head 4 is provided on the top of the grinding pen 3. The grinding pen 3 and the slider 2 move back and forth on the sliding guide rail 1, and the substrate 11 to be processed is placed on the platform 5. The substrate 11 to be processed is positioned by the cooperation of the positioning plate 1 9 and the positioning plate 2 10. The platform 5 is positioned on the positioning block 6 by the fixing screw 8. The height of the platform 5 is adjusted by the top screw 7 to maintain a suitable height between the grinding head 4 and the substrate 11 to be processed. The substrate 11 to be processed is turned by adjusting the positioning plate 1 9 and the positioning plate 2 10, so as to process each edge of the substrate 11 to be processed.
[0017] There are two sets of sliding guide rails 1; there are four top screws 7; there are four fixing screws 8; the widths of the first positioning plate 9 and the second positioning plate 10 are equal, which improves the commonality of parts.
[0018] In summary, the utility model provides a jig for repairing edge defects of copper foil of a substrate. The sliding guide rail provided therein can realize forward and backward movement operation, the consistency of the width of the polished edge is guaranteed, the polishing depth is controllable, and substrates of different specifications and lengths can be processed by adjusting the height of the positioning block and the platform; the manual polishing alignment process is eliminated, and batch operations of the same specifications can be carried out through the positioning of the jig, which is efficient and convenient; the operation is effectively controlled, avoiding manual visual operation, and the polishing is smooth and the margins are unified.
[0019] Although the implementation scheme of the present invention has been disclosed as above, it is not limited to the applications listed in the description and implementation scheme. It can be fully applied to various fields suitable for the present invention. For those familiar with the art, for ordinary technicians in the art, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to specific details.
Claims
1. A jig for repairing substrate copper foil edge defects, characterized by: The invention comprises a sliding guide rail (1), wherein the sliding guide rail (1) is equipped with a slider (2), a grinding pen (3) is installed on the top of the slider (2), and a grinding head (4) is provided on the top of the grinding pen (3). The grinding pen (3) and the slider (2) move forward and backward on the sliding guide rail (1), and a substrate to be processed (11) is placed on a platform (5). The substrate to be processed (11) is positioned by the cooperation of a positioning plate 1 (9) and a positioning plate 2 (10). The platform (5) is positioned on a positioning block (6) by a fixing screw (8). The height of the platform (5) is adjusted by a top screw (7) so that a suitable height is maintained between the grinding head (4) and the substrate to be processed (11). The substrate to be processed (11) is turned by adjusting the positioning plate 1 (9) and the positioning plate 2 (10) so as to process each edge of the substrate to be processed (11).
2. The jig for repairing substrate copper foil edge defects according to claim 1, characterized in that: The number of the sliding guide rails (1) is two groups.
3. The jig for repairing substrate copper foil edge defects according to claim 1, characterized in that: The number of the top screws (7) is four.
4. The jig for repairing substrate copper foil edge defects according to claim 1, characterized in that: The number of the fixing screws (8) is four.
5. The jig for repairing substrate copper foil edge defects according to claim 1, characterized in that: The widths of the positioning plate 1 (9) and the positioning plate 2 (10) are equal.