Optical wafer coating positioning jig

By designing an optical wafer coating positioning fixture, using the support base and vacuum adsorption channel to fix the optical wafer, and using a cover layer to block the coupling out of the grating area, the problem of users seeing reflection imaging of external objects when wearing AR glasses is solved, and the user experience is improved.

CN223292627UActive Publication Date: 2025-09-02BEIJING GREATAR TECH CO LTD
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Patent Information

Application Number
CN202422717900.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-07
Publication Date
2025-09-02
Estimated Expiration
2034-11-07

AI Technical Summary

Technical Problem

When users wear diffraction optical waveguides as AR glasses lenses, they can see external objects reflected and imaged through the optical waveguide substrate, reducing the user experience.

Method used

An optical wafer coating positioning fixture is designed to accurately locate the optical wafer through the support base and positioning member, fix the optical wafer using a vacuum adsorption channel, and the cover layer blocks the coupling grating area to prevent coating operation.

Benefits of technology

Accurate positioning and occlusion of optical wafers is achieved, preventing grating area coating, and improving the visual effect of users when wearing AR glasses.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an optical wafer coating positioning jig which comprises a supporting seat, a fixing table used for placing an optical wafer is arranged in the top surface of the supporting seat, and a positioning piece is arranged at the edge position of the top surface of the supporting seat. In the process that a user can see reflection imaging of an external object in the process of actually wearing AR glasses by coating a film on a non-structural region, except a grating structural region, of the optical wafer, the positioning jig disclosed by the utility model is used for accurately positioning and shielding the coupled-out grating region of the optical wafer; and the film coating operation on the coupled-out grating area of the optical wafer is prevented.
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Description

Technical Field

[0001] The utility model belongs to the technical field of diffraction optical waveguide coating, and in particular relates to an optical wafer coating positioning fixture. Background Art

[0002] Augmented reality (AR) technology refers to the use of certain technical means to provide users with additional information in the real world (the so-called "enhancement"). This technology organically combines images in the virtual world and scenes in the real world, and deeply integrates the calculated information with the real world to provide users with richer information and immersive experience.

[0003] Augmented reality technology can be implemented through many hardware platforms, the most immersive of which is wearable augmented reality devices, namely AR glasses.

[0004] At present, the more mature AR glasses technology solutions are mainly divided into prism solutions, birdbath solutions, free-form surface solutions, off-axis holographic lens solutions and diffraction optical waveguide solutions.

[0005] For example, the diffraction optical waveguide includes an optical waveguide substrate, an in-coupling grating and an out-coupling grating, wherein the in-coupling grating and the out-coupling grating are arranged on the optical waveguide substrate (generally a glass wafer). The basic principle is as follows: Figure 1 As shown, the light output by the optical machine (imaging device) is coupled into the grating and coupled into the optical waveguide matrix, and propagates in the optical waveguide matrix by total reflection. Whenever it encounters the out-coupling grating, a part of the light is coupled out, and the out-coupled light (the solid line in the direction of the human eye in the figure) enters the human eye, so that the same image as the output of the optical machine can be seen. At the same time, the human eye can see the real-world scene (the dotted line in the direction of the human eye in the figure). The overlap of the two parts can realize the function of augmented reality.

[0006] However, when using the above-mentioned diffraction optical waveguide as an AR glasses lens solution, when the user actually wears the AR glasses, in addition to being able to observe the image output from the optical machine through the diffraction optical waveguide and coupled into the human eye, the human eye can also see the external objects reflected by the optical waveguide matrix, thereby reducing the user experience.

[0007] In order to solve the above problems, those skilled in the art adopt the coating operation on the non-structured area of ​​the optical wafer except the grating structure area, but how to prevent the grating structure area of ​​the optical wafer from being coated during this process is a difficult problem. Utility Model Content

[0008] In order to overcome the defects of the prior art, the utility model provides an optical wafer coating positioning fixture.

[0009] The utility model is achieved through the following technical solutions:

[0010] The utility model provides an optical wafer coating positioning fixture, comprising a support seat;

[0011] A fixing platform for placing the optical wafer is provided inside the top surface of the support base, and a positioning piece is provided at the edge of the top surface of the support base.

[0012] Furthermore, a fixing hole is provided at an edge position of the top surface of the support seat, and a positioning column is provided in the fixing hole.

[0013] Furthermore, a plurality of fixing holes are provided at the edge of the top surface of the support seat, and a positioning column is provided in each fixing hole.

[0014] Furthermore, the fixing platform is provided with adsorption holes.

[0015] Furthermore, the fixing platform is provided with a plurality of the adsorption holes.

[0016] Furthermore, the positioning fixture further includes a sealing bottom plate;

[0017] The top edge of the sealing bottom plate is connected to the bottom edge of the support seat;

[0018] The top surface of the sealing bottom plate is provided with an adsorption groove at the location where the adsorption hole is set;

[0019] The sealing bottom plate is provided with a vacuum adsorption channel, one end of the vacuum adsorption channel is communicated with the groove body cavity of the adsorption groove, and the other end of the vacuum adsorption channel is communicated with the outer side of the side wall of the sealing bottom plate.

[0020] Furthermore, a first connection hole is provided on the top edge of the sealing bottom plate, and a second connection hole is provided on the bottom edge of the support seat;

[0021] The first connecting hole and the second connecting hole are fixedly connected.

[0022] Furthermore, the vacuum adsorption channel includes a first vacuum adsorption channel and a second vacuum adsorption channel;

[0023] One end of the first vacuum adsorption channel is connected to the bottom of the adsorption groove, the other end of the first vacuum adsorption channel is connected to one end of the second vacuum adsorption channel, and the other end of the second vacuum adsorption channel is connected to the outer side of the side wall of the sealing bottom plate.

[0024] Compared with the prior art, the technical solution of the utility model has the following beneficial effects:

[0025] The utility model provides an optical wafer coating positioning jig, comprising a support base, a fixing platform for placing the optical wafer disposed within the top surface of the support base, and positioning members disposed at the edge of the top surface of the support base. In the process of coating the non-structural areas of the optical wafer other than the grating structure area to solve the problem of users being able to see reflected images of external objects while wearing AR glasses, the positioning jig of the utility model is used to accurately position and block the outcoupling grating area of ​​the optical wafer, thereby preventing the outcoupling grating area of ​​the optical wafer from being subjected to coating operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0027] Figure 1 Schematic diagram of the working principle of an existing diffraction optical waveguide as an example;

[0028] Figure 2 The figure is a schematic diagram of the overall process of the optical wafer coating process as an example;

[0029] Figure 3 is a schematic diagram of a first exemplary structure of a first coating fixture at a first angle;

[0030] Figure 4 is a schematic diagram of a second exemplary structure of the first coating fixture at a first angle;

[0031] Figure 5 is a schematic diagram of a third exemplary structure of the first coating fixture at a first angle;

[0032] Figure 6 is a schematic diagram of an example structure of the first coating fixture at a second angle;

[0033] Figure 7 is a schematic diagram of an example structure of a first clamping block;

[0034] Figure 8 is a schematic structural diagram of a first example of an optical wafer;

[0035] Figure 9 is a schematic diagram of an example structure of a second clamping block;

[0036] Figure 10 is a schematic structural diagram of a second example of an optical wafer;

[0037] Figure 11 is a schematic diagram of an example structure of the second coating fixture at a first angle;

[0038] Figure 12 is a schematic diagram of an example structure of a second coating fixture at a second angle;

[0039] Figure 13 A schematic diagram of a pre-cut optical wafer;

[0040] Figure 14 This is a schematic structural diagram of the positioning fixture of the first example at a first angle;

[0041] Figure 15 This is a schematic structural diagram of the positioning fixture of the first example at a second angle;

[0042] Figure 16 is a structural schematic diagram of a positioning fixture of the second example;

[0043] Figure 17 A schematic structural diagram of a sealing bottom plate as an example;

[0044] Figure 18 for Figure 17 A partial cross-sectional view of the sealing base plate shown;

[0045] Figure 19 A schematic diagram of the positioning fixture structure for placing optical wafers;

[0046] Figure 20 Schematic diagram of the structure of the positioning layer with a covering layer;

[0047] Figure 21 is a structural schematic diagram of the third coating fixture at a first angle;

[0048] Figure 22 This is a schematic structural diagram of the third coating fixture at a second angle.

[0049] Among them, 1-first base, 2-first groove, 3-first through hole, 4-first clamping block, 4-1-protrusion, 5-first clamping part, 6-optical wafer, 7-second through hole, 8-third through hole, 9-second clamping block, 10-fourth through hole, 11-fifth through hole, 12-positioning part, 13-second base, 14-second groove, 15-sixth through hole, 16-pick-up and place part, 17-coupling grating, 18-coupling grating, 19-support seat, 20-positioning piece, 21-fixed platform, 22-adsorption hole, 23-sealing bottom plate, 24-first connecting hole, 25-second connecting hole, 26-adsorption groove, 27-first vacuum adsorption channel, 28-second vacuum adsorption channel, 29-covering layer, 30-positioning layer, 31-positioning hole, 32-third base, 33-third groove, 34-seventh through hole, 35-shielding part. DETAILED DESCRIPTION

[0050] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0051] Currently, diffraction waveguides are used as the lens solution for AR glasses. When users actually wear AR glasses, in addition to being able to observe the image output from the optical machine through the diffraction waveguide and entering the human eye, the human eye can also see the image reflected by the optical waveguide matrix from external objects, which reduces the user experience.

[0052] In order to solve the above problems, an optical wafer coating process is provided, such as Figure 2 As shown, the overall concept is as follows:

[0053] S1: depositing a first functional film on one side of the optical wafer.

[0054] S2: imprinting a grating structure in a structured region on a surface opposite to the above-mentioned surface of the optical wafer, wherein the grating structure at least includes an in-coupling grating and an out-coupling grating.

[0055] S3 deposits a second functional film on the structure region of the coupling-in grating on the side opposite to the above-mentioned side of the optical wafer.

[0056] S4 performs optical performance detection on the structure area of ​​the outcoupling grating on the opposite side of the optical wafer to the above-mentioned side.

[0057] S5: depositing a first functional film on a non-structured area on the opposite side of the optical wafer.

[0058] Exemplarily, S1 deposits a first functional film on one side of an optical wafer, including the following steps:

[0059] S1-1 places the optical wafer in the first coating fixture.

[0060] For example,

[0061] like Figure 3 As shown, the first coating fixture comprises a first base 1 , a first groove 2 is defined in the first base 1 , and a first through hole 3 is defined in the bottom of the first groove 2 .

[0062] The side wall of the first groove 2 is engaged with the side wall of the optical wafer, and the bottom edge of the first groove 2 is in contact with the edge position of the above-mentioned one side of the optical wafer.

[0063] As a preferred embodiment, the first coating fixture may further include a first clamping block 4 (such as Figure 7As shown), the top of the side wall of the first groove 2 is extended to form a first clamping portion 5 in a direction away from the center of the first through hole 3, and the first clamping block 4 can be clamped in the first clamping portion 5 (as shown Figure 4 shown).

[0064] One end of the first clamping block 4 is provided with a protrusion 4-1 (such as Figure 7 As shown), when the first clamping block is clamped on the first clamping portion, the protrusion can be engaged with the sidewall notch of the optical wafer.

[0065] The above structure can realize that the first coating fixture can be used for the optical wafer 6 (such as Figure 8 As shown in the figure, the optical wafer is relatively fixed to prevent it from rotating in the first coating fixture.

[0066] In the above embodiment, in order to improve the connection performance between the first clamping block and the first clamping portion, the first coating fixture may further include a first connecting component, and the first connecting component may include a first bolt and a first nut. The bottom surface of the first clamping portion 5 is provided with a second through hole 7 (such as Figure 3 、 Figure 6 As shown), a third through hole 8 is provided in the first clamping block 4 (as shown Figure 7 As shown), the third through hole is a threaded hole, and the first bolt passes through the third through hole and the second through hole in sequence and is connected to the first nut.

[0067] As a preferred embodiment, the first coating fixture may further include a second clamping block 9 (such as Figure 9 As shown) and a second connecting component, the second connecting component example includes a second bolt and a second nut.

[0068] The first base is provided with a fourth through hole 10 (such as Figure 6 As shown), the second clamping block defines a fifth through hole 11 (as shown Figure 5 as well as Figure 9 As shown), the fourth through hole is a threaded hole, and the second bolt is connected to the second nut through the fourth through hole and the fifth through hole in sequence.

[0069] Through the above design, the first coating fixture can be used to coat irregular shaped optical wafers (such as Figure 10 The optical wafer 6) shown as having a linear local edge is relatively fixed to prevent the optical wafer from rotating in the first coating fixture.

[0070] Furthermore, as a preferred embodiment, the side wall of the first through hole 3 extends a positioning portion 12 (such as Figure 3As shown in the figure, the positioning portion 12 is designed in combination with the characteristic points of the optical wafer (such as the side wall notch of the optical wafer or the straight line design of the local edge), which is convenient for determining the side of the optical wafer on which the first functional film is coated, thereby assisting subsequent operators to imprint the grating structure on the opposite side of the side of the optical wafer on which the first functional film is coated.

[0071] S1-2 fixes the first coating fixture on which the optical wafer is placed in the coating equipment.

[0072] The coating equipment can adopt existing coating equipment.

[0073] Exemplarily, the coating equipment may include a coating chamber, a heating device, a vacuuming device, an electron beam evaporation source, and an optical wafer fixing device.

[0074] The optical wafer fixing device is fixed at the upper end of the coating chamber and is used to place the optical wafer.

[0075] The heating device is fixedly mounted on the top inner wall of the coating chamber. For example, the heating device can be a heating wire, which is arranged in a curved manner on the top inner wall of the coating chamber, and the heating wire and the top inner wall of the coating chamber are fixedly connected by welding or other methods.

[0076] The vacuum pumping equipment is communicated with the coating chamber, and the vacuum pumping equipment adopts existing equipment.

[0077] The electron beam evaporation source is fixed at the bottom of the coating chamber. It uses existing equipment, including a cathode for emitting electrons, an electron accelerator, and an anode for heating the film material. The heating film material is selected according to the coating film material.

[0078] S1-3 starts the coating equipment and alternately coats silicon and titanium on one side of the optical wafer under a vacuum state. The alternating coating of silicon and titanium on one side of the optical wafer can be achieved by alternately replacing the heating film material of the electron beam evaporation source, thereby completing the coating of the first functional film on the above-mentioned side of the optical wafer. The first functional film has the function of increasing transmission and reducing reflection.

[0079] Among them, the coating time is controlled at 60-100 minutes, and the coating temperature is controlled at 70-100°C.

[0080] Exemplarily, S2, imprinting the grating structure in the structure region on the opposite side of the optical wafer, may include the following steps:

[0081] S2-1 prepares an imprinting master having the above-mentioned grating structure.

[0082] For example,

[0083] A photoresist having a set thickness is spin-coated on the substrate to obtain a substrate provided with the photoresist.

[0084] An interference exposure operation is performed on the photoresist on the substrate to obtain a photoresist body grating with changed properties on the substrate.

[0085] The photoresist grating with changed properties on the substrate is developed to obtain a substrate with a photoresist relief grating mask.

[0086] The photoresist relief grating mask on the substrate is ion-beam etched to transfer the topography of the photoresist relief grating mask to the substrate, thereby obtaining an imprint master having the grating structure.

[0087] S2-2 transfers the grating structure of the imprint master to the soft mold through the nanoimprint process, and obtains the opposite structure of the grating structure on the soft mold.

[0088] For example,

[0089] The soft film substrate is connected to the fixing frame through the elastic component, and the fixing frame with the soft film substrate is placed above the glue-spreading stage.

[0090] Place the lower bottom surface of the imprint master on the glue-spreading platform, and spin-coat the imprint glue on the upper bottom surface of the imprint master.

[0091] The fixed frame is moved down to a position where it fits the imprint template of the glue-dispensing platform through the lifting mechanism.

[0092] A pressure roller is used to apply pressure to the soft film substrate in the fixed frame so that the embossing glue is filled into the grating structure of the embossing master, and a reverse structure of the grating structure is obtained on the embossing glue.

[0093] The embossing adhesive with the opposite structure of the grating structure is transferred to the soft mold substrate by ultraviolet curing and demoulding to obtain a soft film with the opposite structure of the grating structure.

[0094] It should be noted that during the above operation, the soft film substrate is subject to the tension of the elastic component, the pressure of the pressure roller and the influence of the external environment. The soft film substrate is prone to deformation, which causes the grating transfer structure on the soft film to deform, thereby causing the grating structure period subsequently transferred to the optical wafer through the soft film to deviate from the theoretical set period, which can easily cause abnormal optical indicators of the optical wafer.

[0095] To address this issue, flexible glass can be installed on the opposite side of the soft film transfer grating structure. Specifically, after the soft film substrate is connected to the fixed frame via elastic components, the flexible glass is installed on the side of the soft film substrate that contacts the pressure roller. The flexible glass is less susceptible to deformation under stress and is less susceptible to environmental influences (temperature and humidity). This combined design of soft film substrate and flexible glass prevents deformation of the soft film substrate compared to existing designs that use a single soft film substrate.

[0096] S2-3 transfers the opposite structure of the grating structure on the soft mold to the structural area on the opposite side of the above-mentioned one side of the optical wafer through the nanoimprint process, thereby completing the imprinting of the grating structure in the structural area on the opposite side of the above-mentioned one side of the optical wafer.

[0097] For example,

[0098] The opposite surface of the above-mentioned one side of the optical wafer is spin-coated with a tackifier and a product glue in sequence, and the soft mold having a structure opposite to the grating structure is bonded to the product glue of the optical wafer. Pressure is applied to fill the product glue into the opposite structure of the grating structure of the soft mold, and a grating structure is obtained on the product glue. The soft mold having a structure opposite to the grating structure is separated from the product glue having the grating structure by ultraviolet light curing and demolding, thereby completing the grating structure imprinting in the structural area on the opposite surface of the above-mentioned one side of the optical wafer.

[0099] Exemplarily, S3 is depositing a second functional film on the structure region of the coupling-in grating on the side opposite to the above-mentioned side of the optical wafer, comprising the following steps:

[0100] S3-1 places the optical wafer in the second coating fixture.

[0101] For example,

[0102] like Figure 11 As shown, the second coating fixture includes a second base 13, a second groove 14 is provided in the second base 13, and a sixth through hole 15 is provided at a set position inside the bottom of the second groove 14 (as shown in FIG. Figure 12 Here, the setting position of the sixth through hole matches and corresponds to the setting position of the coupling-in grating of the optical wafer, and the shape and size of the sixth through hole match and correspond to the shape and size of the coupling-in grating of the optical wafer.

[0103] The sidewall of the second groove 14 is engaged with the sidewall of the optical wafer, and the bottom edge of the second groove 14 contacts the edge position of the opposite surface of one side of the optical wafer.

[0104] The top end of the sidewall of the second groove 14 extends away from the center of the sixth through hole 15 to form a pick-and-place portion 16, which facilitates the removal and placement of the optical wafer from the second coating fixture. Furthermore, the pick-and-place portion can be designed in conjunction with the optical wafer's characteristic points (such as the sidewall notch of the optical wafer) to facilitate determining the side of the optical wafer where the coupling grating region is to be deposited with the second functional film.

[0105] S3-2 fixes the second coating fixture on which the optical wafer is placed in the coating equipment, wherein the coating equipment can be an existing coating equipment.

[0106] S3-3 starts the coating equipment, and coats titanium on the structural area of ​​the coupling grating on the opposite side of the above-mentioned one side of the optical wafer under a vacuum state, thereby completing the coating of the second functional film on the structural area of ​​the coupling grating on the opposite side of the above-mentioned one side of the optical wafer.

[0107] Among them, the coating time is controlled at 100-200 minutes, and the coating temperature is controlled at 60-80°C.

[0108] The second functional film is plated on the coupling-in grating area to increase the diffraction efficiency of the diffracted light on the working order when the incident light is diffracted by the coupling-in grating in a reflection manner.

[0109] Exemplarily, S4 performs optical performance detection on a structure area of ​​the outcoupling grating on the opposite side of the optical wafer, including:

[0110] The optical wafer is fixed in an optical performance testing device, which then performs a light efficiency test on the structure of the outcoupling grating on the optical wafer. If the optical efficiency test passes, the subsequent process flow continues. If the optical efficiency test fails, an analysis is conducted to determine if there are any corrective measures. If not, the optical wafer is discarded. Performing light efficiency testing at this stage, compared to performing light efficiency testing after fabricating the optical wafer into a diffractive optical waveguide in the form of an AR eyewear lens, can reduce the investment cost of producing diffractive optical waveguides with qualified light efficiency and improve the production efficiency of diffractive optical waveguides with qualified light efficiency.

[0111] It should be noted that, in the process of performing optical performance testing on the structure area of ​​the outcoupling grating on the opposite side of the above-mentioned one side of the optical wafer, in order to enable the optical performance testing equipment to fix the optical wafer with the grating structure, it may be necessary to pre-cut the optical wafer with the grating structure, such as Figure 13 , which is a schematic diagram of an example of a pre-cut optical wafer. In the figure, the grating structure of the optical wafer 6 includes an in-coupling grating 17 and an out-coupling grating 18 .

[0112] Exemplarily, S5 deposits a first functional film on a non-structured area on the opposite side of the optical wafer, including the following steps:

[0113] S5-1 uses a positioning fixture to set a covering layer on the structural area of ​​the outcoupling grating on the opposite side of the above-mentioned one side of the optical wafer, and the covering layer blocks the structural area of ​​the outcoupling grating.

[0114] For example, Figure 14As shown, the positioning fixture includes a support seat 19, a positioning member 20 is set at the edge of the top surface of the support seat 19, a fixing platform 21 is set inside the top surface of the support seat 19, and the fixing platform 21 is provided with an adsorption hole 22. The fixing platform 21 vacuum adsorbs and fixes the above-mentioned side of the optical wafer 6 (such as Figure 19 shown).

[0115] In order to improve the adsorption and fixing effect of the fixing table on the optical wafer, the positioning fixture can further include a sealing bottom plate 23, the top edge of the sealing bottom plate 23 is connected to the bottom edge of the support seat 19 (such as Figure 16 For example, a first connection hole 24 can be opened on the top edge of the sealing bottom plate 23 (as shown). Figure 17 As shown), a second connecting hole 25 is provided on the bottom edge of the support base 19 (as shown Figure 15 As shown), the sealing base plate can be fixedly connected to the support base through the first connecting hole and the second connecting hole.

[0116] The top surface of the sealing bottom plate 23 is provided with an adsorption groove 26 (such as Figure 17 shown).

[0117] The sealing bottom plate is provided with a vacuum adsorption channel, one end of the vacuum adsorption channel is connected to the groove body cavity of the adsorption groove, and the other end of the vacuum adsorption channel is connected to the outer side of the side wall of the sealing bottom plate. Figure 18 As shown, the vacuum adsorption channel includes a first vacuum adsorption channel 27 and a second vacuum adsorption channel 28. One end of the first vacuum adsorption channel 27 is connected to the bottom of the adsorption groove 26, and the other end of the first vacuum adsorption channel 27 is connected to one end of the second vacuum adsorption channel 28. The other end of the second vacuum adsorption channel 28 is connected to the side wall hole of the sealing bottom plate 23.

[0118] A vacuum pump is connected to the other end of the second vacuum adsorption channel through an adsorption pipe to achieve the adsorption and fixing effect of the fixing table on the optical wafer.

[0119] Exemplarily, using the positioning fixture to set a cover layer on the structure area of ​​the outcoupling grating on the opposite side of the optical wafer, wherein the cover layer shields the structure area of ​​the outcoupling grating, includes the following steps:

[0120] S5-1-1 cuts the cover layer so that the size of the cover layer matches the structural area of ​​the outcoupling grating.

[0121] For example, the covering layer may be an existing UV anti-viscosity film.

[0122] S5-1-2 Set a positioning hole 31 on the positioning layer 30 that matches the positioning piece of the positioning fixture, and set one side of the cut covering layer 29 at the set position of the positioning layer 30 (such as Figure 20The cover layer is positioned on the positioning layer such that, after the positioning layer is connected to the positioning fixture through the positioning holes, the cover layer is positioned on the positioning layer so as to correspond to the structure of the outcoupling grating on the optical wafer of the fixed platform in the positioning fixture.

[0123] For example, the positioning layer may be an existing film layer.

[0124] An isolation layer is provided on the side of the covering layer contacting the air. When the covering layer on the positioning layer is not used to shield the outcoupling grating area of ​​the optical wafer, the isolation layer can isolate and protect the side of the covering layer on the positioning layer exposed to the air.

[0125] For example, the isolation layer may be an existing film layer.

[0126] S5-1-3 Place the optical wafer on the top surface of the fixing table, and the above-mentioned side of the optical wafer contacts the top surface of the fixing table.

[0127] S5-1-4 Tear off the isolation layer on the covering layer, match the positioning holes of the positioning layer to the positioning pieces in the positioning fixture, so that the covering layer located in the positioning layer is exposed to the air on one side and is arranged on the structural area of ​​the out-coupling grating on the opposite side of the above-mentioned side of the optical wafer. The covering layer blocks the structural area of ​​the out-coupling grating, and then the positioning layer is torn off.

[0128] Preferably, since the non-structured area of ​​the optical wafer on one side of which the structured area is set needs to be placed in a coating device for a high-temperature coating operation, and the covering layer of the optical wafer in the structured area of ​​the out-coupling grating needs to be removed after the coating operation is completed, the covering layer needs to be resistant to high temperatures, and the covering layer is easy to remove after high-temperature baking, and it is not easy to have residual glue in the structured area of ​​the out-coupling grating of the optical wafer.

[0129] Taking the existing UV anti-viscosity film as an example,

[0130] 1. Attach the preliminarily selected UV anti-adhesion films to the optical wafers and bake them in an oven at a temperature above 100 degrees Celsius for 24 hours.

[0131] 2. Use UV lamp to irradiate the UV anti-viscosity film on the optical wafer for 1-2 minutes.

[0132] 3. Remove the UV anti-adhesion film on the optical wafer.

[0133] 4. Use a microscope to observe whether there is any residual adhesive in the attachment area of ​​the UV anti-viscosity film on the optical wafer. If there is residual adhesive in the attachment area of ​​the UV anti-viscosity film on the optical wafer, the UV anti-viscosity film attached to the optical wafer does not meet the usage requirements. If there is no residual adhesive in the attachment area of ​​the UV anti-viscosity film on the optical wafer, the UV anti-viscosity film attached to the optical wafer meets the usage requirements.

[0134] S5-2 places the optical wafer in a third coating jig, and the third coating jig shields the structure area of ​​the coupling-in grating on the opposite side of the optical wafer to the above-mentioned side.

[0135] For example, Figure 21 As shown, the third coating fixture includes a third base 32 , a third groove 33 is defined in the third base 32 , and a seventh through hole 34 is defined in the bottom of the third groove 33 .

[0136] The bottom edge of the third groove 33 is extended at a set position toward the center of the seventh through hole 34 to form a shielding portion 35 (such as Figure 22 shown).

[0137] The sidewall of the third groove 33 is engaged with the sidewall of the optical wafer, and the bottom edge of the third groove 33 contacts the edge of the opposite surface of the optical wafer.

[0138] The shielding portion 35 shields the structure region of the coupling grating on the opposite side of the above-mentioned side of the optical wafer.

[0139] The setting position of the shielding portion at the bottom edge of the third groove needs to satisfy the following requirement: after the optical wafer is clamped in the third groove, the shielding portion can shield the structural area of ​​the coupling grating of the optical wafer.

[0140] S5-3: A protective layer is provided on the side of the optical wafer opposite to the above-mentioned side where the covering layer contacts the air.

[0141] For example, the protective layer may be made of an existing black polyester film.

[0142] By providing a protective layer on the side of the optical wafer that contacts the air, the following functions are achieved:

[0143] After the first functional film is subsequently coated on the non-structural area opposite to the above-mentioned side of the optical wafer in the coating equipment, in the process of removing the blocking layer from the structural area of ​​the coupling grating of the optical wafer, it is avoided that the structural area of ​​the coupling grating has residues of the blocking layer. For example, when the blocking layer adopts the existing UV anti-viscosity film, in the process of removing the anti-viscosity film from the structural area of ​​the coupling grating of the optical wafer, it is avoided that the structural area of ​​the coupling grating has residual glue of the anti-viscosity film, which affects the coupling imaging effect of the coupling grating area.

[0144] S5-4 fixes the third coating fixture for placing the optical wafer in the coating equipment. The coating equipment can be an existing coating equipment.

[0145] S5-5 starts the coating equipment, and alternately coats silicon and titanium on the non-structural area opposite to the above-mentioned one side of the optical wafer under a vacuum state. The alternating coating of silicon and titanium on one side of the optical wafer can be achieved by alternately replacing the heating film material of the electron beam evaporation source, thereby completing the coating of the first functional film on the non-structural area opposite to the above-mentioned one side of the optical wafer.

[0146] Among them, the coating time is controlled at 60-100 minutes, and the coating temperature is controlled at 70-100°C.

[0147] S5-6 After coating the first functional film on the non-structured area of ​​the surface opposite to the above-mentioned one side of the optical wafer, the covering layer on the surface opposite to the above-mentioned one side of the optical wafer is removed.

[0148] Taking the existing UV anti-viscosity film as an example,

[0149] The opposite side of the optical wafer to the one side is irradiated with a UV lamp, and then the adhesive reduction film is removed from the opposite side of the optical wafer.

[0150] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the same. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field can still modify or replace the specific implementation methods of the present invention. Any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention are within the scope of protection of the claims of the present invention to be approved.

Claims

1. An optical wafer coating positioning fixture, characterized in that: Including support base; A fixing platform for placing the optical wafer is provided inside the top surface of the support base, and a positioning piece is provided at the edge of the top surface of the support base.

2. The optical wafer coating positioning fixture according to claim 1, characterized in that: A fixing hole is provided at an edge position of the top surface of the support seat, and a positioning column is provided in the fixing hole.

3. The optical wafer coating positioning fixture according to claim 2, characterized in that: A plurality of fixing holes are provided at the edge of the top surface of the support seat, and a positioning column is provided in each fixing hole.

4. The optical wafer coating positioning fixture according to claim 1, characterized in that: The fixing platform is provided with adsorption holes.

5. The optical wafer coating positioning fixture according to claim 4, characterized in that: The fixing platform is provided with a plurality of the adsorption holes.

6. The optical wafer coating positioning fixture according to claim 4, characterized in that: The positioning fixture further includes a sealing bottom plate; The top edge of the sealing bottom plate is connected to the bottom edge of the support seat; The top surface of the sealing bottom plate is provided with an adsorption groove at the location where the adsorption hole is set; The sealing bottom plate is provided with a vacuum adsorption channel, one end of the vacuum adsorption channel is communicated with the groove body cavity of the adsorption groove, and the other end of the vacuum adsorption channel is communicated with the outer side of the side wall of the sealing bottom plate.

7. The optical wafer coating positioning fixture according to claim 6, characterized in that: A first connecting hole is formed on the top edge of the sealing bottom plate, and a second connecting hole is formed on the bottom edge of the supporting base; The first connecting hole and the second connecting hole are fixedly connected.

8. The optical wafer coating positioning fixture according to claim 6, characterized in that: The vacuum adsorption channel includes a first vacuum adsorption channel and a second vacuum adsorption channel; One end of the first vacuum adsorption channel is connected to the bottom of the adsorption groove, the other end of the first vacuum adsorption channel is connected to one end of the second vacuum adsorption channel, and the other end of the second vacuum adsorption channel is connected to the outer side of the side wall of the sealing bottom plate.