Laminating device for ITO conductive film production

Abstract

The utility model provides a laminating device for ITO conducting film production, and relates to the ITO conducting film production field, the laminating device comprises an ITO conducting film laminating machine and a processing table, the surface of the ITO conducting film laminating machine is fixedly provided with the processing table, the inner side wall of the upper end of the ITO conducting film laminating machine is provided with an electric sliding table, the lower end of the electric sliding table is connected with a displacement top plate through an electric push rod, and the displacement top plate is provided with a displacement groove. The lower end face of the shifting top plate is connected with a balance weight pressing plate through a spring, the front side and the rear side of the shifting top plate are connected with connecting side plates in a sliding mode, the connecting side plates are connected with a springback rubber roller through rotating shafts, and the lower arc face of the balance weight pressing plate makes contact with the upper roller face of the springback rubber roller through an auxiliary roller. The utility model solves the problem that the pressing wheel of the pressing mechanism in the prior art is difficult to tightly roll and press on the non-planar film fitting surface.

Description

Technical Field

[0001] The utility model relates to the technical field of ITO conductive film production, in particular to a laminating device for ITO conductive film production. Background Art

[0002] ITO conductive film refers to a high-tech product obtained by sputtering a transparent indium tin oxide (ITO) conductive film coating on a transparent organic film material using a magnetron sputtering method and then undergoing high-temperature annealing treatment. The produced conductive film is usually bonded to the substrate of the desired product. After searching, the prior art (application number: CN202120516989.7) An ACF conductive film die-cutting and laminating device An ACF conductive film die-cutting and laminating device is recorded in the article. "The carrier film and the conductive film can be transported by the first conveying mechanism, and the carrier film and the conductive film can be tightly bonded to form a first composite film by the first pressing mechanism." However, the pressing wheel of the pressing mechanism in the prior art is difficult to roll and press tightly on the non-planar film bonding surface. Utility Model Content

[0003] In order to overcome the defects of the existing technology, a laminating device for ITO conductive film production is now provided to solve the problem in the existing technology that the pressure wheel of the pressing mechanism is difficult to roll and press tightly on the non-planar film laminating surface.

[0004] In order to achieve the above object, a laminating device for producing ITO conductive film is provided, comprising: an ITO conductive film laminating machine and a processing table, wherein the processing table is fixed on the surface of the ITO conductive film laminating machine.

[0005] An electric slide is installed on the inner side wall of the upper end of the ITO conductive film laminating machine, and the lower end of the electric slide is connected to a shifting top plate through an electric push rod. The lower end surface of the shifting top plate is connected to a counterweight pressure plate through a spring, and the front and rear sides of the shifting top plate are slidingly connected to connecting side plates, and the connecting side plates are connected to a rebound rubber roller through a rotating shaft. The lower arc surface of the counterweight pressure plate contacts the upper roller surface of the rebound rubber roller through an auxiliary roller.

[0006] Furthermore, a film sleeve column is fixed on the front surface of the ITO conductive film laminating machine; and a rebound rubber roller is distributed at the right end of the film sleeve column, and a film guide roller pair is installed at the lower end of the film sleeve column.

[0007] Furthermore, the upper surface of the processing table is symmetrically distributed with limiting clamps in the front and back directions, and the lower end of the limiting clamp is connected to the processing table through a screw and nut mechanism.

[0008] Furthermore, the front end shaft of the screw nut mechanism is connected to an adjusting column head, and a glue storage box is placed on the right end of the processing table, and a glue brush is inserted into the glue storage box.

[0009] Furthermore, a handle is installed on the upper surface of the glue brush, and the groove surface at the upper end of the glue storage box is inclined; and UV glue is stored in the glue storage box.

[0010] Furthermore, the upper surface of the counterweight pressure plate is connected to the displacement top plate through a limiting rod; and the counterweight pressure plate is in the shape of an arc plate.

[0011] Furthermore, three groups of auxiliary rollers are axially connected to the lower arc surface of the counterweight pressure plate; and three groups of springs are correspondingly distributed above the three groups of auxiliary rollers.

[0012] The beneficial effect of the present invention is that the bonding device for ITO conductive film production of the present invention utilizes a rebound rubber roller to roll on the surface of the ITO conductive film bonded to the substrate, and applies downward pressure to the rebound rubber roller whose lower arc surface contacts the auxiliary roller through a counterweight pressure plate, so that the lower roller surface of the rebound rubber roller is deformed and pressed onto the uneven surface of the ITO conductive film, so that the roller surface of the rebound rubber roller can fully contact the bonded ITO conductive film, thereby facilitating the enhancement of the bonding of the ITO conductive film to the curved surface and the substrate with a curvature, ensuring that the ITO conductive film is tightly bonded, and improving the bonding effect of the ITO conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a front structural schematic diagram of an ITO conductive film production laminating device according to an embodiment of the present utility model.

[0014] Figure 2 This is a schematic diagram of the front cross-sectional structure of a laminating device for producing an ITO conductive film according to an embodiment of the present utility model.

[0015] Figure 3 This is a schematic diagram of the front cross-sectional connection structure of the rebound rubber roller according to an embodiment of the present utility model.

[0016] Figure 4 This is a side view schematic diagram of the connection structure of the rebound rubber roller according to an embodiment of the present utility model.

[0017] In the figure: 1. ITO conductive film laminating machine; 11. Film covering column; 12. Film guide roller; 2. Processing table; 21. Adjusting column head; 22. Limiting splint; 23. Screw nut mechanism; 3. Shifting top plate; 31. Electric slide; 32. Electric push rod; 4. Rebound rubber roller; 41. Connecting side plate; 42. Counterweight pressure plate; 43. Spring; 44. Rotating shaft; 45. Auxiliary roller; 46. Limiting rod; 5. Glue brush; 51. Handle; 52. Glue storage box. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] Reference Figures 1 to 4 As shown, the utility model provides a laminating device for producing ITO conductive film, comprising: an ITO conductive film laminating machine 1 and a processing table 2. The processing table 2 is fixed on the surface of the ITO conductive film laminating machine 1.

[0020] An electric slide 31 is installed on the inner side wall of the upper end of the ITO conductive film laminating machine 1. The lower end of the electric slide 31 is connected to the shift top plate 3 through an electric push rod 32. The lower end surface of the shift top plate 3 is connected to the counterweight pressure plate 42 through a spring 43. The front and rear sides of the shift top plate 3 are slidably connected to the connecting side plate 41. The connecting side plate 41 is connected to the rebound rubber roller 4 through a rotating shaft 44. The lower arc surface of the counterweight pressure plate 42 contacts the upper roller surface of the rebound rubber roller 4 through an auxiliary roller 45.

[0021] First, the substrate is fixedly clamped on the processing table 2, and the glue brush 5 is used to apply glue to the bonding surface of the substrate. Then, the ITO conductive film is pulled to cover the surface of the substrate on the processing table 2, and the rebound rubber roller 4 is driven to move left to the processing table 2, and the electric push rod 32 is controlled to push the rebound rubber roller 4 downward so that the lower rubber roller surface of the rebound rubber roller 4 contacts the ITO conductive film on the surface of the substrate. At this time, the weight of the counterweight pressure plate 42 further presses the rebound rubber roller 4 downward so that the lower roller surface of the rebound rubber roller 4 is deformed and pressed on the surface of the ITO conductive film, and then the rebound rubber roller 4 is driven to move left and right on the substrate so that the substrate and the ITO conductive film are tightly bonded. After the bonding is good, the excess ITO conductive film can be cut off.

[0022] In this embodiment, a film sleeve column 11 is fixed to the front surface of the ITO conductive film laminating machine 1 ; and the rebound rubber roller 4 is distributed at the right end of the film sleeve column 11 , and a film guide roller pair 12 is installed at the lower end of the film sleeve column 11 .

[0023] As a preferred embodiment, the film sleeve column 11 is convenient for sleeve-fitting the ITO conductive film wound into a tube, so that the ITO conductive film is transported through the film guide roller 12, and the ITO conductive film is conveniently pulled to cover the substrate surface of the processing table 2.

[0024] In this embodiment, the upper surface of the processing table 2 is symmetrically distributed front and back with limit clamps 22. The lower ends of the limit clamps 22 are connected to the processing table 2 via a screw-nut mechanism 23. An adjustment stud 21 is axially connected to the front end of the screw-nut mechanism 23. A glue storage box 52 is placed on the right side of the processing table 2, and a glue brush 5 is inserted into the glue storage box 52. The glue brush 5 has a handle 51 on its upper surface. The upper end of the glue storage box 52 has an inclined groove surface. The glue storage box 52 stores UV glue.

[0025] As a preferred embodiment, the limiting clamps 22 facilitate clamping and positioning of the substrate placed on the processing table 2, preventing displacement during lamination. The screw-nut mechanism 23 drives the two sets of limiting clamps 22 in synchronous, opposite directions by adjusting the rotation of the stud 21. The glue brush 5 applies UV glue to the substrate surface, ensuring adhesion and lamination of the ITO conductive film to the substrate surface.

[0026] In this embodiment, the upper surface of the counterweight plate 42 is connected to the shifting top plate 3 via a limiting rod 46. The counterweight plate 42 is in the shape of an arc. Three sets of auxiliary rollers 45 are axially connected to the lower arc surface of the counterweight plate 42. Three sets of springs 43 are distributed above the three sets of auxiliary rollers 45.

[0027] As a preferred embodiment, the counterweight plate 42 applies downward pressure to the rebound rubber roller 4 via three sets of auxiliary rollers 45 without hindering the normal rolling of the rebound rubber roller 4. This allows the rebound rubber roller 4 to be pressed downward against the uneven surface of the ITO conductive film, ensuring a full and tight fit between the ITO conductive film and the substrate surface. The spring 43 provides stable support for the counterweight plate 42.

[0028] The laminating device for ITO conductive film production of the present invention can effectively solve the problem in the prior art that the pressure wheel of the pressing mechanism is difficult to roll and press tightly onto the non-planar film laminating surface, and facilitates the rebound rubber roller surface to fully contact the laminating ITO conductive film, thereby conveniently enhancing the laminating properties of the ITO conductive film with curved surfaces and substrates with curvature, ensuring that the ITO conductive film is tightly laminated, and improving the laminating effect of the ITO conductive film. The utility model is suitable for a laminating device for ITO conductive film production.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laminating device for producing ITO conductive film, comprising: An ITO conductive film laminating machine (1) and a processing table (2), wherein the processing table (2) is fixed on the surface of the ITO conductive film laminating machine (1), characterized in that: An electric slide (31) is installed on the inner side wall of the upper end of the ITO conductive film laminating machine (1); the lower end of the electric slide (31) is connected to a shifting top plate (3) via an electric push rod (32); the lower end surface of the shifting top plate (3) is connected to a counterweight pressure plate (42) via a spring (43); the front and rear sides of the shifting top plate (3) are slidably connected to a connecting side plate (41); the connecting side plate (41) is connected to a rebound rubber roller (4) via a rotating shaft (44); the lower arc surface of the counterweight pressure plate (42) contacts the upper roller surface of the rebound rubber roller (4) via an auxiliary roller (45).

2. The laminating device for producing an ITO conductive film according to claim 1, characterized in that: A film sleeve column (11) is fixed on the front surface of the ITO conductive film laminating machine (1); and a rebound rubber roller (4) is distributed at the right end of the film sleeve column (11); and a film guide roller (12) is installed at the lower end of the film sleeve column (11).

3. The laminating device for producing an ITO conductive film according to claim 1, characterized in that: The upper surface of the processing table (2) has limit clamps (22) symmetrically distributed front and back, and the lower ends of the limit clamps (22) are connected to the processing table (2) via a screw nut mechanism (23).

4. The laminating device for producing an ITO conductive film according to claim 3, characterized in that: The front end of the screw nut mechanism (23) is axially connected to an adjusting column head (21), and a glue storage box (52) is placed on the right end of the processing table (2), and a glue brush (5) is inserted into the glue storage box (52).

5. The laminating device for producing an ITO conductive film according to claim 4, characterized in that: A handle (51) is installed on the upper surface of the glue brush (5); the upper end groove surface of the glue storage box (52) is in the shape of an inclined plane; and UV glue is stored in the glue storage box (52).

6. The laminating device for producing an ITO conductive film according to claim 1, characterized in that: The upper surface of the counterweight pressing plate (42) is connected to the displacement top plate (3) through a limiting rod (46); and the counterweight pressing plate (42) is in the shape of an arc plate.

7. The laminating device for producing an ITO conductive film according to claim 1, characterized in that: The lower arc surface of the counterweight pressure plate (42) is axially connected to three groups of auxiliary rollers (45); and three groups of springs (43) are correspondingly distributed above the three groups of auxiliary rollers (45).

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