Circuit board beneficial to resistance welding

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board beneficial to resistance welding, which solves the technical problem that redundant welding flux possibly flows to other elements and damages the other elements due to the mobility and surface tension of the welding flux in the welding process of the existing circuit board, and comprises a substrate, one side of the substrate is fixedly connected with a conductive layer, one side of the conductive layer is provided with a solder mask layer, one side of the solder mask layer is provided with a bonding pad, one side of the solder mask layer is provided with a solder mask ring, the inner side of the solder mask ring is provided with a bulge, and the upper surface of the solder mask layer is provided with a groove; the solder mask ring is arranged on the periphery of the bonding pad, the groove is formed between the solder mask ring and the bonding pad, redundant solder can be collected, meanwhile, the solder can be prevented from flowing to other areas, damage to other elements is avoided, and therefore the solder mask performance of the circuit board can be improved, and after welding is completed, the circuit board can be prevented from being damaged. And redundant solder can be cleaned more easily.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board that is advantageous for solder resistance. Background Art

[0002] Circuit boards (PCBs) provide mechanical support and electrical connections for components in various electronic systems. They also carry out signal transmission, signal reception, and power supply for electronic devices, and are often referred to as the "mother of electronic products." The working principle of a PCB is to use the board's insulating material to separate the surface copper foil conductive layer, allowing current to flow through various components along pre-designed routes, completing functions such as power generation, amplification, attenuation, modulation, demodulation, and encoding.

[0003] However, during the soldering process of existing circuit boards, due to the fluidity and surface tension of the solder, some excess solder may flow to the area around the pad. This excess solder may flow onto other components, causing problems such as short circuits and leakage. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a circuit board that is conducive to solder resistance, which can solve the problem that in the welding process of the existing circuit board, due to the fluidity and surface tension of the solder, excess solder may flow onto other components and cause damage to other components. The utility model can effectively collect the excess solder to avoid damage to other components, and at the same time facilitate the cleaning of the excess solder, making the appearance of the circuit board more neat and beautiful.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a circuit board that is conducive to solder resistance, comprising a substrate, a conductive layer fixedly connected to one side of the substrate, a solder resist layer provided on one side of the conductive layer, a solder pad provided on one side of the solder resist layer, a solder resist ring provided on one side of the solder resist layer, and a protrusion provided on the inner side of the solder resist ring;

[0006] A groove is provided on the upper surface of the solder resist layer, the groove is located between the solder resist ring and the pad, and a convex ring is provided above the groove.

[0007] Through the above technical solution, the solder resistance performance of the circuit board can be improved by setting the solder resist ring. The solder resist ring is made of solder resist ink. Using the same solder resist ink as the solder resist layer of the circuit board can ensure the compatibility and consistency of the solder resist ring and the solder resist layer. The solder resist ink has good heat resistance, chemical corrosion resistance and insulation performance, which can ensure that it will not deteriorate or be damaged during the welding process.

[0008] Furthermore, the pad is in a circular structure, the solder resist ring is in a circular ring structure, and the center of the pad and the center of the solder resist ring intersect at a point.

[0009] Through the above technical solution, the circular solder resist ring has a uniform solder resist effect and is easy to process and manufacture. Moreover, since the center of the pad and the center of the solder resist ring intersect at one point, the consistency of the solder resist effect can be ensured.

[0010] Furthermore, the height of the solder resist ring is greater than the height of the pad, and the diameter of the pad is smaller than the inner diameter of the solder resist ring.

[0011] Through the above technical solution, the solder mask ring can be determined according to the layout and space limitations of the circuit board. Under the premise of ensuring the solder mask effect, the outer diameter of the solder mask ring is minimized to save circuit board space, and the diameter of the pad is smaller than the inner diameter of the solder mask ring, which can ensure that the pad has enough space to contact the solder during the soldering process.

[0012] Furthermore, the protrusions are in a sheet-like structure, and the protrusions are distributed at equal angles with respect to the center of the solder resist ring.

[0013] Through the above technical solution, adding some tiny flaky protrusions on the surface of the solder mask ring can increase the friction between the solder and the solder mask ring, prevent the solder from sliding during the soldering process, improve the stability and accuracy of welding, and the specific texture design can increase the surface area of ​​the solder mask ring, which helps to improve the heat dissipation effect.

[0014] Furthermore, the height of the groove is smaller than the height of the solder resist layer.

[0015] Through the above technical solution, the height of the groove is smaller than the height of the solder resist layer, which can help avoid damage to the solder resist layer.

[0016] Furthermore, the groove is in a circular ring structure when viewed from above, the inner diameter of the groove is larger than the diameter of the pad, and the outer diameter of the groove is smaller than the inner diameter of the solder resist ring.

[0017] Through the above technical solution, a groove is provided around the solder mask ring to collect excess solder and prevent the solder from flowing to other areas. After soldering is completed, the excess solder can be cleaned more easily to keep the circuit board tidy.

[0018] Furthermore, the convex ring has a circular ring structure when viewed from above, the inner diameter of the convex ring is equal to the outer diameter of the groove, and the upper surface of the convex ring is an arc-shaped curved surface.

[0019] Through the above technical solution, the convex ring structure can further increase the height of the side of the groove, further preventing the solder from overflowing from the inside of the groove.

[0020] Furthermore, the difference between the inner and outer diameters of the upper surface of the groove is greater than the difference between the inner and outer diameters of the lower surface of the groove, and the front cross-section of the groove presents a conical structure.

[0021] With the above technical solution, since the front cross-section of the groove is a conical structure and the upper dimension of the groove is larger than the lower dimension of the groove, it is convenient to subsequently clean the solder inside the groove with a tool.

[0022] Compared with the prior art, the present invention provides a circuit board that is conducive to solder resistance and has the following beneficial effects:

[0023] In the present invention, a solder resist ring is provided on the periphery of the pad to prevent excess solder from flowing onto other components and causing damage to other components, thereby improving the solder resist performance of the circuit board. A groove is provided between the solder resist ring and the pad. The setting of the groove can not only collect excess solder, but also prevent the solder from flowing to other areas. After the soldering is completed, the excess solder can be cleaned more easily to keep the circuit board tidy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 For the utility model Figure 1 A in the middle is an enlarged structural diagram;

[0026] Figure 3 It is a schematic diagram of the overall cross-sectional structure of the present utility model.

[0027] Among them: 1. substrate; 2. conductive layer; 3. solder mask layer; 4. pad; 5. solder mask ring; 6. protrusion; 7. groove; 8. protruding ring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 3 The utility model provides a technical solution: a circuit board that is conducive to solder resistance, including a substrate 1, a conductive layer 2 is fixedly connected to one side of the substrate 1, a solder resist layer 3 is provided on one side of the conductive layer 2, a solder pad 4 is provided on one side of the solder resist layer 3, a solder resist ring 5 is provided on one side of the solder resist layer 3, and a protrusion 6 is provided on the inner side of the solder resist ring 5.

[0030] It is worth mentioning that the solder resist ring 5 can improve the solder resistance performance of the circuit board. The solder resist ring 5 is made of solder resist ink. Using the same solder resist ink as the solder resist layer 3 of the circuit board can ensure the compatibility and consistency of the solder resist ring 5 and the solder resist layer 3. The solder resist ink has good heat resistance, chemical corrosion resistance and insulation performance, which can ensure that it will not deteriorate or be damaged during the welding process.

[0031] See also Figure 1-Figure 3 The pad 4 is a circular structure, the solder resist ring 5 is a circular ring structure, and the center of the pad 4 and the center of the solder resist ring 5 intersect at one point.

[0032] It should be noted that the circular solder resist ring 5 has a uniform solder resist effect and is easy to process and manufacture. Moreover, since the center of the pad 4 intersects with the center of the solder resist ring 5 at one point, the consistency of the solder resist effect can be ensured.

[0033] See also Figure 1-Figure 3 The height of the solder resist ring 5 is greater than the height of the pad 4 , and the diameter of the pad 4 is smaller than the inner diameter of the solder resist ring 5 .

[0034] It is worth mentioning that the size of the solder resist ring 5 can be determined according to the layout and space limitations of the circuit board. Under the premise of ensuring the solder resist effect, the outer diameter of the solder resist ring 5 should be minimized to save circuit board space, and the inner diameter of the solder resist ring 5 should be 0.1mm-0.3mm larger than the diameter of the pad 4 to ensure that the pad 4 has enough space to contact the solder during the soldering process.

[0035] See also Figure 1-Figure 3 The protrusions 6 are in a sheet-like structure and are distributed at equal angles with respect to the center of the solder resist ring 5 .

[0036] The function of the protrusion 6 is to add some tiny sheet-like protrusions 6 structures on the surface of the solder resist ring 5, which can increase the friction between the solder and the solder resist ring 5, prevent the solder from sliding during the soldering process, and improve the stability and accuracy of the soldering. In addition, the specific texture design can increase the surface area of ​​the solder resist ring 5, which helps to improve the heat dissipation effect.

[0037] See also Figure 1-Figure 3 A groove 7 is provided on the upper surface of the solder resist layer 3, and the groove 7 is located between the solder resist ring 5 and the pad 4. A convex ring 8 is provided above the groove 7. The height of the groove 7 is less than the height of the solder resist layer 3. The groove 7 has a circular ring structure when viewed from above. The inner diameter of the groove 7 is greater than the diameter of the pad 4, and the outer diameter of the groove 7 is smaller than the inner diameter of the solder resist ring 5.

[0038] The function of the groove 7 is to set the groove 7 around the solder resist ring 5 to collect excess solder and prevent the solder from flowing to other areas. After the soldering is completed, the excess solder can be cleaned more easily to keep the circuit board tidy. The groove 7 is tightly surrounded by the inner side of the solder resist ring 5 and maintains a distance of 0.1 mm to 0.2 mm from the solder resist ring 5 to ensure that the solder can smoothly enter the groove 7 during the flow process without affecting the solder resist effect of the solder resist ring 5.

[0039] See also Figure 1-Figure 3 The convex ring 8 is a circular ring structure when viewed from above, the inner diameter of the convex ring 8 is equal to the outer diameter of the groove 7, and the upper surface of the convex ring 8 is an arc-shaped curved surface.

[0040] It is worth mentioning that the convex ring 8 structure can further increase the height of the side of the groove 7 and further prevent the solder from overflowing from the inside of the groove 7.

[0041] See also Figure 1-Figure 3 , the difference between the inner and outer diameters of the upper surface of the groove 7 is greater than the difference between the inner and outer diameters of the lower surface of the groove 7, and the front cross-section of the groove 7 is a tapered structure;

[0042] It should be noted that: since the front cross-section of the groove 7 is a conical structure and the upper dimension of the groove 7 is larger than the lower dimension of the groove 7, it is convenient to align the suction nozzle of the desoldering machine with the solder in the groove 7 after the welding is completed, so as to suck out and clean the solder in the groove 7.

[0043] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board that is conducive to solder resistance, comprising a substrate (1), characterized in that: A conductive layer (2) is fixedly connected to one side of the substrate (1), a solder resist layer (3) is provided on one side of the conductive layer (2), a solder pad (4) is provided on one side of the solder resist layer (3), a solder resist ring (5) is provided on one side of the solder resist layer (3), and a protrusion (6) is provided on the inner side of the solder resist ring (5); A groove (7) is provided on the upper surface of the solder resist layer (3), the groove (7) is located between the solder resist ring (5) and the pad (4), and a convex ring (8) is provided above the groove (7).

2. A circuit board that is conducive to solder resistance according to claim 1, characterized in that: The solder pad (4) has a circular structure, the solder resist ring (5) has a circular ring structure, and the center of the solder pad (4) and the center of the solder resist ring (5) intersect at one point.

3. The circuit board advantageous for solder resist according to claim 1, characterized in that: The height of the solder resist ring (5) is greater than the height of the solder pad (4), and the diameter of the solder pad (4) is smaller than the inner diameter of the solder resist ring (5).

4. The circuit board advantageous for solder resist according to claim 1, characterized in that: The protrusions (6) are in a sheet-like structure, and the protrusions (6) are distributed at equal angles with respect to the center of the solder resist ring (5).

5. The circuit board advantageous for solder resist according to claim 1, characterized in that: The height of the groove (7) is smaller than the height of the solder resist layer (3).

6. The circuit board advantageous for solder resist according to claim 1, characterized in that: The groove (7) is in a circular ring structure when viewed from above, the inner diameter of the groove (7) is larger than the diameter of the pad (4), and the outer diameter of the groove (7) is smaller than the inner diameter of the solder resist ring (5).

7. The circuit board advantageous for solder resist according to claim 1, characterized in that: The convex ring (8) is in a circular ring structure when viewed from above, the inner diameter of the convex ring (8) is equal to the outer diameter of the groove (7), and the upper surface of the convex ring (8) is arranged in an arc-shaped curved surface.

8. The circuit board advantageous for solder resist according to claim 1, characterized in that: The difference between the inner and outer diameters of the upper surface of the groove (7) is greater than the difference between the inner and outer diameters of the lower surface of the groove (7), and the front cross-section of the groove (7) presents a conical structure.

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