High-power water-cooling SVG power device

By reasonably arranging power modules and energy storage capacitors in the SVG power device, the problem of large size and high cost is solved, and high power density and cost-saving effects are achieved.

CN223297359UActive Publication Date: 2025-09-02GUANGDONG MINGYANG LONGYUAN POWER ELECTRONICS
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Patent Information

Application Number
CN202422321376.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-23
Publication Date
2025-09-02
Estimated Expiration
2034-09-23

AI Technical Summary

Technical Problem

The existing SVG power devices are large in size and high in cost, mainly due to the unreasonable space configuration of power modules and energy storage capacitors, which requires more space and higher costs.

Method used

Two power modules are arranged reasonably in the case, respectively, and are arranged on two sides of the water-cooled assembly. The energy storage capacitors are located in the storage space below and behind the water-cooled assembly, and are connected through the busbar assembly to make full use of the space to achieve a compact structural design.

Benefits of technology

It improves power density, saves cost, meets operating requirements, and realizes a compact SVG power device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a high-power water-cooling SVG power device, which comprises a shell, a water-cooling assembly and two power modules, each power module comprises a power assembly and a capacitor module connected with the direct current end of the power assembly, the capacitor module comprises a plurality of first capacitors and a plurality of second capacitors, and the first capacitors are connected with the second capacitors. The plurality of first capacitors and the plurality of second capacitors are connected in parallel, one power assembly is arranged on a first side surface of the water cooling assembly, and the other power assembly is arranged on a second side surface of the water cooling assembly. A first storage space is arranged below the water cooling assembly in the shell, a second storage space is arranged behind the water cooling assembly, the multiple first capacitors are arranged side by side and located in the first storage space, and the multiple second capacitors are arranged side by side and located in the second storage space. Internal elements are reasonably arranged, the operation requirement is met, the structure is compact, and the manufacturing cost is saved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, in particular to a high-power water-cooled SVG power device. Background Art

[0002] With the rapid development of renewable energy, SVG power devices (static var generators) have been widely used in the wind power and photovoltaic fields in recent years. Currently, SVG power devices on the market have gradually adopted a structure with two power modules connected in series, which can increase power density and reduce system costs. Previously, SVG power devices required separate control circuit boards and water-cooled heat sinks for each power module. In addition, some SVG power devices are used in high-capacity and high-current scenarios, requiring a large number of energy storage capacitors to be connected to the DC terminals of the power modules. Previously, energy storage capacitors were arranged along the length of the housing and below the water-cooled heat sink. This resulted in more space within the SVG power device to accommodate various components, making the SVG power device larger and more expensive. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a high-power water-cooled SVG power device with a rational arrangement of internal components to meet operational requirements, a compact structure, full space utilization, and cost savings.

[0004] According to the first aspect of the present invention, a high-power water-cooled SVG power device includes: a shell; a water-cooling component arranged in the shell; two power modules, each of the power modules includes a power component and a capacitor module connected to the DC end of the power component, the capacitor module includes multiple first capacitors and multiple second capacitors, and the multiple first capacitors and multiple second capacitors are connected in parallel. One of the power components is arranged on the first side of the water-cooling component, and the other power component is arranged on the second side of the water-cooling component. The shell has a first storage space below the water-cooling component and a second storage space behind the water-cooling component. The multiple first capacitors are arranged side by side and located in the first storage space, and the multiple second capacitors are arranged side by side and located in the second storage space.

[0005] A high-power water-cooled SVG power device according to an embodiment of the present invention has at least the following beneficial effects:

[0006] The utility model discloses a high-power water-cooled SVG power device, in which two power modules are arranged in a housing, thereby improving power density. The two power components are respectively arranged on two sides of the water-cooling component, and can both exchange heat with the water-cooling component to achieve the purpose of heat dissipation. The first capacitor and the second capacitor connected to the DC end of the power component are placed side by side in a first storage space located below the water-cooling component, while the second capacitor is placed side by side in a second storage space located behind the water-cooling component. This design fully utilizes space, rationally arranges internal components, meets operational requirements, has a compact structure, and saves costs.

[0007] According to some embodiments of the present invention, the power component is connected to multiple first capacitors and multiple second capacitors respectively through a busbar component, and the busbar component includes a main busbar arranged along the length direction of the shell and at least one branch busbar, the branch busbar is vertically arranged and connected to the main busbar, the first capacitor is connected to the main busbar, and the second capacitor is connected to the branch busbar.

[0008] According to some embodiments of the present invention, the first capacitor is in the shape of a long strip, the first capacitor is placed vertically in the shell, and at least some of the first capacitors are distributed side by side along the length direction of the shell, the connection end of the first capacitor is located at the top of the first capacitor, and the connection end of the first capacitor is connected to the main busbar.

[0009] According to some embodiments of the present invention, the second capacitor is in the shape of a long strip, the second capacitor is placed horizontally in the shell, and at least part of the plurality of second capacitors are distributed side by side along the height direction of the shell to form at least one column of capacitor groups, and the connection end of the second capacitor is connected to the branch busbar.

[0010] According to some embodiments of the present invention, there are two capacitor groups and two branch busbars, the two branch busbars are located between the two capacitor groups, the connection ends of the second capacitors in the capacitor groups on both sides of the two branch busbars are facing each other, and the connection ends of the second capacitors in the capacitor groups on one side are both connected to one of the branch busbars, and the connection ends of the second capacitors in the capacitor groups on the other side are both connected to the other branch busbar.

[0011] According to some embodiments of the present invention, the high-power water-cooled SVG power device further includes a control drive circuit board, which is disposed on top of the water-cooling assembly and is electrically connected to the two power modules respectively.

[0012] According to some embodiments of the present invention, the housing is provided with an AC connection terminal group, the AC terminals of the two power components are connected in series to form a series port, and the series port is connected to the AC connection terminal group.

[0013] According to some embodiments of the present invention, the housing is provided with a bypass switch component, and the bypass switch component is connected in parallel with the AC connection terminal group.

[0014] According to some embodiments of the present invention, a bypass driving circuit board is further provided in the housing, and the bypass driving circuit board is connected to the bypass switch element to control the on and off of the bypass switch element.

[0015] According to some embodiments of the present invention, the power module includes a first semiconductor switching tube, a second semiconductor switching tube, a third semiconductor switching tube and a fourth semiconductor switching tube, the input end of the first switching tube and the input end of the second switching tube form one pole of the DC end of the power component, the output end of the first switching tube is connected to the input end of the third switching tube to form the first phase of the AC end of the power component, the output end of the second switching tube is connected to the input end of the fourth switching tube to form the second phase of the AC end of the power component, and the output end of the third switching tube is respectively connected to the output end of the fourth switching tube to form the other pole of the DC end of the power component.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 A perspective schematic diagram of one embodiment of a water-cooled SVG power device according to the present invention;

[0019] Figure 2 A perspective diagram of one embodiment of the water-cooled SVG power device of the present invention from a second perspective;

[0020] Figure 3 This is a left side view of one embodiment of the water-cooled SVG power device of the present invention;

[0021] Figure 4 This is a right side view of one embodiment of the water-cooled SVG power device of the present invention;

[0022] Figure 5This is a front view of one embodiment of the water-cooled SVG power device of the present invention;

[0023] Figure 6 This is a schematic structural diagram of one embodiment of a capacitor module;

[0024] Figure 7 A circuit diagram of one embodiment of a power module.

[0025] Reference numerals:

[0026] Shell 100; first storage space 110; second storage space 120; water cooling assembly 200; power module 300; power assembly 310; capacitor module 320; first capacitor 321; second capacitor 322; capacitor group 323; busbar assembly 400; main busbar 410; branch busbar 420; control drive circuit board 500; bypass drive circuit board 600; bypass switch 700; AC connection terminal group 800. DETAILED DESCRIPTION

[0027] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientations or positional relationships indicated by terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", and "outside", are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0029] In the description of this utility model, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0030] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] like Figure 1 - Figure 7 As shown, according to the first embodiment of the present invention, a high-power water-cooled SVG power device includes a housing 100, a water-cooling assembly 200, and two power modules 300. The power module 300 and the water-cooling assembly 200 are both arranged in the housing 100. Each of the power modules 300 includes a power component 310 and a capacitor module 320 connected to the DC end of the power component 310. The capacitor module 320 includes a plurality of first capacitors 321 and a plurality of second capacitors 322. The plurality of first capacitors 321 and the plurality of second capacitors 322 are connected to the DC end of the power component 310. The capacitors 322 are connected in parallel, one of the power components 310 is arranged on the first side of the water cooling component 200, and the other power component 310 is arranged on the second side of the water cooling component 200. The shell 100 has a first storage space 110 below the water cooling component 200 and a second storage space 120 behind the water cooling component 200. A plurality of the first capacitors 321 are arranged side by side and are located in the first storage space 110, and a plurality of the second capacitors 322 are arranged side by side and are located in the second storage space 120.

[0032] Among them, the shell 100 can be formed by enclosing multiple sheet metal parts, specifically, it can be enclosed in a rectangular shape, a horizontally placed cylinder, etc. An AC connection terminal group 800 is provided at the front end of the shell 100, and the water cooling component 200 and the power component 310 are placed at the front end of the shell 100. A water flow channel is provided in the water cooling component 200, and the water cooling component 200 is provided with a water inlet and a water outlet connected to the water flow channel. The water inlet and the water outlet of the water cooling component 200 can also be located at the front end of the shell 100 to facilitate connection to an external water cooling source. The water cooling source outputs a cooler water flow to the water inlet. The water flow flows in the water flow channel and exchanges heat with the power component 310 through the water cooling component 200, and then the water flow carries heat out from the water outlet.

[0033] In some embodiments of the present invention, the AC ends of two power components 310 are connected in series to form a series port, and the series port is connected to the AC connection terminal group 800 .

[0034] Specifically, if Figure 7As shown, the power module 300 includes a first semiconductor switch tube Q1, a second semiconductor switch tube Q2, a third semiconductor switch tube Q3 and a fourth semiconductor switch tube Q4. The input end of the first switch tube Q1 and the input end of the second switch tube Q2 form one pole of the DC end of the power component 310. The output end of the first switch tube Q1 is connected to the input end of the third switch tube Q3 to form a first phase of the AC end of the power component 310. The output end of the second switch tube Q2 is connected to the input end of the fourth switch tube Q4 to form a second phase of the AC end of the power component 310. The output end of the third switch tube Q3 and the output end of the fourth switch tube Q4 respectively form the other pole of the DC end of the power component 310.

[0035] In the two power components 310, the second phase of the AC end of one power component 310 is connected to the first phase of the AC end of the other power component 310, and the first phase of the AC end of one power component 310 and the second phase of the AC end of the other power component 310 form a series port.

[0036] The high-power water-cooled SVG power device of the present invention has two power modules 300 disposed within a housing 100, thereby improving power density. Two power components 310 are disposed on opposite sides of the water-cooling assembly 200, each capable of exchanging heat with the water-cooling assembly 200 to achieve heat dissipation. A first capacitor 321 and a second capacitor 322 connected to the DC terminal of the power components 310 are placed side by side in a first storage space 110 below the water-cooling assembly 200, while the second capacitor 322 is placed side by side in a second storage space 120 behind the water-cooling assembly 200. This design fully utilizes space, rationally arranges internal components, meets operational requirements, has a compact structure, and saves costs.

[0037] In some embodiments of the present invention, Figure 1 - Figure 4 、 Figure 6 As shown, the power component 310 is connected to multiple first capacitors 321 and multiple second capacitors 322 respectively through the busbar component 400. The busbar component 400 includes a main busbar 410 arranged along the length direction of the shell 100 and at least one branch busbar 420. The branch busbar 420 is vertically arranged and connected to the main busbar 410. The first capacitor 321 is connected to the main busbar 410, and the second capacitor 322 is connected to the branch busbar 420.

[0038] The busbar assembly 400 is located between the water cooling assembly 200 and the first capacitor 321 below. The DC end of the power assembly 310 is located below the power assembly 310 to facilitate connection with the main busbar 410. The main busbar 410 is arranged along the length direction of the shell 100. The upper part of the front end of the main busbar 410 is connected to the power assembly 310, and the upper part of the rear end of the main busbar 410 is connected to the branch busbar 420. The lower part of the entire section of the main busbar 410 can be used to connect to each arranged first capacitor 321.

[0039] In some embodiments of the present invention, the first capacitor 321 is in the shape of a long strip, and the first capacitor 321 is placed vertically in the shell 100, and at least some of the first capacitors 321 are distributed side by side along the length direction of the shell 100. The connection end of the first capacitor 321 is located at the top of the first capacitor 321, and the connection end of the first capacitor 321 is connected to the main busbar 410.

[0040] Each first capacitor 321 is placed vertically to facilitate connection of the connection end of the first capacitor 321 to the main busbar 410 above, and then each first capacitor 321 is arranged in at least one row along the length direction of the shell 100 to fully utilize the first storage space 110.

[0041] In some embodiments of the present invention, the second capacitor 322 is in the shape of a long strip, the second capacitor 322 is placed horizontally in the shell 100, and at least part of the plurality of second capacitors 322 are distributed side by side along the height direction of the shell 100 to form at least one column of capacitor groups 323, and the connection end of the second capacitor 322 is connected to the branch busbar 420.

[0042] The branch busbar 420 is placed vertically and the second capacitor 322 is placed horizontally so that the connection end of the second capacitor 322 can be connected to the branch busbar. Multiple second capacitors 322 are distributed side by side along the height direction of the shell 100, so that the second storage space 120 can be fully utilized.

[0043] In some embodiments of the present invention, there are two capacitor groups 323 and two branch busbars 420. The two branch busbars 420 are located between the two capacitor groups 323. The connection ends of the second capacitors 322 in the capacitor groups 323 on both sides of the two branch busbars 420 are facing each other, and the connection ends of the second capacitors 322 in the capacitor groups 323 on one side are both connected to one of the branch busbars, and the connection ends of the second capacitors 322 in the capacitor groups 323 on the other side are both connected to the other branch busbar.

[0044] The two branch busbars 420 are both located between the second capacitors 322 on both sides, which is convenient for user maintenance and assembly. Only one installation space needs to be reserved to assemble and repair the two capacitor groups 323, further saving space.

[0045] In some embodiments of the present invention, the high-power water-cooled SVG power device further includes a control drive circuit board 500 , which is disposed on top of the water-cooling assembly 200 and electrically connected to the two power modules 300 .

[0046] A controller for controlling the operation of the power module 300 is provided on the control drive circuit board 500. The controller may include an MCU or a CPU and its associated circuits. The control drive circuit board 500 is located on the top of the water cooling component 200. The control drive circuit board 500 utilizes contact with the top of the water cooling component 200 to achieve heat dissipation and make full use of the space.

[0047] In some embodiments of the present invention, Figure 5 As shown, the housing 100 is provided with a bypass switch 700 , and the bypass switch 700 is connected in parallel with the AC connection terminal group 800 .

[0048] In some embodiments of the present invention, a bypass driving circuit board 600 is further provided in the housing 100 . The bypass driving circuit board 600 is connected to the bypass switch 700 to control the on and off of the bypass switch 700 .

[0049] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A high-power water-cooled SVG power device, characterized in that: include: case; a water cooling assembly, disposed in the housing; Two power modules, each of the power modules includes a power component and a capacitor module connected to the DC end of the power component, the capacitor module includes multiple first capacitors and multiple second capacitors, multiple first capacitors and multiple second capacitors are connected in parallel, one of the power components is arranged on the first side of the water-cooling component, and the other power component is arranged on the second side of the water-cooling component, the shell has a first storage space below the water-cooling component and a second storage space behind the water-cooling component, multiple first capacitors are arranged side by side and located in the first storage space, and multiple second capacitors are arranged side by side and located in the second storage space.

2. The high-power water-cooled SVG power device according to claim 1, characterized in that: The power component is connected to multiple first capacitors and multiple second capacitors respectively through a busbar component. The busbar component includes a main busbar and at least one branch busbar arranged along the length direction of the shell. The branch busbar is vertically arranged and connected to the main busbar. The first capacitor is connected to the main busbar, and the second capacitor is connected to the branch busbar.

3. The high-power water-cooled SVG power device according to claim 2, characterized in that: The first capacitor is in the shape of a long strip and is placed vertically in the shell. At least some of the first capacitors are distributed side by side along the length direction of the shell. The connection end of the first capacitor is located at the top of the first capacitor and is connected to the main busbar.

4. The high-power water-cooled SVG power device according to claim 2, characterized in that: The second capacitor is in the shape of a long strip and is placed horizontally in the shell. At least part of the second capacitors are distributed side by side along the height direction of the shell to form at least one column of capacitor groups. The connection end of the second capacitor is connected to the branch busbar.

5. The high-power water-cooled SVG power device according to claim 4, characterized in that: There are two capacitor groups and two branch busbars. The two branch busbars are located between the two capacitor groups. The connection ends of the second capacitors in the capacitor groups on both sides of the two branch busbars face each other, and the connection ends of the second capacitors in the capacitor groups on one side are both connected to one of the branch busbars, and the connection ends of the second capacitors in the capacitor groups on the other side are both connected to the other branch busbar.

6. A high-power water-cooled SVG power device according to claim 1, characterized in that: It also includes a control drive circuit board, which is arranged on the top of the water cooling component and is electrically connected to the two power modules respectively.

7. The high-power water-cooled SVG power device according to claim 1, characterized in that: The housing is provided with an AC connection terminal group. The AC terminals of the two power components are connected in series to form a series port. The series port is connected to the AC connection terminal group.

8. The high-power water-cooled SVG power device according to claim 7, characterized in that: The housing is provided with a bypass switch component, and the bypass switch component is connected in parallel with the AC connection terminal group.

9. The high-power water-cooled SVG power device according to claim 8, characterized in that: A bypass driving circuit board is also provided in the housing, and the bypass driving circuit board is connected to the bypass switch element to control the on and off of the bypass switch element.

10. The high-power water-cooled SVG power device according to claim 1, characterized in that: The power module includes a first semiconductor switching tube, a second semiconductor switching tube, a third semiconductor switching tube and a fourth semiconductor switching tube. The input end of the first switching tube and the input end of the second switching tube form one pole of the DC end of the power component. The output end of the first switching tube is connected to the input end of the third switching tube to form the first phase of the AC end of the power component. The output end of the second switching tube is connected to the input end of the fourth switching tube to form the second phase of the AC end of the power component. The output end of the third switching tube is respectively connected to the output end of the fourth switching tube to form the other pole of the DC end of the power component.