Heat dissipation structure and cooling device

Abstract

The utility model provides a heat dissipation structure and a cooling device. The heat dissipation structure comprises a plurality of heat dissipation sheets and at least one adhesive layer. And the plurality of radiating sheets are of porous plate-shaped structures. The at least one adhesive layer is located between two adjacent heat dissipation sheets, and the at least one adhesive layer is connected to the plurality of heat dissipation sheets. Therefore, the heat dissipation structure and the cooling device can improve convenience and heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to a heat dissipation structure and a cooling device, and in particular to a heat dissipation structure and a cooling device having a heat dissipation material with a combined structure. Background Art

[0002] Industrial machinery and systems are typically connected to a cooling water circuit to cool the equipment and release waste heat generated by the equipment into the atmosphere through evaporation of the cooling water. This cooling water circuit uses water as the cooling medium and typically consists of a cooling device and piping. The most common cooling device is a cooling tower.

[0003] However, the heat sinks in the current cooling water tower are all individually installed in the cooling water tower in a scattered manner. Therefore, it is relatively troublesome to install and replace the heat sinks, and the heat dissipation efficiency is low.

[0004] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the important issues that the art wants to solve. Utility Model Content

[0005] The technical problem to be solved by the present application is to provide a heat dissipation structure and a cooling device to address the deficiencies of the prior art.

[0006] To address the aforementioned technical issues, one of the technical solutions employed in this application is to provide a heat dissipation structure comprising a plurality of heat dissipation sheets and at least one adhesive layer. The plurality of heat dissipation sheets are porous plate-like structures. The at least one adhesive layer is positioned between two adjacent heat dissipation sheets and is connected to the plurality of heat dissipation sheets.

[0007] In one feasible or optional embodiment, the at least one adhesive layer includes a moisture-curing adhesive; wherein the material of each of the heat dissipation sheets is polyethylene terephthalate.

[0008] In one feasible or optional embodiment, the heat dissipation structure further includes a plurality of adhesive layers; wherein the plurality of heat dissipation sheets are arranged in a stacked manner, and each adhesive layer is located between two adjacent heat dissipation sheets.

[0009] In one feasible or optional embodiment, each of the heat sink sheets has multiple protrusions on both sides, and the multiple protrusions of one heat sink sheet correspond to the multiple protrusions of another heat sink sheet; wherein each adhesive layer is located between two adjacent protrusions and connects the corresponding multiple protrusions.

[0010] In one feasible or optional embodiment, each of the heat sink sheets has a plurality of through holes, each of the through holes passes through the body of the heat sink sheet, and each of the through holes is located between two adjacent protrusions.

[0011] In order to solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a cooling device, including a device body and a plurality of heat dissipation structures. The device body has at least one first opening, a second opening and a receiving cavity, and the receiving cavity is connected to the at least one first opening and the second opening. A plurality of heat dissipation structures are suspended in the receiving cavity, and each of the heat dissipation structures includes a plurality of heat dissipation sheets and at least one adhesive layer. The plurality of heat dissipation sheets are porous plate-like structures. At least one adhesive layer is located between two adjacent heat dissipation sheets, and the at least one adhesive layer is connected to the plurality of heat dissipation sheets.

[0012] In one feasible or optional embodiment, the at least one adhesive layer includes a moisture-curing adhesive; wherein the material of each of the heat dissipation sheets is polyethylene terephthalate.

[0013] In one feasible or optional embodiment, at least one of the heat dissipation structures further includes a plurality of adhesive layers; wherein the plurality of heat dissipation sheets are arranged in a stacked manner, and each of the adhesive layers is located between two adjacent heat dissipation sheets.

[0014] In one feasible or optional embodiment, each of the heat sink sheets has multiple protrusions on both sides, and the multiple protrusions of one heat sink sheet correspond to the multiple protrusions of another heat sink sheet; wherein each adhesive layer is located between two adjacent protrusions and connects the corresponding multiple protrusions.

[0015] In one feasible or optional embodiment, each of the heat sink sheets has a plurality of through holes, each of the through holes passes through the body of the heat sink sheet, and each of the through holes is located between two adjacent protrusions.

[0016] One of the beneficial effects of the present application is that the heat dissipation structure provided by the present application can improve convenience and heat dissipation efficiency through the technical solution of "multiple heat dissipation sheets are porous plate structures. At least one adhesive layer is located between two adjacent heat dissipation sheets, and the at least one adhesive layer is connected to the multiple heat dissipation sheets."

[0017] Another beneficial effect of the present application is that the cooling device provided by the present application can improve convenience and heat dissipation efficiency through the technical solution of "the device body has at least one first opening, a second opening and a accommodating cavity, and the accommodating cavity is connected to the at least one first opening and the second opening. Multiple heat dissipation structures are suspended in the accommodating cavity, and each of the heat dissipation structures includes multiple heat dissipation sheets and at least one adhesive layer. The multiple heat dissipation sheets are porous plate structures. At least one adhesive layer is located between two adjacent heat dissipation sheets, and the at least one adhesive layer is connected to the multiple heat dissipation sheets."

[0018] The details of other functions and embodiments of the present application are described below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A partial cross-sectional schematic diagram of a cooling device according to a first embodiment of the present application;

[0021] Figure 2 This is an exploded schematic diagram of the heat dissipation structure of the first embodiment of the present application;

[0022] Figure 3 This is a schematic structural diagram of the heat dissipation structure of the first embodiment of the present application;

[0023] Figure 4 This is a three-dimensional schematic diagram of the heat dissipation structure of the first embodiment of the present application;

[0024] Figure 5 This is an exploded schematic diagram of the heat dissipation structure of the second embodiment of the present application;

[0025] Figure 6 This is a structural diagram of the heat dissipation structure of the first embodiment of the present application.

[0026] Explanation of symbols

[0027] Z: Cooling device 1: Device body

[0028] 10: First opening 11: Second opening

[0029] 12: Accommodating cavity 13: Conveying component

[0030] 14: Sprinkling component 15: Airflow generating component

[0031] 16: Ventilation opening D: Heat dissipation structure

[0032] D1: Heat dissipation sheet D1a: Body

[0033] D10: protrusion D11: through hole

[0034] D12: Recessed part D2: Adhesive layer DETAILED DESCRIPTION

[0035] The following is an explanation of the implementation methods of the "heat dissipation structure and cooling device" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of this application in detail, but the disclosed contents are not intended to limit the scope of protection of this application.

[0036] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components, these components should not be limited by these terms. These terms are primarily used to distinguish one component from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, depending on the actual situation.

[0037] First embodiment

[0038] See also Figures 1 to 4 , respectively, are a partial cross-sectional schematic diagram of the cooling device of the first embodiment of the present application, an exploded schematic diagram of the heat dissipation structure, a structural schematic diagram of the heat dissipation structure, and a three-dimensional schematic diagram of the heat dissipation structure. As shown in the above figures, the first embodiment of the present application provides a cooling device Z, which may include a device body 1 and multiple heat dissipation structures D.

[0039] Cooperate Figure 1 As shown, the device body 1 may have at least one first opening 10, a second opening 11, and a receiving cavity 12, wherein the receiving cavity 12 is in communication with the first opening 10 and the second opening 11. For example, the device body 1 may be a heat dissipation water tower structure. The first opening 10 may be located at the top of the device body 1; in this embodiment, the number of first openings 10 may be multiple, but is not limited to this. The second opening 11 may be located at the bottom of the device body 1 and may be connected to an external output pipe (not shown).

[0040] Furthermore, the device body 1 may also have a conveying component 13, a plurality of liquid sprinkling components 14, an airflow generating component 15 and at least one ventilation opening 16. The conveying component 13 is suspended in the accommodating cavity 12. The conveying component 13 may be a pipe for conveying liquid, and the conveying component 13 may be connected to an external input pipe (not shown in the figure). A plurality of liquid sprinkling components 14 are arranged on the conveying component 13. The liquid sprinkling component 14 may be a water spray head or a sprinkler head. The airflow generating component 15 may be an existing fan component, which can be movably arranged on the top of the device body 1. The ventilation opening 16 may be located on the side wall of the device body 1, and the ventilation opening 16 connects the accommodating cavity 12 with the external space of the device body 1.

[0041] Next, cooperate Figures 1 to 4 As shown, a plurality of heat dissipation structures D are suspended in the accommodating cavity 12 , and each heat dissipation structure D may include a plurality of heat dissipation sheets D1 and at least one adhesive layer D2 .

[0042] For example, with Figures 1 to 4 As shown, multiple heat sinks D1 may be solid porous plate structures. The material of each heat sink D1 may be polyethylene terephthalate (PET) or polyvinyl chloride (PVC). Each heat sink D1 may have multiple protrusions D10 on both sides, wherein the multiple protrusions D10 of one heat sink D1 correspond to the multiple protrusions D10 of another heat sink D1. Each heat sink D1 may have multiple through holes D11, each through hole D11 passes through a body D1a of the heat sink D1, and each through hole D11 is located between two adjacent protrusions D10. The outer shape of each heat sink D1 may be a geometric shape, such as a square, semicircular, polygonal or irregular shape; wherein, in this embodiment, the square shape is used as an example, but is not limited to this.

[0043] Furthermore, cooperation Figures 1 to 4 As shown, at least one adhesive layer D2 may be located between two adjacent heat sink sheets D1, and at least one adhesive layer D2 may connect multiple heat sink sheets D1. The adhesive layer D2 may include a moisture-curing adhesive. In this embodiment, the heat dissipation structure D may include multiple adhesive layers D2. The multiple heat sink sheets D1 may be stacked, and each adhesive layer D2 may be located between two adjacent heat sink sheets D1. Furthermore, each adhesive layer D2 may be located between two adjacent protrusions D10 and connect the corresponding protrusions D10.

[0044] Therefore, with Figures 1 to 4As shown, when the cooling device Z of the present application is in operation, the cooling liquid (such as water, but not limited to this) is transported to the transport component 13 through the external input pipe and sprayed onto the multiple heat dissipation structures D using multiple liquid spraying components 14; at this time, the first opening 10 can introduce external gas into the accommodating cavity 12, and the airflow generating component 15 can attract the gas and generate a heat dissipation airflow to be output toward the heat dissipation structure D, which can solve the problem of blowing hot air out of the tower top and generating white smoke. When the cooling liquid is sprayed onto the heat dissipation structure D, the cooling liquid can be cooled while flowing through the heat dissipation structure D, and then drip to the bottom of the device body 1 and collected. The ventilation opening 16 can provide the heat dissipation airflow to the outside of the device body 1.

[0045] Next, the cooled liquid collected at the bottom of the device body 1 can be discharged to the external output pipe through the second opening 11 of the device body 1, and then transported to the heat source device through the external output pipe to absorb heat.

[0046] Thus, the cooling device Z of the present application can utilize the aforementioned technical solution to combine multiple heat sink sheets D1 using an adhesive layer D2, providing users with convenient installation and replacement. Furthermore, the structural design of the heat sink sheet D1 (protrusion D10, through-hole D11) and the structural design of the multiple heat sink sheets D1 combined together can improve the heat dissipation efficiency of the heat dissipation structure D. Furthermore, the use of polyethylene terephthalate for the heat sink sheet D1 and a moisture-curing adhesive for the adhesive layer D2 can reduce environmental pollution, thereby achieving an environmentally friendly effect.

[0047] Because heat sinks must withstand prolonged moisture and even the possibility of being immersed in liquids, hydrolysis resistance is a key concern in the industry. Typical moisture-curing adhesives can hydrolyze and become ineffective within two to three weeks under 65°C / 95% humidity conditions during reliability testing. However, the moisture-curing adhesive used in the adhesive layer D2 of this application, with its enhanced hydrolysis resistance, can be used and maintained for up to six weeks or even longer while retaining its adhesive properties. This significantly increases the shelf life and reduces waste disposal. Furthermore, unlike traditional solvent-based adhesives, moisture-curing adhesives are more environmentally friendly and safer to process (low VOC).

[0048] Furthermore, based on the above, the present application further provides a heat dissipation structure D, which may include multiple heat dissipation sheets D1 and at least one adhesive layer D2. The multiple heat dissipation sheets D1 may be porous plate-like structures. The at least one adhesive layer D2 may be located between two adjacent heat dissipation sheets D1, and the at least one adhesive layer D2 may be connected to the multiple heat dissipation sheets D1.

[0049] However, the above example is only one feasible embodiment and is not intended to limit the present application.

[0050] Second embodiment

[0051] See also Figure 5 and Figure 6 , which are respectively the exploded schematic diagram and the structural schematic diagram of the heat dissipation structure of the second embodiment of the present application, and please refer to Figures 1 to 4 As shown in the figure, the heat dissipation structure D of this embodiment is generally similar to the heat dissipation structure D of the above-mentioned embodiment. Therefore, the configuration or operation of the same components will not be repeated here. However, the difference between this embodiment and the first embodiment is that the heat dissipation structure D in this embodiment further includes multiple adhesive layers D2; wherein, multiple heat dissipation sheets D1 are arranged in a stacked manner, and each adhesive layer D2 is located between two adjacent heat dissipation sheets D1.

[0052] For example, with Figure 1 、 Figure 5 and Figure 6 As shown, a recessed portion D12 is formed between adjacent protrusions D10 of each heat sink D1. Therefore, when two heat sinks D1 are bonded together using the adhesive layer D2, the adhesive layer D2 not only contacts each protrusion D10 but also fills the recessed portion D12 of each heat sink D1, thereby tightly connecting the two heat sinks D1.

[0053] However, the above example is only one feasible embodiment and is not intended to limit the present application.

[0054] Advantageous Effects of the Embodiments

[0055] One of the beneficial effects of the present application is that the heat dissipation structure D provided in the present application can improve convenience and heat dissipation efficiency through the technical solution of "multiple heat dissipation sheets D1 can be porous plate structures. At least one adhesive layer D2 can be located between two adjacent heat dissipation sheets D1, and at least one adhesive layer D2 can be connected to multiple heat dissipation sheets D1."

[0056] Another beneficial effect of the present application is that the cooling device Z provided in the present application can improve convenience and heat dissipation efficiency through the technical solution of "the device body 1 can have at least one first opening 10, a second opening 11 and a accommodating cavity 12, and the accommodating cavity 12 can be connected to the at least one first opening 10 and the second opening 11. Multiple heat dissipation structures D can be suspended in the accommodating cavity 12, and each heat dissipation structure D can include multiple heat dissipation sheets D1 and at least one adhesive layer D2. The multiple heat dissipation sheets D1 can be porous plate structures. At least one adhesive layer D2 can be located between two adjacent heat dissipation sheets D1, and at least one adhesive layer D2 can be connected to the multiple heat dissipation sheets D1."

[0057] Furthermore, the cooling device Z of the present application can combine multiple heat sink sheets D1 together via an adhesive layer D2, providing users with convenient installation and replacement. Furthermore, the structural design of the heat sink sheet D1 (protrusion D10, through-hole D11) and the structural design of the multiple heat sink sheets D1 combined together can improve the heat dissipation efficiency of the heat dissipation structure D. Furthermore, the heat sink sheet D1 of the present application uses polyethylene terephthalate, and the adhesive layer D2 uses a moisture-curing adhesive, which can reduce environmental pollution and thus achieve environmental protection.

[0058] The embodiments and / or implementation methods described above are only used to illustrate the preferred embodiments and / or implementation methods for realizing the technology of the present application, and do not impose any form of limitation on the implementation methods of the technology of the present application. Any person skilled in the art may make slight changes or modifications to other equivalent embodiments without departing from the scope of the technical means disclosed in the content of the present application, but they should still be regarded as technologies or embodiments that are essentially the same as those of the present application.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure includes: a plurality of heat dissipation sheets, each of which is a porous plate-like structure; and At least one adhesive layer is located between two adjacent heat dissipation sheets, and the at least one adhesive layer connects the multiple heat dissipation sheets.

2. The heat dissipation structure according to claim 1, characterized in that: The at least one adhesive layer includes a moisture-curing adhesive; wherein the material of each of the heat dissipation sheets is polyethylene terephthalate.

3. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a plurality of adhesive layers; wherein the plurality of heat dissipation sheets are arranged in a stacked manner, and each adhesive layer is located between two adjacent heat dissipation sheets.

4. The heat dissipation structure according to claim 3, characterized in that: Each of the heat sink sheets has a plurality of protrusions on both sides, wherein the protrusions of one heat sink sheet correspond to the protrusions of another heat sink sheet; wherein each adhesive layer is located between two adjacent protrusions and connects the corresponding protrusions.

5. The heat dissipation structure according to claim 4, characterized in that: Each of the heat dissipation sheets has a plurality of through holes, each of the through holes passes through the body of the heat dissipation sheet, and each of the through holes is located between two adjacent protrusions.

6. A cooling device, characterized in that: The cooling device comprises: a device body, the device body having at least one first opening, a second opening, and a receiving cavity, the receiving cavity being in communication with the at least one first opening and the second opening; and A plurality of heat dissipation structures are suspended in the accommodating cavity, each of the heat dissipation structures comprising: a plurality of heat dissipation sheets, each of which is a porous plate-like structure; and At least one adhesive layer is located between two adjacent heat sink sheets, and the at least one adhesive layer is connected to the plurality of heat sink sheets.

7. The cooling device according to claim 6, characterized in that The at least one adhesive layer includes a moisture-curing adhesive; wherein the material of each of the heat dissipation sheets is polyethylene terephthalate.

8. The cooling device according to claim 6, characterized in that At least one of the heat dissipation structures further includes a plurality of adhesive layers; wherein the plurality of heat dissipation sheets are arranged in a stacked manner, and each of the adhesive layers is located between two adjacent heat dissipation sheets.

9. The cooling device according to claim 8, characterized in that Each of the heat sink sheets has a plurality of protrusions on both sides, wherein the protrusions of one heat sink sheet correspond to the protrusions of another heat sink sheet; wherein each adhesive layer is located between two adjacent protrusions and connects the corresponding protrusions.

10. The cooling device according to claim 9, characterized in that Each of the heat dissipation sheets has a plurality of through holes, each of the through holes passes through the body of the heat dissipation sheet, and each of the through holes is located between two adjacent protrusions.

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