Wafer clamping jaw device used in automatic wafer changing system on die bonder

Abstract

The utility model relates to the field of semiconductor packaging, in particular to a wafer clamping jaw device used in an automatic chip changing system on a die bonder, which comprises a main supporting plate and a clamping jaw module, the clamping jaw module comprises a base, one side of the base is connected with a material pulling anti-blocking assembly in a sliding manner, one side of the material pulling anti-blocking assembly is provided with a material pulling detection chip, and the other side of the material pulling detection chip is provided with a material pulling detection groove. A material pulling anti-blocking detector is fixed to one side of the upper surface of the base, a material pushing anti-blocking assembly is connected to the lower surface of the base in a sliding mode, a material pushing detection piece is arranged on one side of the material pushing anti-blocking assembly, a material pushing anti-blocking detector is fixed to the other side of the top of the base, and a clamping jaw assembly is fixed to the lower surface of the material pushing anti-blocking assembly. The clamping jaw assembly is used for effectively clamping the wafer, the material pulling anti-clamping assembly and the material pushing anti-clamping assembly are used for achieving material clamping detection in the material pulling process and the material pushing process, and the effectiveness of automatically taking and placing the wafer is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a wafer clamping device used in an automatic wafer changing system on a crystal bonding machine. Background Art

[0002] A die bonder, also known as a die loading machine, wafer pasting machine or chip bonding machine, is a key device in the semiconductor back-end packaging process. It is an automated production equipment that uses vision-guided technology to automatically pick up chips from the wafer and bond (a wire bonding method in the chip production process) them to the lead frame.

[0003] The carrier for chips is called a wafer, and multiple wafers can be stacked using a card. In practice, wafers must be manually pushed into the wafer expansion mechanism for expansion. Once expansion is complete, the wafers must be manually removed from the expansion mechanism and returned to the card. This manual operation not only increases labor costs but also reduces overall production efficiency. Summary of the Invention

[0004] The purpose of the utility model is to provide a wafer clamping device used in an automatic wafer changing system on a crystal bonding machine, which can effectively clamp and pull out the wafer in the jam and return the used wafer to the jam again, so as to realize automatic wafer picking and placing and material jam detection during the picking and placing process.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a wafer clamping device used in an automatic wafer changing system on a crystal bonding machine, which is arranged between a jammer and a film expanding mechanism, and comprises a main support plate and a clamping module; the clamping module comprises a base; one side of the base is slidably connected with a pulling material anti-jamming component, one side of the pulling material anti-jamming component is provided with a pulling material detection piece, and one side of the upper surface of the base is fixed with a pulling material anti-jamming detector adapted to the pulling material detection piece; the pulling material anti-jamming component is fixed to one end of the main support plate through a transition connecting plate, and one side of the main support plate is fixed with an optical fiber amplifier; the lower surface of the base is slidably connected with a pushing material anti-jamming component, one side of the pushing material anti-jamming component is provided with a pushing material detection piece, and the other side of the top of the base is fixed with a pushing material anti-jamming detector adapted to the pushing material detection piece; the lower surface of the pushing material anti-jamming component is fixed with a clamping assembly, one side of the clamping assembly is installed with a detection optical fiber, and one end of the detection optical fiber is connected to the optical fiber amplifier.

[0006] Preferably, the clamping jaw assembly includes a front base and a rear base fixed at both ends of the lower surface of the pusher and anti-jamming assembly, the front base is hinged with a clamping jaw, the clamping jaw and the front base form a clamping portion, one end of the clamping jaw is provided with a clamping jaw swing arm extending to the rear base, a micro cylinder is fixed on the rear base, and the push rod of the micro cylinder overlaps the lower surface of the clamping jaw swing arm.

[0007] Preferably, the lower surface of the clamping jaw and the upper surface of the front base are both provided with opposite cylindrical grooves, and a spring three is abutted between the two cylindrical grooves.

[0008] Preferably, a clamping jaw clamping detector adapted to the end of the clamping jaw swing arm is installed at one end of the rear base.

[0009] Preferably, a limiting pin facing the clamping jaw swing arm is provided at the bottom of the pusher anti-jamming assembly.

[0010] Preferably, a detection hole is provided on one side of the front base, the detection hole is located in the clamping portion, and the end of the detection optical fiber is mounted to the detection hole.

[0011] Preferably, the material pulling anti-jamming assembly includes a guide shaft and a material pulling base, the transition connecting plate is fixed to the material pulling base, the material pulling base is installed on one side of the base through a sliding assembly, and a side plate is provided at one end of the base. The guide shaft passes through the side plate and is fixed to one end of the material pulling base, a spring is sleeved on the guide shaft, and the spring is abutted between the side plate and the material pulling base, and the material pulling detection piece is fixed on one side of the material pulling base.

[0012] Preferably, the pushing and anti-jamming assembly includes a pushing base and a second guide shaft. The pushing base is installed on the lower surface of the base through a second sliding assembly. A vertical plate is provided at one end of the pushing base. The second guide shaft passes through the vertical plate and is fixed to one end of the base. A second spring is sleeved on the second guide shaft. The second spring abuts between the base and the vertical plate. The pushing detection piece is fixed on one side of the pushing base. The clamping jaw assembly is fixed on the lower surface of the pushing base.

[0013] After adopting the above technical solution, the beneficial effects of the utility model are:

[0014] The utility model utilizes a micro-cylinder plus a lever to effectively clamp the wafer, and utilizes a pulling anti-jamming component and a pushing anti-jamming component to realize material jam detection during the pulling and pushing processes, thereby greatly improving the effectiveness of automatic wafer picking and placing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 Schematic diagram of the structure of the gripper module;

[0018] Figure 3 This is a schematic diagram of the disassembly of the gripper module;

[0019] Figure 4 This is a structural diagram of the material pulling and anti-jamming component;

[0020] Figure 5 This is a structural diagram of the pusher anti-jamming component;

[0021] Figure 6 Schematic diagram of the structure of the clamping jaw assembly;

[0022] Figure 7 Schematic diagram of the structure of the gripper;

[0023] Figure 8 This is a schematic diagram of the installation of the present utility model.

[0024] Figure markings: 1-main support plate, 2-optical fiber amplifier, 3-transition connection plate, 4-clamping jaw module, 5-base, 6-material pulling anti-jamming detector, 7-material pushing anti-jamming detector, 8-detection optical fiber, 9-material pulling anti-jamming assembly, 10-clamping jaw assembly, 11-material pushing anti-jamming assembly, 12-clamping jaw clamping detector, 13-clamping jaw swing arm, 14-clamping jaw, 15-front base, 16-micro cylinder, 17-rear base, 18-side plate, 19-guide shaft one, 20-spring one, 21-material pulling detection piece, 22-material pulling base, 23-sliding assembly one, 24-material pushing base, 25-material pushing detection piece, 26-spring two, 27-guide shaft two, 28-sliding assembly two, 29-limiting pin, 30-cylindrical groove, 31-detection hole, 32-plug, 33-film expansion mechanism. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the present invention.

[0026] The directional terms used in the following description refer to the directions shown in the drawings and do not limit the specific structure of this utility model. It should also be noted that, in the description of this utility model, unless otherwise specified or limited, the terms "installation" and "connection" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections or indirect connections. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0027] As attached Figure 1-8 As shown, an embodiment of the present invention provides a wafer clamping device for use in an automatic wafer changing system on a die bonder. The device is disposed between a stopper 32 and a film expansion mechanism 33 and includes a main support plate 1 and a clamping module 4. The clamping module 4 includes a base 5, a material pulling and anti-jamming assembly 9 being slidably connected to one side of the base 5, a material pushing and anti-jamming assembly 11 being slidably connected to the lower surface of the base 5, and a clamping assembly 10 being fixed to the lower surface of the material pushing and anti-jamming assembly 11.

[0028] The material pulling anti-jamming assembly 9 includes a guide shaft 19 and a material pulling base 22. The material pulling base 22 is fixed to one end of the main support plate 1 via a transition connecting plate 3. The material pulling base 22 is mounted on one side of the base 5 via a sliding assembly 23 (such as a guide rail slider). One end of the base 5 is provided with a side plate 18. The guide shaft 19 passes through the side plate 18 and is fixed to one end of the material pulling base 22. A spring 20 is sleeved on the guide shaft 19, and the spring 20 abuts between the side plate 18 and the material pulling base 22. Two sets of guide shafts 19 are provided, which improves stability while ensuring that the spring 20 can evenly apply resistance to the material pulling base 22. A material pulling detection plate 21 is fixed to one side of the material pulling base 22, and a material pulling anti-jamming detector 6 that adapts to the material pulling detection plate 21 is fixed to one side of the upper surface of the base 5. A blocking plate 1 (not shown) is provided at the end of the base 5 away from the side plate 18 to limit the displacement of the material pulling base 22.

[0029] Driven by an external drive device (not shown), the main support plate 1 drives the clamping jaw module 4 to move back and forth between the plug 32 and the film expansion mechanism 33. The clamping jaw assembly 10 clamps the wafer and pulls it out of the plug 32. Once an abnormality such as material jamming occurs during the pulling process, as the drive device continues to move, when the pulling force is greater than the elastic force of spring 1 20, the material pulling base 22 moves along the sliding assembly 1 23 to approach the side plate 18, the spring 1 20 is compressed, and the material pulling detection piece 21 moves with the material pulling base 22 until it is detected by the material pulling anti-jamming detector 6. At this time, the material pulling anti-jamming detector 6 triggers a stop signal, and the entire machine is shut down for protection.

[0030] The pusher anti-jamming assembly 11 includes a pusher base 24 and a second guide shaft 27. The pusher base 24 is mounted on the lower surface of the base 5 via a second sliding assembly 28 (such as a guide rail slider), and the clamping jaw assembly 10 is fixed to the lower surface of the pusher base 24. A vertical plate is provided at one end of the pusher base 24, and the second guide shaft 27 passes through the vertical plate and is fixed to one end of the base 5. A second spring 26 is sleeved on the second guide shaft 27, and the second spring 26 abuts between the base 5 and the vertical plate. There are also two sets of second guide shafts 27, which improve stability while ensuring that the second spring 26 can evenly apply resistance to the pusher base 24. A pusher detection piece 25 is fixed to one side of the pusher base 24, and a pusher anti-jamming detector 7 adapted to the pusher detection piece 25 is fixed to the other side of the top of the base 5. A second blocking piece (not shown) is provided at the end of the base 5 away from the vertical plate to limit the displacement of the pusher base 24.

[0031] Driven by the external drive device, the clamping jaw assembly 10 clamps the wafer and removes it from the film expansion mechanism 33, and then pushes back the plug 32. If an abnormality such as material jamming occurs during the pushing process, as the drive device continues to move, when the thrust is greater than the elastic force of the second spring 26, the base 5 as a whole moves along the second sliding assembly 28 to approach the vertical plate, the second spring 26 is compressed, and the push material anti-jamming detector 7 moves with the base 5 until the push material detection plate 2 is detected. At this time, the push material anti-jamming detector 7 triggers a stop signal, and the entire machine is shut down for protection.

[0032] The clamping jaw assembly 10 includes a front base 15 and a rear base 17 fixed at both ends of the lower surface of the pusher base 24. The front base 15 is hinged with a clamping jaw 14, and the clamping jaw 14 and the front base 15 form a clamping portion. One end of the clamping jaw 14 is provided with a clamping jaw swing arm 13 extending to the rear base 17. A micro cylinder 16 is fixed to the rear base 17, and the push rod of the micro cylinder 16 overlaps the lower surface of the clamping jaw swing arm 13. The lower surface of the clamping jaw 14 and the upper surface of the front base 15 are both provided with relative cylindrical grooves 30, and a spring 3 is abutted between the two cylindrical grooves 30. A clamping jaw clamping detector 12 adapted to the end of the clamping jaw swing arm 13 is installed at one end of the rear base 17, and a limit pin 29 facing the clamping jaw swing arm 13 is provided at the bottom of the pusher anti-jamming assembly 11. A detection hole 31 is provided on one side of the front base 15, and the detection hole 31 is located in the clamping portion. A fiber optic amplifier 2 is fixed to one side of the main support plate 1 . One end of the fiber optic amplifier 2 is connected to a detection optical fiber 8 . The end of the detection optical fiber 8 is installed in the detection hole 31 .

[0033] When the gripper module 4 reaches the clamping position as a whole, the detection optical fiber 8 is used to detect whether there is a wafer at the current position. When it is determined that a wafer exists, the micro cylinder 16 lifts the gripper arm 13. During this process, the limit pin 29 limits the upper limit of the gripper arm 13. Using the lever principle, as the gripper arm 13 is lifted, the gripper 14 is brought close to the front base 15, thereby completing the wafer clamping. The gripper clamping detector 12 provides an in-position signal to the end of the gripper arm 13. After detecting the gripper arm 13, the micro cylinder 16 stops rising. The lever principle of the gripper 14 can amplify the clamping force of the micro cylinder 16 to ensure sufficient clamping force when clamping the wafer.

[0034] While the embodiments described above are based on the present invention, these embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Clearly, many modifications and variations are possible based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications and uses. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer clamping device used in an automatic wafer changing system on a crystal bonding machine, which is arranged between a plug (32) and a film expansion mechanism (33), and includes a main support plate (1) and a clamping module (4); characterized in that: The clamping claw module (4) includes a base (5); a material pulling anti-jamming component (9) is slidably connected to one side of the base (5); a material pulling anti-jamming component (9) is provided with a material pulling detection piece (21) on one side of the base (5); a material pulling anti-jamming detector (6) adapted to the material pulling detection piece (21) is fixed on one side of the upper surface of the base (5); the material pulling anti-jamming component (9) is fixed to one end of the main support plate (1) through a transition connecting plate (3); an optical fiber amplifier (2) is fixed to one side of the main support plate (1); The lower surface of the base (5) is slidably connected to a material pushing and anti-jamming component (11), one side of the material pushing and anti-jamming component (11) is provided with a material pushing detection piece (25), and the other side of the top of the base (5) is fixed with a material pushing and anti-jamming detector (7) adapted to the material pushing detection piece (25); the lower surface of the material pushing and anti-jamming component (11) is fixed with a clamping claw component (10), one side of the clamping claw component (10) is installed with a detection optical fiber (8), and one end of the detection optical fiber (8) is connected to the optical fiber amplifier (2).

2. The wafer clamping device according to claim 1, wherein: The clamping jaw assembly (10) includes a front base (15) and a rear base (17) fixed at both ends of the lower surface of the pusher anti-jamming assembly (11); a clamping jaw (14) is hinged on the front base (15); the clamping jaw (14) and the front base (15) form a clamping portion; one end of the clamping jaw (14) is provided with a clamping jaw swing arm (13) extending to the rear base (17); a micro cylinder (16) is fixed on the rear base (17); a push rod of the micro cylinder (16) overlaps the lower surface of the clamping jaw swing arm (13).

3. The wafer clamping device according to claim 2, wherein: The lower surface of the clamping jaw (14) and the upper surface of the front base (15) are both provided with opposite cylindrical grooves (30), and a spring three is abutted between the two cylindrical grooves (30).

4. The wafer clamping device according to claim 2 or 3, wherein: A clamping jaw detector (12) adapted to the end of the clamping jaw swing arm (13) is mounted on one end of the rear base (17).

5. The wafer clamping device according to claim 4, wherein: The bottom of the material pushing and anti-jamming component (11) is provided with a limiting pin (29) facing the clamping jaw swing arm (13).

6. The wafer clamping device according to claim 2, wherein: A detection hole (31) is provided on one side of the front base (15), the detection hole (31) is located at the clamping portion, and the end of the detection optical fiber (8) is mounted to the detection hole (31).

7. The wafer clamping device according to claim 1, wherein: The material pulling anti-jamming component (9) includes a guide shaft (19) and a material pulling base (22), the transition connecting plate (3) is fixed to the material pulling base (22), the material pulling base (22) is installed on one side of the base (5) through a sliding component (23), one end of the base (5) is provided with a side plate (18), the guide shaft (19) passes through the side plate (18) and is fixed to one end of the material pulling base (22), the guide shaft (19) is sleeved with a spring (20), the spring (20) is abutted between the side plate (18) and the material pulling base (22), and the material pulling detection piece (21) is fixed on one side of the material pulling base (22).

8. The wafer clamping device according to claim 1, wherein: The push material anti-jamming component (11) includes a push material base (24) and a second guide shaft (27). The push material base (24) is installed on the lower surface of the base (5) through a second sliding component (28). A vertical plate is provided at one end of the push material base (24). The second guide shaft (27) passes through the vertical plate and is fixed to one end of the base (5). A second spring (26) is sleeved on the second guide shaft (27). The second spring (26) is in contact between the base (5) and the vertical plate. The push material detection piece (25) is fixed on one side of the push material base (24). The clamping claw component (10) is fixed on the lower surface of the push material base (24).

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