Slicing machine for monocrystalline silicon wafer production
By introducing clamping components and adjustment components into the slicer for single crystal silicon wafer production, the problems of low cutting efficiency and unadjustable thickness are solved, and stable clamping and slicing accuracy of single crystal silicon rods are achieved. Single crystal silicon wafers of different thicknesses can be cut, improving the quality of finished products and cutting efficiency.
Patent Information
- Application Number
- CN202422024844.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-08-21
AI Technical Summary
The existing single crystal silicon wafer slicers have low cutting efficiency, and cannot cut single crystal silicon wafers of different thicknesses, and the single crystal silicon rods are easily moved during the cutting process, affecting the quality of the finished product.
A single crystal silicon wafer production slicer is designed including a clamping assembly and a adjustment assembly. The clamping assembly is used to fix the single crystal silicon rod and the adjustment assembly is used to adjust the cutter spacing to ensure slice accuracy and to cut single crystal silicon wafers of different thicknesses.
The stable clamping of single crystal silicon rods is achieved, ensuring slice accuracy and finished product quality, and being able to cut out single crystal silicon wafers of different thicknesses, improving cutting efficiency and practicality.
Smart Images
Figure CN223290066U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of single crystal silicon wafer slicing, in particular to a slicing machine for single crystal silicon wafer production. Background Art
[0002] Monocrystalline silicon is primarily used as a semiconductor material and for photovoltaic power generation and heating. Due to the numerous advantages of solar energy, such as cleanliness, environmental friendliness, and convenience, solar energy utilization technology has made significant progress in research and development, commercial production, and market development over the past three decades, becoming one of the world's fastest-growing and most stable emerging industries. Monocrystalline silicon ingots are the raw material for producing monocrystalline silicon wafers, which are cut using a slicing device during production. The thickness of the slices is specified.
[0003] During the processing and production of existing single crystal silicon, it is necessary to cut larger single crystal silicon rods into slices. The existing slicing method uses a wire saw, which can only cut one slice at a time and cannot cut the single crystal silicon rod into single crystal silicon slices of different thicknesses. At the same time, most single crystal silicon slicers do not fix the single crystal silicon rod, causing the single crystal silicon rod to move during the cutting process, resulting in cutting errors and affecting the quality of the finished product. Utility Model Content
[0004] The utility model provides a slicer for single crystal silicon wafer production, aiming to solve the problems of low cutting efficiency of wire cutting machines and inability to cut single crystal silicon wafers of different thicknesses, as well as the problem that single crystal silicon rods are not fixed during processing, which affects the quality of the finished product.
[0005] The utility model is implemented as follows: a slicer for producing single crystal silicon wafers comprises a base, support rods distributed in a vertical direction are installed at the end corners of the upper surface of the base, and a top plate is installed on the top of the support rods, cylinders are installed on both sides of the lower surface of the top plate, connecting frames are installed at the bottoms of two groups of cylinders, and long rods are fixedly installed in the connecting frames, and several groups of mounting frames are movably sleeved on the outer surfaces of the long rods, and a cutter is fixedly connected to the bottom of the mounting frame through a fixed block, and an adjustment component is provided between the long rod and the mounting frame to facilitate the spacing adjustment of the cutter, and clamping components are fixedly installed on both sides of the base and on both sides of the adjustment component through fixed blocks.
[0006] Preferably, the clamping assembly includes two clamping boxes fixedly mounted on the base, the inner cavities of the two clamping boxes are movably mounted with threaded rods, the outer surfaces of the two threaded rods are fixedly mounted with first gears, and the right sides of the two clamping boxes are movably mounted with rotating rods that penetrate through and extend into the inner cavities of the clamping boxes.
[0007] Preferably, a second gear meshing with the first gear and movably connected to the clamping box is fixedly mounted on the left side of the two rotating rods, and a movable block is threadedly connected to the outer surface of the two threaded rods.
[0008] Preferably, the outer surfaces of the two movable blocks are movably connected with four movable rods, the tops of the eight movable rods are movably connected with sliders that penetrate the clamping box and are movably connected to the clamping box, and one side of the eight sliders is fixedly installed with a clamping block.
[0009] Preferably, the adjustment component includes a long slot opened above and below the long rod, and a limit block arranged on the inner wall of the mounting frame and located inside the long slot, a pulley is fixedly installed inside the limit block, and the outer surface of the pulley is movably connected to the inner wall of the long slot, and the mounting frame is provided with a card slot above and below, and a connecting rod is movably sleeved inside the card slot.
[0010] Preferably, the adjustment assembly also includes a connecting block arranged on the right side of the connecting rod, passing through the mounting frame and extending to the outside of the mounting frame. The left side of the connecting block is movably connected to the right side of the mounting frame, and bolts are threadedly sleeved on the upper and lower parts of the right side of the connecting block.
[0011] Preferably, the other end of the bolt passes through the connecting block and the mounting frame respectively and extends to the inside of the mounting frame. A bayonet is provided on the right side of the long rod, and a clamping block located inside the bayonet is fixedly installed on the left side of the connecting block.
[0012] Compared with the prior art, the embodiments of the present application have the following beneficial effects:
[0013] 1. By providing a clamping assembly, it is convenient to clamp the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod will not move during the slicing process, ensuring the accuracy of the slicing and the quality of the finished product, and the adjustment assembly makes it convenient for the operator to adjust the position of the spacing between the cutters 8, that is, the spacing between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses. It is a practical function. When the single crystal silicon rod needs to be sliced, the rotating rod 15 drives the second gear 16 to rotate, drives the first gear 14 to rotate, drives the threaded rod 13 to rotate, and causes the movable block 17 to move up and down, drives the movable rod 18 to move, drives the slider 19 to move, and drives the clamping block 20 to move, so as to clamp the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod will not move during the slicing process, ensuring the accuracy of the slicing and the quality of the finished product. When the operator needs to adjust the position of the spacing between the cutters 8, the bolt 21 is rotated at this time, which will cause the bolt 21 to be unscrewed from the inside of the mounting frame 7, thereby releasing the fixation of the connecting block 26, and then pulling the connecting block 26 outward, which will be connected through the connecting block 26. The connecting block 26 drives the connecting rod 22 to move to the right. At the same time, due to the cooperation between the card slot 23 and the connecting rod 22, the connecting block 26 will be prevented from being lost, and the card block 25 will be driven out from the inside of the card slot 24 through the connecting block 26, so that it releases the fixation of the entire mounting frame 7. Then, the mounting frame 7 is moved as a whole, so that the limit block 11 and the pulley 10 are driven to move. Furthermore, due to the design of the limit block 11, the mounting frame 7 has a good limiting effect when it moves as a whole, so that it prevents position deviation. At the same time, due to the design of the pulley 10 , it will be convenient for the operator to move the mounting frame 7 as a whole, reduce the workload, and move the mounting frame 7 as a whole to a suitable position, and then screw the bolt 21 into the interior of the mounting frame 7, so that the block 25 is driven to move to the inside of the bayonet 24, so that the mounting frame 7 is re-fixed, and then the cutter 8 is driven to move by the mounting frame 7, so that the operator can adjust the position of the distance between the cutters 8, that is, the distance between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses, which is very practical. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is an overall three-dimensional diagram of the utility model;
[0015] Figure 2 It is a partial cutaway side view of the entirety of the present invention;
[0016] Figure 3 This utility model Figure 2 A schematic diagram of the structure enlarged in the middle;
[0017] Figure 4 It is a structural schematic diagram of the clamping box of the present utility model.
[0018] In the figure: 1. base; 2. support rod; 3. top plate; 4. cylinder; 5. connecting frame; 6. long rod; 7. mounting frame; 8. cutter; 9. long slot; 10. pulley; 11. limit block; 12. clamping box; 13. threaded rod; 14. first gear; 15. rotating rod; 16. second gear; 17. movable block; 18. movable rod; 19. slider; 20. clamping block; 21. bolt; 22. connecting rod; 23. slot; 24. bayonet; 25. clamping block; 26. connecting block. DETAILED DESCRIPTION
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.
[0020] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0021] The present invention provides a single crystal silicon wafer production slicer, such as Figure 1-4 As shown, it includes a base 1, and support rods 2 distributed in a vertical direction are installed at the end corners of the upper surface of the base 1, and a top plate 3 is installed on the top of the support rod 2, and cylinders 4 are installed on both sides of the lower surface of the top plate 3, and a connecting frame 5 is installed at the bottom of the two groups of cylinders 4, and a long rod 6 is fixedly installed in the connecting frame 5, and a plurality of groups of mounting brackets 7 are movably connected to the outer surface of the long rod 6, and a cutter 8 is fixedly connected to the bottom of the mounting bracket 7 through a fixed block. An adjustment component is provided between the long rod 6 and the mounting bracket 7 to facilitate the spacing adjustment of the cutter 8, and clamping components are fixedly installed on both sides of the base 1 and on both sides of the adjustment component through fixed blocks.
[0022] It should be noted that, since the existing single crystal silicon needs to be cut into slices of larger volume during processing and production, the existing slicing method uses a wire saw for cutting, which can only cut one slice at a time and cannot cut the single crystal silicon rod into single crystal silicon wafers of different thicknesses. At the same time, most single crystal silicon wafer slicers do not fix the single crystal silicon rod, causing the single crystal silicon rod to move during the cutting process, resulting in cutting errors and affecting the quality of the finished product. Therefore, in order to solve the problems of low cutting efficiency and inability to cut single crystal silicon wafers of different thicknesses of the existing wire saw and the lack of fixing the single crystal silicon rod during processing of the single crystal silicon rod, which affects the quality of the finished product, this solution is provided with a clamping component to facilitate clamping the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod will not move during the slicing process, ensuring the accuracy of the slicing and the quality of the finished product, and an adjustment component to facilitate the operator to adjust the position of the cutter 8, that is, the spacing between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses, which is practical.
[0023] Specifically, in this embodiment, this solution is mainly achieved by providing a clamping assembly to facilitate clamping the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod will not move during the slicing process, ensuring the accuracy of the slicing and the quality of the finished product, and the adjustment assembly makes it easy for the operator to adjust the position of the spacing between the cutters 8, that is, the spacing between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses. It is a function with good practicality. When the single crystal silicon rod needs to be sliced, the rotating rod 15 drives the second gear 16 to rotate, drives the first gear 14 to rotate, drives the threaded rod 13 to rotate, and causes the movable block 17 to move up and down, drives the movable rod 18 to move, drives the slider 19 to move, and drives the clamping block 20 to move, so as to facilitate clamping the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod will not move during the slicing process, ensuring the accuracy of the slicing and the quality of the finished product. When the operator needs to adjust the position of the spacing between the cutters 8, the bolt 21 is rotated at this time, which will cause the bolt 21 to be unscrewed from the inside of the mounting frame 7, thereby releasing the fixation of the connecting block 26, and then pulling the connecting block 2 outward. 6, will drive the connecting rod 22 to move to the right through the connecting block 26, at the same time, due to the cooperation between the card slot 23 and the connecting rod 22, it will prevent the connection block 26 from being lost, and the card block 25 will be driven out from the inside of the card slot 24 through the connecting block 26, so that it releases the fixation of the entire mounting frame 7, and then the mounting frame 7 is moved as a whole, so that the limit block 11 and the pulley 10 are driven to move, and then due to the design of the limit block 11, the mounting frame 7 will have a good limiting effect when it moves as a whole, so that it prevents position deviation, and at the same time, due to the pulley 10 The design will make it easier for the operator to move the mounting frame 7 as a whole, reduce the workload, and move the mounting frame 7 as a whole to a suitable position. The bolt 21 is then screwed into the interior of the mounting frame 7, so that the block 25 is driven to move to the interior of the bayonet 24, so that the mounting frame 7 is re-fixed. The mounting frame 7 will then drive the cutter 8 to move, making it easier for the operator to adjust the position of the cutters 8, that is, the distance between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses, which is very practical.
[0024] In a further preferred embodiment of the present invention, Figure 2-4 As shown, the clamping assembly includes two clamping boxes 12 fixedly mounted on the base 1, the inner cavities of the two clamping boxes 12 are movably mounted with threaded rods 13, the outer surfaces of the two threaded rods 13 are fixedly mounted with first gears 14, and the right sides of the two clamping boxes 12 are movably mounted with rotating rods 15 that penetrate and extend into the inner cavities of the clamping boxes 12.
[0025] In this embodiment, the clamping assembly facilitates clamping of the outer side of the single crystal silicon rod, ensuring that the single crystal silicon rod does not move during the slicing process.
[0026] In a further preferred embodiment of the present invention, Figure 1-4 As shown, the adjustment component includes a long slot 9 opened at the upper and lower parts of the long rod 6, and a limit block 11 arranged on the inner wall of the mounting frame 7 and located inside the long slot 9. A pulley 10 is fixedly installed inside the limit block 11, and the outer surface of the pulley 10 is movably connected to the inner wall of the long slot 9. The mounting frame 7 is provided with a card slot 23 at the upper and lower parts, and a connecting rod 22 is movably sleeved inside the card slot 23.
[0027] In this embodiment, the adjustment assembly facilitates the operator to adjust the spacing between the cutters 8, that is, the spacing between adjacent cutters 8 can be adjusted, and the single crystal silicon rod can be cut into single crystal silicon wafers of different thicknesses.
[0028] In a further preferred embodiment of the present invention, Figure 2-4 As shown, a second gear 16 meshing with the first gear 14 and movably connected to the clamping box 12 is fixedly installed on the left side of the two rotating rods 15, and a movable block 17 is threadedly connected to the outer surface of the two threaded rods 13.
[0029] In this embodiment, the first gear 14 rotates to drive the threaded rod 13 to rotate, causing the movable block 17 to move up and down, driving the movable rod 18 to move, driving the slider 19 to move, and driving the clamping block 20 to move.
[0030] In a further preferred embodiment of the present invention, Figure 2-4 As shown, the outer surfaces of the two movable blocks 17 are movably connected to four movable rods 18, the tops of the eight movable rods 18 are movably connected to sliders 19 that penetrate the clamping box 12 and are movably connected to the clamping box 12, and a clamping block 20 is fixedly installed on one side of the eight sliders 19.
[0031] In this embodiment, the clamping blocks 20 are provided on all four sides of the clamping box 12 to clamp and fix single crystal silicon rods of different sizes.
[0032] It should be noted that for the aforementioned embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present invention is not limited by the order of the actions described, because according to the present invention, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.
[0033] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative, such as the division of the above-mentioned units. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the coupling or communication connection between each other shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunications or other forms.
[0034] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.
Claims
1. A slicer for producing single crystal silicon wafers, characterized in that: The utility model comprises a base (1), wherein a support rod (2) distributed in a vertical direction is installed at the end corner of the upper surface of the base (1), and a top plate (3) is installed on the top of the support rod (2), and cylinders (4) are installed on both sides of the lower surface of the top plate (3), and a connecting frame (5) is installed at the bottom of the two groups of the cylinders (4), and a long rod (6) is fixedly installed in the connecting frame (5), and the outer surface of the long rod (6) is movably sleeved with a plurality of groups of mounting frames (7), and the bottom of the mounting frame (7) is fixedly connected to a cutter (8) through a fixing block, and an adjustment component is provided between the long rod (6) and the mounting frame (7) to facilitate the spacing adjustment of the cutter (8), and clamping components are fixedly installed on both sides of the base (1) and on both sides of the adjustment component through a fixing block.
2. A single crystal silicon wafer production slicer according to claim 1, characterized in that: The clamping assembly comprises two clamping boxes (12) fixedly mounted on a base (1), the inner cavities of the two clamping boxes (12) are movably mounted with threaded rods (13), the outer surfaces of the two threaded rods (13) are fixedly mounted with first gears (14), and the right sides of the two clamping boxes (12) are movably mounted with rotating rods (15) that penetrate through and extend into the inner cavities of the clamping boxes (12).
3. A single crystal silicon wafer production slicer according to claim 2, characterized in that: A second gear (16) meshing with the first gear (14) and movably connected to the clamping box (12) is fixedly mounted on the left side of the two rotating rods (15), and a movable block (17) is threadedly connected to the outer surfaces of the two threaded rods (13).
4. A single crystal silicon wafer production slicer according to claim 3, characterized in that: The outer surfaces of the two movable blocks (17) are movably connected to four movable rods (18), the tops of the eight movable rods (18) are movably connected to a slider (19) that penetrates the clamping box (12) and is movably connected to the clamping box (12), and one side of the eight sliders (19) is fixedly mounted with a clamping block (20).
5. A single crystal silicon wafer production slicer according to claim 3, characterized in that: The adjustment assembly includes a long slot (9) provided above and below the long rod (6), and a limit block (11) provided on the inner wall of the mounting frame (7) and located inside the long slot (9), a pulley (10) is fixedly installed inside the limit block (11), and the outer surface of the pulley (10) is movably connected to the inner wall of the long slot (9), and a card slot (23) is provided above and below the mounting frame (7), and a connecting rod (22) is movably sleeved inside the card slot (23).
6. A slicer for producing single crystal silicon wafers according to claim 5, characterized in that: The adjustment assembly further comprises a connecting block (26) which is arranged on the right side of the connecting rod (22), passes through the mounting frame (7) and extends to the outside of the mounting frame (7), the left side of the connecting block (26) is movably connected to the right side of the mounting frame (7), and bolts (21) are threadedly sleeved on the upper and lower sides of the right side of the connecting block (26).
7. A single crystal silicon wafer production slicer according to claim 6, characterized in that: The other end of the bolt (21) passes through the connecting block (26) and the mounting frame (7) and extends to the inside of the mounting frame (7). A bayonet (24) is provided on the right side of the long rod (6), and a clamping block (25) located inside the bayonet (24) is fixedly installed on the left side of the connecting block (26).