Liquid cooling heat dissipation module, liquid cooling heat dissipation device and electronic equipment

Abstract

The utility model discloses a liquid cooling heat dissipation module, which comprises a heat dissipation plate and a pressure liquid pump, at least one group of heat dissipation pipelines is arranged in the heat dissipation plate, each group of heat dissipation pipelines comprises a main pipeline and a plurality of branch pipelines, two ends of the main pipeline are respectively communicated with two ends of each branch pipeline, and liquid cooling working media are arranged in the main pipeline and the branch pipelines; and the pressure liquid pump is at least arranged on the main pipeline and is used for providing power for the liquid cooling working medium to circularly flow in the main pipeline and the branch pipelines. The liquid cooling mode is adopted, heat of a heat source can be taken away in time, the temperature equalizing effect of the heat dissipation plate can be effectively improved, the problems of uneven temperature distribution, untimely heat dissipation and the like caused by a long heat dissipation path are solved, the heat dissipation pipeline is divided into the main pipeline and the branch pipelines, the flow speed of a liquid cooling working medium can be increased, and the heat dissipation efficiency is improved. Therefore, the heat exchange efficiency is improved, and the heat dissipation capacity and competitiveness of products are improved. The utility model further discloses a liquid cooling heat dissipation device with the liquid cooling heat dissipation module and electronic equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, and in particular to a liquid cooling heat dissipation module, a liquid cooling heat dissipation device and electronic equipment with improved heat dissipation performance. Background Art

[0002] In existing electronic devices, the CPU power supply (VR) typically uses a copper sheet attached to a thermal pad. The thermal pad is mounted on the heat source, and the copper sheet is mounted on a heat pipe. Heat transfer occurs sequentially from the heat source to the thermal pad, then to the copper sheet. The copper sheet then transfers the heat to the heat pipe, achieving heat dissipation.

[0003] In existing heat dissipation models, excessive heat transfer distances often result in delayed heat removal and uneven temperature distribution, hindering optimal heat dissipation performance. Furthermore, to ensure effective heat dissipation, copper sheets are typically designed to be larger. This not only makes it difficult to adapt to complex electronic device layouts, but the increased weight of the copper sheet also indirectly increases the weight of the electronic device.

[0004] Therefore, it is necessary to provide a liquid cooling heat dissipation module, liquid cooling heat dissipation device and electronic equipment that are easy to arrange, have improved heat dissipation performance and can solve the problems of uneven temperature or untimely heat dissipation caused by too long heat conduction distance, so as to solve the above problems. Utility Model Content

[0005] One purpose of the present invention is to provide a liquid cooling module that is easy to arrange, has improved heat dissipation performance, and can solve the problems of uneven temperature or untimely heat dissipation caused by a long heat conduction distance.

[0006] Another object of the present invention is to provide a liquid cooling device that is easy to arrange, has improved heat dissipation performance, and can solve the problems of uneven temperature or untimely heat dissipation caused by a long heat conduction distance.

[0007] Another object of the present invention is to provide an electronic device that is easy to arrange, has improved heat dissipation performance, and can solve the problems of uneven temperature or untimely heat dissipation caused by a long heat conduction distance.

[0008] To achieve the above-mentioned purpose, the technical solution of the present invention is: to provide a liquid-cooling heat dissipation module, which includes a heat dissipation plate and a pressure liquid pump; wherein, at least one group of heat dissipation pipes is provided in the heat dissipation plate, and each group of the heat dissipation pipes includes a main pipe and multiple branch pipes, and the two ends of the main pipe are respectively connected to the two ends of each branch pipe, and the main pipe and the branch pipes have liquid-cooling medium; the pressure liquid pump is at least provided on the main pipe, and is used to provide power for the liquid-cooling medium to circulate in the main pipe and the branch pipes.

[0009] Preferably, a plurality of heat dissipation pipes are provided in the heat dissipation plate, and each heat dissipation pipe group can be controlled separately, so that each heat dissipation pipe can be managed modularly, thereby being applicable to different heat dissipation scenarios.

[0010] Preferably, the inner diameter of the main pipe is larger than the inner diameter of each branch pipe. Therefore, when the liquid cooling medium enters the branch pipe through the main pipe, the flow rate increases due to the narrowing of the branch pipe, thereby improving the heat exchange efficiency.

[0011] Preferably, the heat dissipation pipe also includes two connecting pipes, each branch pipe is arranged at intervals and connected to the connecting pipe at both ends, the two connecting pipes are respectively connected to the two ends of the main pipe, the inner diameter of the connecting pipe is larger than the inner diameter of each branch pipe, the liquid cooling medium enters the connecting pipe from the main pipe, and then enters each branch pipe through the connecting pipe. When the liquid cooling medium enters the branch pipe through the connecting pipe, the flow rate increases due to the narrowing of the branch pipe, thereby improving the heat exchange efficiency.

[0012] Preferably, one end of the heat sink is provided with a snap-fit ​​structure, which is used to snap-fit ​​with the heat pipe. On the one hand, it enhances the snap-fit ​​strength between the heat sink and the heat pipe, making it difficult for the heat sink and the heat pipe to fall off. Compared with the overlapping method between the copper plate and the heat pipe in the prior art, it has higher connection stability. On the other hand, it avoids the use of chemical adhesives such as flux, reduces thermal resistance, and thus improves the heat conduction efficiency between the heat sink and the heat pipe.

[0013] Preferably, at least the main pipeline extends to the locking structure, thereby increasing the contact area between the heat sink and the heat pipe, and also increasing the heat exchange time between the liquid cooling medium in the main channel and the heat pipe, making the heat exchange between the heat sink and the heat pipe more sufficient, thereby improving the overall heat exchange efficiency.

[0014] Preferably, the locking structure includes a bent locking portion and a connecting portion, the connecting portion is connected to one end of the heat sink, and the locking portion is spaced apart from the heat sink, a slot for locking the heat pipe is formed between the locking portion and the heat sink, and at least the main pipe extends to the locking portion, thereby increasing the contact area between the heat sink and the heat pipe, and also increasing the heat exchange time between the liquid cooling medium in the main channel and the heat pipe, so that the heat exchange between the heat sink and the heat pipe is more sufficient, thereby improving the overall heat exchange efficiency.

[0015] Preferably, the heat sink includes a flow channel plate and a first cover plate and a second cover plate provided on both sides of the flow channel plate, and the heat dissipation pipe is recessed on at least one side of the flow channel plate; on the one hand, the arrangement of the heat dissipation pipe on the flow channel plate is simple, and the liquid cooling channel is easy to arrange in the heat sink, which can adapt to a more complex electronic device layout; on the other hand, since the liquid cooling medium is lighter than copper, the overall weight of the heat dissipation module is lighter than the existing method of using copper sheets for heat dissipation, thereby indirectly reducing the weight of the electronic equipment.

[0016] Correspondingly, the present invention also provides a liquid cooling device, comprising a heat pipe, a cooling fin connected to one end of the heat pipe, and the liquid cooling module as described above, wherein the heat sink is mounted on the other end of the heat pipe.

[0017] Preferably, a locking structure is provided at one end of the heat sink, which is wrapped around the heat pipe to be locked with the heat pipe, and at least the main pipe extends to the locking structure, thereby increasing the contact area between the heat sink and the heat pipe, thereby enhancing the heat exchange efficiency.

[0018] Correspondingly, the present invention also provides an electronic device, which includes a controller, a heat source and the liquid cooling heat dissipation module as described above, wherein the heat sink is mounted on the heat source; the controller is electrically connected to the pressure liquid pump, and the controller is used to control the operation of the pressure liquid pump to provide power for the circulation of the liquid cooling medium; and when the electronic device turns on the performance mode due to excessive temperature, the controller is used to control the operation of the pressure liquid pump to speed up the circulation speed of the liquid cooling medium, and when the electronic device switches from the performance mode to the normal mode, the controller is used to control the operation of the pressure liquid pump to adjust the circulation speed of the liquid cooling medium to a normal state.

[0019] Compared to the prior art, the liquid-cooled heat dissipation module of the present invention arranges at least one set of heat dissipation pipes within the heat dissipation plate. Each set of heat dissipation pipes includes a main pipe and multiple branch pipes. A pressure liquid pump is installed on at least the main pipe, and liquid cooling medium is contained within the main and branch pipes. The pressure liquid pump circulates the liquid cooling medium within the main and branch pipes, dissipating heat from the heat source through heat exchange with the liquid cooling medium. Therefore, the following effects are achieved: first, the liquid cooling medium has a strong heat carrying capacity, and the built-in heat dissipation pipe and liquid cooling medium can effectively increase the heat carrying capacity of the heat sink, can timely take away the heat from the heat source, and improve the temperature uniformity effect of the heat sink, thereby effectively solving the problems of uneven temperature distribution and untimely heat dissipation caused by long heat dissipation distance; secondly, the heat dissipation pipe is divided into main pipes and branch pipes, and the flow rate of the liquid cooling medium is increased, thereby improving the heat exchange efficiency, improving the heat dissipation capacity and competitiveness of the product; thirdly, the heat dissipation pipe is easy to arrange in the heat sink, and can adapt to more complex electronic device layouts, making the arrangement of the heat dissipation module in the electronic equipment more flexible; finally, since the liquid cooling medium is lighter than the weight of copper of the same volume, the weight of the heat dissipation module of the present application is lighter than the heat dissipation module of the same volume that uses copper sheets for heat dissipation, thereby reducing the weight of the electronic equipment.

[0020] Correspondingly, the liquid cooling device and electronic equipment having the liquid cooling module of the present invention both have the above technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of an embodiment of the liquid cooling heat dissipation module of the present invention.

[0022] Figure 2 yes Figure 1 Exploded diagram of .

[0023] Figure 3 yes Figure 2 Schematic diagram of the structure of the middle channel plate from another angle.

[0024] Figure 4 It is along Figure 3 Sectional view along line AA.

[0025] Figure 5 It is along Figure 3 Cross-sectional view along line BB.

[0026] Figure 6 It is a structural schematic diagram of another embodiment of the liquid cooling heat dissipation module of the present invention.

[0027] Figure 7 It is a structural diagram of the liquid cooling heat dissipation device of the present utility model.

[0028] Figure 8 yes Figure 7 Top view of .

[0029] Figure 9 yes Figure 7 side view. DETAILED DESCRIPTION

[0030] The embodiments of the present invention will now be described with reference to the accompanying drawings, in which similar element numbers represent similar elements. It should be noted that the orientation descriptions involved in the present invention, such as the orientations or positional relationships indicated by up, down, left, right, front, and back, are all based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the present application or / and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The first, second, etc. described are only used to distinguish technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] Combine Figures 1-9 As shown, the liquid cooling heat dissipation module provided by the present invention is particularly suitable for use in electronic devices to dissipate heat from a CPU power supply device. However, this is not a limitation and can of course also be used to dissipate heat from other heat sources. In the present invention, the electronic devices may be various handheld devices, vehicle-mounted devices, wearable devices, computing devices, and various forms of user equipment (UE), mobile stations (MS), terminal devices, etc., and are not specifically limited in this application.

[0032] The following combination Figures 1-6 As shown, in one embodiment of the present invention, the liquid cooling heat dissipation module 100 includes a heat sink 110, at least one group of heat dissipation pipes 120 disposed within the heat sink 110, and at least one pressure liquid pump 130 mounted on the heat sink 110. Each group of heat dissipation pipes 120 includes a main pipe 121 and multiple branch pipes 122. The two ends of the main pipe 121 are respectively connected to the two ends of each branch pipe 122, and the main pipe 121 and the branch pipes 122 contain liquid cooling medium. The pressure liquid pump 130 is at least disposed on the main pipe 121, and at least one pressure liquid pump 130 is disposed on each group of heat dissipation pipes 120. The pressure liquid pump 130 is used to provide power for the liquid cooling medium to circulate within the main pipe 121 and the branch pipes 122, thereby dissipating heat from the heat source through the circulation of the liquid cooling medium. Because the liquid cooling medium has a strong heat carrying capacity, the heat dissipation performance is greatly improved, solving the problems of uneven temperature or untimely heat dissipation that exist in copper plate heat dissipation.

[0033] Combine Figure 2-Figure 3 As shown, in one embodiment of the present invention, the heat dissipation plate 110 includes a flow channel plate 111 and a first cover plate 112 and a second cover plate 113 which are provided on both sides of the flow channel plate 111. The shape of the flow channel plate 111 is not specifically limited, and the shapes of the first cover plate 112 and the second cover plate 113 correspond to the shape of the flow channel plate 111. The heat dissipation pipe 120 is recessed on at least one side of the flow channel plate 111. In a specific embodiment, the heat dissipation pipe 120 is recessed only on one side of the flow channel plate 111. The first cover plate 112 and the second cover plate 113 are provided on both sides of the flow channel plate 111 to seal the heat dissipation pipe 120. For example, the first cover plate 112 and the second cover plate 113 can be welded to both sides of the flow channel plate 111. The three-layer structure of the heat sink 110 simplifies the arrangement of the heat dissipation pipe 120 on the flow channel plate 111, and the heat dissipation pipe 120 is easy to arrange inside the heat sink 110. The position of the heat dissipation pipe 120 can be flexibly arranged according to heat dissipation requirements to adapt to a more complex electronic device layout. On the other hand, since the liquid cooling medium is lighter than copper of the same volume, compared with the method of using copper sheets for heat dissipation in the prior art, the heat dissipation module 100 in the present application is lighter than the overall weight of the heat dissipation module of the same volume in the prior art, thereby indirectly reducing the weight of the electronic device.

[0034] Continue to combine Figure 2-Figure 3 As shown, in one embodiment of the present invention, two groups of heat dissipation pipes 120 are provided in the heat dissipation plate 110, and the branch pipes 122 of the two groups of heat dissipation pipes 120 are arranged in an interlaced manner. Of course, the two groups of heat dissipation pipes 120 can be flexibly arranged according to the positional relationship of the specific heat source to adapt to a more complex electronic device layout and improve heat dissipation efficiency. In this embodiment, the two groups of heat dissipation pipes 120 form independent circulation systems, and the two groups of heat dissipation pipes 120 are controlled separately, that is, the two groups of heat dissipation pipes 120 can work simultaneously or separately, so that each group of heat dissipation pipes 120 can be managed modularly, thereby being suitable for different heat dissipation scenarios to improve heat dissipation efficiency.

[0035] It is understandable that when multiple groups of heat dissipation pipes 120 are provided in the heat dissipation plate 110 , each group of heat dissipation pipes 120 can be flexibly arranged according to specific heat dissipation requirements.

[0036] Combine Figure 3-Figure 5As shown, in one embodiment of the present invention, each group of heat dissipation pipes 120 further includes two connecting pipes 123, the two connecting pipes 123 are arranged in parallel, and each branch pipe 122 is arranged at intervals between the two parallel connecting pipes 123, and the two ends of each branch pipe 122 are respectively connected to the two connecting pipes 123. In this embodiment, the branch pipes 122 are also arranged in parallel and at equal intervals, thereby improving the temperature uniformity of the heat dissipation plate 110. Of course, the branch pipes 122 are not limited to this arrangement. The two ends of the main pipe 121 are respectively connected to the two connecting pipes 123, and whether the main pipe 121 is connected to the middle or end of the connecting pipe 123 is not specifically limited. Thus, the cooled liquid-cooling medium enters one of the connecting pipes 123 from the main pipe 121, and then flows into each branch pipe 122 from the connecting pipe 123. The heated liquid-cooling medium flowing out of the other end of each branch pipe 122 flows back into the main pipe 121 through another connecting pipe 123, thereby facilitating the diversion of the heat dissipation pipe 120. At the same time, the division of the main pipe 121 and the branch pipe 122 increases the flow rate of the liquid-cooling medium, thereby improving the heat exchange efficiency, and further improving the heat dissipation capacity and competitiveness.

[0037] Combine Figure 4 、 Figure 5 As shown, in one embodiment of the present invention, the inner diameter D of the main pipe 121 is greater than the inner diameter d of each branch pipe 122. Specifically, the main pipe 121 and the branch pipe 122 are both recessed on one side of the flow channel plate 111, and the main pipe 121 and the branch pipe 122 are preferably rectangular structures. Therefore, the width D of the main pipe 121 is greater than the width d of each branch pipe 122. Of course, the main pipe 121 and the branch pipe 122 can also be provided with circular, arc-shaped and other structures, which are not specifically limited here. Since the main pipe 121 and the branch pipe 122 are divided by different widths, when the liquid-cooling medium passes through the main pipe 121 into the branch pipe 122, the flow rate increases due to the narrowing of the branch pipe 122, thereby improving the heat exchange efficiency.

[0038] More preferably, because the main pipe 121 connects to the multiple branch pipes 122 via the connecting pipe 123, the inner diameter of the connecting pipe 123 is preferably larger than the inner diameter of each branch pipe 122. In this embodiment, the width of the connecting pipe 123 is greater than the width d of each branch pipe 122. The liquid coolant enters the connecting pipe 123 from the main pipe 121 and then enters each branch pipe 122 through the connecting pipe 123. When the liquid coolant enters the branch pipe 122 through the connecting pipe 123, the flow rate increases due to the narrowing of the branch pipe 122, thereby improving heat exchange efficiency.

[0039] The following combination Figure 1 、 Figure 6As shown, in one embodiment of the present invention, a snap-fit ​​structure 140 is provided at one end of the heat sink 110, and the snap-fit ​​structure 140 is used to snap-fit ​​with the heat pipe 200 (described later in detail). This, on the one hand, can enhance the snap-fit ​​strength between the heat sink 110 and the heat pipe 200, making it difficult for the heat sink 110 and the heat pipe 200 to fall off, and has a higher connection stability than the overlap method between the copper plate and the heat pipe 200 in the prior art; on the other hand, it avoids the use of chemical adhesives such as flux between the heat sink 110 and the heat pipe 200, reduces thermal resistance, and thus improves the heat conduction efficiency between the heat sink 110 and the heat pipe 200, thereby improving the heat dissipation effect.

[0040] In the present invention, the snap-fit ​​structure 140 can be formed separately and then fixed to one end of the heat sink 110, or can be formed integrally with the heat sink 110, or formed by bending one end of the heat sink 110, which is not specifically limited here. In a specific embodiment, pressure is applied to one end of the heat sink 110, so that the heat sink 110 is deformed and bent, such as Figure 1 As shown by the middle arrow, one end of the heat dissipation plate 110 is bent to form the engaging structure 140 .

[0041] See Figure 6 As shown, in a specific embodiment, the engaging structure 140 includes a bent engaging portion 141 and a connecting portion 142. The connecting portion 142 is connected to one end of the heat sink 110, so that the engaging portion 141 is spaced apart from the heat sink 110. A slot 143 for engaging the heat pipe 200 is formed between the engaging portion 141 and the heat sink 110. In this embodiment, the engaging portion 141 is parallel to the heat sink 110 to facilitate engagement with the heat pipe 200.

[0042] Continue to combine Figure 1 、 Figure 6 As shown, more preferably, at least the main pipe 121 extends to the engaging structure 140. In this specific embodiment, at least the main pipe 121 extends to the connecting portion 142 and the engaging portion 141 in sequence. In this way, when the engaging groove 143 is engaged with the heat pipe 200, the contact area between the heat sink 110 and the heat pipe 200 is increased, and the heat exchange time between the liquid cooling medium in the flow channel and the heat pipe 200 is also increased, making the heat exchange between the heat sink 110 and the heat pipe 200 more sufficient, thereby improving the overall heat exchange efficiency.

[0043] The following combination Figure 7-Figure 9As shown, the present invention also provides a liquid cooling heat dissipation device 1, comprising a liquid cooling heat dissipation module 100, a heat pipe 200 and a heat dissipation fin 300. The heat dissipation fin 300 is connected to one end of the heat pipe 200, and the structure of the heat dissipation fin 300 and the connection method between the heat dissipation fin 300 and the heat pipe 200 are both conventional methods in the art. The heat dissipation plate 110 of the liquid cooling heat dissipation module 100 is mounted on the other end of the heat pipe 200, and the structure of the liquid cooling heat dissipation module 100 is as described above. In addition, at least the position where the main pipe 121 is set in the heat dissipation plate 110 is in contact with the heat pipe 200, so as to realize heat exchange between the liquid cooling medium in the main pipe 121 and the heat pipe 200.

[0044] Combine Figure 1 、 Figure 6-9 As shown, in one embodiment, when the liquid cooling heat dissipation module 100 is connected to the heat pipe 200, one end of the heat dissipation plate 110 is bent to form a snap-fit ​​structure 140 and snap-fitted onto the heat pipe 200. Figure 1 A force is applied in the direction indicated by the middle arrow to one end of the heat sink 110 where the main conduit 121 is located, causing the heat sink 110 to bend and wrap around the heat pipe 200. Specifically, the heat sink 110 is bent to form a snap-fit ​​portion 141 and a connecting portion 142. The snap-fit ​​portion 141, the connecting portion 142, and the slot 143 between the heat sink 110 snap onto the outside of the heat pipe 200. The snap-fit ​​portion 141 is located above the heat pipe 200, while the heat sink 110 is located below the heat pipe 200. Furthermore, the main conduit 121 extends from the heat sink 110 through the snap-fit ​​portion 141 to the connecting portion 142. This increases the contact area between the heat sink 110 and the heat pipe 200, and also increases the heat exchange time between the liquid coolant in the heat sink conduit 120 and the heat pipe 200. This makes the heat exchange between the heat sink 110 and the heat pipe 200 more efficient, thereby improving the overall heat exchange efficiency.

[0045] Recombination Figures 1-9 As shown, the present invention also provides an electronic device, which includes a heat source and the liquid cooling heat dissipation module 100 as described above. Among them, the end of the heat sink 110 away from the heat pipe 200 is mounted on the heat source. In a specific embodiment, the heat source is a CPU power supply device in an electronic device. During the operation of the electronic device, VR (heating elements such as CHOKE and MOS) generates a large amount of heat. The heat is conducted to the built-in heat dissipation pipe 120 through the heat sink 110 with excellent thermal conductivity. The liquid cooling heat dissipation module 100 can take away the heat in time. Of course, it can also be other heat sources in the electronic device.

[0046] In this specific embodiment, the electronic device further includes a controller electrically connected to the pressure liquid pump 130. The controller is configured to control the operation of the pressure liquid pump 130, thereby providing power for the circulation of the liquid coolant. Furthermore, when the electronic device enters performance mode due to excessive temperature, the controller is configured to control the operation of the pressure liquid pump 130 to increase the flow rate of the liquid coolant. For example, when a user is running a large game or software, the electronic device enters performance mode due to excessive temperature. The controller controls the operation of the pressure liquid pump 130 to increase the flow rate of the liquid coolant, thereby maintaining the temperature of the heat sink 110 within a safe range. Furthermore, when the electronic device switches from performance mode to normal mode, the controller controls the operation of the pressure liquid pump 130 to reduce the flow rate of the liquid coolant, thereby adjusting the circulation speed of the liquid coolant to a normal state and maintaining stability.

[0047] Recombination Figures 1-9 As shown, taking an electronic device having the liquid cooling heat dissipation device 1 as an example, the working principle of the liquid cooling heat dissipation device 1 is described.

[0048] When the electronic device is working, the heating elements (such as CHOKE, MOS, etc.) of the CPU power supply device generate a large amount of heat. The heat is transferred to the built-in heat dissipation pipe 120 through the heat sink 110 with excellent thermal conductivity, and the CPU power supply device is cooled by heat exchange.

[0049] When the pressure pump 130 begins operating, it provides circulation power for the liquid coolant in the heat dissipation pipe 120, causing the liquid coolant to circulate within the heat dissipation pipe 120. Specifically, under the power of the pressure pump 130, the liquid coolant heated by the heating element flows from one end of the branch pipe 122 into a connecting pipe 123, and then is transported through the main pipe 121 to the other connecting pipe 123. At the location where the heat sink 110 and the heat pipe 200 meet, the liquid coolant in the main pipe 121 exchanges heat with the heat pipe 200, thereby cooling the liquid coolant. The cooled liquid coolant is transported through the main pipe 121 to the other connecting pipe 123, from which it flows into each branch pipe 122. The liquid coolant in the branch pipe 122 again exchanges heat with the heating element, achieving cooling. By circulating the liquid coolant within the main pipe 121 and the branch pipes 122, the CPU power supply device is cooled. Since the liquid cooling medium can effectively increase the heat carrying capacity of the heat sink 110, it can take away the heat in a timely manner, thereby improving the temperature uniformity of the heat sink 110. It can also solve the problems of uneven temperature distribution and poor heat dissipation caused by insufficient power provided by the micropump when the heat dissipation path is long in the existing technology, thereby improving the heat dissipation efficiency of the module.

[0050] In the above circulation process, since the main pipe 121 and the branch pipe 122 are divided by different widths, when the liquid cooling medium enters the branch pipe 122 through the main pipe 121, the branch pipe 122 narrows and the flow rate increases, thereby improving the heat exchange efficiency and improving the heat dissipation capacity and competitiveness of the electronic equipment.

[0051] Furthermore, when the user is running some large-scale games or software, and the electronic device enters performance mode due to excessive temperature, its controller controls the pressure liquid pump 130 to operate, thereby increasing the flow rate of the liquid coolant and improving heat exchange efficiency, thereby maintaining the temperature of the heat sink 110 within a safe range. When the electronic device switches from performance mode to normal mode, the controller controls the pressure liquid pump 130 to operate, reducing the flow rate of the liquid coolant, thereby adjusting the circulation speed of the liquid coolant to a normal state and maintaining stability.

[0052] In summary, the liquid-cooled heat dissipation module 100 of the present invention has at least one set of heat dissipation pipes 120 arranged within a heat sink 110. Each set of heat dissipation pipes 120 includes a main pipe 121 and multiple branch pipes 122. A pressure liquid pump 130 is provided on at least the main pipe 121. Liquid cooling medium is contained within the main pipe 121 and the branch pipes 122. The pressure liquid pump 130 circulates the liquid cooling medium within the main pipe 121 and the branch pipes 122, dissipating heat from the heat source through heat exchange with the liquid cooling medium. First, since the liquid cooling medium has a strong heat carrying capacity, the built-in heat dissipation pipe 120 and the liquid cooling medium can effectively increase the heat carrying capacity of the heat dissipation plate 110, so that the heat from the heat source can be taken away in time, and the temperature uniformity of the heat dissipation plate 110 is improved, which can effectively solve the problems of uneven temperature distribution and untimely heat dissipation caused by the long heat dissipation path in the existing technology; secondly, the heat dissipation pipe 120 is divided into a main pipe 121 and a branch pipe 122. The gradual change process of the main pipe 121 and the branch pipe 122 can increase the flow rate of the liquid cooling medium, thereby improving the heat exchange efficiency and improving the heat dissipation capacity and competitiveness of the product; thirdly, the heat dissipation pipe 120 is easy to arrange in the heat dissipation plate 110, and can adapt to a more complex layout of electronic devices, making the arrangement of the heat dissipation module 100 in the electronic device more flexible; finally, since the liquid cooling medium is lighter than the same volume of copper, the weight of the heat dissipation module 100 of the present application is lighter than the heat dissipation module of the same volume that uses copper sheets for heat dissipation, thereby reducing the weight of the electronic device.

[0053] Correspondingly, the liquid cooling device 1 and the electronic device having the liquid cooling module 100 of the present invention both have the above technical effects.

[0054] The structures of other parts of the electronic device involved in the present invention are conventional structures well known to those skilled in the art and will not be described in detail here.

[0055] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A liquid cooling module, characterized in that: include: A heat sink, wherein at least one group of heat dissipation pipes is provided in the heat sink, each group of heat dissipation pipes includes a main pipe and multiple branch pipes, the two ends of the main pipe are respectively connected to the two ends of each branch pipe, and the main pipe and the branch pipes contain liquid cooling medium; A pressure liquid pump is provided at least on the main pipeline, and is used to provide power for the liquid-cooling medium to circulate in the main pipeline and the branch pipeline.

2. The liquid cooling heat dissipation module according to claim 1, wherein: The inner diameter of the main pipeline is larger than the inner diameter of each branch pipeline.

3. The liquid cooling heat dissipation module according to claim 1, wherein: The heat dissipation pipe also includes two connecting pipes. The branch pipes are arranged at intervals and connected to the connecting pipes at both ends. The two connecting pipes are connected to the two ends of the main pipe respectively. The inner diameter of the connecting pipe is larger than the inner diameter of each branch pipe.

4. The liquid cooling heat dissipation module according to any one of claims 1 to 3, wherein: One end of the heat dissipation plate is provided with a clamping structure, and the clamping structure is used for clamping with the heat pipe.

5. The liquid cooling heat dissipation module according to claim 4, wherein: At least the main pipe extends to the engaging structure.

6. The liquid cooling heat dissipation module according to claim 4, wherein: The clamping structure includes a bent clamping portion and a connecting portion, the connecting portion is connected to one end of the heat sink, and the clamping portion is spaced apart from the heat sink. A clamping groove for clamping the heat pipe is formed between the clamping portion and the heat sink, and at least the main pipe extends to the clamping portion.

7. The liquid cooling heat dissipation module according to any one of claims 1 to 3, characterized in that: The heat dissipation plate includes a flow channel plate and a first cover plate and a second cover plate which are arranged on both sides of the flow channel plate. The heat dissipation pipe is recessed on at least one side of the flow channel plate.

8. A liquid cooling device, comprising a heat pipe and a heat dissipation fin connected to one end of the heat pipe, characterized in that: Also includes: The liquid cooling heat dissipation module according to any one of claims 1 to 7, wherein the heat dissipation plate is mounted on the other end of the heat pipe.

9. The liquid cooling device according to claim 8, wherein: One end of the heat dissipation plate is provided with a clamping structure, the clamping structure is wrapped around the heat pipe to be clamped with the heat pipe, and at least the main pipe extends to the clamping structure.

10. An electronic device comprising a heat source, characterized in that: Also includes: The liquid cooling heat dissipation module according to any one of claims 1 to 7, wherein the heat dissipation plate is mounted on the heat source; A controller is electrically connected to the pressure liquid pump, and is used to control the operation of the pressure liquid pump to provide power for the circulation of the liquid-cooling medium; and when the electronic device turns on the performance mode due to excessive temperature, the controller is used to control the operation of the pressure liquid pump to speed up the circulation speed of the liquid-cooling medium. When the electronic device switches from the performance mode to the normal mode, the controller is used to control the operation of the pressure liquid pump to adjust the circulation speed of the liquid-cooling medium to a normal state.

Images