Die assembly of sealing gasket for semiconductor equipment

Abstract

The utility model discloses a die assembly of a sealing gasket for semiconductor equipment, which comprises a die assembly and a sealing gasket, the die assembly comprises a lower die unit and an upper die unit, and the lower die unit and / or the lower die unit is provided with a material injection runner and a negative pressure runner; and the separating and combining assembly drives the upper mold unit and the lower mold unit to be combined and separated, in the mold combining state, the upper mold unit and the lower mold unit define an annular injection molding cavity and a burr cavity, the injection molding cavity communicates between the material injection runner and the negative pressure runner, and the burr cavity comprises an inner annular cavity and / or an outer annular cavity adjacent to the injection molding cavity. According to the mold assembly of the sealing gasket for the semiconductor equipment, the injection molding cavity and the burr cavity adjacent to the injection molding cavity are defined when the upper mold unit and the lower mold unit are closed, part of redundant materials and air can conveniently flow into the burr cavity to form burrs after being injected into the injection molding cavity, it is guaranteed that the injection molding cavity is filled with the materials, the air amount is reduced, and the production efficiency is improved. Therefore, the quality of finally-formed products is ensured and the product precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of rubber injection molding, in particular to a mold component of a sealing gasket for semiconductor equipment. Background Art

[0002] Rubber sealing gaskets have a simple structure and reliable sealing performance. They are widely used in the sealing and isolation fields of various semiconductor equipment. Rubber sealing gaskets are usually made using injection molding technology. By injecting rubber compound into the mold cavity, the molding mold is used to make sealing gaskets of various shapes.

[0003] For example, in the prior art, Chinese patent documents with announcement numbers CN215750460U, CN219405231U, CN213055819U, CN206416456U, and CN113290765B disclose rubber injection molding molds, in which the mold cavity is connected with an injection hole and a negative pressure channel. Rubber compound is injected into the mold cavity through the injection hole, and the negative pressure channel is connected to a negative pressure source to promote the injection of the rubber compound into the mold cavity, thereby facilitating the production of the desired product.

[0004] However, when using the device in the above technical solution to produce rubber sealing gaskets, due to the presence of bubbles in the rubber, the rubber compound cannot completely fill the interior of the mold cavity, ultimately reducing product quality and causing the product to be unqualified; and when producing rubber gaskets of different shapes, different molds need to be replaced, resulting in increased production costs.

[0005] Therefore, it is necessary to improve the mold assembly of the rubber sealing gasket in the prior art. Utility Model Content

[0006] The purpose of the utility model is to overcome the defects in the prior art and provide a mold assembly for a sealing gasket for semiconductor equipment, which improves product quality, is convenient to replace and reduces production costs.

[0007] To achieve the above technical effects, the technical solution of the present invention is: a mold assembly for a sealing gasket for semiconductor equipment, comprising:

[0008] A mold assembly, the mold assembly comprising a horizontal lower mold unit and an upper mold unit horizontally arranged directly above the lower mold unit, the lower mold unit and / or the upper mold unit being provided with an injection runner and a negative pressure runner whose ends extend to the outer surface of the mold assembly, the negative pressure runner being used to connect to a negative pressure source;

[0009] a closing and opening assembly, the closing and opening assembly driving the upper mold unit and the lower mold unit to close and open the mold, wherein in the closed state, the upper mold unit and the lower mold unit enclose a ring-shaped injection cavity, and the injection cavity is connected between the injection runner and the negative pressure runner;

[0010] In the mold closing state, the upper mold unit and the lower mold unit also enclose a ring-shaped burr cavity, and the burr cavity includes an inner ring cavity and / or an outer ring cavity. The inner ring cavity is arranged adjacent to the inner side of the injection cavity, and the injection cavity is arranged adjacent to the inner side of the outer ring cavity.

[0011] Preferably, in order to facilitate the uniform flow of excess material into the burr cavity during the injection molding process and ensure the molding accuracy of the product, the burr cavity and the injection molding cavity are coaxial.

[0012] Preferably, in order to facilitate the excess material in the injection cavity to flow out from both the inner and outer sides, the burr cavity includes an inner ring cavity and an outer ring cavity.

[0013] Preferably, in order to ensure the molding accuracy of the product, the burr cavity and the injection molding cavity are clearance-matched.

[0014] Preferably, in order to facilitate the production of different types of sealing gaskets, the lower mold unit includes a lower mold base and a lower mold core detachably arranged on the lower mold base, and the top surface of the lower mold core is provided with a lower cavity. The upper mold unit includes an upper mold base and an upper mold core detachably arranged on the upper mold base, and the bottom surface of the upper mold core is provided with an upper cavity. The injection cavity is formed by a combination of the lower cavity and the upper cavity.

[0015] Preferably, in order to achieve a quick and detachable connection between the lower die core and the lower die base and between the upper die core and the lower die base, the lower die core is fixedly connected to the lower die base by a first bolt, and the upper die core is fixedly connected to the upper die base by a second bolt.

[0016] Preferably, in order to facilitate the discharge of rubber material during injection molding, the negative pressure flow channel is provided on the lower mold unit.

[0017] Preferably, in order to form a negative pressure flow channel on the lower mold unit, the negative pressure flow channel includes a first negative pressure groove, a negative pressure depression, a second negative pressure groove and a negative pressure channel, all of which are arranged on the parting surface of the lower mold unit, one end of the first negative pressure groove is connected to the lower mold cavity, and the other end is connected to the negative pressure channel through the negative pressure depression and the second negative pressure groove in sequence, at least two first negative pressure grooves are provided and the groove width is smaller than the groove width of the second negative pressure groove, the groove depth of the first negative pressure groove is smaller than the depth of the negative pressure depression, and the negative pressure channel extends away from one end of the second negative pressure groove to the circumferential side wall of the lower mold base.

[0018] Preferably, in order to facilitate the one-time production of multiple sealing gaskets and improve production efficiency, at least two injection molding cavities are provided.

[0019] Preferably, in order to ensure the sealing performance after the lower mold unit and the upper mold unit are closed, an elastic sealing ring is provided between the lower mold unit and the upper mold unit, and the injection cavity is located inside the sealing ring.

[0020] To sum up, compared with the prior art, the mold assembly of the sealing gasket for semiconductor equipment of the utility model forms an injection cavity and a burr cavity adjacent to the injection cavity by enclosing the upper mold unit and the lower mold unit when the mold is closed, so that some excess material and air can flow into the burr cavity to form burrs after being injected into the injection cavity, thereby ensuring that the material fills the injection cavity, reducing the amount of air, and thus ensuring the quality of the final molded product and improving the product precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of the utility model;

[0022] Figure 2 yes Figure 1 Explosion diagram of

[0023] Figure 3 It is a partial structural diagram of the split and combined components of the utility model;

[0024] Figure 4 This is a schematic structural diagram of the mold assembly of the utility model in the mold closing state;

[0025] Figure 5 yes Figure 4 Schematic diagram of the cross-section structure;

[0026] Figure 6 yes Figure 5 A magnified view of part A;

[0027] Figure 7 yes Figure 5 A magnified view of part B;

[0028] Figure 8 yes Figure 4 Explosion diagram of

[0029] Figure 9 yes Figure 8 Magnified view of part C;

[0030] Figure 10 yes Figure 4 Structural diagram from another perspective;

[0031] Figure 11 This is a structural diagram of the upper mold core of the utility model;

[0032] In the figure: 1. Lower mold unit; 11. Lower mold core; 111. Lower cavity; 112. First negative pressure groove; 113. Negative pressure depression; 114. Lower outer ring groove; 115. Lower inner ring groove; 116. Injection blind hole; 117. Lower injection slot; 12. Lower mold base; 121. Sealing groove; 122. Positioning column; 123. Second negative pressure groove; 124. Negative pressure channel; 125. Lower mounting depression; 13. First bolt; 2. Upper mold unit; 21. Upper mold core; 211. Upper cavity; 212. Upper outer ring groove; 213. Upper inner ring groove; 214. Injection through hole; 215. Upper injection groove; 22. Upper mold base; 221. Positioning hole; 222. Connecting through hole; 223. Upper mounting recess; 225. Upper connecting hole; 23. Second bolt; 3. Injection flow channel; 4. Negative pressure flow channel; 5. Splitting and combining assembly; 51. Base; 511. Lower positioning folding plate; 512. Third bolt; 52. Support frame; 53. Lifting cylinder; 54. Top frame; 541. Upper positioning folding plate; 542. Fourth bolt; 55. Injection tube; 6. Injection cavity; 7. Burr cavity; 71. Inner ring cavity; 72. Outer ring cavity; 8. Sealing ring. DETAILED DESCRIPTION

[0033] The following embodiments are used to further describe the specific embodiments of the present invention in conjunction with the accompanying drawings and examples. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0034] like Figures 1-11 As shown, the mold assembly of the sealing gasket for semiconductor equipment of the present invention includes:

[0035] The mold assembly includes a horizontal lower mold unit 1 and an upper mold unit 2 horizontally arranged directly above the lower mold unit 1. The lower mold unit 1 and / or the upper mold unit 1 are provided with an injection flow channel 3 and a negative pressure flow channel 4 whose ends extend to the outer surface of the mold assembly. The negative pressure flow channel 4 is used to connect to a negative pressure source;

[0036] The splitting and closing assembly 5 drives the upper mold unit 2 and the lower mold unit 1 to close and separate the molds. In the closed state, the upper mold unit 2 and the lower mold unit 1 enclose an annular injection cavity 6, and the injection cavity 6 is connected between the injection runner 3 and the negative pressure runner 4;

[0037] In the mold closing state, the upper mold unit 2 and the lower mold unit 1 also enclose a ring-shaped burr cavity 7, which includes an inner ring cavity 71 and / or an outer ring cavity 72. The inner ring cavity 71 is arranged adjacent to the inner side of the injection cavity 6, and the injection cavity 6 is arranged adjacent to the inner side of the outer ring cavity 72.

[0038] To improve production efficiency, the mold assembly of the present invention has at least two injection cavities 6 after the lower mold unit 1 and upper mold unit 2 are closed. Specifically, the injection cavities 6 are arranged in two columns and four rows, totaling eight. This allows the device to produce eight rubber sealing gaskets at a time, thereby improving production efficiency. Of course, the mold assembly can also be designed with other numbers of injection cavities 6 depending on actual production needs.

[0039] Unlike the prior art, in the mold assembly of the present invention, after the lower mold unit 1 and the upper mold unit 2 are closed, in addition to enclosing the injection cavity 6, they also enclose a burr cavity 7 adjacent to the injection cavity 6. In this way, in the process of injecting rubber compound into the injection cavity 6 through the injection channel 3 and attracting the rubber compound to flow through the negative pressure channel 4, the burr cavity 7 can accommodate some excess rubber and air in the rubber, which is conducive to the rubber compound filling the injection cavity 6, and thus can ensure the quality of the product finally molded in the injection cavity 6, and the rubber entering the burr cavity 7 forms burrs on the side walls of the product. After molding, the burrs are removed to obtain the final product. Therefore, by accommodating some excess rubber compound and air through the burr cavity 7, the injection cavity 6 is filled with rubber compound, which ultimately improves the quality of the product.

[0040] A further improvement is that the burr cavity 7 includes an inner ring cavity 71 and an outer ring cavity 72 , and the burr cavity 7 is coaxial with the injection cavity 6 .

[0041] After adopting the above design, when injecting rubber compound into the injection cavity 6, excess compound and air can be evenly injected into the inner ring cavity 71 and the outer ring cavity 72 from the inner and outer sides of the injection cavity 6 respectively, so that the rubber compound in the injection cavity 6 is evenly distributed, thereby improving the quality of the final molded product. The burr cavity 7 includes the inner ring cavity 71 and the outer ring cavity 72, which increases the overall capacity of the burr cavity 7 to accommodate the compound and bubbles flowing out from the inner and outer sides of the injection cavity 6.

[0042] A further improvement is that the burr cavity 7 and the injection cavity 6 are clearance-matched.

[0043] After adopting the above design, the inner ring cavity 71 and the outer ring cavity 72 are separated, avoiding direct circulation. After injection molding, the burrs formed in the inner ring cavity 71 and the outer ring cavity 72 are adjacent to the rubber sealing gasket product through the thin rubber sheet, thereby facilitating the tearing off of the rubber sheet and the burrs from the inner and outer sides of the rubber sealing gasket product.

[0044] A further improvement is that the lower mold unit 1 includes a lower mold base 12 and a lower mold core 11 detachably arranged on the lower mold base 12, and the top surface of the lower mold core 11 is provided with a lower cavity 111, and the upper mold unit 2 includes an upper mold base 22 and an upper mold core 21 detachably arranged on the upper mold base 22, and the bottom surface of the upper mold core 21 is provided with an upper cavity 211, and the injection cavity 6 is formed by a combination of the lower cavity 111 and the upper cavity 211; the lower mold core 11 is fixedly connected to the lower mold base 12 by a first bolt 13, and the upper mold core 21 is fixedly connected to the upper mold base 22 by a second bolt 23.

[0045] After adopting the above design, it is convenient to replace and install the lower mold core 11 on the lower mold base 12, and to replace and install the upper mold core 21 on the upper mold base 22. The lower cavity 111 of the lower mold core 11 and the upper cavity 211 of the upper mold core 21 are combined to form injection cavities 6 of different shapes, which is convenient for producing rubber sealing gaskets of different models and specifications. In this way, a split installation is adopted, and different rubber sealing gaskets can be produced by replacing only the upper mold core 21 and the lower mold core 11, avoiding the increase in replacement and production costs caused by replacing the entire mold; the first bolt 13 facilitates the quick and detachable connection between the lower mold core 11 and the lower mold base 12, and the second bolt 23 facilitates the quick and detachable connection between the upper mold core 21 and the upper mold base 22.

[0046] Specifically, in the present invention, the lower mold base 12 and the upper mold base 22 are both horizontal rectangular parallelepipeds with consistent length and width dimensions. The top surface of the lower mold base 12 and the top surface of the lower mold core 11 are located on the same horizontal plane, that is, the parting surface of the lower mold unit 1. The corresponding bottom surface of the upper mold base 22 and the top surface of the upper mold core 21 are located on the same horizontal plane, that is, the parting surface of the upper mold unit 2.

[0047] Among them, the top surface of the lower die base 12 is provided with eight lower mounting recesses 125 distributed in a rectangular array, and the lower mounting recesses 125 are adapted to the lower die core 11. The first bolt 13 passes through the bottom of the lower mounting recess 125 along the vertical direction and is threadedly connected to the bottom of the lower die core 11. In this way, a quick and detachable connection between the lower die core 11 and the lower die base 12 is realized; and the top surface of the lower die core 11 is provided with a lower mold cavity 111, a lower outer ring groove 114 and a lower inner ring groove 115 coaxial with the center line thereof, and the lower mold cavity 111 is located between the lower outer ring groove 114 and the lower inner ring groove 115.

[0048] Correspondingly, the bottom surface of the upper mold base 22 is provided with eight upper mounting recesses 223 distributed in a rectangular array, and the upper mounting recesses 223 are adapted to the upper mold core 21. The upper mounting recesses 223 correspond one to one with the lower mounting recesses 125 and are arranged opposite each other. The second bolt 23 passes through the top of the upper mounting recess 223 and is threadedly connected to the top of the upper mold core 21. In this way, a quick and detachable connection between the upper mold core 21 and the upper mold base 22 is realized; and the bottom surface of the upper mold core 21 is provided with an upper mold cavity 211, an upper outer ring groove 212 and an upper inner ring groove 213 coaxial with the upper mold core 21, and the upper mold cavity 211 is located between the upper outer ring groove 212 and the upper inner ring groove 213.

[0049] After adopting the above structure, when the lower mold unit 1 and the upper mold unit 2 are closed, Figure 7 As shown, the cavity mouth of the upper cavity 211 coincides with the cavity mouth of the lower cavity 111, and the upper cavity 211 and the lower cavity 111 are combined to form the injection cavity 6, and the notch of the upper outer ring groove 212 coincides with the notch of the lower outer ring groove 114, and the upper outer ring groove 212 and the lower outer ring groove 114 are combined to form an outer ring cavity 72 whose coaxial centerline is closely adjacent to the outside of the injection cavity 6. Correspondingly, the notch of the upper inner ring groove 213 coincides with the notch of the lower inner ring groove 115, and the upper inner ring groove 213 and the lower inner ring groove 115 are combined to form an inner ring cavity 71 whose coaxial centerline is closely arranged on the inside of the injection cavity 6. The inner ring cavity 71 and the outer ring cavity 72 form a burr cavity 7 that is adjacent to the injection cavity 6 and has a gap therebetween, so that after the mold is closed, the burr cavity 7 can accommodate excess material and air, thereby ensuring the filling degree of the rubber material in the injection cavity 6 and thereby improving product quality.

[0050] In order to ensure the precise docking of the upper mold unit 2 and the lower mold unit 1, the four corners of the lower mold base 12 are provided with positioning columns 122 protruding from the top surface of the upper mold unit 2 and extending in the vertical direction, and the four corners of the upper mold base 22 are provided with positioning holes 221 extending in the vertical direction and in the shape of through holes. The positioning holes 221 correspond to and match the positioning columns 122 one by one. When the upper mold unit 2 and the lower mold unit 1 are closed, the positioning columns 122 are plugged into and matched with the positioning holes 221 to ensure the precise docking of the upper mold core 21 and the lower mold core 11.

[0051] In order to form an injection channel 3 connected to the injection cavity 6, the injection channel 3 in the present invention is mainly composed of three parts. The first part is an upper connecting hole 225 provided on the upper mounting recess 223 of the upper mold base 22. The second part includes an injection through hole 214 and an upper injection groove 215 provided on the bottom surface of the upper mold core 21. The upper injection groove 215 is connected between the top of the injection through hole 214 and the upper cavity 211. The third part includes an injection blind hole 116 and a lower injection groove 117 provided on the top surface of the lower mold core 11. The lower injection groove 117 is connected between the injection blind hole 116 and the lower cavity 111. When the upper mold unit 2 and the lower mold unit 1 are closed, the upper connecting hole 225, the injection through hole 214 and the injection blind hole 116 are connected in sequence along the coaxial center line. The notches of the upper injection groove 215 and the lower injection groove 117 coincide and are combined to form an injection channel. The injection channel is connected to the injection cavity 6, thereby forming an injection runner 3 connected to the injection cavity 6. The rubber compound for producing the rubber sealing gasket is conveniently injected into the injection cavity 6 through the injection runner 3.

[0052] Corresponding to the injection flow channel 3, the negative pressure flow channel 4 is provided on the lower mold unit 1, as shown in FIG. Figure 7 and Figure 9 As shown, the negative pressure flow channel 4 includes a first negative pressure groove 112, a negative pressure recess 113, a second negative pressure groove 123 and a negative pressure channel 124, all of which are arranged on the parting surface of the lower mold unit 1. One end of the first negative pressure groove 112 is connected to the lower mold cavity 111, and the other end is connected to the negative pressure channel 124 through the negative pressure recess 113 and the second negative pressure groove 123 in sequence. The first negative pressure groove 112 is provided with at least two grooves whose width is smaller than the width of the second negative pressure groove 123. The groove depth of the first negative pressure groove 112 is smaller than the depth of the negative pressure recess 113. The negative pressure channel 124 extends away from one end of the second negative pressure groove 123 to the circumferential side wall of the lower mold base 12.

[0053] Specifically, the negative pressure flow channel 4 is divided into two parts as a whole, which are respectively arranged on the lower mold core 11 and the lower mold base 12. The first part includes a first negative pressure groove 112 and a negative pressure recess 113 that are connected, wherein the groove depth of the first negative pressure groove 112 is smaller than the negative pressure recess 113 and there are multiple negative pressure recesses 113 distributed side by side, and the side of the negative pressure recess 113 away from the first negative pressure groove 112 extends to the circumferential outer edge of the lower mold core 11, and the end of the first negative pressure groove 112 away from the negative pressure recess 113 is connected to the lower mold cavity 111. The second part includes a second negative pressure groove 123 and a negative pressure channel 124 that are connected, and the groove width of the second negative pressure groove 123 is greater than that of the first negative pressure groove The groove width 112 is set on the top surface of the lower mold base 12, one end of the negative pressure channel 124 is located on the top surface of the lower mold base 12, and the other end extends to one of the side walls of the lower mold base 12. When the lower mold core 11 is fixedly installed on the lower mold base 12 by the first bolt 13, the negative pressure recess 113 is connected with the second negative pressure groove 123, so that the first negative pressure groove 112, the negative pressure recess 113, the second negative pressure groove 123 and the negative pressure channel 124 are combined to form a negative pressure flow, which is convenient for attracting the rubber compound to flow during the injection molding process. There are multiple first negative pressure grooves 112, which can effectively avoid blockage caused by slow flow of the compound.

[0054] A further improvement is that an elastic sealing ring 8 is provided between the lower mold unit 1 and the upper mold unit 2 , and the injection cavity 6 is located inside the sealing ring 8 .

[0055] Specifically, a closed-loop sealing groove 121 is provided on the top surface of the lower mold base 12, and a sealing ring 8 is provided in the sealing groove 121. In a natural state, the top of the sealing ring 8 protrudes from the notch of the sealing groove 121. After the mold is closed, the top surface of the sealing ring 8 is squeezed and deformed by the upper mold base 22. While the upper mold base 22 and the lower mold base 12 are sealed and fitted, the sealing ring 8 is clamped between the upper mold base 22 and the lower mold base 12 to ensure sealing. Preferably, the sealing ring 8 is a rubber ring.

[0056] In order to realize the closing and opening operations of the lower mold unit 1 and the upper mold unit 2, the closing and opening assembly 5 includes a horizontal base 51, on which four L-shaped lower positioning folding plates 511 are fixed. The four lower positioning folding plates 511 enclose a lower positioning area, which is adapted to the lower mold base 12. Third bolts 512 are provided at both ends of the lower positioning folding plates 511. The third bolts 512 are threadedly connected to the lower mold base 12 to facilitate the detachable connection between the lower mold base 12 and the base 51.

[0057] Two support frames 52 are fixed above the base 51. The support frames 52 are in an inverted U shape. Two lifting cylinders 53 are provided on the top of the support frames 52. The cylinder barrels of the lifting cylinders 53 are fixed above the support frames 52. The piston rods are downward and fixedly connected to the horizontal top frame 54. Four L-shaped upper positioning folding plates 541 are fixed at the four corners of the bottom of the top frame 54. The four upper positioning folding plates 541 enclose an upper positioning area, which is adapted to the upper mold base 22. Fourth bolts are provided at both ends of the upper positioning folding plates 541. 542, the fourth bolt 542 is threadedly connected to the upper mold base 22, which facilitates the detachable connection between the lower mold base 12 and the top frame 54; an injection tube 55 is also fixed on the top frame 54, and the injection tube 55 has an upward input end and eight downward output ends. The top surface of the upper mold base 22 is fixed with a connecting through hole 222 that is coaxially connected to the eight upper connecting holes 225 in a one-to-one correspondence. The connecting through hole 222 corresponds to the output end of the injection tube 55 in a one-to-one correspondence and is plug-fitted, which facilitates the injection of rubber compound into the injection channel 3 through the injection tube 55.

[0058] After adopting the above structure, the support frame 52 is used to support the lifting cylinder 53, and the lifting cylinder 53 drives the top frame 54 to move up and down, thereby realizing the lifting and moving of the upper mold unit 2 fixed under the top frame 54, making it convenient for the upper mold unit 2 to achieve mold closing and mold separation with the lower mold unit 1 fixed at a fixed position on the base 51 through its own lifting and moving.

[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A mold assembly for a sealing gasket for semiconductor equipment, comprising: A mold assembly, the mold assembly comprising a horizontal lower mold unit (1) and an upper mold unit (2) horizontally arranged directly above the lower mold unit (1), the lower mold unit (1) and / or the upper mold unit (1) being provided with an injection flow channel (3) and a negative pressure flow channel (4) whose end portion extends to the outer surface of the mold assembly, the negative pressure flow channel (4) being used for connecting to a negative pressure source; a closing and opening assembly (5), wherein the closing and opening assembly (5) drives the upper mold unit (2) and the lower mold unit (1) to close and open the mold; in the closed mold state, the upper mold unit (2) and the lower mold unit (1) enclose and form an annular injection cavity (6); the injection cavity (6) is connected between the injection flow channel (3) and the negative pressure flow channel (4); Its characteristics are: In the mold closing state, the upper mold unit (2) and the lower mold unit (1) further enclose an annular burr cavity (7), the burr cavity (7) comprising an inner ring cavity (71) and / or an outer ring cavity (72), the inner ring cavity (71) being arranged adjacent to the inner side of the injection mold cavity (6), and the injection mold cavity (6) being arranged adjacent to the inner side of the outer ring cavity (72).

2. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: The burr cavity (7) and the injection cavity (6) are coaxial.

3. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: The burr cavity (7) comprises an inner annular cavity (71) and an outer annular cavity (72).

4. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: The burr cavity (7) is clearance-matched with the injection cavity (6).

5. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: The lower mold unit (1) comprises a lower mold base (12) and a lower mold core (11) detachably arranged on the lower mold base (12), the top surface of the lower mold core (11) being provided with a lower mold cavity (111), the upper mold unit (2) comprises an upper mold base (22) and an upper mold core (21) detachably arranged on the upper mold base (22), the bottom surface of the upper mold core (21) being provided with an upper mold cavity (211), and the injection mold cavity (6) being formed by combining the lower mold cavity (111) and the upper mold cavity (211).

6. The mold assembly for a semiconductor device sealing gasket according to claim 5, wherein: The lower die core (11) is fixedly connected to the lower die base (12) via a first bolt (13), and the upper die core (21) is fixedly connected to the upper die base (22) via a second bolt (23).

7. The mold assembly for a semiconductor device sealing gasket according to claim 5, wherein: The negative pressure flow channel (4) is arranged on the lower mold unit (1).

8. The mold assembly for a semiconductor device sealing gasket according to claim 7, wherein: The negative pressure flow channel (4) includes a first negative pressure groove (112), a negative pressure depression (113), a second negative pressure groove (123) and a negative pressure channel (124) all arranged on the parting surface of the lower mold unit (1), one end of the first negative pressure groove (112) is connected to the lower mold cavity (111), and the other end is connected to the negative pressure channel (124) through the negative pressure depression (113) and the second negative pressure groove (123) in sequence, the first negative pressure groove (112) is provided with at least two grooves and the groove width is smaller than the groove width of the second negative pressure groove (123), the groove depth of the first negative pressure groove (112) is smaller than the depth of the negative pressure depression (113), and the negative pressure channel (124) extends away from one end of the second negative pressure groove (123) to the circumferential side wall of the lower mold base (12).

9. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: At least two injection molding cavities (6) are provided.

10. The mold assembly for a semiconductor device sealing gasket according to claim 1, wherein: An elastic sealing ring (8) is provided between the lower mold unit (1) and the upper mold unit (2), and the injection mold cavity (6) is located inside the sealing ring (8).

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