Visual positioning laser processing device with underlying CCD (Charge Coupled Device)

Abstract

The utility model discloses a visual positioning laser processing device with an underlying CCD (Charge Coupled Device), which belongs to the field of laser processing equipment and comprises a cutting platform, a laser cutting module and a visual positioning component, a scanning head of the laser cutting module emits cutting laser to the cutting platform, the cutting platform comprises a transparent carrying table arranged below the scanning head, and the thick material workpiece is arranged on the transparent carrying table. The visual positioning assembly comprises a CCD camera and a light supplementing illumination module. The CCD camera is arranged below the transparent carrying table, and a lens of the CCD camera faces the printing face of the thick material workpiece and is used for shooting the printing face. According to the utility model, the back of the thick material workpiece is buckled on the transparent carrying table, and the CCD camera is positioned below the thick material workpiece, so that the scanning head directly carries out laser cutting on the back of the thick material workpiece, the defect that the edge of the printing surface of the thick material workpiece becomes yellow or has a bevel edge is avoided, and the attractiveness and the yield of products are effectively ensured.

Description

Technical Field

[0001] The utility model belongs to the field of laser processing equipment, and in particular relates to a CCD-mounted visual positioning laser processing device. Background Art

[0002] In modern manufacturing, laser cutting technology, with its high precision and high efficiency, has become an indispensable part. In particular, the introduction of CCD (charge-coupled device) vision positioning technology into laser cutting systems enables precise identification and positioning of workpieces by capturing image information of the workpiece being processed, significantly improving cutting accuracy. This technology is not only widely used for the fine cutting of thin sheet materials, but also demonstrates great potential in a variety of fields, including electronic component manufacturing and automotive parts production. Its high precision and intelligent features have made the application of laser cutting technology increasingly widespread.

[0003] In the prior art, some innovative laser processing devices have been proposed to further improve the processing effect. For example, the Chinese patent document with the announcement number CN201693290U provides a laser processing device that integrates multiple functions. In addition to the processing platform, laser, laser processing head and driving mechanism for adjusting the relative position, the device also introduces a camera and a computer. The laser processing device not only realizes the function of laser processing, but also gives the device the ability to accurately focus and position the initial position. However, although the device performs well in cutting thin plate materials, when processing thick materials with a thickness of more than 1 mm, it is easy to have yellowing edges or bevel defects on the printed surface. These problems are largely due to the fact that in the process of laser processing thick workpieces, as the thickness of the workpiece increases, the verticality of the laser cutting seam decreases, and it presents a slope, which causes the edges of the printed surface to yellow or bevel defects (such as Figure 1 After in-depth research, the inventor found that the printed surface of the thick workpiece is facing down and the CCD is placed below the thick workpiece (as shown). Figure 2 In this case, the scanning head performs laser cutting on the back of the thick workpiece, which can effectively avoid bevel defects on the printed surface. This provides a feasible solution for CCD vision positioning in laser cutting of thick workpieces.

[0004] Therefore, in view of the problems existing in the prior art, there is an urgent need to provide an improved CCD-undermounted visual positioning laser processing device to meet the demand for high-quality processing in modern manufacturing. Summary of the Invention

[0005] In response to the problems in the related art, the present invention proposes a CCD-mounted visual positioning laser processing device to overcome the above-mentioned technical problems in the existing related art.

[0006] The technical solution of the utility model is achieved as follows: a CCD-mounted visual positioning laser processing device comprises a frame, a cutting platform, a laser cutting module and a visual positioning component arranged on the frame; the cutting platform is used to place a thick workpiece to be processed; the laser cutting module comprises a laser, an optical path component and a scanning head; the cutting laser emitted by the laser passes through the optical path component and is emitted by the scanning head to the cutting platform; the cutting platform comprises a transparent carrier arranged below the scanning head, the thick workpiece is placed on the upper surface of the transparent carrier; wherein the side of the thick workpiece facing away from the scanning head is the printing side, and the side facing the scanning head is the back side;

[0007] The visual positioning component includes a CCD camera and a lighting module; the CCD camera is arranged below the transparent carrier, and the lens of the CCD camera faces the printing surface of the thick workpiece, which is used to photograph the printing surface; the lighting module is used for fill light and includes multiple light-emitting units, each of which is arranged below the transparent carrier and does not block the CCD camera's photography of the printing surface.

[0008] The utility model places the back of a thick workpiece on a transparent carrier, configures a CCD camera below the thick workpiece, and places a scanning head above the thick workpiece, so that the scanning head can directly perform laser cutting on the back of the thick workpiece, avoiding yellowing or bevel defects on the printed surface of the thick workpiece, and effectively ensuring the beauty and yield of the product.

[0009] As a further improvement to the above solution, the cutting platform includes a support frame that is fixedly connected to the frame; the support frame is provided with at least two crossbeams, with a distance between adjacent crossbeams, and the transparent carrier is mounted on the crossbeams. By providing at least two crossbeams on the support frame and maintaining a certain distance between adjacent crossbeams, a stable and flexible mounting space is provided for the transparent carrier, allowing the transparent carrier to be firmly placed on the crossbeams without the need for a complicated installation process. This also facilitates the operator to adjust the position of the transparent carrier or perform other operations according to actual needs, making the entire cutting process more flexible and smooth.

[0010] As a further improvement of the above solution, the support frame is a frame-shaped structure, and a dust collecting groove is provided between the peripheral edge of the transparent carrier and the frame structure.

[0011] A dust collecting bin is provided below the cutting platform. The dust collecting bin is an upper opening structure. The transparent carrier is mounted at the upper opening. The dust collecting slot is communicated with the interior of the dust collecting bin.

[0012] The support frame adopts a frame-like structure design, forming dust collection channels that run through the edges of the transparent platform. This clever use of space allows debris and dust generated during the cutting process to pass smoothly through these channels and fall into the dust collection bin below. This direct and efficient dust collection path greatly improves dust collection efficiency and reduces dust accumulation in the cutting area.

[0013] As a further improvement of the above solution, a light opening is provided at the bottom of the dust collecting bin, and the CCD camera is arranged below the dust collecting bin, and the CCD camera shoots upward through the light opening; the light-emitting units of the lighting module are arranged on the side wall or bottom of the dust collecting bin, and are arranged around the light opening.

[0014] By providing a light aperture at the bottom of the dust collection bin, the CCD camera is provided with a clear field of view, enabling it to directly shoot upward through the aperture to capture objects on the transparent stage without the need for additional light refraction or reflection devices, thus ensuring accurate and clear capture. Furthermore, the individual light-emitting units surrounding the light aperture provide ample and even lighting for capture. This surround layout not only ensures comprehensive lighting coverage of the capture area but also avoids glare or shadows caused by direct light, further improving image quality.

[0015] As a further improvement of the above solution, the lighting module includes a first light-emitting unit, which is arranged on the side wall of the dust collecting bin; a dust shield is provided above each first light-emitting unit, the outer end of the dust shield is fixed to the side wall of the dust collecting bin, and the inner end extends downward at an angle. By arranging a dust shield above each first light-emitting unit, the interference of debris and dust generated during the cutting process on the first light-emitting unit is effectively blocked, ensuring that the first light-emitting unit can continuously and stably emit light, avoiding the phenomenon of light attenuation due to dust coverage, and thus improving the quality of the captured image. In addition, the inner end of the dust shield extends downward at an angle, forming a reasonable dust-guiding structure, which not only enhances the stability of the dust shield, but also allows fallen debris and dust to slide along the inclined surface of the dust shield into the dust collecting bin, avoiding accumulation around the first light-emitting unit, and further ensuring the cleanliness and light-emitting effect of the first light-emitting unit.

[0016] As a further improvement of the above solution, the lighting module also includes a second light-emitting unit, which is close to the bottom of the dust collection bin, directly below the transparent carrier, and is completely blocked by the transparent carrier. Since the second light-emitting unit is blocked by the transparent carrier, the debris and dust generated during the cutting process are not easily exposed to the second light-emitting unit, thereby extending the service life of the second light-emitting unit and reducing maintenance costs. In addition, placing the second light-emitting unit directly below the transparent carrier also helps to achieve more uniform light exposure. Since the light penetrates the transparent carrier from below and shines on the object, a more uniform lighting effect can be formed, ensuring the quality of the captured image.

[0017] As a further improvement of the above solution, the second light-emitting unit is arranged on a folding plate, which includes a substrate and is fixedly connected to the side wall of the dust collecting bin through the substrate; one side of the substrate is provided with a mounting plane for mounting the second light-emitting unit; the other side of the substrate is provided with a dust-blocking plate, which partially blocks the second light-emitting unit.

[0018] As a further improvement to the above solution, the frame structure of the support frame is provided with a groove, and the crossbeam is a linear ridge that engages with the groove. The linear ridge is engaged with the groove to facilitate the installation of the linear ridge and ensure the stability of the installation of the linear ridge.

[0019] As a further improvement of the above solution, the dust collecting bin is a square funnel structure that gradually decreases from top to bottom; an exhaust port is provided on the side wall of the dust collecting bin, and the exhaust port is connected to the exhaust fan through a pipe.

[0020] As a further improvement to the above solution, the sidewall of the dust bin is equipped with an inspection window, which is detachably connected to a maintenance cover. This inspection window provides convenient access for maintenance personnel. This design allows maintenance personnel to directly observe the interior of the dust bin through the inspection window without having to dismantle the entire bin or move other equipment, greatly simplifying the maintenance process and improving work efficiency.

[0021] Beneficial effects of the utility model:

[0022] The utility model places the back of a thick workpiece on a transparent carrier, configures a CCD camera below the thick workpiece, and places a scanning head above the thick workpiece, so that the scanning head can directly perform laser cutting on the back of the thick workpiece, avoiding yellowing or bevel defects on the printed surface of the thick workpiece, and effectively ensuring the beauty and yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the laser cutting process for thick workpieces in the prior art;

[0024] Figure 2 This is a schematic diagram of the laser cutting of thick workpieces according to the present invention;

[0025] Figure 3 It is a three-dimensional diagram of the utility model;

[0026] Figure 4 A three-dimensional diagram of the cutting platform and visual positioning component of the present invention;

[0027] Figure 5 This is a front view of the cutting platform and visual positioning component of the present invention;

[0028] Figure 6 A top view of the cutting platform and visual positioning assembly of the present invention;

[0029] Figure 7 This is a schematic diagram of the assembly of the cutting platform and the visual positioning component with the transparent stage removed according to the present invention;

[0030] Figure 8 It is a cross-sectional view of the cutting platform and the visual positioning component of the present invention;

[0031] Reference numerals:

[0032] 1. Frame;

[0033] 2. Cutting platform; 21. Transparent carrier; 22. Support frame; 221. Groove; 23. Beam;

[0034] T1, dust collection slot; T2, light port;

[0035] 3. Laser cutting module; 31. Scanning head; 32. Cutting laser;

[0036] 4. Vision positioning assembly; 41. CCD camera; 42. Lighting module; 421. First light-emitting unit; 422. Second light-emitting unit; 43. Dust collection bin; 431. Dust shield; 432. Folding plate; 4321. Base plate; 4322. Mounting plane; 4323. Dust shield; 433. Exhaust vent; 434. Inspection window; 435. Inspection cover;

[0037] 5. Thick workpieces. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] Example

[0040] like Figures 1-8 The figure shows a CCD-mounted visual positioning laser processing device, comprising a frame 1, a cutting platform 2, a laser cutting module 3, and a visual positioning assembly 4 mounted on the frame 1. The cutting platform 2 is used to place thick workpieces 5 to be processed. Thick workpieces 5 refer to printed materials with a thickness exceeding 1 mm, such as stickers and billboards. The laser cutting module 3 includes a laser (not shown), an optical path assembly (not shown), and a scanning head 31. The cutting laser 32 emitted by the laser passes through several optical lenses in the optical path assembly and is emitted by the scanning head 31 onto the cutting platform 2.

[0041] In this embodiment, the cutting platform 2 includes a transparent carrier 21 disposed below a scanning head 31. The thick workpiece 5 is placed on the upper surface of the transparent carrier 21. The side of the thick workpiece 5 facing away from the scanning head 31 is the printing side, and the side facing the scanning head 31 is the back side. Specifically, the transparent carrier 21 can be made of a highly transparent glass plate, for example.

[0042] The cutting platform 2 also includes a support frame 22, which is fixedly connected to the frame 1; the support frame 22 is provided with at least two crossbeams 23, with a distance between adjacent crossbeams 23, and the transparent carrier 21 is mounted on the crossbeams 23. By arranging at least two crossbeams 23 on the support frame 22 and maintaining a certain distance between adjacent crossbeams 23, a stable and flexible mounting space is provided for the transparent carrier 21, so that the transparent carrier 21 can be firmly placed on the crossbeams 23 without the need for a complicated installation process. It is also convenient for the operator to adjust the position of the transparent carrier 21 or perform other operations according to actual needs, making the entire cutting process more flexible and smooth. In this embodiment, a groove 221 is provided on the frame structure of the support frame 22, and the crossbeam 23 is a linear ridge, which is engaged with the groove 221. The linear ridge is engaged with the groove 221 to facilitate the installation of the linear ridge and ensure the stability of the installation of the linear ridge.

[0043] The visual positioning component 4 includes a CCD camera 41 and a lighting module 42; the CCD camera 41 is arranged below the transparent carrier 21, and the lens of the CCD camera 41 is facing the printing surface of the thick workpiece 5, for photographing the printing surface; the lighting module 42 is used for fill light, and includes multiple light-emitting units, each of which is arranged below the transparent carrier 21 and does not block the CCD camera 41 from photographing the printing surface.

[0044] In this embodiment, the support frame 22 is a frame-shaped structure, and a dust collecting groove T1 is provided between the peripheral edge of the transparent carrier 21 and the frame structure, which is connected to the upper and lower parts. A dust collecting bin 43 is provided below the cutting platform 2. The dust collecting bin 43 is an upper-opening structure, and the transparent carrier 21 is installed at the upper opening. The dust collecting groove T1 is connected to the inside of the dust collecting bin 43. In this embodiment, the dust collecting bin 43 is a square funnel structure that gradually decreases from top to bottom. An exhaust port 433 is provided on the side wall of the dust collecting bin 43, and the exhaust port 433 is connected to the exhaust fan through a pipe. In this embodiment, an inspection window 434 is provided on the side wall of the dust collecting bin 43, and an inspection cover 435 is detachably connected to the inspection window 434. By providing the inspection window 434 on the side wall of the dust collecting bin 43, a convenient passage is provided for maintenance personnel. This design allows maintenance personnel to directly observe the internal conditions of the dust bin 43 through the inspection window 434 without having to dismantle the entire dust bin 43 or move other equipment, greatly simplifying the maintenance process and improving work efficiency. Specifically, the inspection cover 435 can be detachably connected to the inspection window 434 by hand screws.

[0045] In this embodiment, the support frame 22 adopts a frame-shaped structure, and dust collection slots T1 are formed between the support frame 22 and the side edges of the transparent platform 21. This clever use of the spatial structure allows debris and dust generated during the cutting process to pass smoothly through these slots and fall into the dust collection bin 43 below. This direct and efficient dust collection path greatly improves dust collection efficiency and reduces dust retention in the cutting area.

[0046] In this embodiment, a light opening T2 is provided at the bottom of the dust collecting bin 43, and the CCD camera 41 is provided below the dust collecting bin 43, and the CCD camera 41 shoots upwards through the light opening T2; the light-emitting units of the lighting module 42 are provided on the side wall or bottom of the dust collecting bin 43, and are arranged around the light opening T2. By providing the light opening T2 at the bottom of the dust collecting bin 43, a clear shooting field of view is provided for the CCD camera 41, so that the CCD camera 41 can directly shoot upwards the objects on the transparent carrier 21 through the light opening T2 without the need for additional light refraction or reflection devices, thereby ensuring the accuracy and clarity of the shooting. At the same time, the light-emitting units are arranged around the light opening T2 to provide sufficient and uniform light for shooting. This surround-type layout not only ensures that the light coverage of the shooting area has no dead angles, but also avoids glare or shadows caused by direct light, further improving the quality of the captured image.

[0047] In this embodiment, the lighting module 42 includes a first light-emitting unit 421, which is located on the side wall of the dust collection bin 43. A dust shield 431 is provided above each first light-emitting unit 421. The outer end of each dust shield 431 is fixedly connected to the side wall of the dust collection bin 43, and the inner end extends downward at an angle. The provision of the dust shield 431 above each first light-emitting unit 421 effectively prevents debris and dust generated during the cutting process from interfering with the first light-emitting unit 421, ensuring that the first light-emitting unit 421 can continuously and stably emit light, avoiding light attenuation caused by dust accumulation, and thus improving the quality of the captured image. In addition, the inner end of the dust shield 431 extends downward at an angle, forming a reasonable dust-guiding structure, which not only enhances the stability of the dust shield 431, but also allows the fallen debris and dust to slide along the inclined surface of the dust shield 431 into the dust collecting bin 43, avoiding accumulation around the first light-emitting unit 421, and further ensuring the cleanliness and light-emitting effect of the first light-emitting unit 421.

[0048] In this embodiment, the lighting module 42 also includes a second light-emitting unit 422, which is close to the bottom of the dust collection bin 43, directly below the transparent carrier 21, and is completely blocked by the transparent carrier 21. Since the second light-emitting unit 422 is blocked by the transparent carrier 21, the debris and dust generated during the cutting process are not easy to come into contact with the second light-emitting unit 422, thereby extending the service life of the second light-emitting unit 422 and reducing maintenance costs. In addition, placing the second light-emitting unit 422 directly below the transparent carrier 21 also helps to achieve more uniform light exposure. Since the light penetrates the transparent carrier 21 from below and shines on the object, a more uniform lighting effect can be formed, ensuring the quality of the captured image. Specifically, the first light-emitting unit 421 can adopt a combination of LED downlights and strip lamps, and the second light-emitting unit 422 can adopt LED downlights.

[0049] In this embodiment, the second light-emitting unit 422 is arranged on the folding plate 432, and the folding plate 432 includes a substrate 4321 and is fixedly connected to the side wall of the dust collecting bin 43 through the substrate 4321; a mounting plane 4322 is provided on one side of the substrate 4321 for mounting the second light-emitting unit 422; a dust blocking plate 4323 is provided on the other side of the substrate 4321, and the dust blocking plate 4323 partially blocks the second light-emitting unit 422.

[0050] The above-mentioned solution of the present invention is specifically applied in a CCD-mounted visual positioning laser processing device. When cutting a thick workpiece 5, the workpiece 5 is placed on its back on a transparent stage 21, a CCD camera 41 is positioned below the workpiece 5, and a scanning head 31 is positioned above the workpiece 5. The cutting laser 32 emitted by the laser passes through the optical path component and is then emitted by the scanning head 31 onto the cutting platform 2, allowing the scanning head 31 to directly laser cut the back of the thick workpiece 5, thereby preventing yellowing or bevel defects on the printed surface of the thick workpiece 5, effectively ensuring the product's aesthetics and yield rate.

[0051] Based on the disclosure and teachings of the above description, those skilled in the art may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and modifications and variations of the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although certain specific terms are used in this description, these terms are for convenience only and do not constitute any limitation to the present invention.

Claims

1. A CCD-mounted visual positioning laser processing device, comprising a frame, a cutting platform, a laser cutting module, and a visual positioning assembly mounted on the frame; the cutting platform is used to place thick workpieces to be processed; the laser cutting module comprises a laser, an optical path assembly, and a scanning head; the cutting laser emitted by the laser passes through the optical path assembly and is then emitted by the scanning head onto the cutting platform; characterized in that: The cutting platform includes a transparent carrier provided below the scanning head, and the thick workpiece is placed on the upper surface of the transparent carrier; wherein the side of the thick workpiece facing away from the scanning head is the printing side, and the side facing the scanning head is the back side; The visual positioning component includes a CCD camera and a lighting module; the CCD camera is arranged below the transparent carrier, and the lens of the CCD camera faces the printing surface of the thick workpiece, which is used to photograph the printing surface; the lighting module is used for fill light and includes multiple light-emitting units, each of which is arranged below the transparent carrier and does not block the CCD camera's photography of the printing surface.

2. The CCD-undermounted vision positioning laser processing device according to claim 1, characterized in that: The cutting platform includes a support frame, which is fixedly connected to the frame; at least two beams are provided on the support frame, and there is a distance between adjacent beams, and the transparent carrier is mounted on the beams.

3. The CCD-undermounted vision positioning laser processing device according to claim 2, characterized in that: The support frame is a frame-shaped structure, and a dust collecting groove is provided between the peripheral edge of the transparent carrier and the frame structure. A dust collecting bin is provided below the cutting platform. The dust collecting bin is an upper opening structure. The transparent carrier is mounted at the upper opening. The dust collecting slot is communicated with the interior of the dust collecting bin.

4. The CCD-undermounted vision positioning laser processing device according to claim 3, characterized in that: A light opening is provided at the bottom of the dust collecting bin, and the CCD camera is provided below the dust collecting bin, and the CCD camera shoots upward through the light opening; the light-emitting units of the lighting module are provided on the side wall or bottom of the dust collecting bin, and are arranged around the light opening.

5. The CCD-undermounted vision positioning laser processing device according to claim 4, characterized in that: The lighting module includes a first light-emitting unit, which is arranged on the side wall of the dust collecting bin; a dust shield is provided above each first light-emitting unit, the outer end of the dust shield is fixed to the side wall of the dust collecting bin, and the inner end extends downward at an angle.

6. The CCD-undermounted vision positioning laser processing device according to claim 5, characterized in that: The lighting module further includes a second light-emitting unit, which is close to the bottom of the dust collecting bin, directly below the transparent carrier, and completely shielded by the transparent carrier.

7. The CCD-undermounted vision positioning laser processing device according to claim 6, characterized in that: The second light-emitting unit is arranged on the folding plate, which includes a substrate and is fixedly connected to the side wall of the dust collecting bin through the substrate; a mounting plane is provided on one side of the substrate for mounting the second light-emitting unit; a dust blocking plate is provided on the other side of the substrate, and the dust blocking plate partially blocks the second light-emitting unit.

8. The CCD-undermounted vision positioning laser processing device according to claim 3, characterized in that: A groove is provided on the frame structure of the support frame, and the crossbeam is a linear convex strip, which is engaged with the groove.

9. The CCD-undermounted vision positioning laser processing device according to claim 3, characterized in that: The dust collecting bin is a square funnel structure that gradually decreases from top to bottom; an air exhaust port is provided on the side wall of the dust collecting bin, and the air exhaust port is connected to the exhaust fan through a pipeline.

10. The CCD-undermounted vision positioning laser processing device according to claim 3, characterized in that: A maintenance window is provided on the side wall of the dust collecting bin, and a maintenance cover is detachably connected to the maintenance window.

Images