PCB Mylar film nail pressing device

Abstract

The utility model discloses a PCB (Printed Circuit Board) Mylar film nail pressing device, which aims to autonomously complete the nail pressing operation, reduce the manual burden, be suitable for different PCBs and have strong flexibility, and comprises a base, a material placing module and a pressing module, the material placing module is used for placing the PCB, the material placing module is detachably fixed on the base, the pressing module is used for pressing the PCB, the material placing module is used for placing the PCB, the pressing module is used for pressing the PCB, and the pressing module is used for pressing the PCB. The pressing module is positioned above the base; the downward pressing module comprises a lifting plate and a driving assembly, the lifting plate is detachably fixed to the output end of the driving assembly, pressing columns corresponding to the plastic rivets are arranged on the lifting plate, and the driving assembly drives the lifting plate to descend so that the pressing columns can press the plastic rivets to the PCB. Belongs to the technical field of circuit board assembly.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board assembly, and more specifically relates to a PCB board Mylar pressing nail device. Background Art

[0002] Currently, for PCB boards containing power supplies, the pins of the power supply part need to be isolated with Mylar sheets, and then fixed with plastic rivets;

[0003] At present, the Mylar sheets are basically arranged manually. After the Mylar sheets are placed on the PCB board, they are fixed to the PCB board using plastic rivets. However, pressing the plastic rivets is quite strenuous. After a long time of operation, the fingers will hurt. In addition, pressing the plastic rivets one by one is also inefficient. Utility Model Content

[0004] The main purpose of the utility model is to provide a PCB board mylar pressing nailing device, which is designed to be able to independently complete the nailing operation, reduce the manual burden, and at the same time be applicable to different PCB boards with strong flexibility.

[0005] According to a first aspect of the present invention, a device for pressing PCB board mylar tabs is provided, comprising a base, a loading module, and a pressing module. The loading module is used to place PCB boards, the loading module is detachably fixed to the base, and the pressing module is located above the base.

[0006] The pressing module includes a lifting plate and a driving assembly. The lifting plate is detachably fixed to the output end of the driving assembly. The lifting plate is provided with a pressure column corresponding to the plastic rivet. The driving assembly drives the lifting plate to descend so that the pressure column presses the plastic rivet onto the PCB board.

[0007] In the above-mentioned PCB board mylar nailing device, the material placement module includes a plate body, and a plurality of positioning blocks are provided on the plate body. The positioning blocks are used to contact the outer edge of the PCB board, and the plurality of positioning blocks cooperate to position the PCB board.

[0008] In the above-mentioned PCB board Mylar sheet pressing nailing device, a plurality of top columns are provided on the board body, and the top columns are used to support the PCB board.

[0009] In the above-mentioned PCB board Mylar nail pressing device, the materials of the board body and the top column are both insulating materials.

[0010] In the above-mentioned PCB board mylar nailing device, the base is provided with a groove for accommodating the board body, the outer contour of the projection of the board body on the horizontal plane is a missing corner rectangle with a missing corner, and the shape of the groove is adapted to the shape of the board body.

[0011] In the above-mentioned PCB board Mylar nail pressing device, a mounting plate is provided at the bottom of the groove, and adsorption holes for adsorbing the board body are provided on the mounting plate, and the adsorption holes are connected to an external negative pressure device.

[0012] In the above-mentioned PCB board mylar pressing nail device, a mounting plate is provided at the bottom of the groove, and a plurality of threaded holes are arranged in a matrix on the mounting plate. A through hole is provided on the plate body, and the through hole corresponds to some of the threaded holes. Screws are used to pass through the through holes and connect with the threaded holes to fix the plate body on the mounting plate.

[0013] One of the above technical solutions of the utility model has at least one of the following advantages or beneficial effects:

[0014] In this utility model, a loading module is provided for placing PCB boards. After placing the PCB boards on the loading module, workers can manually place the Mylar sheets and plastic rivets. Then, the pressing module is activated, and the top column descends to press the plastic rivets, allowing the plastic rivets to be pressed onto the PCB board. This realizes automatic nail pressing, reduces the manual burden, and improves efficiency.

[0015] At the same time, the loading module and the lifting plate are both detachable structures. Different PCB boards can use different loading modules and different lifting plates, so that the device can be applied to different PCB boards with better flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 It is a front view of the first embodiment of the utility model;

[0018] Figure 2 is a top view of the base of the first embodiment of the utility model;

[0019] Figure 3 It is a top view of the material loading module of the first embodiment of the present utility model.

[0020] Among them, the reference numerals of each figure are:

[0021] 1. Base; 11. Groove; 12. Mounting plate; 121. Adsorption hole; 2. Material placement module; 21. Plate body; 22. Positioning block; 23. Top column; 3. Pressing module; 31. Lifting plate; 32. Driving assembly; 33. Pressing column. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0023] Reference Figures 1 to 3 As shown, a PCB board mylar pressing device includes a base 1, a material placement module 2 and a pressing module 3. The material placement module 2 is used to place the PCB board. The material placement module 2 is detachably fixed to the base 1. The pressing module 3 is located above the base 1.

[0024] The pressing module 3 includes a lifting plate 31 and a driving assembly 32. The lifting plate 31 is detachably fixed to the output end of the driving assembly 32. The lifting plate 31 is provided with a pressing column 33 corresponding to the plastic rivet. The driving assembly 32 drives the lifting plate 31 downward, so that the pressing column 33 presses the plastic rivet onto the PCB.

[0025] After placing the PCB on the loading module 2, workers can manually place the Mylar sheet and plastic rivets. Then, the pressing module 3 is activated, and the top column 23 descends to press the plastic rivets, allowing the plastic rivets to be pressed onto the PCB. This realizes automatic nail pressing, reduces the manual burden, and improves efficiency.

[0026] At the same time, the material placement module 2 and the lifting plate 31 are both detachable structures. Different PCB boards can use different material placement modules 2 and different lifting plates 31, so that the device can be applied to different PCB boards with better flexibility.

[0027] In this embodiment, the driving assembly 32 is a cylinder.

[0028] In this embodiment, the loading module 2 includes a plate body 21, on which are provided a plurality of positioning blocks 22. The positioning blocks 22 are used to contact the outer edge of the PCB board, thereby positioning the side edges or corners of the PCB board. The plurality of positioning blocks 22 cooperate to position the four sides of the PCB board, thereby positioning the PCB board.

[0029] The layout of the positioning blocks 22 on the board body 21 is different for different PCB boards. Therefore, different placement modules 2 are replaced to position different PCB boards and ensure that the PCB boards do not shake.

[0030] In this embodiment, a plurality of top posts 23 are provided on the board body 21 . The top posts 23 are used to support the PCB board to prevent the electronic components on the PCB board from touching the base 1 and being damaged.

[0031] In this embodiment, the material of the plate body 21 and the top pillar 23 are both insulating materials, which can protect the PCB board;

[0032] The plate body 21 is generally made of acrylic, and the top column 23 is made of plastic.

[0033] In this embodiment, the base 1 is provided with a groove 11 for accommodating the plate 21. The outer contour of the projection of the plate 21 on the horizontal plane is a rectangular shape with a missing corner. The shape of the groove 11 is adapted to the shape of the plate 21.

[0034] By limiting the shape of the plate 21, it can be ensured that the plate 21 is positioned in the correct direction when placed, and that the pressure column 33 can be pushed to the correct position when pressing the plastic rivet. This fool-proof design can reduce the difficulty of operation for workers and is more convenient.

[0035] In this embodiment, a mounting plate 12 is provided at the bottom of the groove 11, and an adsorption hole 121 for adsorbing the plate body 21 is provided on the mounting plate 12. The adsorption hole 121 is connected to an external negative pressure device. Through the adsorption effect of the adsorption hole 121, the plate body 21 can be further fixed to avoid the plate body 21 not being placed in place and affecting the pressing of the plastic rivet.

[0036] In some other embodiments, threaded holes are provided on the mounting plate 12, and multiple threaded holes are arranged in a matrix. Through holes are provided on the plate body 21, and the through holes correspond to some of the threaded holes. Screws are used to pass through the through holes and connect with the threaded holes to fix the plate body 21 on the mounting plate 12.

[0037] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A PCB board Mylar pressing nail device, characterized in that: It includes a base, a material placement module and a pressing module. The material placement module is used to place the PCB board. The material placement module is detachably fixed to the base. The pressing module is located above the base. The pressing module includes a lifting plate and a driving assembly. The lifting plate is detachably fixed to the output end of the driving assembly. The lifting plate is provided with a pressure column corresponding to the plastic rivet. The driving assembly drives the lifting plate to descend so that the pressure column presses the plastic rivet onto the PCB board.

2. The PCB board Mylar pressing nail device according to claim 1, characterized in that: The material placement module includes a plate body, and a plurality of positioning blocks are provided on the plate body. The positioning blocks are used to contact the outer edge of the PCB board, and the plurality of positioning blocks cooperate to position the position of the PCB board.

3. The PCB board Mylar pressing nail device according to claim 2, characterized in that: A plurality of top columns are provided on the board body, and the top columns are used to support the PCB board.

4. The PCB board Mylar pressing nail device according to claim 3, characterized in that: The plate body and the top column are both made of insulating materials.

5. The PCB board Mylar pressing nail device according to claim 2, characterized in that: The base is provided with a groove for accommodating the plate body. The outer contour of the projection of the plate body on the horizontal plane is a missing corner rectangle with a missing corner. The shape of the groove is adapted to the shape of the plate body.

6. The PCB board Mylar pressing nail device according to claim 5, characterized in that: A mounting plate is provided at the bottom of the groove, and adsorption holes for adsorbing the plate body are provided on the mounting plate, and the adsorption holes are connected to an external negative pressure device.

7. The PCB board Mylar pressing nail device according to claim 5, characterized in that: A mounting plate is provided at the bottom of the groove, and a plurality of threaded holes are arranged in a matrix on the mounting plate. A through hole is provided on the plate body, and the through hole corresponds to some of the threaded holes. Screws are passed through the through holes and connected to the threaded holes to fix the plate body on the mounting plate.

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