Electronic component packaging structure, packaging assembly and packaging system

Abstract

The utility model provides an electronic component packaging structure, a packaging assembly and a packaging system, and the structure comprises a box body which is internally provided with a plurality of accommodation grooves; the protective layer covers the plurality of accommodating grooves, and one side, facing the accommodating grooves, of the protective layer is of a smooth structure; and the connecting layer is arranged between the box body and the protective layer, and the protective layer is connected with the box body through the connecting layer, so that the electronic component to be packaged is sealed in the corresponding accommodating groove. The protective layer is connected to the box body through the connecting layer, so that the plurality of accommodating grooves in the box body form a sealing mechanism. By means of the design, the problem that when an operator takes and places the components, the components fall off due to the fact that the components are inverted can be solved, on the other hand, the sealing mechanism can form all-directional protection on the components on the premise that the components are not damaged, and therefore transferring and storing are convenient. Compared with a conventional packaging box, the packaging box has the remarkable advantages of being simple in structure, convenient to take and place, high in protection performance, capable of preventing components from being damaged and the like.

Description

Technical Field

[0001] The present application relates to the field of component packaging technology, and specifically refers to an electronic component packaging structure, packaging assembly, and packaging system. Background Art

[0002] In the tide of modern integrated circuit technology, electronic devices are developing at an unprecedented pace toward smaller size and higher performance. This trend places increasingly stringent demands on the packaging technology of key components in integrated circuits. Traditional packaging methods are particularly difficult to meet the high market standards and consumer demands, especially in the field of packaging high-integration and environmentally sensitive components.

[0003] Among existing chip packaging technologies, waffle box packaging has been widely used due to its ease of disassembly and flexible use. The waffle box consists of a chip box, a lid, and a clip. The packaging process involves placing the chip into the box according to size, closing the lid, and finally securing it with a clip. However, this packaging method presents a significant problem: customers risk turning the box upside down when opening it, causing components inside to fall out. This is especially true for small components, which, once lost, are difficult to retrieve, resulting in unnecessary losses. To address this issue, some manufacturers have tried adding a layer of masking tape to the chip box for additional protection. However, the rough surface of masking tape can damage the sensitive chip surface during movement or removal, potentially causing the chip to fail. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the problem of instability and easy damage in taking and placing components in the prior art, and to provide an electronic component packaging structure, packaging assembly and packaging system.

[0005] In order to solve the above technical problems, the utility model provides an electronic component packaging structure, which includes: a box body, wherein a plurality of accommodating grooves are provided inside the box body, and the electronic components to be packaged are placed in the accommodating grooves; a protective layer, wherein the protective layer is connected to the box body and covers the plurality of accommodating grooves, and the side of the protective layer facing the accommodating grooves is a smooth structure; a connecting layer, wherein the connecting layer is arranged between the box body and the protective layer, and the protective layer is connected to the box body through the connecting layer to seal the electronic components to be packaged in the corresponding accommodating grooves.

[0006] In one embodiment of the present invention, the box body includes a bottom plate and a plurality of partition plates, wherein the plurality of partition plates are respectively connected to the bottom plate and together with the bottom plate enclose a plurality of the accommodating grooves.

[0007] In one embodiment of the present invention, the partition plate includes multiple horizontal plates and multiple vertical plates. The multiple horizontal plates are evenly spaced apart, and the multiple vertical plates are evenly spaced apart. The horizontal plates and the vertical plates are perpendicular to each other to form a mesh structure.

[0008] In one embodiment of the present invention, the connection layer includes at least one connection adhesive strip, and the connection adhesive strip is attached to a side of the partition plate facing the protective layer.

[0009] In one embodiment of the present invention, the connection layer includes at least one connection adhesive strip, and the connection adhesive strip is attached to the edge of the protective layer.

[0010] In one embodiment of the present invention, it also includes a cover body and a fixing member, the cover body is connected to the protective layer through the fixing member, wherein an assembly groove is provided inside the fixing member, and the box body, the protective layer, the connecting layer and the cover body are all inserted into the assembly groove.

[0011] In one embodiment of the present invention, the cover body includes a main body and a sealing portion, the main body abuts against the protective layer, the sealing portion is arranged at the edge of the main body and extends toward the bottom plate of the box body along the thickness direction of the cover body, wherein the sealing portion abuts against the box body, or the sealing portion abuts against the protective layer.

[0012] In one embodiment of the present invention, the protective layer is an antistatic film.

[0013] The utility model also provides a packaging assembly, which includes a plurality of the above-mentioned electronic component packaging structures.

[0014] The utility model also provides a packaging system, which includes a plurality of the above-mentioned electronic component packaging structures.

[0015] The above technical solution of the utility model has the following advantages compared with the prior art:

[0016] The electronic component packaging structure, packaging assembly, and packaging system described in the present invention connect the protective layer to the box body via a connecting layer, thereby forming a sealing mechanism for the multiple accommodating grooves in the box body. On the one hand, this design can prevent the operator from dropping components due to inversion when removing and placing components. On the other hand, this sealing mechanism can also provide all-round protection for the components without damaging them, thereby facilitating transportation and storage. Compared to conventional packaging boxes, this application has significant advantages such as simple structure, easy access, high protection, and the ability to avoid damage to components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0018] Figure 1 This is a structural diagram of the electronic component packaging structure in a preferred embodiment of the present utility model;

[0019] Figure 2 yes Figure 1 A schematic diagram of the structure of the box body, the connection layer and the protective layer in the electronic component packaging structure shown;

[0020] Figure 3 yes Figure 1 A side view of the box in the electronic component packaging structure shown;

[0021] Figure 4 yes Figure 3 A top view of the box body;

[0022] Figure 5 yes Figure 1 A schematic diagram of the structure of the box body and the connection layer in the electronic component packaging structure shown;

[0023] Figure 6 This is a structural diagram of an electronic component packaging structure in another embodiment of the present invention;

[0024] Figure 7 yes Figure 6 A schematic diagram of the structure of the box body and the cover body in the electronic component packaging structure shown;

[0025] Figure 8 yes Figure 6 Schematic diagram of the structure of the cover and the connection layer in the electronic component packaging structure shown.

[0026] Explanation of the reference numerals in the specification: 100, box body; 110, bottom plate; 120, partition plate; 130, accommodating groove; 200, connecting layer; 300, protective layer; 400, cover body; 410, main body; 420, sealing part. DETAILED DESCRIPTION

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0028] Example 1

[0029] See also Figures 1 to 4As shown, this embodiment provides an electronic component packaging structure, which includes: a box body 100, wherein a plurality of receiving grooves 130 are provided inside the box body 100, and the electronic components to be packaged are placed in the receiving grooves 130; a protective layer 300, wherein the protective layer 300 is connected to the box body 100 and covers the plurality of receiving grooves 130, and the side of the protective layer 300 facing the receiving grooves 130 is a smooth structure; a connecting layer 200, wherein the connecting layer 200 is arranged between the box body 100 and the protective layer 300, and the protective layer 300 is connected to the box body 100 through the connecting layer 200 to seal the electronic components to be packaged in the corresponding receiving grooves 130.

[0030] The electronic component packaging structure described in this embodiment connects the protective layer 300 to the box body 100 via the connecting layer 200, thereby forming a sealing mechanism for the multiple receiving grooves 130 in the box body 100. On the one hand, this design can prevent the operator from dropping components due to inversion when taking and placing components. On the other hand, this sealing mechanism can also provide all-round protection for the components without damaging them, thereby facilitating transportation and storage. Compared with conventional packaging boxes, this application has significant advantages such as simple structure, easy access, high protection, and avoidance of component damage.

[0031] The conventional usage of the electronic component packaging structure in this embodiment is shown in FIG. Figure 1 As shown, the overall structure is a waffle box. In the thickness direction, the protective layer 300, the connecting layer 200, and the box body 100 are arranged sequentially from top to bottom. The cover 400 is snapped onto the box body 100 and covers the connecting layer 200 and the protective layer 300 within it. Specifically, the box body 100 in this embodiment is used to accommodate multiple electronic components to be packaged, the connecting layer 200 is used to achieve a detachable connection between the protective layer 300 and the box body 100, the protective layer 300 is used to cover the multiple receiving grooves 130 to form multiple relatively independent sealing structures, thereby ensuring stable transportation or storage of electronic components, and the cover 400 is used to protect the various internal structures.

[0032] See also Figures 2 to 4As shown, in this embodiment, the box body 100 includes a bottom plate 110 and a plurality of partition plates 120. The plurality of partition plates 120 are respectively connected to the bottom plate 110 and together with the bottom plate 110, enclose a plurality of the receiving grooves 130. Furthermore, the partition plates 120 have a certain thickness, which can limit the components inside the receiving grooves 130 in the horizontal direction. Specifically, the partition plates 120 in this embodiment include a plurality of horizontal plates and a plurality of vertical plates. The plurality of horizontal plates are evenly spaced, and the plurality of vertical plates are also evenly spaced. The horizontal plates and the vertical plates are perpendicular to each other to form a mesh structure on the horizontal plane. Based on this, the plurality of receiving grooves 130 in this embodiment are arranged in an array with even spacing, and the volume of any receiving groove 130 is the same. In other embodiments, the partition plates 120 can be adaptively adjusted according to the different sizes or shapes of the components to be packaged. The present invention does not impose specific restrictions on this.

[0033] See also Figure 5 As shown, the connection layer 200 includes at least one connection adhesive strip, which is attached to the side of the partition plate 120 facing the protective layer 300. The connection layer 200 in this embodiment includes multiple connection adhesive strips, which are interconnected and form the same structure as the mesh partition plate 120. The mesh connection adhesive strips are correspondingly attached to the top of the partition plate 120. Based on this, after the protective layer 300 is connected, the protective layer 300 and the bottom plate 110 can limit the accommodating groove 130 in the thickness direction. In addition, for any accommodating groove 130, its edge is provided with a connection adhesive strip, thereby achieving highly independent sealing of the accommodating groove 130. When taking and placing components, the user only needs to tear off the protective layer 300 at the corresponding position. At this time, the remaining accommodating grooves 130 are still in a highly sealed state, thereby improving the flexibility of use of the present application. Furthermore, the connecting layer 200 in this embodiment uses connecting adhesive strips to achieve repeated tearing and sealing of the protective layer 300, thereby further improving the practicality of the present application. The present invention does not impose specific restrictions on the specific type of the connecting layer 200. It can be pre-processed as a whole according to the shape of the partition plate 120, or it can be set as a plurality of independent adhesive strips spliced ​​together.

[0034] The protective layer 300 in this embodiment is preferably a transparent antistatic film. On the one hand, its transparent property enables the operator to easily distinguish whether the packaging structure of the electronic component is inverted. On the other hand, the antistatic film with a smooth surface can not only eliminate static electricity, but also has good electrical insulation properties, thereby ensuring the electrical performance of the components. In addition, the antistatic film also has the advantages of strong environmental adaptability, anti-pollution and easy cutting and processing.

[0035] In this embodiment, the cover body 400 includes a main body 410 and a sealing portion 420, the main body 410 abuts against the protective layer 300, and the sealing portion 420 is arranged at the edge of the main body 410 and extends along the thickness direction of the cover body 400 toward the bottom plate 110 of the box body 100, wherein the sealing portion 420 abuts against the box body 100, the main body 410 is attached to the protective layer 300, and the protective layer 300 is pressed onto the connecting layer 200. Furthermore, the present structure also includes a cover body 400 and a fixing part (not shown in the figure), and the cover body 400 is connected to the protective layer 300 through the fixing part, wherein an assembly groove is provided inside the fixing part, and the box body 100, the protective layer 300, the connecting layer 200 and the cover body 400 are all inserted into the assembly groove, thereby forming a waffle box structure of the present structure. The fixing part can, on the one hand, improve the connection stability between the box body 100 and the cover body 400, thereby improving the packaging effect of the protective layer 300, and on the other hand, such a fixing part can also facilitate the operator to distinguish the front and back of the box body 100.

[0036] Example 2

[0037] This embodiment provides another electronic component packaging structure. The layout of its box body 100, cover body 400, and connection layer 200 is the same as that of the first embodiment, and will not be described in detail here. In this embodiment, the layout of the connection layer 200 is different from that of the first embodiment. Specifically, the connection layer 200 in this embodiment includes at least one connection adhesive strip, which is attached to the edge of the protective layer 300. Based on this, when the protective layer 300 is connected to the box body 100, the connection adhesive strip located at the edge of the protective layer 300 can be affixed to the bottom plate 110 outside the partition plate 120, thereby achieving the connection between the protective layer 300 and the bottom plate 110. This connection method can not only reduce the use of connection adhesive strips, but also simplify the layout process of the connection layer 200. Furthermore, when the protective layer 300 is connected to the box body 100, the sealing portion 420 of the box body 100 abuts against the protective layer 300, thereby cooperating with the bottom plate 110 to clamp and fix the edge of the protective layer 300.

[0038] Example 3

[0039] This embodiment provides a packaging structure, which includes the electronic component packaging structure described in the first embodiment.

[0040] Example 4

[0041] This embodiment provides a packaging system, which includes the electronic component packaging structure described in the first embodiment.

[0042] In summary, the electronic component packaging structure, packaging assembly, and packaging system described in the present invention connect the protective layer 300 to the box body 100 via the connecting layer 200, thereby forming a sealing mechanism for the multiple accommodating grooves 130 in the box body 100. On the one hand, this design can prevent the operator from dropping components due to inversion when taking and placing components. On the other hand, this sealing mechanism can also provide all-round protection for the components without damaging them, thereby facilitating transportation and storage. Compared with conventional packaging boxes, this application has significant advantages such as simple structure, easy access, high protection, and the ability to avoid damage to components.

[0043] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An electronic component packaging structure, characterized in that: include: A box body, wherein a plurality of accommodating grooves are provided inside the box body, and the electronic components to be packaged are placed in the accommodating grooves; a protective layer connected to the box body and covering the plurality of receiving grooves, wherein a side of the protective layer facing the receiving grooves is a smooth structure; A connecting layer is provided between the box body and the protective layer, and the protective layer is connected to the box body through the connecting layer to seal the electronic components to be packaged in the corresponding accommodating grooves.

2. The electronic component packaging structure according to claim 1, wherein: The box body includes a bottom plate and a plurality of partition plates. The plurality of partition plates are respectively connected to the bottom plate and together with the bottom plate enclose a plurality of the accommodating grooves.

3. The electronic component packaging structure according to claim 2, wherein: The partition plate includes a plurality of horizontal plates and a plurality of vertical plates. The horizontal plates are evenly spaced apart, the vertical plates are evenly spaced apart, and the horizontal plates and the vertical plates are perpendicular to each other to form a mesh structure.

4. The electronic component packaging structure according to claim 2 or 3, characterized in that: The connection layer includes at least one connection adhesive strip, and the connection adhesive strip is attached to a side of the partition plate facing the protective layer.

5. The electronic component packaging structure according to claim 1 or 2, characterized in that: The connecting layer includes at least one connecting adhesive strip, and the connecting adhesive strip is attached to the edge of the protective layer.

6. The electronic component packaging structure according to claim 1, wherein: It also includes a cover body and a fixing piece, wherein the cover body is connected to the protective layer through the fixing piece, wherein an assembly groove is provided inside the fixing piece, and the box body, the protective layer, the connecting layer and the cover body are all inserted into the assembly groove.

7. The electronic component packaging structure according to claim 6, wherein: The cover body includes a main body and a sealing part, the main body abuts the protective layer, the sealing part is arranged at the edge of the main body and extends toward the bottom plate of the box body along the thickness direction of the cover body, wherein the sealing part abuts the box body, or the sealing part abuts the protective layer.

8. The electronic component packaging structure according to claim 1 or 2, characterized in that: The protective layer is an antistatic film.

9. A packaging component, characterized in that: The electronic component packaging structure comprises a plurality of electronic component packaging structures according to any one of claims 1 to 8.

10. A packaging system, characterized in that: A plurality of electronic component packaging structures according to any one of claims 1 to 8.

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