Full-automatic coating and photo-curing integrated glue uniformizing equipment

Abstract

The embodiment of the utility model provides full-automatic coating and light curing integrated glue uniformizing equipment. The full-automatic coating and light curing integrated glue uniformizing equipment comprises a box body, a sheet placing groove, a glue uniformizing system, a film covering system, a light curing system, a grabbing device and a conveying belt, the sheet placing groove, the glue uniformizing system, the film covering system, the light curing system, the grabbing device and the conveying belt are all arranged in the box body, and the glue uniformizing system, the film covering system and the light curing system are arranged in the extending direction of the conveying belt. A to-be-processed substrate is arranged in the substrate placing groove, and a substrate bearing table is arranged on the conveying belt; according to the technical scheme, the glue uniformizing system, the film covering system, the light curing system, the grabbing device and the conveying belt are integrated, automatic production from glue uniformizing, film covering and curing can be achieved, the production quality and efficiency are improved, high repeatability and consistency are achieved, and flatness and uniformity of products are kept.

Description

Technical Field

[0001] The embodiment of the utility model relates to the field of semiconductor technology, and in particular to a fully automatic photo-curing integrated glue coating device. Background Art

[0002] Spin coating is a high-speed film-forming method that produces uniform thin films and is widely used in the preparation of thin films for semiconductor and chemical materials. It utilizes the centrifugal force generated by rotation to evenly spread sols, solutions, or suspensions onto the substrate surface. A spin coater (also known as a spin coater, spin spreader, spin coater, or spin coater) is the equipment used in spin coating. The general operating principle is to drip various types of glue onto a high-speed rotating substrate, using centrifugal force to evenly coat the glue on the substrate. The thickness varies depending on the viscosity between the glue and the substrate, and is also related to the rotation speed and time.

[0003] The typical coating process involves dispensing, high-speed rotation, and drying (solvent evaporation). Dispensing involves dripping the adhesive onto the substrate surface, then spinning it at high speed to spread it into a thin layer. Drying removes excess solvent from the adhesive layer. There are two common dispensing methods: static dispensing and dynamic dispensing. Current substrate coating preparation processes suffer from numerous steps and long processing times. Utility Model Content

[0004] The utility model provides a fully automatic coating light-curing integrated glue spreading equipment, which can realize automated production from glue spreading, film coating to curing, improve production quality and efficiency, and has high repeatability and consistency.

[0005] In the first aspect, the embodiment of the present invention provides a fully automatic coating and light-curing integrated glue-spinning device, including a box, a sheet placement slot, a glue-spinning system, a film-coating system, a light-curing system, a gripping device and a conveyor belt;

[0006] The film placement tank, the glue spreading system, the film coating system, the light curing system, the gripping device and the conveyor belt are all placed inside the box, and the glue spreading system, the film coating system and the light curing system are arranged along the extension direction of the conveyor belt; the film placement tank is equipped with a substrate to be processed, and a film holding table is provided on the conveyor belt;

[0007] The substrate table carries the substrate to be processed and moves along a preset transmission route via the conveyor belt; the coating system is used to coat the substrate to be processed with a first material layer; the coating system is used to coat the substrate to be processed coated with the first material layer; the coating system is also used to coat the coated substrate to be processed with UV black glue; the light curing system is used to cure the substrate to be processed coated with UV black glue;

[0008] The grabbing device is used to grab the substrate to be processed from the wafer placement groove to the glue spreading system, and realize the displacement of the substrate to be processed between the wafer holding table and the glue spreading system.

[0009] Optionally, the interior of the box includes an intermediate plate parallel to the horizontal plane;

[0010] The sheet placement slot, the glue spreading system, the film coating system, the light curing system, the gripping device and the conveyor belt are all placed on a side surface of the middle plate facing the top plate of the box body.

[0011] Optionally, a lifting platform for carrying the substrate to be processed is provided in the middle area of ​​the wafer stage; the area of ​​the lifting platform is smaller than the substrate to be processed and the lifting platform can be raised and lowered relative to the wafer stage.

[0012] Optionally, the glue dispensing system includes a glue dispensing table, a moving module and a glue dispensing device;

[0013] The glue dispensing station includes a hollowed-out area in the middle, wherein the hollowed-out area accommodates a wafer carrier panel for carrying the substrate to be processed; the movable module is located above the glue dispensing station, and the glue dispensing device is fixedly connected to a side of the movable module facing the glue dispensing station;

[0014] The moving module drives the glue dropping device to move along a first direction and a second direction to adjust the glue dropping position of the glue dropping device; the first direction is a direction parallel to the horizontal plane, and the second direction is a direction perpendicular to the horizontal plane.

[0015] Optionally, the mobile module includes a sliding beam and a telescopic arm having a lifting shaft; the lifting direction of the lifting shaft is the second direction;

[0016] The sliding beam is arranged parallel to the horizontal plane and extends along the first direction, and both ends of the sliding beam in the extension direction are fixed to the middle plate through support frames;

[0017] The telescopic arm includes a sliding end and a telescopic end, the sliding end is slidably connected to the sliding beam, and the glue dropping device is fixedly connected to the telescopic end of the telescopic arm; the sliding end of the telescopic arm moves along the extension direction of the sliding beam to drive the glue dropping device to move along the first direction, and the telescopic end of the telescopic arm telescopically moves in a direction perpendicular to the horizontal plane to drive the glue dropping device to move along the second direction relative to the substrate to be processed.

[0018] Optionally, the glue dropping equipment includes a first glue dropping device and a second glue dropping device; the first glue dropping device contains the first material; the second glue dropping device contains the UV black glue.

[0019] Optionally, the first glue dropping device and the second glue dropping device both include a nozzle and a peristaltic pump.

[0020] Optionally, the diameter of the carrier panel is smaller than the substrate to be processed, and the carrier panel can be raised and lowered relative to the glue-dispensing table; the glue-dispensing table can be rotated and the direction and speed of rotation are controllable.

[0021] Optionally, the laminating system includes a support base and a laminating plate; the bottom end of the support base is fixed to the middle plate, and a crossbeam is provided on the top end of the support base, the crossbeam is located above the conveyor belt, and the extension direction of the crossbeam is parallel to the horizontal plane and perpendicular to the direction of transmission from the wafer stage to the laminating system;

[0022] One end of the bonding plate is rotatably connected to the crossbeam, a mold is provided on the first side surface of the bonding plate, the first side surface is the surface where the bonding plate is bonded to the substrate to be processed, a diaphragm is placed inside the mold, and the bonding plate rotates around the crossbeam toward the wafer table so that the diaphragm in the mold on the first side surface is bonded to the substrate to be processed.

[0023] Optionally, the laminating system further comprises a rubber roller; the extension direction of the rubber roller is the same as the extension direction of the crossbeam and the rubber roller is rollingly connected to an end of the laminating plate opposite to the crossbeam;

[0024] When the laminating plate and the substrate to be processed are laminated, the rubber roller rolls on the wafer stage in a direction opposite to the conveying direction of the conveyor belt to press the membrane and the substrate to be processed.

[0025] Optionally, it further comprises a second gripping device and a film placing groove; the second gripping device and the film placing groove are both located in an area of ​​the surface of the intermediate plate close to the film laminating system;

[0026] The film sheet is placed inside the film placing groove, and the second grabbing device is used to grab the film sheet from the film placing groove and put it into the mold of the bonding plate.

[0027] Optionally, the conveyor belts are distributed in a “sun” shape.

[0028] Optionally, the light curing system includes a UV lamp tube, a lampshade and a fan; the lampshade is arranged above the conveyor belt, and the UV lamp tube and the fan are fixed to a side of the lampshade facing the conveyor belt;

[0029] When the wafer stage carries the substrate to be processed and is transported to the bottom of the lampshade along the conveyor belt, the UV lamp emits light and cooperates with the fan to cure the substrate to be processed.

[0030] Optionally, it further includes an induction door, which is arranged on the transmission path from the light curing system to the glue spreading system;

[0031] The sensing door includes a sensing area, and the sensing door opens when the wafer stage is transferred to the sensing area, so that the wafer stage is transferred to the coating system.

[0032] The embodiment of the present invention provides a fully automatic coating and light-curing integrated glue-splitting equipment, which includes a box body, a sheet placement slot, a glue-splitting system, a film coating system, a light-curing system, a gripping device and a conveyor belt; the sheet placement slot, the glue-splitting system, the film coating system, the light-curing system, the gripping device and the conveyor belt are all placed inside the box body, and the glue-splitting system, the film coating system and the light-curing system are arranged along the extension direction of the conveyor belt; the sheet placement slot has a substrate to be processed built in, and a sheet holding table is provided on the conveyor belt; the sheet holding table carries the substrate to be processed and moves along a preset transmission route through the conveyor belt; the glue-splitting system is used to coat the substrate to be processed with a first material layer; the film coating system is used to coat the substrate to be processed coated with the first material layer; the glue-splitting system is also used to coat the coated substrate to be processed with UV black glue; the light-curing system is used to cure the substrate to be processed coated with UV black glue; the gripping device is used to grab the substrate to be processed from the sheet placement slot to the glue-splitting system, and realize the shift of the substrate to be processed between the sheet holding table and the glue-splitting system. The above technical solution, by integrating the glue spreading system, laminating system, light curing system, gripping device and conveyor belt into one, can realize automated production from glue spreading, laminating to curing, improve production quality and efficiency, have high repeatability and consistency, and maintain the flatness and uniformity of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a structural diagram of a fully automatic photo-curing integrated coating device provided by an embodiment of the present invention;

[0034] Figure 2 This is a partial structural diagram of a glue spreading system provided by an embodiment of the present utility model;

[0035] Figure 3This is a schematic diagram of a laminating system provided by an embodiment of the utility model;

[0036] Figure 4 This is a schematic diagram of the distribution structure of a conveyor belt provided by an embodiment of the present utility model. DETAILED DESCRIPTION

[0037] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0038] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present invention are described based on the angles shown in the accompanying drawings and should not be understood as limitations on the embodiments of the present invention. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is formed "on" or "under" another element, it can not only be formed directly "on" or "under" another element, but can also be formed indirectly "on" or "under" another element through an intermediate element. The terms "first", "second", etc. are only used for descriptive purposes and do not indicate any order, quantity or importance, but are only used to distinguish different components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0039] The term "including" and its variations used in the present invention are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment".

[0040] It should be noted that the concepts of "first" and "second" mentioned in this utility model are only used to distinguish the corresponding contents, and are not used to limit the order or mutual dependence.

[0041] It should be noted that the modifications of "one" and "multiple" mentioned in the present invention are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0042] Figure 1 This is a schematic diagram of the structure of a fully automatic light-curing integrated coating device provided by the embodiment of the utility model, with reference to Figure 1The device includes a box 01, a film placement tank 10, a glue spreading system 20, a film coating system 30, a light curing system 40, a gripping device 50 and a conveyor belt 60; the film placement tank 10, the glue spreading system 20, the film coating system 30, the light curing system 40, the gripping device 50 and the conveyor belt 60 are all placed inside the box 01, and the glue spreading system 20, the film coating system 30 and the light curing system 40 are arranged along the extension direction of the conveyor belt 60; the film placement tank 10 has a substrate 11 to be processed built in, and a wafer support 61 is provided on the conveyor belt 60; the wafer support 61 carries the substrate 11 to be processed, It moves along a preset transmission route through the conveyor belt 60; the glue-spreading system 20 is used to coat the first material layer on the substrate to be processed 11; the coating system 30 is used to coat the substrate to be processed 11 coated with the first material layer; the glue-spreading system 20 is also used to coat the coated substrate to be processed 11 with UV black glue; the light curing system 40 is used to cure the substrate to be processed 11 coated with UV black glue; the grabbing device 50 is used to grab the substrate to be processed 11 from the sheet placement slot 10 to the glue-spreading system 20, and realize the shift of the substrate to be processed between the sheet holding table 61 and the glue-spreading system 20.

[0043] Specifically, refer to Figure 1 The cleaned substrate 11 to be processed is initially stored in the wafer placement tank 10. During operation, the gripping device 50 is responsible for gripping the substrate 11 to be processed from the wafer placement tank 10, and is also responsible for gripping the substrate 11 to be processed and transferring it between the wafer table 61 on the conveyor belt 60 and any other mechanism, namely, the glue-spreading system 20, the laminating system 30, and the light-curing system 40. When placed on the wafer table 61 on the conveyor belt 60, the substrate 11 to be processed moves along the conveyor belt 60 along the preset transmission route; illustratively, the substrate 11 to be processed is first transferred to the working area of ​​the glue-spreading system 20, at which time the gripping device 50 grips the substrate 11 to be processed to the glue-spreading system 20, and the glue-spreading system 20 is transferred to the substrate 11 to be processed. The substrate 11 is coated with a first material layer; then the gripping device 50 grips the substrate 11 to be processed and returns it to the wafer table 61, and moves it to the working area of ​​the coating system 30 along with the conveyor belt 60. After the coating system 30 coats the substrate 11 to be processed coated with the first material layer, the wafer table 61 continues to carry the substrate 11 to be processed and transfers it back to the working area of ​​the glue-spreading system 20. The gripping device 50 grips the substrate 11 to be processed from the wafer table 61 to the glue-spreading system 20, and after coating it with UV black glue, it is gripped and returned to the wafer table 61. The wafer table 61 is transferred to the working area of ​​the light-curing system 40 along the conveyor belt 60, thereby curing the substrate 11 to be processed coated with UV black glue to obtain the target substrate.

[0044] The embodiment of the present invention provides a fully automatic coating and light-curing integrated glue-splitting equipment, which includes a box body, a sheet placement slot, a glue-splitting system, a film coating system, a light-curing system, a gripping device and a conveyor belt; the sheet placement slot, the glue-splitting system, the film coating system, the light-curing system, the gripping device and the conveyor belt are all placed inside the box body, and the glue-splitting system, the film coating system and the light-curing system are arranged along the extension direction of the conveyor belt; the sheet placement slot has a substrate to be processed built in, and a sheet holding table is provided on the conveyor belt; the sheet holding table carries the substrate to be processed and moves along a preset transmission route through the conveyor belt; the glue-splitting system is used to coat the substrate to be processed with a first material layer; the film coating system is used to coat the substrate to be processed coated with the first material layer; the glue-splitting system is also used to coat the coated substrate to be processed with UV black glue; the light-curing system is used to cure the substrate to be processed coated with UV black glue; the gripping device is used to grab the substrate to be processed from the sheet placement slot to the glue-splitting system, and realize the shift of the substrate to be processed between the sheet holding table and the glue-splitting system. The above technical solution, by integrating the glue spreading system, laminating system, light curing system, gripping device and conveyor belt into one, can realize automated production from glue spreading, laminating to curing, improve production quality and efficiency, have high repeatability and consistency, and maintain the flatness and uniformity of the product.

[0045] In an optional embodiment of the present invention, the interior of the box 01 includes a middle plate 011 parallel to the horizontal plane. The substrate placement slot 10, adhesive spreading system 20, laminating system 30, light curing system 40, gripping device 50, and conveyor belt 60 are all located on the side of the middle plate 011 facing the top plate. The air compressor, electrical box, control system, and various control circuits can be located between the bottom plate and the middle plate 011. At least one swinging door 012 can be installed on the sidewalls of the box 01, corresponding to the adhesive spreading area 20, laminating system 30, and light curing system 40. This swinging door 012 allows convenient access to substrates from these three areas.

[0046] Optionally, a lifting platform 611 for carrying the substrate 11 to be processed is provided in the middle area of ​​the wafer stage 61 ; the area of ​​the lifting platform 611 is smaller than the substrate 11 to be processed and the lifting platform 611 can be raised and lowered relative to the wafer stage 61 .

[0047] Specifically, the lifting platform 611 on the wafer holding table 61 rises when receiving the substrate 11 to be processed grabbed by the grabbing device 50 from the wafer slot 10 or the glue spreading system 20, so as to facilitate receiving the substrate 11 to be processed, and falls when the wafer holding table 61 is transported along the conveyor belt 60, so as to ensure the smooth transmission of the substrate 11 to be processed; at the same time, the lifting platform 611 also grabs the substrate 11 to be processed from the lifting platform 611 to the glue spreading system 20 and lifts it up. The area of ​​the lifting platform 611 is smaller than the substrate 11 to be processed, so as to facilitate grabbing; optionally, the grabbing device 50 includes a robotic arm, a four-claw execution tool and a sensor, so that it has accuracy and flexibility.

[0048] Figure 2 This is a partial structural diagram of a glue spreading system provided by the embodiment of the present invention, refer to Figure 1 、 Figure 2 The glue dispensing system 20 includes a glue dispensing table 21, a moving module 22 and a glue dropping device 23; the glue dispensing table 21 includes a middle hollow area, and the hollow area accommodates a carrier panel 211 for carrying the substrate to be processed; the moving module 22 is located above the glue dispensing table 21, and the glue dropping device 23 is fixedly connected to the side of the moving module 22 facing the glue dispensing table 21; the moving module 22 drives the glue dropping device 23 to move along the first direction x and the second direction z to adjust the glue dropping position of the glue dropping device 23; the first direction x is a direction parallel to the horizontal plane, and the second direction z is a direction perpendicular to the horizontal plane.

[0049] Among them, the moving module 22 includes a sliding beam 221 and a telescopic arm 222 with a lifting axis; the lifting direction of the lifting axis is the second direction z; the sliding beam 221 is arranged parallel to the horizontal plane and extends along the first direction x, and the two ends of the sliding beam 221 in the extension direction are fixed to the middle plate 011 through a support frame 223.

[0050] Specifically, when the glue system 20 is glueing the substrate 11 to be processed, the substrate 11 to be processed is located on the carrier panel 211 of the glue table 21; wherein the area of ​​the carrier panel 211 is smaller than the area of ​​the substrate 11 to be processed, so that the gripping device 50 can grip it; and the carrier panel 211 can be raised and lowered relative to the glue table 21. When the gripping device 50 grips the substrate 11 to be processed on the carrier panel 211, the carrier panel 211 is raised relative to the glue table 21 to facilitate gripping; when applying glue, it is lowered into the concave inner cavity of the glue table 21 to facilitate glue spreading and prevent sputtering during the rotating glue spreading process; refer to Figure 2 The telescopic arm 222 includes a sliding end 2221 and a telescopic end 2222. The sliding end 2221 is slidably connected to the slide beam 221, and the glue dispensing device 23 is fixedly connected to the telescopic end 2222 of the telescopic arm 222. The sliding end 2221 of the telescopic arm moves along the extension direction of the slide beam 221 to drive the glue dispensing device 23 to move along a first direction x. The telescopic end 2222 of the telescopic arm telescopically moves in a direction perpendicular to the horizontal plane to drive the glue dispensing device 23 to move along a second direction z relative to the substrate 11 to be processed, thereby adjusting the glue dispensing position of the glue dispensing device 23. At the same time, the glue dispensing table 21 is rotatable, and the rotation direction and speed are controllable, thereby driving the substrate 11 to be processed located above the glue dispensing table 21 to rotate, and utilizing centrifugal force to evenly coat the glue liquid dripped on the substrate 11 to be processed. The rotation direction and speed can be determined based on the material to be dripped and the thickness of the substrate.

[0051] Optionally, the glue dripping device 23 includes a first glue dripping device and a second glue dripping device; the first glue dripping device contains a first material; the second glue dripping device contains UV black glue. The glue dripping materials in the first glue dripping device and the second glue dripping device can be set according to the desired substrate, and this is not limited to this. Specifically, two telescopic arms 222 can be provided on the sliding beam 221, and the first glue dripping device and the second glue dripping device are each fixedly connected to the telescopic end 2222 of a telescopic arm 222. Optionally, the first glue dripping device and the second glue dripping device both include a nozzle and a peristaltic pump to achieve uniform glue dripping through the nozzle and the peristaltic pump.

[0052] Optionally, Figure 3 This is a schematic diagram of a laminating system provided by an embodiment of the utility model, with reference to Figure 1 、 Figure 3 The laminating system 30 includes a support seat 31 and a laminating plate 32; the bottom end of the support seat 31 is fixed on the middle plate, and a beam 311 is provided on the top of the support seat 31. The beam 311 is located above the conveyor belt 60, and the extension direction of the beam 311 is parallel to the horizontal plane and perpendicular to the direction of transmission from the wafer stage 61 to the laminating system 30; one end of the laminating plate 32 is rotatably connected to the beam 311, and a mold 321 is provided on the first side surface of the laminating plate 32. The first side surface is the surface on which the laminating plate 32 is bonded to the substrate to be processed, and a diaphragm 322 is placed in the mold 321. The laminating plate 32 rotates around the beam 311 toward the wafer stage 61 so that the diaphragm 322 in the mold 321 on the first side surface is bonded to the substrate 11 to be processed.

[0053] Specifically, the laminating plate 32 is fixed above the conveyor belt by a crossbeam 311. A mold 321 is provided on the first side surface of the laminating plate 32, and a diaphragm 322 is placed inside the mold 321. In an optional embodiment of the present invention, the middle area of ​​the first side surface of the laminating plate 32 is hollowed out for installing and removing molds with the same external specifications but different laminating surface dimensions. The mold 321 is provided with air holes inside, and the diaphragm 322 can be fixed inside the mold 321 by vacuum adsorption. When the wafer support table 61 reaches the working area of ​​the laminating system 30, the laminating plate 32 rotates around the crossbeam 311 in the direction S2, so that the diaphragm 322 on the first side surface is laminated with the substrate 11 to be processed. The power for flipping the laminating plate 32 can be provided by an air compressor, which is not limited to this.

[0054] Optionally, the laminating system 30 also includes a rubber roller 33; the extension direction of the rubber roller 33 is the same as the extension direction of the beam 311 and the rubber roller 33 is rollingly connected to the end of the laminating plate 32 opposite to the beam 311; when the laminating plate 32 is laminated with the substrate 11 to be processed, the rubber roller 33 rolls on the wafer table 61 in a direction opposite to the transmission direction of the conveyor belt to press the film 322 and the substrate 11 to be processed.

[0055] Specifically, the bonding plate 32 rotates around the beam 311 in the direction S2, so that the diaphragm 322 on the first side surface is bonded to the substrate 11 to be processed. At this time, the conveyor belt 60 drives the wafer support table 61, so that the substrate 11 to be processed and the diaphragm 322 on the wafer support table 61 move relative to the bonding plate 32 in the direction S1. Correspondingly, the rubber roller 33 rolls in the direction opposite to the transmission direction S1 of the conveyor belt to press the diaphragm 322 and the substrate 11 to be processed, so that the bonding effect between the substrate 11 to be processed and the diaphragm 322 is smoother.

[0056] Optionally, the device also includes a second grabbing device 71 and a film placing groove 72; the second grabbing device 71 and the film placing groove 72 are both located in the area of ​​the intermediate plate surface close to the laminating system 30; a film sheet 322 is placed inside the film placing groove 72, and the second grabbing device 71 is used to grab the film sheet 322 from the film placing groove 72 to the mold 321 of the bonding plate.

[0057] There can be multiple film placement slots 72 to place different films so that the corresponding films can be selected according to different substrates. The second gripping device 71 is a suction cup manipulator that sucks out the film 322 from the film placement slot 72 and places it in the mold 321 of the laminating board.

[0058] Optionally, Figure 4 This is a schematic diagram of the distribution structure of a transmission belt provided by the embodiment of the utility model, with reference to Figure 4 The conveyor belt 60 is distributed in the shape of a "sun", and the wafer holding table carries the substrate 11 to be processed. As the conveyor belt moves along the preset transmission route, it first passes through the glue leveling system 20. After completing the first glue leveling, it continues to move along the conveyor belt 60 to the coating system 30 for coating, and then moves to the glue leveling system 20 for the second glue leveling, and finally is transmitted to the light curing system 40 for light curing; among them, the "sun" shaped conveyor belt can be equipped with multiple wafer holding tables 61 at the same time, so that multiple wafer holding tables 61 can carry out the above-mentioned glue leveling process at the same time, and the transmission paths will not conflict, which further improves the glue leveling efficiency.

[0059] Optionally, the light curing system 40 includes a UV lamp tube 41, a lampshade 42 and a fan 43; the lampshade 42 is arranged above the conveyor belt, and the UV lamp tube 41 and the fan 43 are fixed to the side of the lampshade 42 facing the conveyor belt 60; when the wafer table 61 carries the substrate 11 to be processed and is transferred to the bottom of the lampshade 42 along the conveyor belt 60, the UV lamp tube 41 emits light and cooperates with the fan 43 to cure the substrate 11 to be processed. Exemplarily, the UV lamp tube 41 can be a UV curing lamp with a wavelength range of 365nm, equipped with a voltage regulator and a capacitor. The lampshade 42 adopts a focusing reflective cover to concentrate the energy of the reflected UV light, thereby improving the efficiency of light curing. The fan 43 is used for exhaust and heat dissipation, and is used in conjunction with a thermostat to automatically control the operation of the fan according to the actual temperature.

[0060] Optionally, a sensing door 80 is also included, which is arranged on the transmission path from the light curing system 40 to the glue spreading system 20; the sensing door 80 includes a sensing area, and the sensing door 80 opens when the wafer carrier 61 is transferred to the sensing area, so that the wafer carrier 61 is transferred to the glue spreading system.

[0061] Specifically, when the light curing system 40 is curing the UV-coated black glue, the sensing door 80 is closed to prevent light emitted by the UV lamp 41 in the light curing system from leaking into the glue distributing system 20 and affecting the dripping of the material in the glue distributing system 20. The sensing door 80 is opened only when the substrate stage 61 is transferred to the sensing area, that is, when the curing is completed and the substrate is transferred.

[0062] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A fully automatic coating light-curing integrated coating equipment, characterized in that: It includes box, film placement tank, glue spreading system, laminating system, light curing system, gripping device and conveyor belt; The film placement tank, the glue spreading system, the film coating system, the light curing system, the gripping device and the conveyor belt are all placed inside the box, and the glue spreading system, the film coating system and the light curing system are arranged along the extension direction of the conveyor belt; the film placement tank is equipped with a substrate to be processed, and a film holding table is provided on the conveyor belt; The substrate table carries the substrate to be processed and moves along a preset transmission route via the conveyor belt; the coating system is used to coat the substrate to be processed with a first material layer; the coating system is used to coat the substrate to be processed coated with the first material layer; the coating system is also used to coat the coated substrate to be processed with UV black glue; the light curing system is used to cure the substrate to be processed coated with UV black glue; The grabbing device is used to grab the substrate to be processed from the wafer placement groove to the glue spreading system, and realize the displacement of the substrate to be processed between the wafer holding table and the glue spreading system.

2. The glue-spinning equipment according to claim 1, characterized in that: The interior of the box includes a middle plate parallel to the horizontal plane; The sheet placement slot, the glue spreading system, the film coating system, the light curing system, the gripping device and the conveyor belt are all placed on a side surface of the middle plate facing the top plate of the box body.

3. The glue-spinning equipment according to claim 1, characterized in that: A lifting platform for carrying the substrate to be processed is provided in the middle area of ​​the wafer stage; the area of ​​the lifting platform is smaller than the substrate to be processed and the lifting platform can be raised and lowered relative to the wafer stage.

4. The glue-spinning equipment according to claim 2, characterized in that: The glue dispensing system includes a glue dispensing table, a mobile module and a glue dispensing device; The glue dispensing station includes a hollowed-out area in the middle, wherein the hollowed-out area accommodates a wafer carrier panel for carrying the substrate to be processed; the movable module is located above the glue dispensing station, and the glue dispensing device is fixedly connected to a side of the movable module facing the glue dispensing station; The moving module drives the glue dropping device to move along a first direction and a second direction to adjust the glue dropping position of the glue dropping device; the first direction is a direction parallel to the horizontal plane, and the second direction is a direction perpendicular to the horizontal plane.

5. The glue-spinning equipment according to claim 4, characterized in that: The mobile module includes a sliding beam and a telescopic arm having a lifting shaft; the lifting direction of the lifting shaft is the second direction; The sliding beam is arranged parallel to the horizontal plane and extends along the first direction, and both ends of the sliding beam in the extension direction are fixed to the middle plate through support frames; The telescopic arm includes a sliding end and a telescopic end, the sliding end is slidably connected to the sliding beam, and the glue dropping device is fixedly connected to the telescopic end of the telescopic arm; the sliding end of the telescopic arm moves along the extension direction of the sliding beam to drive the glue dropping device to move along the first direction, and the telescopic end of the telescopic arm telescopically moves in a direction perpendicular to the horizontal plane to drive the glue dropping device to move along the second direction relative to the substrate to be processed.

6. The glue-spinning equipment according to claim 4, characterized in that: The glue dropping equipment includes a first glue dropping device and a second glue dropping device; the first glue dropping device contains the first material; the second glue dropping device contains the UV black glue.

7. The coating equipment according to claim 6, characterized in that: The first glue dropping device and the second glue dropping device both include a nozzle and a peristaltic pump.

8. The glue-spinning equipment according to claim 4, characterized in that: The diameter of the carrier panel is smaller than that of the substrate to be processed, and the carrier panel can be raised and lowered relative to the glue-dispensing platform; the glue-dispensing platform can be rotated, and the direction and speed of rotation are controllable.

9. The glue-spinning equipment according to claim 2, characterized in that: The laminating system includes a support base and a laminating plate; the bottom end of the support base is fixed to the middle plate, and a crossbeam is provided on the top end of the support base. The crossbeam is located above the conveyor belt, and the extension direction of the crossbeam is parallel to the horizontal plane and perpendicular to the direction of the wafer stage being transferred to the laminating system; One end of the bonding plate is rotatably connected to the crossbeam, a mold is provided on the first side surface of the bonding plate, the first side surface is the surface where the bonding plate is bonded to the substrate to be processed, a diaphragm is placed inside the mold, and the bonding plate rotates around the crossbeam toward the wafer table so that the diaphragm in the mold on the first side surface is bonded to the substrate to be processed.

10. The coating equipment according to claim 9, characterized in that: The laminating system further includes a rubber roller; the extension direction of the rubber roller is the same as the extension direction of the beam and the rubber roller is rollingly connected to the end of the laminating plate opposite to the beam; When the laminating plate and the substrate to be processed are laminated, the rubber roller rolls on the wafer stage in a direction opposite to the conveying direction of the conveyor belt to press the membrane and the substrate to be processed.

11. The glue-spinning equipment according to claim 9, characterized in that: It also includes a second gripping device and a film placing groove; the second gripping device and the film placing groove are both located in the area of ​​the surface of the middle plate close to the film coating system; The film sheet is placed inside the film placing groove, and the second grabbing device is used to grab the film sheet from the film placing groove and put it into the mold of the bonding plate.

12. The glue-spinning equipment according to claim 1, characterized in that: The transmission belts are distributed in a "sun" shape.

13. The coating equipment according to claim 1, characterized in that: The light curing system includes a UV lamp, a lampshade and a fan; the lampshade is arranged above the conveyor belt, and the UV lamp and the fan are fixed to the side of the lampshade facing the conveyor belt; When the wafer stage carries the substrate to be processed and is transported to the bottom of the lampshade along the conveyor belt, the UV lamp emits light and cooperates with the fan to cure the substrate to be processed.

14. The coating equipment according to claim 1, characterized in that: It also includes an induction door, which is arranged on the transmission path from the light curing system to the glue spreading system; The sensing door includes a sensing area, and the sensing door opens when the wafer stage is transferred to the sensing area, so that the wafer stage is transferred to the coating system.

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