LED chip cutting device

Abstract

The utility model relates to the field of LED chip processing, in particular to an LED chip cutting device. The LED chip cutting device comprises a base, a bearing plate and a plurality of cutting units, wherein the bearing plate is arranged above the base and can ascend and descend relative to the base. Wherein each cutting unit comprises two blades capable of moving relatively and an extension spring arranged between the two blades. In the process of inserting an LED chip into the LED chip cutting device, due to the fact that the extension spring is in a natural state and the interval between the two blades is smaller than or equal to the minimum side length of an LED lamp, after the LED lamp is squeezed between the two adjacent blades, due to the action of the extension spring, the two blades are attached to the side edge of the LED lamp, and then under the action of the driving mechanism, the LED chip is inserted into the LED chip cutting device. And the bearing plate drives the blade to descend relative to the base until the LED lamp is cut off from the substrate. According to the LED chip cutting device, the gap between the two blades is adjusted through the extension spring, so that the requirement for cutting LED lamps of different specifications on the LED chip is met, and the LED chip cutting device has the advantage of being wide in application range.

Description

Technical Field

[0001] The present disclosure relates to the field of LED chip processing, and in particular to an LED chip cutting device. Background Art

[0002] During the LED chip packaging process, multiple LED lights are often processed on the same substrate, and these LED lights are arranged in an array on the substrate. Then, the LED chip carrying multiple LED lights needs to be cut and the LED lights are cut individually.

[0003] In the prior art, LED chips are often cut using a stripping machine due to their thin substrates. However, the stripping machines currently used on the market require different cutting templates to cut different types of LED chips. Since each cutting template needs to be customized, the manufacturing cost is high.

[0004] Therefore, how to provide a low-cost cutting device suitable for cutting multiple types of LED chips has become a technical problem that needs to be solved urgently. Utility Model Content

[0005] In order to solve the problem in the prior art that different types of LED chips require different special cutting templates for cutting, thereby causing high LED chip processing costs, the present disclosure provides an LED chip cutting device.

[0006] The present disclosure provides an LED chip cutting device, wherein the LED chip includes a substrate and LED lamps arranged on the substrate in a square array. The LED chip cutting device includes:

[0007] a base configured to place an LED chip;

[0008] A pressure plate, the pressure plate being arranged above the base in a liftable manner;

[0009] At least two cutting units, at least two of which are sequentially spaced apart on the lower surface of the pressure plate, and each cutting unit comprises two blades spaced apart and moving relative to each other, and a tension spring disposed between the two blades, wherein the tension spring is in a natural state such that the spacing between the two blades is less than or equal to the minimum side length of the LED lamp;

[0010] A driving mechanism is provided on the base and is configured to push the pressure plate to drive the blade to descend and cut the LED chip.

[0011] In one embodiment of the present disclosure, the LED chip cutting device includes at least three cutting units and a telescopic retaining frame. The telescopic retaining frame is arranged on the lower surface of the pressure plate in a telescopic manner and is hinged to one of the blades of each cutting unit. Under the action of a force perpendicular to the extension direction of the blade edge, the telescopic retaining frame drives the blade to move and adjusts the gap between two adjacent cutting units.

[0012] In one embodiment of the present disclosure, the telescopic retainer comprises:

[0013] A scissor-fork type telescopic member, wherein the middle hinge shaft at the starting end of the scissor-fork type telescopic member is hinged to the pressure plate and the blade at the starting end, and the remaining middle hinge shafts are hinged to the corresponding blades, and the blade at the starting end is fixedly arranged on the pressure plate;

[0014] Two rails arranged parallel to each other, each rail having a first guide groove, the end hinge shaft of the scissor-fork telescopic member is inserted into the first guide groove, and the first guide groove extends in a direction perpendicular to the cutting edge of the blade;

[0015] A connecting member having a second guide groove and a third guide groove, wherein the second guide groove extends in a direction perpendicular to the cutting edge of the blade, and the third guide groove extends in a direction parallel to the cutting edge of the blade, the end of the blade facing away from the cutting edge is slidably inserted into the third guide groove, and the rail is slidably inserted into the second guide groove.

[0016] In one embodiment of the present disclosure, an accommodating groove for placing the telescopic retainer is provided on the edge of the blade away from the cutting edge.

[0017] In one embodiment of the present disclosure, the pressure plate and the blade are slidably matched through matching slides and sliding parts, the slides extend in a direction perpendicular to the cutting edge of the blade, the cross-sectional shapes of the slides and the sliding parts are both T-shaped, and one of the slides and the sliding part is arranged on the pressure plate, and the other is arranged on the blade.

[0018] In one embodiment of the present disclosure, both blades of the same cutting unit have outwardly expanding introduction portions, and the end portion of the introduction portion of the blade located at the starting end exceeds the ends of the remaining blades.

[0019] In one embodiment of the present disclosure, the base has a guide column, and the pressure plate is lifted and lowered relative to the base through the guide column under the action of the driving mechanism.

[0020] In one embodiment of the present disclosure, the LED chip cutting device further includes a compression spring provided at two adjacent cutting units.

[0021] In one embodiment of the present disclosure, the driving mechanism includes:

[0022] A cylinder, wherein the cylinder body of the cylinder is fixedly arranged on the base;

[0023] a telescopic rod, wherein the end of the piston rod is movably inserted into the telescopic rod, and the telescopic rod is configured to contact the pressure plate and push the pressure plate to drive the blade downward under the push of the piston rod of the cylinder;

[0024] A return spring is sleeved on the guide column and pre-compressed between the base and the pressure plate, and is configured to push the pressure plate to return to its original position after the driving force of the cylinder is removed.

[0025] In one embodiment of the present disclosure, the telescopic rod comprises:

[0026] a first kit having a first blind hole, the end of the piston rod being movably inserted into the first blind hole, and the end of the piston rod having a first flange, the first flange abutting against a first stop ring in the first blind hole in the axial direction to limit the piston rod from being disengaged from the first blind hole;

[0027] a first buffer spring, the first buffer spring being located in the first blind hole and pre-compressed between the end of the piston rod and the bottom of the first blind hole;

[0028] a second sleeve, wherein the second sleeve has a second blind hole, an end portion of the first sleeve is movably inserted into the second blind hole, and the end portion of the first sleeve has a second flange, the second flange abuts against a second stop ring in the second blind hole in the axial direction to limit the first sleeve from being separated from the second blind hole;

[0029] A second buffer spring is located in the second blind hole and is pre-compressed between the end of the first sleeve and the bottom of the second blind hole.

[0030] One beneficial effect of the present disclosure is that the LED chip cutting device provided herein includes a base for supporting the LED chip and a drive mechanism, a pressure plate disposed above the base and capable of rising and falling relative to the base, and a cutting unit disposed on the lower surface of the pressure plate. Each cutting unit includes two blades capable of relative movement and a tension spring disposed between the two blades.

[0031] In actual use, an LED chip is inserted into the LED chip cutting device. Because the tension spring is in its natural state, the distance between the two blades is less than or equal to the minimum side length of the LED lamp. Therefore, once the LED lamp is squeezed between the two adjacent blades, the tension spring forces the two blades to conform to the sides of the LED lamp. The drive mechanism then pushes the pressure plate, driving the cutting unit on its lower surface downward, completing the cutting of the LED chip.

[0032] The LED chip cutting device provided by the present disclosure utilizes a tension spring to adjust the gap between the two blades to meet the needs of cutting LED lamps of different specifications on LED chips, and has the advantage of a wide range of applications.

[0033] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0035] Figure 1 This is a schematic diagram of the overall structure of an LED chip cutting device provided by an embodiment of the present disclosure;

[0036] Figure 2 This is a partial structural diagram of an LED chip cutting device provided by an embodiment of the present disclosure;

[0037] Figure 3 This is a structural diagram of a cutting unit and a base of an LED chip cutting device provided by an embodiment of the present disclosure;

[0038] Figure 4 1 is a schematic top view of the structure of a telescopic holder and a cutting unit of an LED chip cutting device provided in one embodiment of the present disclosure;

[0039] Figure 5 This is a schematic diagram of the three-dimensional structure of a telescopic holder and a cutting unit of an LED chip cutting device provided in one embodiment of the present disclosure;

[0040] Figure 6 This is a schematic diagram of the position of the blade introduction portion of the cutting unit of the LED chip cutting device provided by one embodiment of the present disclosure;

[0041] Figure 7 This is a schematic diagram of the connector structure of an LED chip cutting device provided by an embodiment of the present disclosure;

[0042] Figure 8 This is a schematic structural diagram of a blade of an LED chip cutting device provided by an embodiment of the present disclosure;

[0043] Figure 9 Schematic diagram of the structure of the telescopic rod of the LED chip cutting device provided in one embodiment of the present disclosure.

[0044] Figures 1 to 9 The one-to-one correspondence between the component names and the reference numerals is as follows:

[0045] 1. LED chip; 11. LED lamp; 12. Substrate;

[0046] 2. Base; 21. Guide column; 22. Return spring;

[0047] 3. Pressure plate; 31. Slideway;

[0048] 4. Cutting unit; 41. Blade; 411. Introducing portion; 412. Blade; 413. Receiving groove; 414. Sliding portion; 42. Tension spring; 43. Compression spring;

[0049] 5. Driving mechanism; 51. Piston rod; 52. Telescopic rod; 521. First assembly; 522. First buffer spring; 523. Second assembly; 524. Second buffer spring;

[0050] 6. Telescopic retainer; 61. Scissor-fork telescopic member; 611. Intermediate hinge shaft; 612. End hinge shaft; 62. Track; 621. First guide groove; 63. Connecting member; 631. Second guide groove; 632. Third guide groove. DETAILED DESCRIPTION

[0051] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure.

[0052] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0053] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0054] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0055] The specific embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0056] In this document, “upper”, “lower”, “front”, “back”, “left”, “right”, etc. are only used to indicate the relative position relationship between related parts, rather than to limit the absolute positions of these related parts.

[0057] In this article, "first", "second", etc. are only used to distinguish each other, and do not indicate the importance and order, or the prerequisite for each other's existence.

[0058] In this document, “equal”, “same”, etc. are not strictly limited in a mathematical and / or geometric sense, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.

[0059] In order to solve the problem in the prior art that when a stripping machine cuts LED chips 1 , different types of LED chips 1 require different special cutting templates to complete the cutting, thereby causing high chip processing costs.

[0060] To this end, the present disclosure provides a LED chip cutting device, such as Figure 1 As shown, the LED chip cutting device includes: a base 2, a pressure plate 3, at least two cutting units 4 and a driving mechanism 5.

[0061] Among them, the base 2 is configured to place the LED chip 1; the pressure plate 3 is arranged above the base 2 in a liftable manner; at least two cutting units 4 are arranged in sequence on the lower surface of the pressure plate 3, and the cutting unit 4 includes two blades 41 arranged at intervals and moving relative to each other and a tension spring 42 arranged between the two blades 41. The tension spring 42 is in a natural state, and the interval between the two blades 41 is less than or equal to the minimum side length of the LED lamp 11; the driving mechanism 5 is arranged on the base 2, and is configured to push the pressure plate 3 to drive the blade 41 to descend and cut the LED chip 1.

[0062] The LED chip 1 includes a substrate 12 and LED lamps 11 arranged in a square array on the substrate 12. During the actual manufacturing process, the LED lamps 11 and the portion of the substrate 12 bonded to the bottom of the LED lamps 11 need to be cut away from the LED chip 1 to form individual LED lamp units.

[0063] Combine Figure 2 After analysis, the LED chip cutting device provided by the present disclosure includes a base 2, which is mainly responsible for carrying the LED chip 1 and supporting the LED chip 1 to the working position in actual application. At the same time, the base 2 is also responsible for installing the driving mechanism 5.

[0064] The pressure plate 3 in the LED chip cutting device serves as a carrier for mounting multiple cutting units 4 and can be raised and lowered relative to the base 2. The cutting units 4, located on the lower surface of the pressure plate 3, serve as the actuators for cutting the LED chips 1 and include two blades 41 and a tension spring 42.

[0065] The blade 41 is arranged perpendicular to the lower surface of the pressure plate 3 and has a cutting edge 412 at one end away from the pressure plate 3. The two blades 41 in each cutting unit 4 can move relative to each other to adjust the distance between the blades 41.

[0066] Since the sizes of LED chips 1 of different models are different in the actual production process, the distance between the blades 41 needs to be adjusted to complete the cutting of LED chips 1 of different models.

[0067] In the initial state of the above-mentioned LED chip cutting device, the distance between the blade 412 of the blade 41 in the cutting unit 4 and the upper surface of the base 2 should be greater than the thickness of the substrate 12 in the LED chip 1, and less than the overall thickness of the LED chip 1, that is, the sum of the thicknesses of the substrate 12 in the LED chip 1 and the LED lamp 11.

[0068] It is easy to understand that this distance setting can ensure that the LED chip 1 is smoothly inserted into the LED chip cutting device, and the LED lamp 11 is clamped by the blade 41 in the LED chip cutting device.

[0069] The specific working process of the LED chip cutting device disclosed in the present invention is: the side of the LED chip 1 provided with the LED lamp 11 faces upward, the lower surface of the substrate 12 in the LED chip 1 is fitted with the upper surface of the base 2, and each column of the LED chip 1 is inserted into a corresponding cutting unit 4.

[0070] like Figure 3 As shown, each cutting unit 4 includes two blades 41 that can move relative to each other. Since the initial gap between the two blades 41 is less than or equal to the minimum side length of the LED lamp 11, the LED lamp 11 in the LED chip 1 needs to squeeze between the two blades 41 during insertion into the cutting unit 4, increasing the distance between the two blades 41. A tension spring 42 is provided between the two blades 41. Under the action of this tension spring 42, the two blades 41 tend to narrow the gap, ultimately abutting the two blades 41 on either side of the LED lamp 11.

[0071] It should be noted that the aforementioned minimum side length of the LED lamp 11 actually refers to the minimum side length of the various models of LED lamps 11 to be processed. For example, if the LED chip cutting device is used to process three models of LED chips 1: an X1 chip with dimensions of 5mm x 3mm; an X2 chip with dimensions of 5.5mm x 3.2mm; and an X3 chip with dimensions of 5.8mm x 3.5mm, then the aforementioned minimum side length of the LED lamp 11 should be 3mm.

[0072] After the two blades 41 are attached to both sides of the LED lamp 11, the user inserts all the LED chips 1 to be cut into the LED chip cutting device and controls the drive mechanism 5 to push the pressure plate 3 downward, causing the blades 41 in the cutting unit 4 to cut downward along the sides of the LED lamp 11. Finally, the blades 41 penetrate the substrate 12 of the LED chip 1, completing the cutting of the LED chip 1 in one direction.

[0073] The LED chip 1 that has been cut in one direction is then taken out, rotated 90 degrees, and reinserted into the LED chip cutting device. The cutting process is the same as the above process to complete the cutting in the other direction of the LED chip 1 to form a separate LED lamp 11.

[0074] The LED chip cutting device provided by the present disclosure is suitable for cutting LED chips 1 of varying sizes. Furthermore, a tension spring 42 is provided between the two blades 41 in the cutting unit 4, allowing the blades 41 to conform to the sides of the LED lamp 11 and clamp the LED lamp 11. This not only solves the problem of inconvenient positioning of traditional cutting molds, but also avoids the problem of the cut LED lamp 11 not meeting the required size due to the manufacturing accuracy of the cutting mold during the cutting process.

[0075] In one embodiment of the present disclosure, the LED chip cutting device includes at least three cutting units 4, and the LED chip cutting device includes a telescopic retaining frame 6, which is arranged in a telescopic manner on the lower surface of the pressure plate 3 and is hinged to one of the blades 41 of each cutting unit 4. Under the action of a force perpendicular to the extension direction of the blade 412 of the blade 41, the blade 41 is driven to move and the gap between two adjacent cutting units 4 is adjusted.

[0076] In the actual production process of LED chips 1, multiple rows and columns of LED lamps 11 are often mounted on the same substrate 12. For example, 18 rows x 10 columns of LED lamps 11 may be processed on a single substrate 12. In this case, the LED chip cutting device needs to position the chips in each column. However, using a one-by-one positioning method is not only complex but also inefficient.

[0077] Therefore, in the LED chip cutting device provided by the present disclosure, a telescopic holder 6 is further provided to adjust the gap between the cutting units 4 .

[0078] Specifically, because the LED chips 1 are arranged in a square array on the substrate 12 during the manufacturing process, the distance between each column is equal. In the embodiment provided herein, the two cutting units at the starting end first contact the LED chips to achieve positioning. After the two columns of LED lights 11 are positioned, the distance between the other cutting units 4 is adjusted using the telescopic retainer 6 to align the other cutting units 4 with the LED lights 11 in the other columns, facilitating the insertion of the LED lights 11 in the other columns into the corresponding cutting units 4.

[0079] In the LED chip cutting device provided in the present invention, the telescopic retaining frame is arranged in a telescopic manner on the lower surface of the pressure plate 3 and is hinged to a blade 41 in each cutting unit 4. During the process of inserting the LED chip 1 into the LED chip cutting device, the telescopic retaining frame changes with the change of the distance between the two cutting units 4 at the starting end, and adjusts the gap between the other two adjacent cutting units 4.

[0080] Specifically, if Figure 5 As shown, in one embodiment of the present disclosure, the telescopic retainer 6 includes a scissor-fork type telescopic member 61, two rails 62, and a connecting member 63 for keeping the two rails 62 parallel.

[0081] Among them, the middle hinge shaft 611 at the starting end of the scissors-fork telescopic member 61 is hinged to the pressure plate 3 and the blade 41 at the starting end, and the remaining middle hinge shafts 611 are hinged to the corresponding blades 41, and the blade at the starting end is fixedly set on the pressure plate; the two tracks 62 are parallel to each other, and each of the tracks 62 has a first guide groove 621, and the end hinge shaft 612 of the scissors-fork telescopic member 61 is inserted into the first guide groove 621, and the first guide groove 621 extends in a direction perpendicular to the blade 41; the connecting member 63 has a second guide groove 631 and a third guide groove, the second guide groove 631 extends in a direction perpendicular to the blade 41, and the third guide groove 632 extends in a direction parallel to the blade 41, and the end of the blade 41 away from the blade 412 is slidably inserted into the third guide groove, and the track 62 is slidably inserted into the second guide groove 631.

[0082] In this telescopic holder 6, a scissor-fork telescopic member 61 serves as the main transmission mechanism. Multiple transmission rods are arranged into multiple diamond-shaped members. Each diamond-shaped member connects two adjacent cutting units 4 and is hinged to the blade 41 of each cutting unit 4. Furthermore, to provide positioning, the blade 41 at the initial end is fixed to the pressure plate. Two parallel rails 62 are used to adjust the diamond-shaped members mounted on the other cutting units.

[0083] Specifically, analyzing the operating process of the aforementioned LED chip cutting device, during the insertion of the LED chip 1 into the device, the two cutting units 4 at the starting end are first inserted into the LED lamp 11, completing their positioning. At this point, the diagonal distance between the diamond-shaped members positioned between the two cutting units 4 is determined, thereby also determining the distance between the two rails 62. Subsequently, the diagonal lengths of the diamond-shaped members positioned on the other cutting units 4 are determined, as the hinge shaft 612 at the end of the scissor-fork telescopic member 61 is inserted into the first guide slot 621. This determines the distance between the two rails 62, thereby ensuring that the distance between each cutting unit 4 is equal.

[0084] In addition, if Figure 7 As shown, the connecting member 63 serves as a component to ensure that the two rails 62 are parallel to each other. It has a guide groove on its upper and lower surfaces, namely the second guide groove 631 and the third guide groove 632. The second guide groove 631 extends in a direction perpendicular to the cutting edge 412 of the blade 41, and the third guide groove 632 extends in a direction parallel to the cutting edge 412 of the blade 41. The second guide groove 631 and the third guide groove 632 are perpendicular to each other.

[0085] During installation, two of the above-mentioned connecting members 63 are set on the same blade 41, and the third guide groove 632 of the connecting member 63 is slidably inserted into the end of the blade 41 away from the cutting edge 412, and the second guide grooves 631 of the two connecting members 63 are respectively slidably inserted into the two rails 62 mentioned above.

[0086] Due to the structure of the connecting member 63 , each rail 62 is perpendicular to the blade 41 , thereby ensuring the parallelism between the two rails 62 .

[0087] The LED chip cutting device provided by the present invention provides a telescopic retaining frame 6, so that when the LED chip is inserted into the LED chip cutting device, the cutting unit 4 corresponding to each column of LED lamps 11 can be positioned, thereby avoiding the LED lamp 11 from colliding with the blade 41 in the cutting unit 4 due to inaccurate positioning, thereby avoiding wear and tear.

[0088] like Figure 8As shown, during the installation process, in order to save assembly space, in one embodiment of the present disclosure, the LED chip cutting device provided herein has a receiving groove 413 for accommodating the telescopic holder 6 on the edge of the blade 41 facing away from the cutting edge 412. This arrangement ensures that the telescopic holder 6 can adjust the various cutting units 4 without affecting the movement of the blade 41 in the cutting unit 4 relative to the pressure plate 3.

[0089] Furthermore, in one embodiment of the present disclosure, the LED chip cutting device includes at least two telescopic holders 6 , and the at least two telescopic holders 6 are sequentially spaced apart along the extending direction of the blade 412 .

[0090] like Figure 3 As shown, the LED chip cutting device provided by the present disclosure is provided with multiple telescopic holders 6, and the multiple telescopic holders 6 are evenly arranged in the extension direction of the blades 41 in the cutting units 4. When the telescopic holders 6 adjust the gap between the cutting units 4, such an arrangement helps to ensure that the blades 41 in each cutting unit 4 are properly stressed, and avoids the blades 41 from rotating due to uneven stress, thereby increasing the wear between the blades 41 and the carrier plate.

[0091] Of course, in practical applications, the number of telescopic holders 6 should be reasonably set according to the length of the blade 41 in the cutting unit 4 .

[0092] Combine Figure 2 、 Figure 8 For explanation, in one embodiment of the present disclosure, the pressure plate 3 and the blade 41 are slidably matched through a corresponding slide 31 and a sliding portion 414, the slide 31 extends in a direction perpendicular to the cutting edge 412 of the blade 41, and the cross-sectional shape of the slide 31 and the sliding portion 414 are both T-shaped, and one of the slide 31 and the sliding portion 414 is arranged on the pressure plate 3, and the other is arranged on the blade 41.

[0093] In the LED chip cutting device provided in the present invention, in order to realize the movable connection between the blade 41 in the cutting unit 4 and the pressure plate 3, a T-shaped slide 31 is arranged on the pressure plate 3 along a direction perpendicular to the cutting edge 412 of the blade 41, and a T-shaped sliding part 414 adapted to the T-shaped slide 31 is arranged at the end of the blade 41 away from the cutting edge 412.

[0094] During installation, the T-shaped sliding portion 414 of the blade 41 is embedded in the T-shaped slide 31, thereby realizing the movement of the blade 41 relative to the pressure plate 3. At the same time, the T-shaped slide 31 can also ensure that the blade 41 will not fall off from the pressure plate 3 during the process of cutting the LED chip 1, thereby ensuring the stability of the cutting of the LED chip 1.

[0095] Of course, in another embodiment of the present disclosure, a sliding portion 414 may be provided on the pressure plate 3 and a slideway 31 may be provided on the blade 41 , which will not be described in detail in the present disclosure.

[0096] like Figure 6 As shown, in one embodiment of the present disclosure, the two blades 41 of the same cutting unit 4 both have an outward-expanded introduction portion 411 , and the introduction portions 411 of the two cutting units 4 located at the starting end are longer than the introduction portions 411 of the other cutting units 4 .

[0097] The LED chip cutting device provided in the present disclosure is provided with an introduction part 411, so that when the LED chip 1 is inserted into the cutting unit 4, the LED lamp 11 of the LED chip 1 first contacts the introduction part 411, and enters between the two blades 41 of the same cutting unit 4 along the introduction part 411, thereby avoiding the LED lamp 11 from colliding with the blades 41 when inserted between the two blades 41, causing damage to the LED lamp 11.

[0098] In addition, since the introduction parts 411 of the two cutting units 4 at the starting end are longer than the introduction parts 411 of other cutting units 4, during the process of inserting the LED chip 1 into the LED cutting device, the LED chip 1 will first contact the two cutting units 4 at the starting end, and first complete the positioning of the two columns of LED lamps 11 corresponding to these two cutting units 4.

[0099] In one embodiment of the present disclosure, Figure 1 As shown, the base 2 has a guide column 21 , and the pressure plate 3 is lifted and lowered relative to the base 2 through the guide column 21 under the action of the driving mechanism 5 .

[0100] As analyzed above for the working process of the LED chip cutting device, after the driving mechanism 5 applies driving force to the pressure plate 3, since the base 2 is provided with a guide column 21, the pressure plate 3 drives the blade 41 to move along the guide column 21 toward the base 2 to complete the cutting of the LED chip 1.

[0101] In one embodiment of the present disclosure, the LED chip cutting device further includes a compression spring 43 provided on two adjacent cutting units 4 .

[0102] In practice, the manufacturing and assembly of the telescopic holder 6 can contain errors, which can result in the blades in the cutting units not being able to fully conform to the sides of the LED light. For example, the distance between the first and second cutting units is 10 mm. Ideally, the distance between the second and third cutting units should also be 10 mm. However, due to the errors in the telescopic holder 6, the actual distance between the third and second cutting units is 9.8 mm. Consequently, the blades in the third cutting unit cannot conform to the sides of the LED light, meaning there is a 0.2 mm gap between the blades in the third cutting unit, which are hinged to the telescopic holder, and the sides of the LED light.

[0103] Therefore, the LED chip cutting device provided by the present disclosure further provides a compression spring 43 between two adjacent cutting units 4 .

[0104] Since the second cutting unit has been positioned, the blade in the second cutting unit connected to the third cutting unit by the compression spring 43 no longer moves. Under the action of the compression spring 43, the blade in the third cutting unit hinged to the telescopic retaining frame is pushed toward the side of the LED lamp, and finally the blade is fitted with the side of the LED lamp, ultimately achieving precise cutting of the LED chip 1.

[0105] That is, the LED chip cutting device provided by the present invention effectively compensates for the errors caused by the cutting units and the telescopic retaining frame 6 during actual manufacturing and assembly by arranging compression springs 43 between each cutting unit, so that the LED chip cutting device provided by the present invention is more in line with actual production requirements and improves the practicality of the LED chip cutting device.

[0106] In one embodiment of the present disclosure, the drive mechanism includes a cylinder, a telescopic rod, and a return spring. The cylinder body is fixedly mounted on a base. The piston rod of the cylinder is movably connected to the telescopic rod. After the piston rod pushes the telescopic rod to contact a pressure plate, the pressure plate is pushed to drive the blade downward.

[0107] The return spring is sleeved on the guide column and pre-tightened between the base and the pressure plate, and is configured to push the pressure plate to return to its original position after the driving force of the cylinder is removed.

[0108] like Figure 9 As shown, after the LED chip is loaded into the cutting unit, the driving mechanism is started to complete the cutting of the LED chip. The driving mechanism includes a cylinder, a telescopic rod 52 and a return spring. The cylinder is mainly responsible for providing power to the telescopic rod so that the telescopic rod 52 can move up and down along the height direction of the base.

[0109] Specifically, the cylinder body is fixed relative to the base 2, while the piston rod 51 of the cylinder can move up and down in the height direction relative to the base 2. However, considering the small diameter of the piston rod and the high speed of movement of the piston rod 51 of the cylinder, if the piston rod 51 directly contacts the pressure plate, not only will the pressure on the pressure plate 3 be uneven due to the small contact area, but the piston rod 51 will also have a strong impact force on the pressure plate 3, indirectly affecting the service life of the blade 41.

[0110] Therefore, the LED chip cutting device provided by the present disclosure further includes a telescopic rod 52 installed on the piston rod 51 of the cylinder. Specifically, the telescopic rod 52 includes a first set 521, a second set 523, a first buffer spring 522 disposed inside the first set 521, and a second buffer spring 524 disposed inside the second set 523.

[0111] Among them, the first kit 521 has a first blind hole, the end of the piston rod 51 is inserted into the first blind hole in a movably manner, and the end of the piston rod 51 has a first flange, the first flange abuts against the first stop ring in the first blind hole in the axial direction to limit the piston rod from disengaging from the first blind hole; the first buffer spring 522 is located in the first blind hole and is pre-pressed between the end of the piston rod 51 and the bottom of the first blind hole; the second kit 523 has a second blind hole, the end of the first kit 521 is inserted into the second blind hole in a movably manner, and the end of the first kit 521 has a second flange, the second flange abuts against the second stop ring in the second blind hole in the axial direction to limit the first kit 521 from disengaging from the second blind hole; the second buffer spring 524 is located in the second blind hole and is pre-pressed between the end of the first kit 521 and the bottom of the second blind hole.

[0112] Combined with Figure 9 The working process of the telescopic rod 52 is described. The first set 521 is sleeved on the outside of the piston rod 51 of the cylinder, and the second set 523 is sleeved on the outside of the first set 521.

[0113] At the moment the cylinder's piston rod 51 pushes the telescopic rod 52 into contact with the pressure plate 3, the first flange of the piston rod 51 first slides within the first blind hole of the first component 521 and compresses the first buffer spring 522. It then pushes the second flange of the first component 521 to slide within the second blind hole of the second component 523 and compresses the second buffer spring 524. Finally, the driving force is transmitted to the pressure plate 3 via the second component 523, causing the pressure plate 3 to move the blade 41 downward. Because the first component 521 is provided with a first stop ring at the top, the first flange of the piston rod cannot be disengaged from the first blind hole. Similarly, because the second component 523 is provided with a second stop ring at the top, the second flange of the first component 521 cannot be disengaged from the second blind hole of the second component 523.

[0114] Such a configuration is beneficial for effectively buffering the driving force generated by the cylinder, reducing the impact of the piston rod 51 on the pressure plate 3 and the blade 41, and increasing the service life of the blade 41.

[0115] Moreover, the outer diameters of the piston rod 51 , the first set 521 , and the second set 523 increase successively, so that the contact area between the second set 523 and the pressure plate 3 is larger, thereby optimizing the stress condition of the pressure plate 3 .

[0116] Furthermore, since the drive mechanism is not fixedly connected to the pressure plate 3, the pressure plate 3 cannot automatically return to its original position after the drive mechanism removes the driving force. Therefore, a return spring 22 is sleeved on the guide shaft and pre-loaded between the base 2 and the pressure plate 3. The return spring 22 is configured to push the pressure plate 3 back to its original position after the drive mechanism 5 removes the driving force.

[0117] After the LED chip 1 is cut, it is necessary to lift the pressure plate 3 and the blade 41 to take out the cut LED chip 1, so a reset spring 22 is provided. After the driving mechanism 5 removes the driving force, the reset spring 22 pushes the pressure plate 3 and the blade 41 back to the initial position, thereby resetting the pressure plate 3 and the blade 41, and making it convenient for the user to take out the cut LED chip 1.

[0118] In order to more clearly illustrate the LED chip cutting device provided by the present disclosure, an application scenario is used for illustration:

[0119] When cutting LED chips, users first insert the bottom of the LED chip into the LED chip cutting device against the surface of the base. During this process, the LED chip first contacts and positions the cutting unit at the starting end, and then adjusts the gap between the other cutting units through the telescopic holder.

[0120] After positioning is completed, the user fully inserts the LED chip into the cutting unit of the LED chip cutting device. Subsequently, the user activates the driving mechanism, which pushes the carrier plate to drive the blade downward to complete the unidirectional cutting of the LED chip.

[0121] Then, the user takes out the chip, rotates it 90 degrees, and reinserts it into the LED chip cutting device to cut the LED chip in the other direction. At this point, the entire LED chip cutting process is completed.

[0122] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terms used herein are selected to best explain the principles of the embodiments, their practical applications, or technical improvements in the marketplace, or to enable other persons skilled in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. An LED chip cutting device, characterized in that: The LED chip (1) comprises a substrate (12) and LED lamps (11) arranged on the substrate (12) in a square array, and the LED chip cutting device comprises: A base (2), the base (2) being configured to place the LED chip (1); A pressure plate (3), the pressure plate (3) being arranged above the base (2) in a liftable manner; At least two cutting units (4), at least two of the cutting units (4) are sequentially spaced apart on the lower surface of the pressure plate (3), and the cutting unit (4) comprises two blades (41) spaced apart and relatively movable, and a tension spring (42) disposed between the two blades (41), wherein the spacing between the two blades (41) of the tension spring (42) in a natural state is less than or equal to the minimum side length of the LED lamp (11); A driving mechanism (5) is provided on the base (2) and is configured to push the pressure plate (3) to drive the blade (41) to descend and cut the LED chip (1).

2. The LED chip cutting device according to claim 1, characterized in that: The LED chip cutting device comprises at least three cutting units (4) and a telescopic holder (6), wherein the telescopic holder (6) is arranged on the lower surface of the pressure plate (3) in a telescopic manner and is hinged to one of the blades (41) of each cutting unit (4); The telescopic retainer is configured to drive the blade (41) to move and adjust the gap between two adjacent cutting units (4) under the action of a force perpendicular to the extension direction of the blade edge (412) of the blade (41).

3. The LED chip cutting device according to claim 2, characterized in that: The telescopic retainer (6) comprises: A scissor-fork type telescopic member (61), wherein the intermediate hinge shaft (611) at the starting end of the scissor-fork type telescopic member (61) is hinged to the pressure plate (3) and the blade (41) at the starting end, and the remaining intermediate hinge shafts (611) are hinged to the corresponding blades (41), and the blade (41) at the starting end is fixedly arranged on the pressure plate; Two rails (62) arranged parallel to each other, each rail (62) having a first guide groove (621), an end hinge shaft (612) of the scissor-fork type telescopic member (61) being inserted into the first guide groove (621), and the first guide groove (621) extending in a direction perpendicular to the cutting edge of the blade (41); A connecting member (63), wherein the connecting member (63) has a second guide groove (631) and a third guide groove (632), wherein the second guide groove (631) extends in a direction perpendicular to the blade edge of the blade (41), and the third guide groove (632) extends in a direction parallel to the blade edge of the blade (41), and the end of the blade (41) facing away from the blade edge (412) is inserted into the third guide groove (632) in a slidable manner, and the rail (62) is inserted into the second guide groove (631) in a slidable manner.

4. The LED chip cutting device according to claim 2, characterized in that: An accommodating groove (413) for accommodating the telescopic retainer (6) is provided on the edge of the blade (41) away from the cutting edge (412).

5. The LED chip cutting device according to claim 1, characterized in that: The pressure plate (3) and the blade (41) are slidably engaged via a matching slideway (31) and a sliding portion (414); The slideway (31) extends in a direction perpendicular to the blade edge of the blade (41), and the cross-sectional shapes of the slideway (31) and the sliding portion (414) are both T-shaped. One of the slideway (31) and the sliding portion (414) is arranged on the pressure plate (3), and the other is arranged on the blade (41).

6. The LED chip cutting device according to claim 1, characterized in that: The two blades (41) of the same cutting unit (4) both have an outwardly expanding introduction portion (411), and the end of the introduction portion (411) of the blade (41) located at the starting end exceeds the ends of the other blades (41).

7. The LED chip cutting device according to claim 1, characterized in that: The base (2) has a guide column (21), and the pressure plate (3) is lifted and lowered relative to the base (2) via the guide column (21) under the action of the driving mechanism (5).

8. The LED chip cutting device according to claim 1, characterized in that: The LED chip cutting device further comprises a compression spring (43) arranged on two adjacent cutting units (4).

9. The LED chip cutting device according to claim 7, characterized in that: The driving mechanism (5) comprises: A cylinder, the cylinder body of which is fixedly arranged on the base (2); a telescopic rod (52), wherein the end of the piston rod (51) of the cylinder is movably inserted into the telescopic rod (52), and the telescopic rod (52) is configured to contact the pressure plate (3) and push the pressure plate (3) to drive the blade (41) downward under the push of the piston rod (51) of the cylinder; A return spring (22) is sleeved on the guide column (21) and pre-compressed between the base (2) and the pressure plate (3), and is configured to push the pressure plate (3) to return to its original position after the driving force of the cylinder is removed.

10. The LED chip cutting device according to claim 9, characterized in that: The telescopic rod (52) comprises: a first set (521), wherein the first set (521) has a first blind hole, the end of the piston rod (51) is movably inserted into the first blind hole, and the end of the piston rod (51) has a first flange, and the first flange abuts against a first stop ring in the first blind hole in the axial direction to limit the piston rod (51) from being disengaged from the first blind hole; a first buffer spring (522), the first buffer spring (522) being located in the first blind hole and pre-compressed between the end of the piston rod (51) and the bottom of the first blind hole; A second sleeve (523), wherein the second sleeve (523) has a second blind hole, an end portion of the first sleeve is movably inserted into the second blind hole, and an end portion of the first sleeve (521) has a second flange, the second flange abuts against a second stop ring in the second blind hole in the axial direction to limit the first sleeve (521) from being separated from the second blind hole; A second buffer spring (524) is located in the second blind hole and is pre-compressed between the end of the first sleeve (521) and the bottom of the second blind hole.

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