MOCVD heater thermal insulation assembly

By using MOCVD heater insulation components made of boron nitride material, the problems of difficult processing, high scrap rate and high replacement cost in the prior art are solved, and convenient replacement and efficient insulation effects are achieved.

CN223297718UActive Publication Date: 2025-09-02JIANGSU SHIWEI SEMICON TECH CO LTD
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Patent Information

Application Number
CN202422722720.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-09-02
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

The hardness of the existing MOCVD heater insulation components is high, resulting in high processing difficulty, high scrap rate, and easy to be oxidized, and the replacement cost is high when the overall structure is damaged.

Method used

The insulation components made of multiple boron nitride insulation plates are made of hot press sintered. The insulation plates can be spliced ​​and combined. When damaged, only separate plates need to be replaced, and heat dissipation holes are installed to improve thermal conductivity and oxidation resistance.

Benefits of technology

It reduces the replacement cost of thermal insulation components, improves processing convenience and oxidation resistance, extends the service life of the equipment, reduces heat loss, and improves heat utilization efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a metal organic chemical vapor deposition (MOCVD) heater heat insulation assembly which comprises a heater and a heat insulation assembly and is characterized in that a heating wire is arranged in the heater, the heat insulation assembly comprises a heat insulation assembly body and an assembling assembly, the heat insulation assembly body is attached to the bottom of the heating wire in an attaching mode, and the assembling assembly is arranged on the heat insulation assembly body. The heat insulation assembly body is formed by splicing a plurality of heat insulation plates, and the shape of the heat insulation assembly body is matched with the shape of the heating wire. The heating assembly provided by the utility model is formed by combining a plurality of heat insulation plates, so that the heat insulation assembly is convenient to replace when being damaged, the replacement materials are reduced, and the use cost is saved; meanwhile, the heat insulation plate is formed by hot pressing and sintering a boron nitride material, so that the heat insulation plate is good in chemical stability, can resist erosion of most molten metal and is not easy to oxidize; and the boron nitride material is low in hardness, so that the heat insulation assembly is convenient to process, and meanwhile, the rejection rate during use is reduced.
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Description

Technical Field

[0001] The utility model belongs to the technical field of MOCVD, and in particular relates to a MOCVD heater insulation component. Background Art

[0002] In the production process of semiconductor wafers, a key step is to place the semiconductor wafer on a heater for heating. The MOCVD heater usually uses the substrate to energize the heater to heat the heater. In order to avoid thermal damage to the substrate during the heating process, it is usually necessary to set a layer of thermal insulation between the heater and the charged substrate to prevent heat from being transferred downward to the substrate.

[0003] Existing insulation components have the following problems when used: the high hardness of the material makes processing difficult and has a high scrap rate; the material is easily oxidized and needs to be placed in a nitrogen cabinet when not in use, causing waste; the insulation component is divided into four parts, and the replacement cost is high when damaged.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide an MOCVD heater insulation component, which can solve the problems existing in the use of existing insulation components.

[0006] In order to achieve the above-mentioned purpose, the technical solution provided by a specific embodiment of the present invention is as follows:

[0007] The MOCVD heater insulation assembly includes a heater and an insulation assembly, wherein a heating wire is installed in the heater, and the insulation assembly includes:

[0008] The heat insulation component body is attached to the bottom of the heating wire in a fitting manner, so that a heat insulation layer can be formed at the bottom of the heating wire through the heat insulation component body. The heat insulation component body is formed by splicing a plurality of heat insulation boards, so that when the heat insulation component body is damaged during use, only the corresponding heat insulation board needs to be replaced, avoiding large-scale replacement when the heat insulation component body is damaged, thereby saving materials and further saving the cost of use. At the same time, the splicing method makes it easy to replace the heat insulation board, making it easy to replace the heat insulation component body during use. The shape of the heat insulation component body is matched with the shape of the heating wire, so that the heat insulation layer formed at the bottom of the heating wire has a better heat insulation effect on temperature.

[0009] The assembly component includes assembly holes. When multiple insulation boards are spliced ​​into an insulation component body, multiple assembly holes are formed. The multiple assembly holes enable the insulation component body to fit the bottom of the heating wire. In order to ensure that the insulation component body is completely fitted with the heating wire when installed on the bottom of the heating wire, since other components are provided at the bottom of the heating wire, the assembly holes allow the insulation component body to be installed on the bottom of the heating wire without affecting the installation of the insulation component body due to other components.

[0010] In one or more embodiments of the present invention, the plurality of thermal insulation panels are made of boron nitride material by hot pressing and sintering, achieving high-density and high-strength ceramic products at a lower temperature. Boron nitride products have low hardness and are easy to machine, and have good high-temperature resistance in an inert gas space.

[0011] In one or more embodiments of the present invention, the plurality of thermal insulation boards include a first thermal insulation board, a second thermal insulation board, a third thermal insulation board, a fourth thermal insulation board, a fifth thermal insulation board, a sixth thermal insulation board, a sixth thermal insulation board, a seventh thermal insulation board, an eighth thermal insulation board, a ninth thermal insulation board, a tenth thermal insulation board, an eleventh thermal insulation board, a twelfth thermal insulation board, a thirteenth thermal insulation board, a fourteenth thermal insulation board, a fifteenth thermal insulation board and a sixteenth thermal insulation board.

[0012] In one or more embodiments of the present invention, the second insulation board, the fourth insulation board, the sixth insulation board, the eighth insulation board, the tenth insulation board, the twelfth insulation board, the fourteenth insulation board and the sixteenth insulation board are sequentially spliced ​​together to form the inner circle of the insulation assembly body.

[0013] In one or more embodiments of the present invention, the first insulation board, the third insulation board, the fifth insulation board, the seventh insulation board, the ninth insulation board, the eleventh insulation board, the thirteenth insulation board and the fifteenth insulation board are sequentially spliced ​​together to form the outer ring of the insulation component body.

[0014] In one or more embodiments of the present invention, the inner ring and the outer ring are spliced ​​together to form a heat insulation component body. When the inner ring and the outer ring are spliced ​​together, the first heat insulation board and the second heat insulation board, the third heat insulation board and the fourth heat insulation board, the fifth heat insulation board and the sixth heat insulation board, the seventh heat insulation board and the eighth heat insulation board, the ninth heat insulation board and the tenth heat insulation board, the eleventh heat insulation board and the twelfth heat insulation board, the thirteenth heat insulation board and the fourteenth heat insulation board, and the fifteenth heat insulation board and the sixteenth heat insulation board are spliced ​​together.

[0015] In one or more embodiments of the present invention, the positions of the multiple assembly holes correspond to the positions of the blocking components when the thermal insulation component body is attached to the bottom of the heating wire, so that the thermal insulation component body can be attached to the bottom of the heating wire.

[0016] In one or more embodiments of the present invention, multiple heat-dissipating holes are formed on each of the plurality of heat-insulating plates, and the plurality of heat-dissipating holes are formed in an irregular manner to prevent deformation of the heat-insulating plates when subjected to high temperatures and to improve thermal conductivity of the heat-insulating plates.

[0017] Compared with the prior art, the heating assembly provided by the present invention is composed of multiple insulation boards, which makes it easy to replace the insulation assembly when damaged and reduces the replacement materials, thereby saving the cost of use; at the same time, the insulation board is made of boron nitride material by hot pressing and sintering, which has good chemical stability and can resist the corrosion of most molten metals and is not easily oxidized; and the boron nitride material has low hardness, which makes the insulation assembly easy to process and reduces the scrap rate during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A top view of a MOCVD heater insulation assembly according to an embodiment of the present invention;

[0020] Figure 2 This is a bottom view of the MOCVD heater insulation assembly in one embodiment of the present invention;

[0021] Figure 3 This is a three-dimensional diagram of an MOCVD heater insulation assembly in one embodiment of the present invention.

[0022] Description of main reference numerals:

[0023] 1-heat insulation assembly body, 11-first heat insulation board, 12-second heat insulation board, 13-third heat insulation board, 14-fourth heat insulation board, 15-fifth heat insulation board, 16-sixth heat insulation board, 17-seventh heat insulation board, 18-eighth heat insulation board, 19-ninth heat insulation board, 110-tenth heat insulation board, 111-eleventh heat insulation board, 112-twelfth heat insulation board, 113-thirteenth heat insulation board, 114-fourteenth heat insulation board, 115-fifteenth heat insulation board, 116-sixteenth heat insulation board, 2-assembly assembly, 21-assembly hole, 22-heat dissipation hole. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will be combined with the drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0025] like Figures 1 to 3 As shown, the MOCVD heater insulation assembly in one embodiment of the present invention includes a heater and an insulation assembly. A heating wire is installed in the heater, and the insulation assembly includes an insulation assembly body 1 and an assembly assembly 2.

[0026] Specifically, the heat insulation component body 1 is attached to the bottom of the heating wire in a fitting manner, so that a heat insulation layer can be formed at the bottom of the heating wire through the heat insulation component body 1. The heat insulation component body 1 is spliced ​​together by a plurality of heat insulation boards, so that when the heat insulation component body 1 is damaged during use, only the corresponding heat insulation board needs to be replaced, avoiding large-scale replacement when the heat insulation component body 1 is damaged, thereby saving materials and further saving the cost of use. At the same time, the splicing method makes it easy to replace the heat insulation board, making it easy to replace the heat insulation component body 1 during use. The shape of the heat insulation component body 1 is matched with the shape of the heating wire, so that the heat insulation layer formed at the bottom of the heating wire has a better heat insulation effect on temperature.

[0027] Preferably, multiple insulation boards are made of boron nitride material through hot pressing and sintering, achieving high-density and high-strength ceramic products at a lower temperature. Due to the low hardness of boron nitride products, the insulation boards are easy to machine and have good high-temperature resistance in an inert gas space. Boron nitride makes the insulation boards chemically stable, can resist the corrosion of most molten metals, and are not easily oxidized during use.

[0028] like Figure 2 As shown, the plurality of heat insulation boards include a first heat insulation board 11, a second heat insulation board 12, a third heat insulation board 13, a fourth heat insulation board 14, a fifth heat insulation board 15, a sixth heat insulation board 16, a seventh heat insulation board 17, an eighth heat insulation board 18, a ninth heat insulation board 19, a tenth heat insulation board 110, an eleventh heat insulation board 111, a twelfth heat insulation board 112, a thirteenth heat insulation board 113, a fourteenth heat insulation board 114, a fifteenth heat insulation board 115 and a sixteenth heat insulation board 116.

[0029] like Figure 2As shown, the second insulation board 12 , the fourth insulation board 14 , the sixth insulation board 16 , the eighth insulation board 18 , the tenth insulation board 110 , the twelfth insulation board 112 , the fourteenth insulation board 114 and the sixteenth insulation board 116 are sequentially spliced ​​together to form the inner circle of the insulation assembly body 1 .

[0030] like Figure 2 As shown, the first insulation board 11, the third insulation board 13, the fifth insulation board 15, the seventh insulation board 17, the ninth insulation board 19, the eleventh insulation board 111, the thirteenth insulation board 113 and the fifteenth insulation board 115 are spliced ​​together in sequence to form the outer ring of the insulation component body 1.

[0031] like Figure 2 As shown, the inner ring and the outer ring are spliced ​​together to form the insulation component body 1. When the inner ring and the outer ring are spliced ​​together, the first insulation board 11 and the second insulation board 12, the third insulation board 13 and the fourth insulation board 14, the fifth insulation board 15 and the sixth insulation board 16, the seventh insulation board 17 and the eighth insulation board 18, the ninth insulation board 19 and the tenth insulation board 110, the eleventh insulation board 111 and the twelfth insulation board 112, the thirteenth insulation board 113 and the fourteenth insulation board 114, and the fifteenth insulation board 115 and the sixteenth insulation board 116 are spliced ​​together.

[0032] Preferably, the first insulation board 11, the second insulation board 12, the third insulation board 13, the fourth insulation board 14, the fifth insulation board 15, the sixth insulation board 16, the sixth insulation board 16, the seventh insulation board 17, the eighth insulation board 18, the ninth insulation board 19, the tenth insulation board 110, the eleventh insulation board 111, the twelfth insulation board 112, the thirteenth insulation board 113, the fourteenth insulation board 114, the fifteenth insulation board 115 and the sixteenth insulation board 116 are combined into the insulation component body 1 by splicing, so that the insulation component body 1 can be easily installed at the bottom of the heating wire, so that when some insulation boards in the insulation component body 1 are broken during use, the insulation boards can be easily replaced.

[0033] like Figures 1 to 3 As shown, the assembly component 2 includes an assembly hole 21. When multiple insulation boards are spliced ​​into the insulation component body 1, multiple assembly holes 21 are formed. The multiple assembly holes 21 allow the insulation component body 1 to fit the bottom of the heating wire. In order to ensure that the insulation component body 1 is completely fitted with the heating wire when the bottom of the heating wire is installed, since other components are provided at the bottom of the heating wire, the assembly holes 21 allow the insulation component body 1 to be installed at the bottom of the heating wire without affecting the installation of the insulation component body 1 due to other components.

[0034] Preferably, the positions of the multiple mounting holes 21 correspond to the positions of the blocking member when the insulation assembly body 1 is attached to the bottom of the heating wire, so that the insulation assembly body 1 can be attached to the bottom of the heating wire. Furthermore, since the heating wires in different specifications are arranged differently, the holes 21 are arranged according to the specific arrangement of the heating wires, making 1 suitable for heaters of different specifications, thereby improving the practicality of 1.

[0035] like Figures 1 to 3 As shown, multiple heat-dissipating holes 22 are provided on multiple heat-insulating boards. The multiple heat-dissipating holes 22 are provided in an irregular manner, which can effectively prevent the heat-insulating boards from being deformed when subjected to high temperatures, and at the same time improve the thermal conductivity of the heat-insulating boards.

[0036] When in use, the first insulation board 11, the second insulation board 12, the third insulation board 13, the fourth insulation board 14, the fifth insulation board 15, the sixth insulation board 16, the sixth insulation board 16, the seventh insulation board 17, the eighth insulation board 18, the ninth insulation board 19, the tenth insulation board 110, the eleventh insulation board 111, the twelfth insulation board 112, the thirteenth insulation board 113, the fourteenth insulation board 114, the fifteenth insulation board 115 and the sixteenth insulation board 116 are spliced ​​and combined in sequence to form the insulation assembly body 1 attached to the bottom of the heating wire, thereby preventing the surface temperature of the heater from being too high, reducing the loss of internal parts of the equipment due to overheating, and extending the service life of the equipment; at the same time, insulation can reduce heat loss, so that the heat generated by the heater can be utilized more instead of being dissipated into the surrounding environment, thereby improving the heat utilization efficiency.

[0037] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0038] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An MOCVD heater insulation assembly, comprising a heater and an insulation assembly, characterized in that: A heating wire is installed in the heater, and the thermal insulation component includes: A heat insulation assembly body, which is attached to the bottom of the heating wire in a fitting manner, and is formed by splicing a plurality of heat insulation boards, and the shape of the heat insulation assembly body matches the shape of the heating wire; The assembly component includes assembly holes. When multiple insulation boards are spliced ​​into an insulation component body, multiple assembly holes are formed. The multiple assembly holes enable the insulation component body to fit the bottom of the heating wire.

2. The MOCVD heater insulation assembly according to claim 1, wherein: The plurality of heat insulation plates are all made of boron nitride material by hot pressing and sintering.

3. The MOCVD heater insulation assembly according to claim 2, wherein: The plurality of thermal insulation boards include a first thermal insulation board, a second thermal insulation board, a third thermal insulation board, a fourth thermal insulation board, a fifth thermal insulation board, a sixth thermal insulation board, a sixth thermal insulation board, a seventh thermal insulation board, an eighth thermal insulation board, a ninth thermal insulation board, a tenth thermal insulation board, an eleventh thermal insulation board, a twelfth thermal insulation board, a thirteenth thermal insulation board, a fourteenth thermal insulation board, a fifteenth thermal insulation board, and a sixteenth thermal insulation board.

4. The MOCVD heater insulation assembly according to claim 3, wherein: The second insulation board, the fourth insulation board, the sixth insulation board, the eighth insulation board, the tenth insulation board, the twelfth insulation board, the fourteenth insulation board and the sixteenth insulation board are sequentially spliced ​​together to form the inner circle of the insulation assembly body.

5. The MOCVD heater insulation assembly according to claim 4, wherein: The first insulation board, the third insulation board, the fifth insulation board, the seventh insulation board, the ninth insulation board, the eleventh insulation board, the thirteenth insulation board and the fifteenth insulation board are sequentially spliced ​​together to form the outer ring of the insulation assembly body.

6. The MOCVD heater insulation assembly according to claim 5, wherein: The inner ring and the outer ring are spliced ​​together to form the heat insulation component body. When the inner ring and the outer ring are spliced ​​together, the first heat insulation board and the second heat insulation board, the third heat insulation board and the fourth heat insulation board, the fifth heat insulation board and the sixth heat insulation board, the seventh heat insulation board and the eighth heat insulation board, the ninth heat insulation board and the tenth heat insulation board, the eleventh heat insulation board and the twelfth heat insulation board, the thirteenth heat insulation board and the fourteenth heat insulation board, and the fifteenth heat insulation board and the sixteenth heat insulation board are spliced ​​together.

7. The MOCVD heater insulation assembly according to claim 1, wherein: The positions of the multiple assembly holes correspond to the positions of the blocking components when the heat insulation component body is attached to the bottom of the heating wire.

8. The MOCVD heater insulation assembly according to claim 1, wherein: A plurality of heat dissipation holes are provided on the plurality of heat insulation plates, and the plurality of heat dissipation holes are provided in an irregular manner.