Improved light emitting diode structure

Abstract

The utility model relates to the technical field of light-emitting diodes, in particular to an improved light-emitting diode structure, which comprises an anode pin, a cathode pin and a reflective bowl, the cathode pin is arranged on one side of the anode pin, the reflective bowl is arranged on the upper surface of the cathode pin, the inner wall of the reflective bowl is fixedly connected with a light-emitting chip, and the inner wall of the light-emitting chip is fixedly connected with the anode pin. The upper surface of the positive electrode pin is fixedly connected with a wire, the wire is fixedly connected with the upper surface of the light-emitting chip, the surface of the positive electrode pin is coated with epoxy resin package, and a connection assembly is arranged at the connection position of the positive electrode pin and the negative electrode pin. According to the utility model, through the arrangement of the connection assembly, the positive and negative electrode pins of the light-emitting diode can be limited before packaging, so that the problems that the distance between the positive and negative electrode pins is difficult to control, and the quality control quality is poor as the lead is easy to shift and pull are solved, and the product quality of the light-emitting diode during production is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting diodes, in particular to an improved light emitting diode structure. Background Art

[0002] Light-emitting diodes (LEDs) are highly efficient, energy-saving, and widely used electronic components. Made of semiconductor materials, they emit light through the recombination of minority and majority carriers. LEDs have the advantages of small size, long life, low power consumption, and fast response speed. The light they emit is rich and varied, covering different bands from visible light to infrared and ultraviolet. In the lighting field, LED lights are gradually replacing traditional lighting equipment with their high brightness and low energy consumption; in the electronic display field, LED screens are highly favored for their bright colors and high definition; they are also widely used in traffic lights, car taillights, and other fields.

[0003] Existing technologies include a utility model with publication number CN201265758Y, which discloses an improved light-emitting diode structure. The patent uses a copper foil substrate, a conductor, a light-emitting diode chip, a transparent adhesive, and a printed circuit board. A rectangular groove is provided on the copper foil substrate, and an annular groove is provided on the periphery of the rectangular groove. The annular groove covers the rectangular groove and makes the side wall of the rectangular groove and the surface of the copper foil substrate generate a natural chamfer angle, thereby generating an island-shaped platform. The conductor passes through the copper foil substrate and is provided between the rectangular groove and the annular groove, and is located outside the conductor. An insulator is coated to insulate the conductor from the copper foil substrate; the light-emitting diode chip is arranged on the copper foil substrate; the transparent adhesive is arranged on the copper foil substrate, covering a fluorescent adhesive and the surface of the copper foil substrate, and the covering range of the transparent adhesive is smaller than the natural chamfer angle generated by the annular groove; the copper foil substrate is arranged on the printed circuit board to solve the problem that waste heat is generated when the light-emitting diode chip is used for a long time, causing the external housing to have a thermal expansion and contraction reaction, which easily causes the lens to fall off after a period of use. Therefore, these situations will reduce the brightness of the light source, which is not conducive to mass production.

[0004] During the production of light-emitting diodes, the positive and negative pins of most existing light-emitting diodes on the market are separated during the packaging process. Since the pin spacing in the separated state is difficult to control, the error range between the positive and negative pins of the same batch of light-emitting diodes during the packaging process is large, resulting in poor quality control. In addition, during the packaging process, since the positive and negative pins are separated, when the positions of the positive and negative pins shift, the wires located on the positive and negative pins are easily torn during the packaging process. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings in the prior art that, during the packaging process of the same batch of light-emitting diodes, there is a large error range between the positive and negative electrodes, resulting in poor quality control. In addition, during the packaging process, since the positive and negative electrode pins are in a separated state, when the positions of the positive and negative electrode pins are offset, the wires located on the positive and negative electrode pins are easily torn off during the packaging process. An improved light-emitting diode structure is proposed.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an improved light-emitting diode structure, comprising a positive pin, a negative pin and a reflective bowl, the negative pin is arranged on one side of the positive pin, the upper surface of the negative pin is provided with a reflective bowl, the inner wall of the reflective bowl is fixedly connected to a light-emitting chip, the upper surface of the positive pin is fixedly connected to a wire, the wire is fixedly connected to the upper surface of the light-emitting chip, the surface of the positive pin is coated with an epoxy resin package, the epoxy resin package is in contact with the surface of the negative pin, a connecting component is provided at the junction of the positive pin and the negative pin, the connecting component includes a fixing pin, the surfaces of the positive pin and the negative pin are both provided with mounting holes, the fixing pin is fixedly connected to the inner wall of the mounting hole, a support frame is installed on the side surface of the positive pin, the side surface of the support frame is fixedly connected to a first clamping plate, the side surface of the support frame is fixedly connected to a second clamping plate, the surfaces of the first clamping plate and the second clamping plate are both provided with positioning holes, and the fixing pin is plugged into the inner wall of the positioning hole.

[0007] Preferably, the side surfaces of the first and second splints are provided with guide grooves, which are connected to the inner wall of the positioning hole. The moving direction of the fixing pin can be guided by the guide groove to ensure that the fixing pin can be accurately inserted into the positioning hole.

[0008] Preferably, a protective frame is fixedly connected to the upper surface of the support frame, and the protective frame is sleeved with the surface of the wire.

[0009] Preferably, both ends of the fixing pin are chamfered, and the positions of the first and second splints can be locked by the cooperation between the fixing pin and the positioning hole.

[0010] Preferably, the splint 1 contacts the surface of the positive pin, and there are two splints 1, which are symmetrically arranged front to back with respect to the positive pin. The splint 2 contacts the surface of the negative pin, and the number of the splint 2 matches that of the splint 1. By cooperating with the splint 1 and the fixing pin, the position of the positive pin can be locked on the support frame.

[0011] Preferably, the inner wall of the guide groove is chamfered, and the guide groove is adapted to the diameter of the fixing pin.

[0012] Preferably, the protective frame contacts the upper surface of the positive pin, and the protective frame contacts the upper surface of the negative pin. The protective frame can protect the wire above the positive pin to reduce the chance of the wire being damaged by pulling.

[0013] Compared with the prior art, the advantages and positive effects of the present invention are:

[0014] The present invention provides a method for fixing the positive electrode pins and the negative electrode pins in a fixed manner, so that the positive electrode pins can be fixed to the support frame when the positive electrode pins are fixed to the support frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of an improved light-emitting diode structure proposed by the utility model;

[0016] Figure 2 This is a schematic cross-sectional view of an improved light emitting diode structure proposed by the utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of an improved light emitting diode structure proposed by the utility model;

[0018] Figure 4 This utility model proposes an improved light emitting diode structure Figure 3 Schematic diagram of the structure at A in the middle;

[0019] Figure 5 This is a partial structural diagram of an improved light emitting diode structure proposed by the utility model;

[0020] Figure 6 The utility model provides a schematic diagram of the connecting component structure of an improved light emitting diode structure.

[0021] Legend:

[0022] 1. Positive pin; 2. Negative pin; 3. Reflective bowl; 4. Light-emitting chip; 5. Wire; 6. Epoxy resin package; 7. Connecting assembly; 71. Mounting hole; 72. Fixing pin; 73. Support frame; 74. Clamping plate 1; 75. Clamping plate 2; 76. Positioning hole; 77. Guide groove; 78. Protective frame. DETAILED DESCRIPTION

[0023] See also Figures 1-6 The utility model provides a technical solution: an improved light-emitting diode structure, including a positive pin 1, a negative pin 2 and a reflective bowl 3, the negative pin 2 is arranged on one side of the positive pin 1, the upper surface of the negative pin 2 is provided with a reflective bowl 3, the inner wall of the reflective bowl 3 is fixedly connected with a light-emitting chip 4, the upper surface of the positive pin 1 is fixedly connected with a wire 5, the wire 5 is fixedly connected to the upper surface of the light-emitting chip 4, the surface of the positive pin 1 is coated with an epoxy resin package 6, the epoxy resin package 6 is in contact with the surface of the negative pin 2, and a connecting component 7 is provided at the connection between the positive pin 1 and the negative pin 2.

[0024] In this embodiment: the connecting component 7 includes a fixing pin 72, and a mounting hole 71 is provided on the surface of the positive pin 1 and the negative pin 2. The fixing pin 72 is fixedly connected to the inner wall of the mounting hole 71. A support frame 73 is installed on the side surface of the positive pin 1. The side surface of the support frame 73 is fixedly connected to a clamping plate 1 74. The side surface of the support frame 73 is fixedly connected to a clamping plate 2 75. Positioning holes 76 are provided on the surfaces of the clamping plate 1 74 and the clamping plate 2 75. The fixing pin 72 is plugged into the inner wall of the positioning hole 76.

[0025] Specifically, guide grooves 77 are formed on the side surfaces of the first clamping plate 74 and the second clamping plate 75 , and the guide grooves 77 are connected to the inner wall of the positioning hole 76 .

[0026] In this embodiment, the guide groove 77 can guide the moving direction of the fixing pin 72 to ensure that the fixing pin 72 can be accurately inserted into the positioning hole 76.

[0027] Specifically, a protective frame 78 is fixedly connected to the upper surface of the support frame 73 , and the protective frame 78 is sleeved with the surface of the wire 5 .

[0028] Specifically, both ends of the fixing pin 72 are chamfered, and the positions of the first clamping plate 74 and the second clamping plate 75 can be locked by the cooperation between the fixing pin 72 and the positioning hole 76 .

[0029] In this embodiment: clamping plate 1 74 contacts the surface of the positive pin 1, there are two clamping plates 1 74, and the two clamping plates 74 are symmetrically arranged front to back about the positive pin 1, clamping plate 2 75 contacts the surface of the negative pin 2, and the number of clamping plates 2 75 matches that of clamping plates 1 74.

[0030] In this embodiment, the position of the positive electrode pin 1 can be locked on the support frame 73 by the cooperation between the clamping plate 1 74 and the fixing pin 72 .

[0031] Specifically, the inner wall of the guide groove 77 is chamfered, and the guide groove 77 is adapted to the diameter of the fixing pin 72 .

[0032] Specifically, the protection frame 78 contacts the upper surface of the positive electrode pin 1 , and the protection frame 78 contacts the upper surface of the negative electrode pin 2 .

[0033] In this embodiment, the protective frame 78 can protect the wire 5 above the positive pin 1 to reduce the probability of the wire 5 being pulled and damaged.

[0034] Working principle: When assembling the diode, align the fixing pin 72 on the positive pin 1 with the guide groove 77 on the clamping plate 1 74, push the positive pin 1, the positive pin 1 pushes the fixing pin 72, and the fixing pin 72 is inserted into the positioning hole 76 on the surface of the clamping plate 1 74 under the guidance of the guide groove 77. Then the positive pin 1 is locked on the support frame 73. When the above operation is completed, align the fixing pin 72 on the negative pin 2 with the guide groove 77 on the clamping plate 2 75, push the negative pin 2, the negative pin 2 pushes the fixing pin 72, and the fixing pin 72 is inserted into the clamping plate 2 75 under the guidance of the guide groove 77. The positive and negative pins 2 are fixed in the positioning hole 76 on the surface, thereby locking the negative pin 2. After completing the above operation, the spacing between the positive pin 1 and the negative pin 2 can be limited. Then, when welding the wire 5, the wire 5 is placed in the protective frame 78, so that the protective frame 78 can protect the wire 5. By setting the connecting component 7, the positive and negative pins 2 of the light-emitting diode can be limited before packaging, thereby reducing the difficulty in controlling the spacing between the positive and negative pins 2, and easily offsetting and pulling the wire 5, resulting in poor quality control, and further improving the product quality of the light-emitting diode during production.

Claims

1. An improved light emitting diode structure, comprising a positive electrode pin (1), a negative electrode pin (2) and a reflective bowl (3), characterized in that: The negative electrode pin (2) is arranged on one side of the positive electrode pin (1); a reflective bowl (3) is arranged on the upper surface of the negative electrode pin (2); a light emitting chip (4) is fixedly connected to the inner wall of the reflective bowl (3); a wire (5) is fixedly connected to the upper surface of the positive electrode pin (1); the wire (5) is fixedly connected to the upper surface of the light emitting chip (4); the surface of the positive electrode pin (1) is coated with an epoxy resin package (6); the epoxy resin package (6) is in contact with the surface of the negative electrode pin (2); a connecting component (7) is arranged at the connection between the positive electrode pin (1) and the negative electrode pin (2); the connecting component (7) is fixedly connected to the inner wall of the reflective bowl (3); a wire (5) is fixedly connected to the upper surface of the light emitting chip (4); the surface of the positive electrode pin (1) is coated with an epoxy resin package (6); the epoxy resin package (6) is in contact with the surface of the negative electrode pin (2); The component (7) includes a fixing pin (72), the surfaces of the positive electrode pin (1) and the negative electrode pin (2) are both provided with mounting holes (71), the fixing pin (72) is fixedly connected to the inner wall of the mounting hole (71), the side surface of the positive electrode pin (1) is provided with a support frame (73), the side surface of the support frame (73) is fixedly connected to a first clamping plate (74), the side surface of the support frame (73) is fixedly connected to a second clamping plate (75), the surfaces of the first clamping plate (74) and the second clamping plate (75) are both provided with positioning holes (76), and the fixing pin (72) is plugged into the inner wall of the positioning hole (76).

2. The improved light emitting diode structure according to claim 1, characterized in that: The side surfaces of the first clamping plate (74) and the second clamping plate (75) are both provided with a guide groove (77), and the guide groove (77) is connected to the inner wall of the positioning hole (76).

3. The improved light emitting diode structure according to claim 1, characterized in that: The upper surface of the support frame (73) is fixedly connected to a protective frame (78), and the protective frame (78) is sleeved with the surface of the wire (5).

4. The improved light emitting diode structure according to claim 1, characterized in that: Both ends of the fixing pin (72) are chamfered.

5. The improved light emitting diode structure according to claim 1, characterized in that: The first clamp (74) contacts the surface of the positive electrode pin (1), and the number of the first clamp (74) is two. The two first clamps (74) are symmetrically arranged in the front and back direction with respect to the positive electrode pin (1). The second clamp (75) contacts the surface of the negative electrode pin (2), and the number of the second clamp (75) matches that of the first clamp (74).

6. The improved light emitting diode structure according to claim 2, characterized in that: The inner wall of the guide groove (77) is chamfered, and the guide groove (77) is adapted to the diameter of the fixing pin (72).

7. The improved light emitting diode structure according to claim 3, characterized in that: The protective frame (78) contacts the upper surface of the positive electrode pin (1), and the protective frame (78) contacts the upper surface of the negative electrode pin (2).

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