Electronic component arraying system

Abstract

An electronic component arraying system is provided with at least one vibration feeding device used for sending out at least one electronic component; the rotating disc is positioned below the at least one vibration feeding device and is used for bearing the electronic elements; the image sensing device is used for extracting a sensing image of the electronic element in the material accommodating hole, so that a control circuit can judge whether the electronic element is in a positive vertical state or a negative vertical state in the material accommodating hole; the first pneumatic transfer device is used for configuring a first conveying channel between the lower part of the rotating disc and a containing plate when the electronic element is in the forward vertical state so as to execute first pneumatic transfer operation; and the second pneumatic transfer device is used for configuring a second conveying channel between the upper part of the rotating disc and the accommodating plate when the electronic element is in the negative vertical state so as to execute a second pneumatic transfer operation.

Description

Technical Field

[0001] The utility model relates to an electronic component arranging method, in particular to an electronic component arranging method for determining a pneumatic transfer path according to a sensing image. Background Art

[0002] As electronic products continue to improve in functionality, the component mounting process for many circuit boards involves transferring a large number of electronic components onto the board. Furthermore, if the head and tail of an electronic component are asymmetrical, the component mounting process must ensure that the electronic component is correctly positioned upright, for example, with the head up and the tail down.

[0003] However, since conventional electronic component transfer generally utilizes a pick and place technique, the transfer efficiency is poor and thus the technique is gradually unable to meet the requirements of transferring a large number of electronic components involved in today's advanced semiconductor packaging processes.

[0004] To solve the above problems, a novel electronic component arrangement solution is urgently needed in the art. Utility Model Content

[0005] The main purpose of the present invention is to provide an electronic component alignment solution, which can perform an adaptive pneumatic transfer operation on multiple electronic components with inconsistent head and tail arrangements accommodated in a rotating disk, so that these electronic components are arranged in a consistent head and tail manner in a receiving plate.

[0006] Another object of the present invention is to provide an electronic component aligning solution, which can use an image sensing device to determine whether the electronic components are in a positive upright position with the head up and the tail down or in a negative upright position with the head down and the tail up on the rotating disk, so as to perform the adaptive pneumatic transfer operation, thereby providing a highly efficient batch electronic component aligning operation.

[0007] To achieve the above objectives, an electronic component arranging system is proposed, which has:

[0008] a control circuit;

[0009] At least one vibrating feeding device is electrically coupled to the control circuit and delivers at least one electronic component under the control of the control circuit, wherein the electronic component has a distinguishable first end and a second end;

[0010] a rotating disk electrically coupled to the control circuit and located below the at least one vibrating feeder, the rotating disk having a plurality of receiving holes and being controlled by the control circuit to rotate the empty receiving holes below the outlet of the vibrating feeder to receive the electronic components;

[0011] an image sensing device electrically coupled to the control circuit and configured to capture a sensing image of the electronic component in the material receiving hole under control of the control circuit, so as to allow the control circuit to determine whether the electronic component is in a positive upright position with the first end at the top or a negative upright position with the second end at the top in the material receiving hole;

[0012] a first pneumatic transfer device electrically coupled to the control circuit, configured to perform a first pneumatic transfer operation by disposing a first conveying channel between the bottom of the rotating disk and a receiving plate when the electronic component is in the upright position, so as to guide the electronic component into a receiving hole of the receiving plate with the second end facing forward; and

[0013] A second pneumatic transfer device is electrically coupled to the control circuit. When the electronic component is in the negative upright position, a second conveying channel is arranged above the rotating disk and between the receiving plate to perform a second pneumatic transfer operation to guide the electronic component into the receiving hole of the receiving plate with the second end facing forward.

[0014] In one embodiment, the first pneumatic transfer device has a first air pressure applying device, and the first pneumatic transfer operation includes: driving the rotating disk to open a valve of the material holding hole; and driving the first air pressure applying device to perform a first negative pressure operation on the second end of the electronic component.

[0015] In one embodiment, the first pneumatic transfer device has a first air pressure applying device, and the first pneumatic transfer operation includes: driving the rotating disk to open a valve of the material holding hole; and driving the first air pressure applying device to perform a first positive pressure operation on the first end of the electronic component.

[0016] In one embodiment, the second pneumatic transfer device has a second air pressure applying device, and the second pneumatic transfer operation includes: driving the second air pressure applying device to perform a second negative pressure operation on the second end of the electronic component.

[0017] In one embodiment, the second pneumatic transfer device has a second air pressure applying device, and the second pneumatic transfer operation includes: driving the second air pressure applying device to perform a second positive pressure operation on the first end of the electronic component.

[0018] In one embodiment, each of the vibration feeding devices has a circular vibration container and a horizontal vibration channel connected to the circular vibration container.

[0019] In one embodiment, two of the at least one vibration feeding device have the horizontal vibration channels of different sizes to transport the electronic components of different sizes.

[0020] In a possible embodiment, the electronic component may be a spring pin, an active component, a passive component or a metal pillar.

[0021] In order to further understand the structure, features, objectives, and advantages of the present invention, the following are attached with drawings and detailed descriptions of preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A block diagram of an embodiment of an electronic component arranging system according to the present invention;

[0023] Figure 2a and 2b for the reason Figure 1 A schematic diagram of an electronic component fed by a vibration feeding device of an electronic component aligning system showing different upright positions in a receiving hole of a rotating disk;

[0024] Figure 3a for Figure 1 A schematic diagram of the configuration of the first conveying channel of the electronic component aligning system;

[0025] Figure 3b For Figure 3a A schematic diagram of a first positive pressure operation performed on a first delivery channel;

[0026] Figure 3c For Figure 3a A schematic diagram of a first negative pressure operation performed on a first delivery channel;

[0027] Figure 4a for Figure 1 A schematic diagram of the configuration of the second conveying channel of the electronic component aligning system;

[0028] Figure 4b For Figure 4a A schematic diagram of a second positive pressure operation performed on the second delivery channel;

[0029] Figure 4c For Figure 4a A schematic diagram of a second negative pressure operation performed on the second delivery channel; and

[0030] Figure 5 A flow chart illustrating an embodiment of the electronic component arranging operation scheme of the present invention is shown.

[0031] In the above drawings, the meanings of the reference numerals are as follows:

[0032] 10: Electronic components

[0033] 11: First End

[0034] 12: Second end

[0035] 110: Control circuit

[0036] 120: Vibration feeding device

[0037] 130: Rotating disk

[0038] 131: Material hole

[0039] 140: Image sensing device

[0040] 151: First pneumatic transfer device

[0041] 151a: First conveying channel

[0042] 151b: First air pressure applying device

[0043] 152: Second pneumatic transfer device

[0044] 152a: Second conveying channel

[0045] 152b: Second air pressure applying device

[0046] 160: Accommodation plate

[0047] 161: Accommodation hole

[0048] 170: Work Platform DETAILED DESCRIPTION

[0049] The main principles of this utility model are:

[0050] 1. Using a vibrating feeding device to convey multiple electronic components into multiple receiving holes of a rotating disk by combining circular vibration and horizontal vibration; and

[0051] Second, since the upright positions of the electronic components in the receiving holes may randomly present a positive upright position with the head up and the tail down, or a negative upright position with the head down and the tail up, the present invention utilizes an image sensing device to determine whether the electronic components are in the positive upright position or the negative upright position in the rotating disk, and performs an adaptive pneumatic transfer operation based on the sensing result to arrange the electronic components in a consistent upright position in a receiving plate, thereby providing a highly efficient batch electronic component arranging operation.

[0052] Please refer to Figure 1 , which illustrates a block diagram of an embodiment of the electronic component arrangement system of the present invention. Figure 1As shown, the electronic component arranging system has a control circuit 110, at least one vibration feeding device 120, a rotating disk 130, an image sensing device 140, a first pneumatic transfer device 151, a second pneumatic transfer device 152 and a receiving plate 160, wherein the control circuit 110 is coupled to the vibration feeding device 120, the rotating disk 130, the image sensing device 140, the first pneumatic transfer device 151 and the second pneumatic transfer device 152 to perform an electronic component arranging operation.

[0053] The vibration feeding device 120 may have a circular vibration container and a horizontal vibration channel connected to the outer periphery of the circular vibration container. Since the circular vibration container and the horizontal vibration channel are both existing technologies, their local structures are not described here. During operation, the circular vibration container transports the electronic components contained therein to the horizontal vibration channel one by one through its circular vibration action, and each electronic component is then transported to a material storage hole of the rotating disk 130 through the horizontal vibration action of the horizontal vibration channel and randomly presents a positive upright state or a negative upright state. Please refer to Figure 2a and 2b , which is a schematic diagram showing an electronic component fed by the vibration feeding device 120 and showing different upright states in a material receiving hole of the rotating disk 130. Figure 2a In the embodiment, an electronic component 10 is in a receiving hole 131 of the rotating disk 130 and is in a normal upright state with the first end 11 upward. Figure 2b In the embodiment, an electronic component 10 is in a receiving hole 131 of the rotating disk 130 and is in a negative upright state with the second end 12 facing upward. The electronic component 10 may be a spring pin, an active component, a passive component or a metal column.

[0054] The rotating disk 130 is a rotatable receiving disk, and is used to rotate the empty receiving holes 131 to below the outlet of the vibration feeding device 120 to receive the electronic components 10 under the control of the control circuit 110 .

[0055] The image sensor 140 is used to capture a sensing image of the electronic component 10 in the material receiving hole 131 , so that the control circuit 110 can determine whether the electronic component 10 is in a positive upright position with the first end 11 facing upward or a negative upright position with the second end 12 facing upward in the material receiving hole 131 .

[0056] The first pneumatic transfer device 151 has a first conveying channel 151 a and a first air pressure applying device 151 b ; the second pneumatic transfer device 152 has a second conveying channel 152 a and a second air pressure applying device 152 b .

[0057] The receiving plate 160 can be placed on a working platform 170 and is provided with a plurality of receiving holes for receiving the electronic components 10 transferred from the rotating disk 130 .

[0058] In detail, the electronic component aligning operation includes the following steps:

[0059] (1) The control circuit 110 performs a material preparation operation, which includes driving the at least one vibrating feeding device 120 to deliver at least one electronic component 10 to at least one hole among the multiple material receiving holes 131 of the rotating disk 130. The bottom of each of the material receiving holes 131 is provided with a valve (not shown in the figure) to prevent the electronic component 10 from falling downward. The valve is opened or closed by the control of an electrical signal.

[0060] (2) The control circuit 110 performs a series of operations to introduce the at least one electronic component 10 into the at least one receiving hole of the receiving plate 160, including:

[0061] (1) determining, based on a sensing image provided by the image sensing device 140, whether a target electronic component among the at least one electronic component 10 is in a positive upright position with the first end 11 upward or in a negative upright position with the second end 12 upward in a corresponding material receiving hole 131; and

[0062] (2) When the target electronic component is in the positive upright state, a first conveying channel 151a is configured between the bottom of the rotating disk 130 and the receiving plate 160 to perform a first pneumatic transfer operation to introduce the target electronic component into the receiving hole of the receiving plate 160 with the second end 12 in front, and when the target electronic component is in the negative upright state, a second conveying channel 152a is configured between the top of the rotating disk 130 and the receiving plate 160 to perform a second pneumatic transfer operation to introduce the target electronic component into the receiving hole of the receiving plate 160 with the second end 12 in front.

[0063] Please refer to Figures 3a to 3c ,in, Figure 3a Schematic diagram of the configuration of the first delivery channel 151a; Figure 3b For Figure 3a A schematic diagram of a first positive pressure operation performed on the first delivery channel 151a; and Figure 3c For Figure 3aSchematic diagram of a first negative pressure operation performed on the first conveying channel 151a. As shown in 3a, the first conveying channel 151a is connected between the bottom of the rotating disk 130 and the receiving plate 160; as shown in 3b, the first air pressure applying device 151b outputs a positive air pressure Fpositive pressure to perform a first positive pressure operation on the first end 11 of the electronic component 10 to push the electronic component 10 into a receiving hole 161 of the receiving plate 160, so that the electronic component 10 is in a positive upright state in the receiving hole 161; as shown in 3c, the first air pressure applying device 151b generates a negative air pressure Fnegative pressure on a side opening of the first conveying channel 151a to perform a first negative pressure operation on the second end 12 of the electronic component 10, so that the electronic component 10 moves downward into a receiving hole 161 of the receiving plate 160, so that the electronic component 10 is in a positive upright state in the receiving hole 161.

[0064] Please refer to Figures 4a to 4c ,in, Figure 4a Schematic diagram of the configuration of the second delivery channel 152a; Figure 4b For Figure 4a A schematic diagram of a second positive pressure operation of the second delivery channel 152a; and Figure 4c For Figure 4a Schematic diagram of a second negative pressure operation on the second conveying channel 152a. As shown in 4a, the second conveying channel 152a is connected between the upper part of the rotating disk 130 and the receiving plate 160; as shown in 4b, the second air pressure applying device 152b outputs a positive air pressure Fpositive pressure below the rotating disk 130 to perform a second positive pressure operation on the first end 11 of the electronic component 10 to push the electronic component 10 into a receiving hole 161 of the receiving plate 160, so that the electronic component 10 is in a positive upright state in the receiving hole 161; as shown in 4c, the second air pressure applying device 152b generates a negative air pressure Fnegative pressure on a side opening of the second conveying channel 152a to perform a second negative pressure operation on the second end 12 of the electronic component 10, so that the electronic component 10 moves downward to a receiving hole 161 of the receiving plate 160, so that the electronic component 10 is in a positive upright state in the receiving hole 161.

[0065] In addition, two of the at least one vibration feeding device 120 may have the horizontal vibration channels of different sizes to transport electronic components 10 of different sizes.

[0066] From the above description, it can be seen that the utility model discloses an electronic component arranging operation scheme. Figure 5, which depicts a flow chart of an embodiment of the electronic component arranging operation of the present invention, which is executed by a control circuit and includes the following steps: performing a material preparation operation, which includes driving at least one vibrating feeding device to deliver at least one electronic component to at least one hole among a plurality of material holes of a rotating disk, wherein the bottoms of the material holes are each provided with a valve to prevent the electronic component from falling downward, and the electronic component has a distinguishable first end and a second end (step a); and performing an arranging operation to guide the at least one electronic component into at least one receiving hole of a receiving plate, which includes: judging a target electronic component among the at least one electronic component according to a sensing image provided by an image sensing device. A corresponding material receiving hole is in a positive upright state with the first end at the top or in a negative upright state with the second end at the top; and when the target electronic component is in the positive upright state, a first conveying channel is arranged between the bottom of the rotating disk and the receiving plate to perform a first pneumatic transfer operation to introduce the target electronic component into the receiving hole of the receiving plate with the second end in front, and when the target electronic component is in the negative upright state, a second conveying channel is arranged between the top of the rotating disk and the receiving plate to perform a second pneumatic transfer operation to introduce the target electronic component into the receiving hole of the receiving plate with the second end in front (step b).

[0067] In step a, the vibratory feeding device may include a circular vibrating container and a horizontal vibrating channel connected to the circular vibrating container; the electronic components may be pogo pins, active components, passive components, or metal pillars. Furthermore, two of the at least one vibratory feeding device may have horizontal vibrating channels of different sizes to facilitate conveying electronic components of varying sizes.

[0068] In step b, the first pneumatic transfer operation may include: driving the rotating disk to open the corresponding valve; and driving a first air pressure applying device to perform a first negative pressure operation on the second end of the target electronic component.

[0069] In step b, the first pneumatic transfer operation may include: driving the rotating disk to open the corresponding valve; and driving a first air pressure applying device to perform a first positive pressure operation on the first end of the target electronic component.

[0070] In step b, the second pneumatic transfer operation may include: driving a second air pressure applying device to perform a second negative pressure operation on the second end of the target electronic component.

[0071] In step b, the second pneumatic transfer operation may include: driving a second pneumatic pressure applying device to perform a second positive pressure operation on the first end of the target electronic component.

[0072] According to the above design, the utility model has the following advantages:

[0073] 1. The electronic component alignment solution of the present invention can perform an adaptive pneumatic transfer operation on a plurality of electronic components with inconsistent head and tail arrangements contained in a rotating disk, so that the electronic components are arranged in a consistent head and tail manner in a receiving plate; and

[0074] 2. The electronic component arranging solution of the present invention can use an image sensing device to determine whether the electronic components are in a positive upright position with the head up and the tail down, or in a negative upright position with the head down and the tail up, on the rotating disk, so as to perform the adaptive pneumatic transfer operation, thereby providing a highly efficient batch electronic component arranging operation.

[0075] What is disclosed in this case is a preferred embodiment. Any local changes or modifications that are derived from the technical ideas of this case and are easily inferred by those skilled in the art fall within the scope of protection of this case.

[0076] In summary, this case shows that its purpose, means and effects are different from the existing technology and are practical.

Claims

1. An electronic component arranging system, characterized in that: It has: a control circuit; At least one vibrating feeding device is electrically coupled to the control circuit and delivers at least one electronic component under the control of the control circuit, wherein the electronic component has a distinguishable first end and a second end; a rotating disk electrically coupled to the control circuit and located below the at least one vibrating feeder, the rotating disk having a plurality of receiving holes and being controlled by the control circuit to rotate the empty receiving holes below the outlet of the vibrating feeder to receive the electronic components; an image sensing device electrically coupled to the control circuit and configured to capture a sensing image of the electronic component in the material receiving hole under control of the control circuit, so as to allow the control circuit to determine whether the electronic component is in a positive upright position with the first end at the top or a negative upright position with the second end at the top in the material receiving hole; a first pneumatic transfer device electrically coupled to the control circuit, configured to perform a first pneumatic transfer operation by disposing a first conveying channel between the bottom of the rotating disk and a receiving plate when the electronic component is in the upright position, so as to guide the electronic component into a receiving hole of the receiving plate with the second end facing forward; as well as A second pneumatic transfer device is electrically coupled to the control circuit. When the electronic component is in the negative upright position, a second conveying channel is arranged above the rotating disk and between the receiving plate to perform a second pneumatic transfer operation to guide the electronic component into the receiving hole of the receiving plate with the second end facing forward.

2. The electronic component arranging system according to claim 1, characterized in that: The first pneumatic transfer device has a first air pressure applying device, and the first pneumatic transfer operation includes: driving the rotating disk to open a valve of the material holding hole; and driving the first air pressure applying device to perform a first negative pressure operation on the second end of the electronic component.

3. The electronic component arranging system according to claim 1, characterized in that: The first pneumatic transfer device has a first air pressure applying device, and the first pneumatic transfer operation includes: driving the rotating disk to open a valve of the material holding hole; and driving the first air pressure applying device to perform a first positive pressure operation on the first end of the electronic component.

4. The electronic component arranging system according to claim 1, characterized in that: The second pneumatic transfer device has a second air pressure applying device, and the second pneumatic transfer operation includes: driving the second air pressure applying device to perform a second negative pressure operation on the second end of the electronic component.

5. The electronic component arranging system according to claim 1, characterized in that: The second pneumatic transfer device has a second air pressure applying device, and the second pneumatic transfer operation includes: driving the second air pressure applying device to perform a second positive pressure operation on the first end of the electronic component.

6. The electronic component arranging system according to claim 1, characterized in that: Each of the vibration feeding devices is provided with a circular vibration container and a horizontal vibration channel communicated with the circular vibration container.

7. The electronic component arranging system according to claim 6, characterized in that: Two of the at least one vibration feeding device have the horizontal vibration channels of different sizes to transport the electronic components of different sizes.

8. The electronic component arranging system according to claim 1, characterized in that: The electronic component is a spring pin, an active component, a passive component or a metal column.

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