Heat dissipation profile for surface of warmer

Abstract

The utility model discloses a heat dissipation section bar used on the surface of a warmer, which comprises a main board, a plurality of heat dissipation fins, a connecting piece and an embedded piece are arranged on one end face of the main board, the plurality of heat dissipation fins are oppositely and vertically arranged on one end face of the main board, every two heat dissipation fins are arranged at intervals, and the connecting piece is arranged on the other end face of the main board. The connecting piece and the embedded piece are arranged on the left side and the right side of one end face of the main board respectively, the connecting piece is of a rectangular frame structure with an opening facing the outer side, the embedded piece is of an inverted-T-shaped structure with an opening facing the outer side, the diameter of the outer side of the protruding end of the opening in the side edge of the embedded piece is smaller than the diameter of the inner side of the opening in the outer side of the connecting piece, and the cooling fin is of a T-shaped structure. And the upper sides of the cooling fins, the connecting pieces and the embedded pieces are all provided with corrugated structures, heat dissipation is more efficient, installation and connection are easy, and the service life is longer.

Description

Technical Field

[0001] The utility model relates to the technical field of heater equipment, in particular to a heat dissipation profile on the surface of a heater. Background Art

[0002] In the field of heating equipment, the heat dissipation performance of the heater is of vital importance. Traditional heaters often have some shortcomings in heat dissipation, such as low heat dissipation efficiency and unreasonable heat dissipation structure design. As people's requirements for heater performance continue to increase, there is an urgent need for a more efficient and reliable heat dissipation solution. The types of heat dissipation profiles for heaters currently on the market are relatively single, and the heat dissipation effect is limited. Some heat dissipation profiles have a small number of heat sinks and an unreasonable layout, resulting in heat not being dissipated quickly and evenly; some profile materials have poor thermal conductivity, which affects the overall performance of the heater; and some are not convenient enough in connection and installation with other components of the heater, increasing production and use costs.

[0003] To meet the demand for efficient heat dissipation, stable performance, and convenient installation of heaters, it is imperative to develop a new type of heat dissipation profile for the heater surface. This new heat dissipation profile should have a reasonable structural design, excellent thermal conductivity, and easy installation and connection properties to improve the heat dissipation efficiency and user experience of the heater. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a heat dissipation profile for the surface of a heater, which has more efficient heat dissipation, simple installation and connection, and longer service life.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a heat dissipation profile for the surface of a heater, including a main board, and one end face of the main board is further provided with a heat sink, a connector and an embedding part. There are multiple heat sinks, and the multiple heat sinks are relatively vertically arranged on one end face of the main board, and a spacing is set between every two heat sinks. The connector and the embedding part are respectively arranged on the left and right sides of one end face of the main board. The connector is a rectangular frame structure opening to the outside, and the embedding part is a convex structure opening to the outside. The outer diameter of the protruding end of the side opening of the embedding part is smaller than the inner diameter of the outer opening of the connector. The heat sink is a T-shaped structure, and a corrugated structure is provided on the upper side of the heat sink, the connector and the embedding part.

[0006] Preferably, the number of the heat sinks is N, where N is a positive integer greater than or equal to three. The multiple heat sinks are arranged in a horizontal array and vertically on the upper end of one end surface of the mainboard, and the multiple heat sinks are arranged at equal distances.

[0007] Preferably, the mainboard, heat sink, connector and embedded parts are all made of high thermal conductivity aluminum-magnesium alloy, and the outer surfaces of the mainboard, heat sink, connector and embedded parts are coated with a metal oxide coating.

[0008] Preferably, threaded holes are provided on the upper and lower frames of the connecting piece and the embedded piece, and the threaded holes on the upper and lower frames of the connecting piece and the embedded piece are arranged correspondingly.

[0009] The beneficial effects of the present invention are: 1. The present invention increases the contact area between the heat sink and the surrounding air by arranging a T-shaped heat sink on one end face of the mainboard, thereby improving the heat dissipation efficiency, and a certain distance is set between the multiple heat sinks to provide sufficient space for air flow, promote heat convection, and improve heat dissipation efficiency.

[0010] 2. By incorporating a corrugated structure into the connectors, inserts, and upper ends of the heat sink, the wavy heat sink structure offers improved thermal conductivity, allowing heat to diffuse rapidly within the fins. The heat sink then transfers heat to the surrounding air through convection, raising the air temperature and creating airflow that removes the heat. Simultaneously, the heat sink also dissipates a certain amount of heat to the surrounding environment through thermal radiation.

[0011] 3. The outer opening diameter of the embedded part is smaller than the inner opening diameter of the connecting part. During the installation and connection process, multiple heat dissipation profiles can be connected by embedding the embedded part inside the connecting part. At the same time, the upper and lower frames of the embedded part and the connecting part are provided with mounting holes. During the connection process, they are fixed from the bottom with bolts. The hidden installation is more beautiful. At the same time, the connection and fixation between multiple heat dissipation profiles can be carried out in terms of length according to needs, and the choices are more diverse. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 This is the main view of the utility model;

[0014] Figure 3 It is a schematic diagram of multiple installation structures of the utility model.

[0015] Notes in the figure

[0016] 1. Mainboard; 2. Heat sink; 3. Embedded parts; 4. Connectors; 5. Threaded holes. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] Combine Figure 1-3 The utility model is a heat dissipation profile for the surface of a heater, comprising a main board 1, one end surface of the main board 1 is further provided with a heat sink 2, a connecting piece 4 and an embedding piece 3, the heat sink 2 is multiple, and the multiple heat sinks 2 are relatively vertically arranged on one end surface of the main board 1, with a spacing set between every two heat sinks 2, the connecting piece 4 and the embedding piece 3 are respectively arranged on the left and right sides of one end surface of the main board 1, the connecting piece 4 is a rectangular frame structure opening to the outside, and the embedding piece 3 is a convex structure opening to the outside, the outer diameter of the protruding end of the side opening of the embedding piece 3 is smaller than the inner diameter of the outer opening of the connecting piece 4, the heat sink 2 is a T-shaped structure, and a corrugated structure is provided on the upper sides of the heat sink 2, the connecting piece 4 and the embedding piece 3.

[0019] Furthermore, the number of the heat sinks 2 is N, where N is a positive integer greater than or equal to three. The multiple heat sinks 2 are arranged in a horizontal array and vertically on the upper end of one end surface of the mainboard 1, and the multiple heat sinks 2 are arranged at equal intervals.

[0020] Furthermore, the mainboard 1, heat sink 2, connector 4 and embedded part 3 are all made of high thermal conductivity aluminum-magnesium alloy, and the outer surfaces of the mainboard 1, heat sink 2, connector 4 and embedded part 3 are coated with metal oxide coating.

[0021] Furthermore, threaded holes 5 are formed on the upper and lower frames of the connecting member 4 and the embedded member 3 , and the threaded holes 5 on the upper and lower frames of the connecting member 4 and the embedded member 3 are correspondingly arranged.

[0022] This utility model utilizes T-shaped heat sinks 2 positioned on one end of the mainboard 1 to increase the contact area between the heat sink 2 and the surrounding air, thereby improving heat dissipation efficiency. Furthermore, the multiple heat sinks 2 are spaced at regular intervals, providing ample space for air flow, promoting heat convection, and enhancing heat dissipation efficiency. By providing a corrugated structure within the connector 4, the insert 3, and the upper end of the heat sink 2, the wavy heat sink 2 exhibits improved thermal conductivity, allowing heat to diffuse rapidly within the heat sink 2. Subsequently, the heat sink 2 transfers heat to the surrounding air through convection, raising the air temperature and creating airflow that removes the heat. At the same time, the heat sink 2 will also emit a certain amount of heat to the surrounding environment through thermal radiation. The outer opening diameter of the embedded part 3 is smaller than the inner opening diameter of the connecting part 4. During the installation and connection process, multiple heat dissipation profiles can be connected by embedding the embedded part 3 inside the connecting part 4. At the same time, the upper and lower frames of the embedded part 3 and the connecting part 4 are provided with mounting holes. During the connection process, they are fixed from the bottom with bolts, and the hidden installation is more beautiful. At the same time, multiple heat dissipation profiles can be connected and fixed in length according to needs, and the choices are more diverse.

[0023] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation profile for a heater surface, comprising a main board (1), characterized in that: One end face of the mainboard (1) is further provided with a heat sink (2), a connecting piece (4) and an embedded piece (3). There are a plurality of heat sinks (2), and the plurality of heat sinks (2) are relatively vertically arranged on one end face of the mainboard (1). A spacing is arranged between each two heat sinks (2). The connecting piece (4) and the embedded piece (3) are respectively arranged on the left and right sides of one end face of the mainboard (1). The connecting piece (4) is a rectangular frame structure opening outward, and the embedded piece (3) is a convex structure opening outward. The outer diameter of the protruding end of the side opening of the embedded piece (3) is smaller than the inner diameter of the outer opening of the connecting piece (4). The heat sink (2) is a T-shaped structure. The upper sides of the heat sink (2), the connecting piece (4) and the embedded piece (3) are all provided with a corrugated structure.

2. The heat dissipation profile for the surface of a heater according to claim 1, characterized in that: The number of the heat sinks (2) is N, where N is a positive integer greater than or equal to three. The plurality of heat sinks (2) are arranged in a horizontal array and vertically on the upper end of one end surface of the mainboard (1). The plurality of heat sinks (2) are arranged at equal intervals.

3. The heat dissipation profile for the surface of a heater according to claim 1, characterized in that: The mainboard (1), heat sink (2), connector (4) and embedded part (3) are all made of a high thermal conductivity aluminum-magnesium alloy, and the outer surfaces of the mainboard (1), heat sink (2), connector (4) and embedded part (3) are all coated with a metal oxide coating.

4. The heat dissipation profile for the surface of a heater according to claim 1, characterized in that: The connecting piece (4) and the upper and lower frames of the embedded piece (3) are both provided with threaded holes (5), and the threaded holes (5) on the connecting piece (4) and the upper and lower frames of the embedded piece (3) are arranged correspondingly.

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