Chip aging test seat for microchip

Abstract

The chip aging test seat comprises a base, a placement groove is formed in the center of the top of the base, a negative pressure air channel is formed in one side of the interior of the base, and one end, located at the negative pressure air channel, of the base is connected with a connecting pipe in a penetrating manner; the positioning assembly is arranged at the position, above the containing groove, of the top of the base and comprises fixing blocks which are symmetrically installed at the top of the base and located on the left side and the right side of the containing groove, sliding rods are slidably connected into the fixing blocks, and positioning blocks are fixedly installed at one ends of the sliding rods; one side of the outer portion of the sliding rod is sleeved with a telescopic spring, and one end of the telescopic spring is fixedly connected with the fixing block. According to the chip fixing device, when the chip is fixed, the chip can be preliminarily positioned and calibrated, so that the chip can be located in the center of the placing groove, the situation that the fixing effect is affected due to deflection of the chip is avoided, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, specifically a chip aging test socket for microchips. Background Art

[0002] A chip, also known as a microcircuit, microchip, wafer or chip in electronics, is a way of miniaturizing circuits and is often manufactured on the surface of a semiconductor wafer.

[0003] Publication No. CN219625638U discloses a chip aging test socket adapted for microchips. This patent uses a negative pressure adsorption component as the primary chip loading mechanism to effectively secure ultra-small microchips. Furthermore, when the clamping component is disengaged, the negative pressure adsorption component can continue to adsorb the microchip, preventing it from flying out and thus protecting it. However, this patent still has the following problems in actual use:

[0004] By adopting a negative pressure adsorption component as the main chip loading mechanism, effective fixation of ultra-small microchips can be achieved. However, although the chip can be fixed in actual use, the chip is prone to deviation and skew after placement. If deviation and skew occur, the chip may be offset from the negative pressure suction port, making it impossible for the chip to block the negative pressure suction port. As a result, the chip cannot be reliably positioned during subsequent negative pressure fixation, which is not conducive to subsequent chip testing.

[0005] A chip aging test socket for microchips is proposed to solve the above problems. Utility Model Content

[0006] The purpose of the present utility model is to provide a chip aging test seat for microchips, so as to solve the problem proposed in the above background technology that currently by adopting a negative pressure adsorption component as the main chip loading mechanism, the microchip of ultra-small area can be effectively fixed, but in actual use, although the chip can be fixed, the chip is prone to deviation and skewness after placement. If deviation and skewness occur, the chip may be offset from the negative pressure suction port, so that the chip cannot block the negative pressure suction port, and then the chip cannot be reliably positioned during subsequent negative pressure fixation, which is not conducive to subsequent chip testing.

[0007] To achieve the above-mentioned object, the present utility model provides the following technical solutions: a chip aging test socket for a microchip, comprising a base;

[0008] A placement slot is provided at the center of the top of the base, a negative pressure air duct is provided on one side of the interior of the base, and a connecting pipe is connected through one end of the base located at the negative pressure air duct;

[0009] Also includes:

[0010] A positioning assembly is provided on the top of the base above the placement slot;

[0011] The positioning assembly includes fixed blocks symmetrically mounted on the top of the base and located on the left and right sides of the placement slot, and a sliding rod is slidably connected to the interior of the fixed block, and a positioning block is fixedly mounted on one end of the sliding rod, and a telescopic spring is sleeved on one side of the exterior of the sliding rod, and one end of the telescopic spring is fixedly connected to the fixed block, and the other end of the telescopic spring is fixedly connected to the positioning block;

[0012] Among them, the two sliding rods are fixedly installed with a U-shaped rod at one end away from each other, and the outer sides of the U-shaped rod are symmetrically slidably connected with positioning frames, and the positioning frames are fixedly connected to the base, and the top of the base is located on one side of the right U-shaped rod and an electric push rod is fixedly installed, and the movable end of the electric push rod is fixedly connected to the right U-shaped rod.

[0013] Preferably, both ends of the two U-shaped rods are fixedly installed with mounting rods, and one side of the mounting rod is fixedly installed with a fixing rod, and the top of the base is fixedly installed with a support frame between the two fixing rods, and a rotating rod is rotatably connected to the upper part of the support frame, and the bottom end of the rotating rod is rotatably connected to the base.

[0014] Preferably, a rotating gear is fixedly installed on the outside of the rotating rod, and a rack is fixedly installed on one side of the two fixed rods close to the rotating gear, and the rack is meshed with the rotating gear.

[0015] Preferably, mounting blocks are symmetrically installed on the top of the base at the front and rear sides of the placement slot, and movable rods are slidably connected inside the mounting blocks, and limiting blocks are fixedly installed on the sides where the two movable rods are close to each other.

[0016] Preferably, a tension spring is sleeved on one side of the exterior of the two movable rods, one end of the tension spring is fixedly connected to the mounting block, and the other end of the tension spring is fixedly connected to the limiting block.

[0017] Preferably, a cam is fixedly mounted on the top end of each of the two rotating rods, and a connecting plate is fixedly mounted on the ends of each of the two movable rods that are away from each other, and the cam is slidably connected to the connecting plate.

[0018] Preferably, sponge pads are fixedly installed on the sides of the two positioning blocks close to the two limiting blocks.

[0019] Compared with the prior art, the present invention has the following beneficial effects: a chip aging test seat for microchips is provided with a positioning component on the top of the base, so that when the chip is fixed, the chip can be preliminarily positioned and calibrated so that the chip is in the center of the placement slot, thereby preventing the chip from being skewed and affecting the fixing effect, thereby improving practicality. The specific contents are as follows:

[0020] 1. A positioning assembly is provided on the top of the base. When fixing the chip, the chip is placed inside the placement slot, and the electric push rod is started to drive the U-shaped rod on one side to move. The U-shaped rod slides on the positioning frame to limit the position. After the U-shaped rod moves, it can drive the mounting rod to move. After the mounting rod moves, it drives the rack to move. After the rack on one side moves, it can drive the rotating gear to rotate by meshing with the rotating gear. After the rotating gear rotates, it can drive the mounting rod on the other side to move by meshing with the rack on the other side, so that the movement of the U-shaped rod on one side can make the two U-shaped rods approach each other at the same time. After the U-shaped rod moves, the positioning blocks are driven to approach each other through the sliding rod. The sliding rod can stretch the telescopic spring during the movement so that the sponge pad on the positioning block contacts the chip, so that the left and right sides of the chip can be positioned to prevent the subsequent chip from being skewed during the negative pressure fixation process;

[0021] 2. After the two U-shaped rods move, they can drive the rotating gear and the rotating rod to rotate. After the rotating rod rotates, it can drive the cam to rotate. After the cam rotates, it can push the connecting plate to move. After the connecting plate moves, it pushes the movable rod to move. While the movable rod moves, the tension spring can be stretched, so that the two limit blocks are close to each other, so that the sponge pads on the limit blocks contact the front and back sides of the chip, and the sponge pads can be deformed. If the sponge on the limit block does not contact the chip after the left and right sides of the chip are positioned, the two U-shaped rods can be continued to be close to each other, and the sponge pads on the positioning blocks are deformed, so that the two limit blocks can continue to be close to each other, and then the front and back sides of the chip can be positioned, and chips of different sizes can be positioned, so that the front and back sides and left and right sides of the chip can be positioned, so that the chip can be located in the center of the placement slot. The connecting pipe is connected to the air pump, and the chip can be negatively fixed by the negative pressure air duct, thereby improving the fixing effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0023] Figure 2 This is a front cross-sectional structural diagram of the utility model;

[0024] Figure 3 This is a schematic diagram of the top view of the positioning assembly of the utility model;

[0025] Figure 4For this utility model Figure 3 Schematic diagram of the enlarged structure of area A in the middle;

[0026] Figure 5 It is a schematic diagram of the three-dimensional structure of the rotating rod of the utility model.

[0027] In the figure: 1. Base; 101. Placement slot; 102. Negative pressure air duct; 103. Connecting pipe; 2. Positioning assembly; 201. Fixed block; 202. Sliding rod; 203. Telescopic spring; 204. Positioning block; 205. U-shaped rod; 206. Electric push rod; 207. Positioning frame; 208. Mounting rod; 209. Fixed rod; 210. Support frame; 211. Rotating rod; 212. Rack; 213. Rotating gear; 214. Mounting block; 215. Movable rod; 216. Limit block; 217. Tension spring; 218. Connecting plate; 219. Cam. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-5The utility model provides a technical solution: a chip aging test seat for microchips, comprising a base 1, a placement slot 101 is provided at the top center of the base 1, and a negative pressure air duct 102 is provided on one side of the interior of the base 1, and a connecting pipe 103 is connected through one end of the base 1 located at the negative pressure air duct 102, and further comprising: a positioning assembly 2 is provided on the top of the base 1 above the placement slot 101, wherein the positioning assembly 2 comprises a fixed block 201 symmetrically mounted on the top of the base 1 on the left and right sides of the placement slot 101, and a sliding rod 202 is slidably connected to the interior of the fixed block 201, and a positioning block 204 is fixedly mounted on one end of the sliding rod 202, and a telescopic spring 203 is sleeved on one side of the outer side of the sliding rod 202, and the telescopic spring 203 is sleeved on the outer side of the sliding rod 202. One end of 03 is fixedly connected to the fixed block 201, and the other end of the telescopic spring 203 is fixedly connected to the positioning block 204, wherein the ends of the two sliding rods 202 away from each other are fixedly installed with a U-shaped rod 205, and the outer sides of the U-shaped rod 205 are symmetrically slidably connected with positioning frames 207, and the positioning frames 207 are fixedly connected to the base 1, and the top of the base 1 is located on one side of the right U-shaped rod 205 and an electric push rod 206 is fixedly installed, and the movable end of the electric push rod 206 is fixedly connected to the right U-shaped rod 205, so that when the chip is fixed, the chip can be preliminarily positioned and calibrated so that the chip can be in the center of the placement slot 101, avoiding the chip from being skewed and affecting the fixing effect, thereby improving practicality.

[0030] The two ends of the two U-shaped rods 205 are fixedly installed with mounting rods 208, and one side of the mounting rod 208 is fixedly installed with a fixing rod 209, and the top of the base 1 is fixedly installed with a support frame 210 between the two fixing rods 209, and the upper inner part of the support frame 210 is rotatably connected with a rotating rod 211, and the bottom end of the rotating rod 211 is rotatably connected to the base 1, so as to support the rotation of the rotating rod 211, and the outside of the rotating rod 211 is fixedly installed with a rotating gear 213, and the two fixing rods 209 are fixedly installed with a rack 212 on one side close to the rotating gear 213, and the rack 212 is meshed with the rotating gear 213, so that after the U-shaped rod 205 on one side moves, the two U-shaped rods 205 can be close to each other at the same time, and the top of the base 1 is symmetrically installed with mounting blocks 214 on the front and rear sides of the placement slot 101, and the inside of the mounting block 214 is slidably connected with a movable rod 215, and the two The side of the movable rod 215 that is close to each other is fixedly installed with a limit block 216, so that the front and rear sides of the chip can be positioned. The outer side of the two movable rods 215 is sleeved with a tension spring 217, and one end of the tension spring 217 is fixedly connected to the mounting block 214, and the other end of the tension spring 217 is fixedly connected to the limit block 216, so that the movable rod 215 can automatically reset after moving. The top of the two rotating rods 211 is fixedly installed with a cam 219, and the end of the two movable rods 215 that is away from each other is fixedly installed with a connecting plate 218, and the cam 219 is slidably connected to the connecting plate 218, so that the rotation of the rotating rod 211 can push the movable rod 215 to move. The two positioning blocks 204 are fixedly installed with a sponge pad on the side close to the two limit blocks 216 to avoid damage to the chip, and the sponge pad can be deformed to position chips of different specifications and sizes.

[0031] Working principle: Before using this chip aging test socket for microchips, it is necessary to check the overall condition of the device to ensure that it can work normally. Figure 1 - Figure 5As shown, a positioning assembly 2 is provided on the top of the base 1. When fixing the chip, the chip is placed inside the placement groove 101, and the electric push rod 206 is started to drive the U-shaped rod 205 on one side to move. The U-shaped rod 205 slides on the positioning frame 207 to limit the position. After the U-shaped rod 205 moves, it can drive the installation rod 208 to move. After the installation rod 208 moves, it drives the rack 212 to move. After the rack 212 on one side moves, it can drive the rotating gear 213 to rotate by engaging with the rotating gear 213. The rotating gear 213 is rotated. After the rotation, the mounting rod 208 on the other side can be driven to move by engaging with the rack 212 on the other side, thereby moving the U-shaped rod 205 on one side so that the two U-shaped rods 205 are simultaneously close to each other. After the U-shaped rod 205 moves, the positioning blocks 204 are driven to move closer to each other through the sliding rod 202. During the movement, the sliding rod 202 can stretch the telescopic spring 203 so that the sponge pad on the positioning block 204 contacts the chip, thereby positioning the left and right sides of the chip and preventing the chip from being skewed during the subsequent negative pressure fixation process.

[0032] After the two U-shaped rods 205 move, they can drive the rotating gear 213 and the rotating rod 211 to rotate. After the rotating rod 211 rotates, it can drive the cam 219 to rotate. After the cam 219 rotates, it can push the connecting plate 218 to move. After the connecting plate 218 moves, it pushes the movable rod 215 to move. When the movable rod 215 moves, it can stretch the tension spring 217, so that the two limit blocks 216 are close to each other, so that the sponge pads on the limit blocks 216 contact the front and back sides of the chip, and the sponge pads can be deformed. If the limit blocks 216 are positioned on the left and right sides of the chip, the left and right sides of the chip will be moved. When the sponge on block 216 is not in contact with the chip, the two U-shaped rods 205 can continue to approach each other, and the sponge pad on the positioning block 204 can be deformed, so that the two limit blocks 216 can continue to approach each other, and then the front and back sides of the chip can be positioned, and chips of different sizes can be positioned, so that the front and back sides and the left and right sides of the chip can be positioned, so that the chip can be located in the center of the placement groove 101. The connecting pipe 103 is connected to the air pump, and the chip can be fixed by negative pressure through the negative pressure air duct 102, thereby improving the fixing effect of the chip.

[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip aging test socket for a microchip, comprising a base (1); A placement slot (101) is provided at the center of the top of the base (1), a negative pressure air duct (102) is provided on one side of the interior of the base (1), and a connecting pipe (103) is passed through and connected to one end of the base (1) located in the negative pressure air duct (102); It is characterized by: Also includes: A positioning assembly (2) is provided on the top of the base (1) above the placement groove (101); The positioning assembly (2) comprises a fixed block (201) symmetrically mounted on the top of the base (1) and located on the left and right sides of the placement slot (101), and the interior of the fixed block (201) is slidably connected to a sliding rod (202), and one end of the sliding rod (202) is fixedly mounted with a positioning block (204), and one side of the exterior of the sliding rod (202) is sleeved with a telescopic spring (203), and one end of the telescopic spring (203) is fixedly connected to the fixed block (201), and the other end of the telescopic spring (203) is fixedly connected to the positioning block (204); The ends of the two sliding rods (202) that are away from each other are both fixedly mounted with U-shaped rods (205), and the outer sides of the U-shaped rods (205) are symmetrically slidably connected with positioning frames (207), and the positioning frames (207) are fixedly connected to the base (1), and the top of the base (1) is fixedly mounted on one side of the right U-shaped rod (205), and the movable end of the electric push rod (206) is fixedly connected to the right U-shaped rod (205).

2. The chip aging test socket for microchips according to claim 1, characterized in that: Both ends of the two U-shaped rods (205) are fixedly mounted with mounting rods (208), and a fixing rod (209) is fixedly mounted on one side of the mounting rod (208), and a support frame (210) is fixedly mounted on the top of the base (1) between the two fixing rods (209), and a rotating rod (211) is rotatably connected to the upper part of the support frame (210), and the bottom end of the rotating rod (211) is rotatably connected to the base (1).

3. The chip aging test socket for microchips according to claim 2, characterized in that: A rotating gear (213) is fixedly mounted on the outside of the rotating rod (211), and racks (212) are fixedly mounted on one side of the two fixed rods (209) close to the rotating gear (213), and the racks (212) are meshedly connected with the rotating gear (213).

4. The chip aging test socket for microchips according to claim 2, characterized in that: The top of the base (1) is symmetrically mounted with mounting blocks (214) on both sides of the placement slot (101), and a movable rod (215) is slidably connected inside the mounting blocks (214), and a limiting block (216) is fixedly mounted on the adjacent sides of the two movable rods (215).

5. The chip aging test socket for microchips according to claim 4, characterized in that: A tension spring (217) is sleeved on one side of the exterior of the two movable rods (215), one end of the tension spring (217) is fixedly connected to the mounting block (214), and the other end of the tension spring (217) is fixedly connected to the limiting block (216).

6. The chip aging test socket for microchips according to claim 4, characterized in that: The top ends of the two rotating rods (211) are fixedly mounted with cams (219), and the ends of the two movable rods (215) that are away from each other are fixedly mounted with connecting plates (218), and the cams (219) are slidably connected to the connecting plates (218).

7. The chip aging test socket for microchips according to claim 4, characterized in that: Sponge pads are fixedly installed on the sides of the two positioning blocks (204) close to the two limiting blocks (216).

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