Pressing ring device for monitoring sample temperature in real time

Abstract

The utility model relates to a pressure ring device for monitoring the temperature of a sample in real time, which comprises a bearing table, an annular clamping structure for clamping a substrate is arranged at the upper end of the bearing table, the bearing table is of a hollow cylindrical structure, a vertically-through cavity is formed in the bearing table, a thermal imaging camera for monitoring the temperature of the substrate in real time is arranged in the bearing table, and the thermal imaging camera is arranged in the bearing table. The thermal imaging camera is provided with an external host, the shooting end of the thermal imaging camera extends towards the bearing table, and the shooting center of the thermal imaging camera is consistent with the axis of the annular clamping structure. The sample temperature and surface defects are convenient to observe, and the process control capability can be further improved, so that the yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PVD equipment, in particular to a pressure ring device for real-time monitoring of sample temperature. Background Art

[0002] As an important material preparation method, thin film deposition technology is widely used in many fields, including electronic device manufacturing, optical coatings, new energy, and functional thin films. The development of thin film deposition technology has not only promoted the advancement of materials science and engineering technology, but also provided strong support for the sustainable development of human society. Common thin film deposition methods include physical vapor deposition (PVD), chemical vapor deposition (CVD), solution deposition, and atomic layer deposition (ALD).

[0003] PVD technology is one of the primary techniques for preparing thin-film materials. It involves using physical methods under vacuum conditions to vaporize the surface of a substance into gaseous atoms, molecules, or partially ionize them into ions. Through a low-pressure gas (or plasma) process, thin films with specialized functionalities are deposited onto the substrate. Compared to other deposition methods, PVD technology operates in a high vacuum, reducing impurities and contamination while ensuring film purity. It also boasts strong adaptability, being able to process a wide range of materials, including metals, alloys, oxides, nitrides, and carbides.

[0004] Currently, all PVD equipment used for thin film deposition has no way to directly monitor the sample temperature within the chamber. During the sputtering process of thin film growth, the temperature of the substrate itself, or the temperature of the local area of ​​the substrate, is actually a very important parameter, but we actually have no means to measure this temperature. If the sample temperature does not meet the process requirements, it will affect the sample performance and increase the difficulty of sample design and process implementation. Existing technology can only measure by attaching temperature test paper to the sample, which will cause contamination to both the sample surface and the interior of the chamber, which will have a direct impact on the process and lead to a decrease in sample yield.

[0005] Prior art solutions exist for real-time sample temperature monitoring. For example, Chinese invention patent publication CN104746028B discloses a pressure ring system and magnetron sputtering equipment capable of real-time wafer temperature monitoring. This system utilizes a temperature probe extending from within the chamber, placing it in direct, close contact with the substrate, enabling precise temperature measurement.

[0006] However, this direct contact temperature measurement method is prone to affect the coverage and deposition growth process of the thin film during the film deposition and growth process, and is also unable to accurately reflect the temperature changes of the substrate during the film growth process. Utility Model Content

[0007] The purpose of the utility model is to provide a pressure ring device for real-time monitoring of sample temperature, so as to record the temperature of the sample surface and sample defects during the deposition process in real time without interfering with the thin film growth process, and observe the state of the sample in real time.

[0008] In order to solve the above problems, the pressure ring device for real-time monitoring of sample temperature involved in the present invention adopts the following technical solutions:

[0009] A pressure ring device for real-time monitoring of sample temperature includes a supporting platform, an annular clamping structure for clamping a substrate is provided on the upper end of the supporting platform, the supporting platform is a hollow cylindrical structure with a cavity running through it from top to bottom, a thermal imaging camera for real-time monitoring of the substrate temperature is provided inside the supporting platform, the thermal imaging camera is equipped with an external host, the shooting end of the thermal imaging camera extends toward the supporting platform, and the shooting center of the thermal imaging camera is consistent with the axis of the annular clamping structure.

[0010] Furthermore, the supporting platform is provided with a protective structure for blocking between the thermal imaging camera and the annular clamping structure. During the movement, the protective structure has a shielding position that blocks the lens shooting path of the thermal imaging camera to protect against splashing debris, and also has an avoidance position that moves away from the lens shooting path to avoid the shooting path of the thermal imaging camera. The supporting platform is provided with a driving structure for driving the protective structure to move.

[0011] Furthermore, a transversely extending guide groove is provided on the middle side wall of the supporting platform, and the guide groove is hollowly connected to the interior of the supporting platform. The protective structure includes a protective plate inserted into the guide groove, and one side wall of the protective plate is assembled with the supporting platform guide.

[0012] Furthermore, a rack is provided on the other side wall of the protective plate, and the driving structure includes a reduction motor coordinated with the rack transmission, and a gear meshing with the rack is provided on the output shaft of the reduction motor, and the signal input end of the reduction motor is connected to the signal output end of the external host.

[0013] Furthermore, a magnetic structure is provided on the upper surface of the protective plate.

[0014] Furthermore, a receiving groove is provided on the upper surface of the protective plate, and the magnetic attraction structure is a magnet fixed in the receiving groove.

[0015] Furthermore, the lens of the thermal imaging camera is covered with a transparent protective film.

[0016] The beneficial effects of the present invention are as follows: Compared to the existing technology, a thermal imaging camera is installed inside the existing carrier platform. That is, the radiation energy of the substrate is reflected on the photosensitive element of the infrared detector to obtain an infrared thermal image, and then the real-time temperature distribution of each area on the substrate is obtained. The thermal imaging camera is used to observe and record the changes in sample temperature during the sputtering process in real time, and real-time data recording and monitoring is performed on the display screen. The thermal imaging camera is used to record the temperature of the sample surface and sample defects during the deposition process in real time, and the status of the sample is observed in real time. The sample temperature and surface defects are easy to observe, which can further improve the process control ability and thus improve the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments:

[0018] Figure 1 This is a structural schematic diagram of a specific embodiment of the pressure ring device for real-time monitoring of sample temperature of the present utility model;

[0019] Figure 2 for Figure 1 Schematic diagram of the specific structure of the middle protective plate.

[0020] Explanation of the accompanying drawings: 1-supporting platform 1; 2-cavity 2; 3-annular clamping structure 3; 4-substrate 4; 5-thermal imaging camera 5; 6-external host 6; 7-protective plate 7; 8-guide groove 8; 9-rack 9; 10-reduction motor 10; 11-gear 11; 12-transparent protective film 12; 13-accommodating groove 13; 14-magnet 14. DETAILED DESCRIPTION

[0021] In order to make the technical objectives, technical solutions, and beneficial effects of the present invention more clear, the technical solutions of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. That is, the embodiments described herein are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in a variety of different configurations.

[0022] The specific embodiment of the pressure ring device for real-time monitoring of sample temperature involved in the present utility model is as follows: Figure 1 、 Figure 2 As shown, the pressure ring device for real-time monitoring of sample temperature includes a supporting platform 1, and an annular clamping structure 3 for clamping a substrate 4 is provided at the upper end of the supporting platform 1. The shape of the supporting platform 1 and the specific form of the annular clamping structure 3 are basically consistent with the existing technology and are not described in detail.

[0023] Among them, the supporting platform 1 is designed as a hollow cylindrical structure, the top of the supporting platform 1 has a positioning surface, the annular clamping structure 3 is arranged on the horizontal outside of the positioning surface, the interior of the supporting platform 1 has a cavity 2 that passes through from top to bottom, and the interior of the supporting platform 1 is provided with a thermal imaging camera 5 for real-time monitoring of the temperature of the substrate 4. The thermal imaging camera 5 is equipped with an external host 6, and the external host 6 is equipped with a display. The shooting end of the thermal imaging camera 5 extends toward the supporting platform 1, and the shooting center of the thermal imaging camera 5 is consistent with the axis of the annular clamping structure 3.

[0024] Thermal imaging camera 5 is used to record temperature changes during thin film growth. It can also detect temperature changes in certain localized areas of substrate 4 and track the formation of defects. Thermal imaging camera 5 primarily acquires temperature information by measuring infrared radiation from the surface. Using a specialized infrared detector and optical system, thermal imaging camera 5 converts infrared radiation into electrical signals, which are then converted into image signals and displayed on the screen. This allows for intuitive visualization of the temperature distribution in different areas, enabling contactless temperature measurement.

[0025] Compared with the existing direct contact temperature detection, it can detect the temperature distribution of each position of the substrate 4 in a wider range and monitor the temperature change on the substrate 4 in real time. It does not require contact with the substrate 4 and will not affect the growth of the thin film.

[0026] At the same time, in order to protect the thermal imaging camera 5, a protective structure is movably provided inside the supporting platform 1 to block the thermal imaging camera 5 and the annular clamping structure 3. During the movement, the protective structure has a shielding position that blocks the lens shooting path of the thermal imaging camera 5 to protect against splashing debris, and also has an avoidance position that moves away from the lens shooting path to avoid the shooting path of the thermal imaging camera 5. The supporting platform 1 is provided with a driving structure for driving the action of the protective structure.

[0027] In actual use, since magnetron sputtering easily generates debris, during the thin film growth process, the protective structure is in an avoidance position. When the substrate 4 needs to be removed, in order to prevent the debris distributed on the surrounding side of the substrate 4 and the supporting platform 1 from falling into the inside of the supporting platform 1 and hitting the lens attached to the thermal imaging camera 5, the protective structure is moved to the blocking position. The debris can be effectively isolated from the thermal imaging camera 5, which facilitates subsequent debris cleaning work.

[0028] Specifically, in order to realize the assembly of the protective structure, a transversely extending guide groove 8 is provided on the middle side wall of the carrier 1. The guide groove 8 is connected to the hollow interior of the carrier 1. The protective structure includes a protective plate 7 that is inserted into the guide groove 8. One side wall of the protective plate 7 is guided and assembled with the carrier 1. The protective plate 7 is driven to move back and forth in the horizontal direction by a driving mechanism to realize the position switching between the avoidance position and the blocking position. In order to realize the drive of the protective plate 7, a rack 9 is provided on the other side wall of the protective plate 7. The driving structure includes a reduction motor 10 that is in transmission with the rack 9. The output shaft of the reduction motor 10 is provided with a gear 11 that meshes with the rack 9. The signal input end of the reduction motor 10 is connected to the signal output end of the external host 6.

[0029] In other embodiments, the protective structure may also be designed as a folding shutter structure, or a flip-up plate structure, etc., without specific limitation. The driving mechanism may also be driven by a cylinder.

[0030] Preferably, in order to achieve further adsorption and isolation of debris, a magnetic structure is provided on the upper surface of the protective plate 7 .

[0031] In order to ensure smooth position switching of the protective plate 7 , a receiving groove 13 is provided on the upper surface of the protective plate 7 , and the magnetic attraction structure is a magnet 14 fixed in the receiving groove 13 .

[0032] In order to further protect the lens of the thermal imaging camera 5 and prevent the lens from being covered by a film, the lens of the thermal imaging camera 5 is covered with a transparent protective film 12. The transparent protective film 12 is covered by adsorption and is replaced regularly to ensure the accuracy and stability of the camera.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate and not to limit the technical solutions of the present invention. Any equivalent replacement of the present invention and any modification or partial replacement that does not depart from the spirit and scope of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A pressure ring device for real-time monitoring of sample temperature, comprising a carrier platform, the upper end of which is provided with an annular clamping structure for clamping a substrate, characterized in that: The supporting platform is a hollow cylindrical structure with a cavity running through it from top to bottom. A thermal imaging camera for real-time monitoring of the substrate temperature is provided inside the supporting platform. The thermal imaging camera is equipped with an external host. The shooting end of the thermal imaging camera extends toward the supporting platform, and the shooting center of the thermal imaging camera is consistent with the axis of the annular clamping structure.

2. The pressure ring device for real-time monitoring of sample temperature according to claim 1, characterized in that: The supporting platform is provided with a protective structure inside for blocking between the thermal imaging camera and the annular clamping structure. During the movement, the protective structure has a shielding position that blocks the lens shooting path of the thermal imaging camera to protect against splashing debris. It also has an avoidance position that moves away from the lens shooting path to avoid the shooting path of the thermal imaging camera. The supporting platform is provided with a driving structure for driving the protective structure to move.

3. The pressure ring device for real-time monitoring of sample temperature according to claim 2, characterized in that: A transversely extending guide groove is provided on the middle side wall of the supporting platform, and the guide groove is hollowly connected to the interior of the supporting platform. The protective structure includes a protective plate inserted into the guide groove, and one side wall of the protective plate is assembled with the supporting platform guide.

4. The pressure ring device for real-time monitoring of sample temperature according to claim 3, characterized in that: A rack is provided on the other side wall of the protective plate, and the driving structure includes a reduction motor that cooperates with the rack transmission. A gear that meshes with the rack is provided on the output shaft of the reduction motor, and the signal input end of the reduction motor is connected to the signal output end of the external host.

5. The pressure ring device for real-time monitoring of sample temperature according to claim 3, characterized in that: A magnetic structure is provided on the upper surface of the protective plate.

6. The pressure ring device for real-time monitoring of sample temperature according to claim 5, characterized in that: A receiving groove is provided on the upper plate surface of the protective plate, and the magnetic attraction structure is a magnet fixed in the receiving groove.

7. The pressure ring device for real-time monitoring of sample temperature according to claim 1, characterized in that: The lens of the thermal imaging camera is covered with a transparent protective film.

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