Cleaning device and semiconductor equipment
By using an inclined flow guide surface and a separation and drainage system in the cleaning device, the problem of H2SO4 being backsplashed to the substrate surface is solved, and the rapid discharge of the treatment liquid and protection of the substrate surface are achieved.
Patent Information
- Application Number
- CN202422703447.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-11-05
AI Technical Summary
In the existing cleaning device, H2SO4 and H2O2 do not react sufficiently, resulting in H2SO4 being backsplashed onto the substrate surface, causing defects.
Design a cleaning device, using an inclined flow guide surface and a separation drainage system, including an inclined flow guide surface, a separation drainage pipe and a check valve, to ensure rapid discharge of the treatment liquid and reduce backsplash.
The discharge speed of the treatment liquid is improved, the probability of the treatment liquid being backsplashed on the substrate surface is reduced, and the defects on the substrate surface are reduced.
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Figure CN223296776U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor technology, and in particular to, but not limited to, a cleaning device and semiconductor equipment. Background Art
[0002] Currently, substrate cleaning machines are designed with dual liquid outlets. When SPM (a mixture of H2SO4 and H2O2) is used to clean organic residues on the substrate surface, SPM can react with the organic residues to form H2SO4, CO2, and H2O, thereby removing the organic residues on the substrate surface.
[0003] In the related art, since the double drain ports of the cleaning machine are connected to the horizontal pipe, the discharge performance of H2SO4 in the cleaning machine is poor. The H2SO4 that is not discharged in time reacts violently with the input H2O2, causing H2SO4 to splash back from the bottom of the cleaning machine to the surface of the substrate, causing defects on the substrate. Utility Model Content
[0004] In view of this, embodiments of the present disclosure provide a cleaning apparatus and a semiconductor device.
[0005] In a first aspect, an embodiment of the present disclosure provides a cleaning device, comprising:
[0006] a liquid supply device, for supplying a processing liquid to the substrate;
[0007] The processing box is provided with an accommodating space; the bottom of the processing box has an inclined guide surface;
[0008] A carrier is accommodated in the accommodating space and installed on the bottom of the processing box, and the projection portion on the bottom covers the guide surface; the carrier is arranged below the liquid supply device and corresponds to the liquid supply device, and the carrier is used to carry the substrate;
[0009] A liquid discharge device is connected to the guide surface and is used to discharge the treatment liquid out of the accommodating space.
[0010] In some embodiments, the bottom of the processing box has two drainage ports;
[0011] At least one of the liquid discharge ports is located at the lowest point of the guide surface, and is used to discharge the processing liquid to the liquid discharge device after the processing liquid processes the substrate.
[0012] In some embodiments, the drainage device includes: a first drainage pipe;
[0013] The first liquid discharge pipe is a four-way pipe; the first liquid discharge pipe includes an output port and two input ports, the two input ports are respectively connected to the two liquid discharge ports, and the output port is used to discharge the treatment liquid.
[0014] In some embodiments, the treatment liquid is a first solution or a second solution; the drainage device further comprises: a second drainage pipe and a third drainage pipe;
[0015] The second liquid discharge pipe is linear and connected to an output port of the first liquid discharge pipe, and is used to discharge the first solution;
[0016] The third liquid discharge pipe is linear and connected to the other output port of the first liquid discharge pipe for discharging the second solution.
[0017] In some embodiments, the liquid discharge device further comprises: a first one-way valve and a second one-way valve;
[0018] The first one-way valve is provided on the second drain pipe and is used to discharge the first solution in a one-way direction away from the processing tank;
[0019] The second one-way valve is provided on the third drain pipe, and is used for discharging the second solution in a one-way direction away from the processing tank.
[0020] In some embodiments, the drainage device further comprises: a drainage tank;
[0021] The drainage box is provided on the second drainage pipe and is located on the side of the output port of the second drainage pipe relative to the first one-way valve, and is used to prevent the discharged first solution from flowing back.
[0022] In some embodiments, the bottom of the processing box further has a first carrying surface and a second carrying surface, and the carrier is mounted on the first carrying surface;
[0023] The guide surface is located between the first bearing surface and the second bearing surface; wherein,
[0024] The first bearing surface is higher than the second bearing surface, and the guide surface is inclined downward from the first bearing surface to the second bearing surface; or
[0025] The first bearing surface is lower than the second bearing surface, and the guide surface is inclined upward from the first bearing surface to the second bearing surface.
[0026] In some embodiments, the guide surface is inclined upward from the first supporting surface to the second supporting surface, and the projection of the platform on the bottom completely covers the first supporting surface.
[0027] In some embodiments, the cleaning device further comprises:
[0028] A protective cover is located on the second carrying surface and is used to block and recover the processing liquid.
[0029] In a second aspect, an embodiment of the present disclosure provides a semiconductor device, comprising: a main drain pipe, and a plurality of cleaning devices as described in the above embodiments;
[0030] The main drain pipe is connected to each of the drain devices, and is used to receive the processing liquid discharged by each of the cleaning devices.
[0031] The embodiments of the present disclosure provide a cleaning device and a semiconductor device, wherein the cleaning device includes: a liquid supply device for supplying a processing liquid to a substrate; a processing box provided with a storage space; the bottom of the processing box having an inclined guide surface; a carrier, which is accommodated in the storage space and mounted on the bottom of the processing box, with the projection on the bottom covering the guide surface; the carrier is arranged below the liquid supply device and corresponds to the liquid supply device, and the carrier is used to carry the substrate; a liquid discharge device connected to the guide surface and used to discharge the processing liquid from the storage space. Due to the inclined guide surface at the bottom of the processing box, on the one hand, it helps the processing liquid to flow quickly to the lowest point of the guide surface, thereby speeding up the speed of the processing liquid when it is discharged; on the other hand, it makes the angle of the processing liquid splashing back lower, that is, it is difficult for the processing liquid to splash back to the surface of the substrate, thereby reducing defects on the surface of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In the accompanying drawings (which are not necessarily drawn to scale), like reference numerals may describe similar components in different views. Like reference numerals with different letter suffixes may represent different examples of similar components. The accompanying drawings generally illustrate various embodiments discussed herein by way of example and not limitation.
[0033] Figure 1 A schematic diagram of the structure of a cleaning device provided in the related art;
[0034] Figure 2 A schematic diagram of the structure of the cleaning device provided in the embodiment of the present disclosure Figure 1 ;
[0035] Figure 3 A schematic diagram of the structure of the cleaning device provided in the embodiment of the present disclosure Figure 2 ;
[0036] Figure 4 A schematic structural diagram of a semiconductor device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0037] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the specific embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0038] In the following description, numerous details are provided to provide a more thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that the present disclosure can be practiced without one or more of these details. In other instances, certain technical features known in the art are not described to avoid confusion with the present disclosure; that is, all features of actual embodiments are not described herein, nor are well-known functions and structures described in detail.
[0039] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.
[0040] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to, or coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to, or directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. However, when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part exists in the present disclosure.
[0041] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present disclosure. When used herein, the singular forms "a", "an", and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.
[0042] Currently, H2SO4 / H2O2 mixed solutions (SPM) are commonly used to remove organic residues after photolithography processes. This is because the mixture of H2SO4 and H2O2 forms carboxylic acid, which has very strong oxidizing properties and can quickly react with organic residues on the substrate surface to form H2SO4, CO2, and H2O, thereby quickly removing organic residues on the substrate surface.
[0043] For related technologies, please refer to Figure 1 Since the two drain ports 11 at the bottom of the cleaning device 10 are connected to the horizontal pipe 12, the discharge performance of the formed H2SO4 is poor. The H2SO4 that is not discharged in time will react violently with the H2O2 input into the cleaning device 10 in the next step, causing H2SO4 to splash from the bottom of the cleaning device (such as Figure 1 The H2SO4 is transferred to the surface of the substrate 13 (indicated by the arrow in the middle), generating linear defects on the surface of the substrate 13. Specifically, please refer to Table 1, which shows the splash test results of H2SO4 under different treatment times.
[0044] Table 1:
[0045]
[0046] It can be seen from Table 1 that: Figure 1 After the cleaning device 10 shown cleans the organic residues on the surface of the substrate, splashes are found on the surface of the substrate. Since some of the splashes (such as H2SO4) are corrosive, defects may be caused on the surface of the substrate.
[0047] Based on this, the present disclosure provides a cleaning device 20, please refer to Figure 2 and Figure 3The cleaning device 20 includes: a liquid supply device 21, a processing box 22, a carrier 25 and a liquid discharge device 23; the liquid supply device 21 is used to provide processing liquid to the substrate 24; the processing box 22 is provided with a accommodating space; the bottom 221 of the processing box 22 has an inclined guide surface 221a; the carrier 25 is accommodated in the accommodating space and installed on the bottom 221 of the processing box 22, and the projection part on the bottom 221 covers the guide surface 221a; the carrier 25 is arranged below the liquid supply device 21 and corresponds to the liquid supply device 21, and the carrier 25 is used to carry the substrate 24; the liquid discharge device 23 is connected to the guide surface 221a, and is used to discharge the processing liquid from the accommodating space.
[0048] In the disclosed embodiment, the treatment liquid provided by the liquid supply device 21 can be a solution such as SPM, H2O2, HDIW, or hydrofluoric acid (HF) used to treat the substrate 24. The treatment liquid (i.e., waste liquid) discharged from the accommodating space may include not only residual treatment liquid, such as residual SPM, H2O2, HDIW, or HF, but also H2SO4 and H2O generated when SPM reacts with organic residues on the surface of the substrate 24.
[0049] In addition, the carrier 25 is arranged below the liquid supply device 21 and corresponds to the liquid supply device 21, which means that the upper surface of the carrier 25 is located below the liquid supply device 21, so that the substrate 24 is located below the liquid supply device 21, which is conducive to cleaning the substrate 24 with the processing liquid.
[0050] In the embodiment of the present disclosure, the projection of the carrier 25 on the bottom 221 partially covers the guide surface 221a; for example, please refer to Figure 2 and Figure 3 The projection of the edge of the carrier 25 on the bottom 221 is located on the guide surface 221a. In this way, the processing liquid after cleaning the substrate 24 can drip from the carrier 25 to the guide surface 221a, which is beneficial to reducing the angle of the processing liquid splashing back.
[0051] In the embodiment of the present disclosure, the bottom of the processing box is flat (such as Figure 1 Compared with the above, the bottom 221 of the treatment box 22 has an inclined guide surface 221a. On the one hand, it helps the treatment liquid to quickly flow to the lowest point of the guide surface 221a, thereby accelerating the discharge speed of the treatment liquid. On the other hand, the angle of the splash back when the treatment liquid drops onto the inclined surface (i.e., the guide surface 221a) is increased (as shown in FIG. Figure 2 and Figure 3 The dotted arrow in the middle shows the angle of the splashing of the treatment liquid when it drops onto the plane (as shown in the figure). Figure 1 As shown by the dotted arrow in the middle, it is difficult for the processing liquid to splash back onto the surface of the substrate, thereby reducing defects on the surface of the substrate.
[0052] Next, please refer to Figure 2 and Figure 3 , the cleaning device 20 is introduced in detail.
[0053] In some embodiments, please refer to Figure 2 and Figure 3 The bottom of the processing box 22 has two drainage ports A (as shown in the dotted area); at least one drainage port A is located at the lowest point of the guide surface 221a, and is used to discharge the processing liquid to the drainage device 23 after the processing liquid processes the substrate 24.
[0054] In this disclosure, please refer to Figure 2 and Figure 3 , both drain ports A are located at the lowest point of the guide surface 221a, so that the treated liquid can be quickly discharged through the drain ports A. In other embodiments, one drain port A can be located at the lowest point of the guide surface 221a, and the other drain port A can be set at other suitable locations (for example, Figure 2 on the first supporting surface 221c in the middle).
[0055] In this disclosure, please continue to refer to Figure 2 and Figure 3 Since there are two drain ports A at the bottom of the processing box 22, waste liquid can be discharged simultaneously through these two drain ports A. On the one hand, the speed of the waste liquid in the discharge process can be increased and the accumulation of waste liquid can be reduced; on the other hand, the risk of the drain port A being blocked by impurities or particulate matter in the waste liquid is reduced. Even if one of the drain ports A is slightly blocked, the other drain port A can still work normally, ensuring that the treated liquid can be discharged smoothly.
[0056] In some embodiments, the drainage device 23 includes: a first drainage pipe 231; the first drainage pipe 231 is a four-way pipe; the first drainage pipe 231 includes an output port and two input ports, the two input ports are respectively connected to the two drainage ports A, and the two output ports are used to discharge the treated liquid.
[0057] In the embodiment of the present disclosure, since the two input ports of the first drain pipe 231 are respectively connected to the two drain ports A, the processing liquid can be discharged from the processing box 22 through the first drain pipe 231 .
[0058] In the embodiment of the present disclosure, the two input ports of the first liquid discharge pipe 231 can form a Y shape (see Figure 2 and Figure 3 ); In this way, not only can the treatment liquid pass through the first drainage pipe 231 quickly, it helps to reduce the residence time of the treatment liquid in the box and improve the discharge efficiency. In other embodiments, the first drainage pipe 231 can also be of other shapes, and this disclosure is not limited to this.
[0059] In some embodiments, the treatment liquid is a first solution or a second solution; please continue to refer to Figure 2 and Figure 3 The drainage device 23 also includes: a second drainage pipe 232 and a third drainage pipe 233; the second drainage pipe 232 is linear and connected to one output port of the first drainage pipe 231 for discharging the first solution; the third drainage pipe 233 is linear and connected to the other output port of the first drainage pipe 231 for discharging the second solution.
[0060] In the embodiment of the present disclosure, the first solution provided by the liquid supply device 21 can be a solution such as SPM, H2O2 or HDIW; the first solution discharged from the accommodating space can include residual SPM, residual H2O2, or can also include H2SO4 and H2O generated when SPM reacts with organic residues on the surface of the substrate 24; the second solution can include HF.
[0061] It should be noted that, referring to Table 1, during the processing of the substrate 24, the SPM, H2O2, etc. in the first solution are not added at the same time; for example, after the substrate is processed and discharged by the SPM, H2O2 is input through the liquid supply device 21; in this way, heat and backsplash caused by the reaction of the subsequently added H2O2 with the undischarged H2SO4 can be prevented.
[0062] In addition, since HF is highly corrosive and reactive and can melt glass or plastic, to ensure safety during processing, the second solution (i.e., HF) needs to be collected separately through the third drain pipe 233.
[0063] In the embodiment of the present disclosure, the two solutions are discharged by respectively setting up a second drain pipe 232 and a third drain pipe 233; on the one hand, the first solution and the second solution can be discharged and recovered separately, and can be treated separately according to the characteristics of the discharged solutions, which not only reduces the danger of chemical reagents but also is beneficial to environmental protection; on the other hand, it ensures that the first solution and the second solution will not mix when discharged, reducing the heat and splashing caused by the mixing of different solutions, thereby extending the service life of the drain pipe.
[0064] In some embodiments, please refer to Figure 2 and Figure 3 The drainage device 23 also includes: a first one-way valve 234 and a second one-way valve 235; the first one-way valve 234 is arranged on the second drainage pipe 232, and is used to discharge the first solution in a one-way direction away from the treatment box 22; the second one-way valve 235 is arranged on the third drainage pipe 233, and is used to discharge the second solution in a one-way direction away from the treatment box 22.
[0065] In this disclosure, please continue to refer to Figure 2 and Figure 3The first one-way valve 234 allows the first solution to be discharged in one direction, preventing the discharged first solution from flowing back into the treatment tank 22. This not only avoids the mixing of different solutions in the treatment tank 22, which would otherwise cause heat and splashing, but also prevents acid gas from downstream equipment from flowing back into the treatment tank 22 through the second drain pipe 232, thereby maintaining a good processing atmosphere in the treatment tank 22. For example, when the treatment tank 22 is drying, the first one-way valve 234 can prevent acid gas from downstream equipment from flowing back into the treatment tank 22, thus maintaining a good drying atmosphere in the treatment tank 22. The function of the second one-way valve 235 is similar to that of the first one-way valve 234 and will not be further described here.
[0066] In some embodiments, please refer to Figure 2 and Figure 3 The drainage device 23 further includes: a drainage box 236; the drainage box 236 is provided on the second drainage pipe 232 and is located on the output port side of the second drainage pipe 232 relative to the first one-way valve 234, for backflow of the discharged first solution.
[0067] In the embodiment of the present disclosure, the drainage box 236 can not only prevent the remaining first solution from flowing back into the treatment box 22; it can also prevent the acid gas in the downstream equipment from flowing back into the treatment box 22 through the second drainage pipe 232, so that the treatment atmosphere in the treatment box 22 is better.
[0068] Also, please continue to refer to Figure 2 and Figure 3 The drainage tank 236 can also serve as a buffer container, which can slow down the discharge speed of the first solution from the second drainage pipe 232, thereby avoiding the solution from flowing back into the treatment tank 22 due to excessive discharge speed or pipeline pressure fluctuations. This helps to maintain the stability of the discharge process and ensure that the first solution can be discharged smoothly and safely.
[0069] In some embodiments, please refer to Figure 2 and Figure 3 The bottom 221 of the processing box 22 further includes a first supporting surface 221c and a second supporting surface 221b. The carrier 25 is disposed on the first supporting surface 221c. The guide surface 221a is located between the first supporting surface 221c and the second supporting surface 221b. Placing the carrier 25 on the first supporting surface 221c facilitates securing the carrier 25 and reduces shaking during the cleaning process of the substrate 24.
[0070] In some embodiments, please refer to Figure 2The first supporting surface 221c is lower than the second supporting surface 221b, and the guide surface 221a slopes upward from the first supporting surface 221c to the second supporting surface 221b. The projection of the carrier 25 on the bottom 221 completely covers the first supporting surface 221c. This not only facilitates the collection of waste liquid at the drain port A, facilitating its rapid discharge, but also allows any back-splashing waste liquid to be blocked by the bottom surface of the carrier 25, thereby preventing damage to the substrate 24 and ensuring the integrity of the substrate 24 surface.
[0071] In some embodiments, please refer to Figure 3 The first supporting surface 221c is higher than the second supporting surface 221b, and the guide surface 221a is inclined downward from the first supporting surface 221c to the second supporting surface 221b. In this way, the waste liquid splashes away from the substrate 24 (such as Figure 3 The process of removing the substrate 24 from the substrate 24 is performed by removing the waste liquid from the substrate 24 and removing the waste liquid from the substrate 24.
[0072] In this disclosure, please continue to refer to Figure 2 and Figure 3 The cleaning device further includes a rotating shaft 26, which is located between the first carrying surface 221c and the carrier 25 and is used to drive the carrier 25 to rotate. In this way, the uniformity of the treatment process of the treatment liquid is improved.
[0073] In some embodiments, the cleaning device 20 further includes: a protective cover 27 and a support plate ( Figure 2 and Figure 3 protective cover 27, located on the second bearing surface 221b, for blocking and recovering the processing liquid; a support plate, located on the side wall of the rotating shaft 26, for supporting the rotating shaft 26.
[0074] In the disclosed embodiment, the sidewalls 222 of the processing box 22 are disposed on the periphery of the protective cover 27 ; the sidewalls 222 of the processing box 22 and the interior of the bottom 221 together constitute a storage space for the processing liquid and the substrate 24 during processing.
[0075] In the embodiment of the present disclosure, the protective cover 27 is located on the second supporting surface 221b, and its main function is to block and recover the processing liquid; specifically, during the processing of the substrate 24, the rotating shaft 26 drives the carrier 25 to rotate, and the processing liquid will splash out from the side of the carrier 25. The design of the protective cover 27 can effectively block the processing liquid and prevent the processing liquid from splashing to the outside of the processing box 22.
[0076] In addition, please refer to Figure 4 The embodiment of the present disclosure further provides a semiconductor device 30, comprising a plurality of cleaning devices in the above embodiments.
[0077] It should be noted that Figure 4The semiconductor device 30 shows a plurality of Figure 2 The cleaning devices 20a to 20n are shown; in fact, the semiconductor device 30 may include Figure 2 and / or Figure 3 Cleaning device shown.
[0078] In some embodiments, the semiconductor device 30 further includes a main drain pipe 31 ; the main drain pipe 31 is configured to receive the processing liquid discharged from each cleaning device.
[0079] In the embodiment of the present disclosure, since the semiconductor equipment 30 includes multiple cleaning devices 20 as in the above-mentioned embodiment, on the one hand, the liquid discharge speed of the semiconductor equipment 30 is faster, and the solution will not accumulate in the processing box of the cleaning device 20; on the other hand, the acid gas in the main drain pipe 31 will not flow back into the cleaning device 20, so that the processing atmosphere in the cleaning device 20 is better.
[0080] In the several embodiments provided in this disclosure, it should be understood that the disclosed structures and methods can be implemented in non-targeted ways. The structural embodiments described above are merely illustrative. For example, the division of units is merely a logical functional division. In actual implementation, there may be other division methods, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the components shown or discussed are coupled or directly coupled to each other.
[0081] The features disclosed in several method or structural embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments or structural embodiments.
[0082] The above are only some embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.
Claims
1. A cleaning device, characterized in that: include: a liquid supply device, for supplying a processing liquid to the substrate; The processing box is provided with an accommodating space; the bottom of the processing box has an inclined guide surface; A carrier is accommodated in the accommodating space and installed on the bottom of the processing box, and the projection portion on the bottom covers the guide surface; the carrier is arranged below the liquid supply device and corresponds to the liquid supply device, and the carrier is used to carry the substrate; A liquid discharge device is connected to the guide surface and is used to discharge the treatment liquid out of the accommodating space.
2. The cleaning device according to claim 1, characterized in that The bottom of the processing box is provided with two drainage ports; At least one of the liquid discharge ports is located at the lowest point of the guide surface, and is used to discharge the processing liquid to the liquid discharge device after the processing liquid processes the substrate.
3. The cleaning device according to claim 2, characterized in that The liquid discharge device comprises: a first liquid discharge pipe; The first liquid discharge pipe is a four-way pipe; the first liquid discharge pipe includes an output port and two input ports, the two input ports are respectively connected to the two liquid discharge ports, and the output port is used to discharge the treatment liquid.
4. The cleaning device according to claim 3, characterized in that: The treatment liquid is a first solution or a second solution; the drainage device further comprises: a second drainage pipe and a third drainage pipe; The second liquid discharge pipe is linear and connected to an output port of the first liquid discharge pipe, and is used to discharge the first solution; The third liquid discharge pipe is linear and connected to the other output port of the first liquid discharge pipe for discharging the second solution.
5. The cleaning device according to claim 4, characterized in that: The liquid discharge device further comprises: a first one-way valve and a second one-way valve; The first one-way valve is provided on the second drain pipe and is used to discharge the first solution in a one-way direction away from the processing tank; The second one-way valve is provided on the third drain pipe, and is used for discharging the second solution in a one-way direction away from the processing tank.
6. The cleaning device according to claim 5, characterized in that: The drainage device further includes: a drainage box; The drainage box is provided on the second drainage pipe and is located on the side of the output port of the second drainage pipe relative to the first one-way valve, and is used to prevent the discharged first solution from flowing back.
7. The cleaning device according to claim 1, characterized in that The bottom of the processing box also has a first carrying surface and a second carrying surface, and the carrier is installed on the first carrying surface; The guide surface is located between the first bearing surface and the second bearing surface; wherein, The first bearing surface is higher than the second bearing surface, and the guide surface is inclined downward from the first bearing surface to the second bearing surface; or The first bearing surface is lower than the second bearing surface, and the guide surface is inclined upward from the first bearing surface to the second bearing surface.
8. The cleaning device according to claim 7, characterized in that: The guide surface is inclined upward from the first carrying surface to the second carrying surface, and the projection of the platform on the bottom completely covers the first carrying surface.
9. The cleaning device according to claim 8, characterized in that: The cleaning device also includes: A protective cover is located on the second carrying surface and is used to block and recover the processing liquid.
10. A semiconductor device, characterized in that: It comprises a main drain pipe and a plurality of cleaning devices as claimed in claims 1 to 9; The main drain pipe is connected to each of the drain devices, and is used to receive the processing liquid discharged by each of the cleaning devices.