Automatic feeding and discharging system for chip aging test

Abstract

The utility model discloses an automatic loading and unloading system for a chip aging test. The automatic loading and unloading system comprises a maintenance terminal for detecting a test board and outputting test seat information according to a detection result; the plugging machine is used for plugging an undetected chip into the test seat or pulling the detected chip out of the test seat; the aging test machine is used for testing the chip and outputting chip information according to a test result; and the server is used for receiving the test seat information, generating feeding information, transmitting the feeding information to the plugging machine, receiving the chip information, generating discharging information and transmitting the discharging information to the plugging machine. According to the invention, data sharing of the maintenance terminal, the plugging machine and the aging test machine is realized through the server, so that the coordinate of the abnormal test seat can be automatically closed, invalid test caused by feeding of the abnormal test seat is avoided, the chip can be classified according to the test result, and the test efficiency and the test accuracy are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an automatic loading and unloading system for chip aging testing. Background Art

[0002] Chip burn-in testing involves supplying power and test signals to the chip under test, then operating it continuously for a set period of time at either high or low temperatures, thereby accelerating chip failure and screening out good quality chips. Currently, chips are typically plugged into test sockets on a test board using a plug-in machine. The test board is then placed in a burn-in tester for burn-in testing. Finally, the plug-in machine removes the tested chip from the test socket.

[0003] However, the existing automatic loading and unloading system for chip aging test cannot automatically close the coordinates of the abnormal test seat, so that the abnormal test seat is also loaded with chips. After the test is completed, the chip on the abnormal test seat needs to be re-inserted and tested, affecting the test efficiency; when conducting the test, the technician needs to manually close the coordinates of the abnormal test seat. If the technician forgets to close it or closes it in the wrong position, it will affect the accuracy of the chip aging test; in addition, the existing automatic loading and unloading system for chip aging test cannot classify the chips according to the results of the aging test.

[0004] Based on the above technical problems, this application proposes an automatic loading and unloading system for chip aging testing. Utility Model Content

[0005] The purpose of this utility model is to provide an automatic loading and unloading system for chip aging test to solve the technical problems mentioned in the background technology. The purpose of this utility model is achieved through the following technical solutions:

[0006] A chip aging test automatic loading and unloading system includes: a maintenance terminal for testing all test sockets on a test board and outputting test socket information based on the test results; a plug-in machine for inserting untested chips into the test sockets of the test board or removing tested chips from the test sockets of the test board; an aging test machine for performing aging tests on chips installed on the test board and outputting chip information based on the test results; a server for receiving the test socket information output by the maintenance terminal, generating loading information based on the test socket information, transmitting the loading information to the plug-in machine, and the plug-in machine inserting chips onto the test board based on the loading information; and receiving the chip information output by the aging test machine, generating unloading information based on the chip information, and transmitting the unloading information to the plug-in machine, and the plug-in machine removing the chips on the test board and placing them in categories based on the unloading information.

[0007] Furthermore, the maintenance terminal includes a terminal body and a connector, the connector is electrically connected to the terminal body, the connector matches the test socket, and the terminal body is used to send detection signals and receive feedback signals, and analyze the status of the test socket according to the feedback signals.

[0008] Furthermore, the test board includes a test board body, one end of which is provided with a test interface, and a plurality of test sockets are arranged in an array on the test board body, and the test sockets are electrically connected to the test interface directly or via other test sockets.

[0009] Furthermore, the plug-in and unplug-in machine includes a machine and a controller. The machine is provided with a plug-in and unplug-in station and a material tray station. There are at least two material tray stations. A test board is fixed at the plug-in and unplug-in station, and a material tray is fixed at the material tray station. A three-dimensional moving mechanism is installed on the machine, and a picking mechanism is installed on the three-dimensional moving mechanism. The three-dimensional moving mechanism and the picking mechanism are both electrically connected to the controller, and the controller is communicatively connected to the server.

[0010] Furthermore, the aging test machine includes a control box and an aging box, and an insulation layer is provided between the control box and the aging box; a control board is provided in the control box, and the control board is communicated with the server; a mounting seat is provided in the aging box, and the test board is fixed on the mounting seat; a connecting piece is provided in the insulation layer, and the two ends of the connecting piece are respectively connected to the control board and the test board, and the control board sends power signals and test signals to the test board through the connecting piece, and receives test data.

[0011] Furthermore, the test socket information includes the position information of the test socket and the state information of the test socket, and the state information of the test socket includes an available state or an unavailable state; the loading information is the position information of the test socket in the available state.

[0012] Furthermore, the chip information includes chip location information and chip status information, and the chip status information includes Pass status or Fail status; the blanking information includes location information of chips in Pass status and location information of chips in Fail status.

[0013] The technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0014] Data sharing among maintenance terminals, plug-in machines, and aging testers is achieved through the server, which automatically closes the coordinates of abnormal test sockets, avoids invalid tests caused by abnormal test sockets, and can classify chips according to test results, thus improving test efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application.

[0017] The attached figure shows: 1. Maintenance terminal; 2. Plug-in machine; 3. Server; 4. Aging test machine. DETAILED DESCRIPTION

[0018] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the drawings and specific implementation methods of the specification. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present utility model and its application or use. Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present utility model.

[0019] like Figure 1 The automatic loading and unloading system for chip aging test shown includes a maintenance terminal 1, a plug-in machine 2, a server 3 and an aging test machine 4. The maintenance terminal 1 is used to detect all test sockets on the test board and output the test socket information according to the detection results. The plug-in machine 2 is used to insert undetected chips into the test sockets of the test board, or to unplug detected chips from the test sockets of the test board. The aging test machine 4 is used to perform aging tests on chips installed on the test board and output chip information according to the test results. The server 3 is used to receive the test socket information output by the maintenance terminal 1, generate loading information according to the test socket information, transmit the loading information to the plug-in machine 2, and the plug-in machine 2 inserts the chip onto the test board according to the loading information; and is used to receive the chip information output by the aging test machine 4, generate unloading information according to the chip information, transmit the unloading information to the plug-in machine 2, and the plug-in machine 2 unplugs the chips on the test board and places them in categories according to the unloading information.

[0020] Specifically, the test board includes a test board body, which is a PCB circuit board. A test interface is installed at one end of the test board body. Multiple test sockets are arrayed on the test board body. The test sockets are connected to the test interface directly through the lines on the PCB circuit board or via other test sockets.

[0021] Maintenance Terminal 1 is a test socket detector, consisting of a terminal body and a connector. The terminal body is an industrial computer. The connector is connected to the terminal body via wires, and the contacts on the connector match the contacts on the test socket. During use, the terminal body sends a test signal to the test socket through the connector and receives a feedback signal from the test socket. The status of the test socket is analyzed based on the feedback signal. By connecting the connector to the test socket one by one and testing it, the status of each test socket on the test board can be obtained.

[0022] After completing the inspection of all test seats, the position information of each test seat is marked through the plane coordinate system, and the test seats with normal inspection are marked as available, and the test seats with abnormal inspection are marked as unavailable, and saved as test seat information. The test seat information is saved to server 3. After reading the test seat information, server 3 extracts the position information of the test seats in the available state and saves it as loading information.

[0023] Insertion and removal machine 2 consists of a machine platform and a controller, which is connected to the server via a serial port. The machine platform is equipped with an insertion and removal station and two material tray stations. The test board is fixed to the insertion and removal station, and the material tray is installed at the material tray station. A three-dimensional motion mechanism is installed on the machine platform, and a pickup mechanism is mounted on the three-dimensional motion mechanism. Both the three-dimensional motion mechanism and the pickup mechanism are electrically connected to the controller, which controls the movement of the three-dimensional motion mechanism and the pickup mechanism to achieve chip handling and insertion and removal. The three-dimensional motion mechanism can be a three-axis linear module or a handling robot, and the pickup mechanism is a negative pressure suction nozzle.

[0024] During loading, the controller of the plug-in machine 2 obtains loading information from the server 3, drives the picking mechanism to pick up untested chips from the tray through the three-dimensional moving mechanism, and inserts them one by one into the test sockets in an available state.

[0025] The burn-in tester 4 comprises a control box and a burn-in chamber arranged side by side. An insulation layer is placed between the control box and the burn-in chamber. Connectors are installed in the insulation layer, with their ends extending into the control box and the burn-in chamber, respectively. A control board is installed in the control box, which is connected to the server via a serial port. A test board is secured to an annular mounting block within the burn-in chamber. The test board's test interface is connected to the control board via the connector. The control board transmits power and test signals to the test board via the connector and receives test data.

[0026] Before the aging test, the control board reads the loading information from the server and closes the test sockets that are in an unavailable state according to the loading information to avoid forgetting to close or closing them incorrectly due to manual closing, thereby improving the accuracy of the test.

[0027] After the aging test is completed, the control board marks the chip location information according to the test socket position of each chip. Based on the test data, normal chips are marked as Pass and abnormal chips are marked as Fail. The chip information is saved as chip information and transmitted to server 3. Server 3 extracts the location information of chips in the Pass state and the location information of chips in the Fail state from the chip information and saves it as blanking information.

[0028] During unloading, the controller of the plug-in machine 2 obtains the unloading information from the server 3, drives the picking mechanism to pull out the tested chips from the test board through the three-dimensional moving mechanism, places the chips in the Pass state into one tray, and places the chips in the Fail state into another tray to realize chip sorting.

[0029] The server enables data sharing among maintenance terminals, plug-in machines, and aging testers, which has the following advantages:

[0030] 1. The plug-in machine loads materials in real time according to the status of the test socket on the test board to avoid invalid aging test caused by abnormal test socket loading and reduce the occurrence of aging test failures;

[0031] 2. The aging tester reads the loading information before testing and automatically closes the test sockets that have not been loaded to avoid yield abnormalities caused by empty testing;

[0032] 3. After the equipment data is shared in real time, the results of the previous station can be quickly located through mutual file reading, avoiding the time waste of corresponding manual intervention, reducing the generation of invalid tests, and improving production efficiency.

[0033] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A chip aging test automatic loading and unloading system, characterized in that: include: Maintenance terminal, used to test all test sockets on the test board and output test socket information based on the test results; Insertion and extraction machine, used to insert untested chips into the test socket of the test board, or to remove tested chips from the test socket of the test board; A aging tester is used to perform aging tests on chips mounted on a test board and output chip information based on the test results; The server is used to receive the test socket information output by the maintenance terminal, generate loading information based on the test socket information, and transmit the loading information to the plug-in machine. The plug-in machine inserts the chip into the test board according to the loading information; and is used to receive the chip information output by the aging tester, generate unloading information based on the chip information, and transmit the unloading information to the plug-in machine. The plug-in machine unplugs the chips on the test board and places them in categories according to the unloading information.

2. The chip aging test automatic loading and unloading system according to claim 1 is characterized in that: The maintenance terminal includes a terminal body and a connector, wherein the connector is electrically connected to the terminal body and matches the test socket. The terminal body is used to send detection signals and receive feedback signals, and analyze the status of the test socket according to the feedback signals.

3. The chip aging test automatic loading and unloading system according to claim 1, characterized in that: The test board includes a test board body, one end of which is provided with a test interface, and a plurality of test sockets are arranged in an array on the test board body. The test sockets are electrically connected to the test interface directly or via other test sockets.

4. The chip aging test automatic loading and unloading system according to claim 1, characterized in that: The plug-in / out machine includes a machine and a controller. The machine is provided with a plug-in / out station and a tray station. There are at least two tray stations. A test board is fixed at the plug-in / out station, and a tray is fixed at the tray station. A three-dimensional moving mechanism is installed on the machine, and a picking mechanism is installed on the three-dimensional moving mechanism. The three-dimensional moving mechanism and the picking mechanism are both electrically connected to the controller, and the controller is communicatively connected to the server.

5. The chip aging test automatic loading and unloading system according to claim 1, characterized in that: The aging test machine includes a control box and an aging box, and an insulation layer is provided between the control box and the aging box; a control board is provided in the control box, and the control board is communicatively connected to the server; a mounting seat is provided in the aging box, and the test board is fixed on the mounting seat; a connecting piece is provided in the insulation layer, and the two ends of the connecting piece are respectively connected to the control board and the test board, and the control board sends power signals and test signals to the test board through the connecting piece, and receives test data.

6. The chip aging test automatic loading and unloading system according to claim 1, characterized in that: The test socket information includes the position information of the test socket and the state information of the test socket, and the state information of the test socket includes an available state or an unavailable state; the loading information is the position information of the test socket in the available state.

7. The chip aging test automatic loading and unloading system according to claim 1, characterized in that: The chip information includes chip location information and chip status information, and the chip status information includes Pass status or Fail status; the blanking information includes chip location information of the Pass status and chip location information of the Fail status.

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