Metal grid for improving adhesive force of photoresist

Abstract

The utility model relates to the technical field of metal grids, in particular to a metal grid capable of improving adhesive force of photoresist, which comprises a peripheral copper area and an in-plane metal grid area, the in-plane metal grid area is mounted at the lower end of the peripheral copper area, the upper end of the peripheral copper area is attached to the photoresist, and the lower end of the peripheral copper area is attached to the photoresist. The outer wall of the peripheral copper area is fixedly connected with the peripheral copper lead area, the lower end of the peripheral copper lead area is electrically connected with the CU conducting layer, and the outer wall of the peripheral copper lead area is connected with a supporting mechanism. The horizontal effect is displayed through the position in the tubular gradienter on the connecting blocks on the periphery of the supporting seat, so that the photoresist can be more accurately and uniformly transferred to a to-be-processed in-plane metal grid area, and the photoresist is more accurately and uniformly attached to the in-plane metal grid area; and the adhesive force of the photoresist is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of metal grids, in particular to a metal grid with improved photoresist adhesion. Background Art

[0002] The preparation of metal mesh flexible touch sensors requires processes such as photoresist coating, baking, exposure, development, etching, degumming, and blackening. During these processes, a process protective film is often required to prevent scratches, falling off, and breakage of the in-plane grid and edge traces.

[0003] For example, the metal grid for improving the adhesion of photoresist with the authorization announcement number "CN219800130U" has solved the problem that the photoresist in the overlapping area is most likely to fall off in the existing metal grid for improving the adhesion of photoresist. The above-mentioned first peripheral grid copper area and the second peripheral grid copper area have a dispersion effect after being grid-shaped, and the area of ​​the protective film colloid attached to the grid is very small. Therefore, the viscosity generated when the protective film is torn off is very low, so it will not bring up the photoresist in the edge routing area, the overlapping area, and the in-plane metal grid area, thereby effectively avoiding the failure of the metal grid. Considering that the placement position of the existing metal grid for improving the adhesion of photoresist cannot guarantee the correct level, there are differences in the accuracy and thickness of the photoresist adhesion, resulting in poor effect of the metal grid for photoresist adhesion. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the existing metal grid for improving photoresist adhesion has differences in photoresist adhesion accuracy and thickness, resulting in poor effect of the metal grid for improving photoresist adhesion, and to propose a metal grid for improving photoresist adhesion.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a metal grid for improving the adhesion of photoresist, comprising a peripheral copper area and an in-plane metal grid area, the lower end of the peripheral copper area is installed with the in-plane metal grid area, the upper end of the peripheral copper area is in contact with the photoresist, the outer wall of the peripheral copper area is fixedly connected to the peripheral copper lead area, the lower end of the peripheral copper lead area is electrically connected to the CU conductive layer, and the outer wall of the peripheral copper lead area is connected to a supporting mechanism.

[0006] Preferably, the support mechanism includes an insulating ring, the outer wall of the insulating ring is in contact with the outer copper lead area, the outer wall of the outer overlap area is fixedly connected to the support seat, and the lower end of the support seat is fixedly connected to the support ring.

[0007] Preferably, a slot is processed on the inner wall of the support seat, and a leveling mechanism is connected to the outer wall of the support seat.

[0008] Preferably, the leveling mechanism includes a rubber clamping block, the outer wall of the rubber clamping block is fixedly connected to the support seat, the inner wall of the rubber clamping block is tightly pressed against the connecting block, and the inner wall of the connecting block is fixedly connected to the tubular level.

[0009] Preferably, the outer wall of the insulating ring is movably connected to the peripheral copper area.

[0010] The utility model proposes a metal grid for improving the adhesion of photoresist, which has the beneficial effect of displaying the horizontal effect by the internal position of the tubular level on the connecting blocks around the support base. At this time, the photoresist can be more accurately and evenly transferred to the metal grid area in the surface to be processed, so that the photoresist can be more accurately and evenly attached to the metal grid area in the surface, thereby improving the metal grid effect of improving the adhesion of the photoresist. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the structure of the utility model;

[0012] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure from top view;

[0013] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure in the center front view;

[0014] Figure 4 for Figure 3 A in the middle is an enlarged structural diagram;

[0015] Figure 5 for Figure 2 The enlarged structural diagram at B in the middle;

[0016] Figure 6 for Figure 1 Schematic diagram of the enlarged structure of the middle connection block.

[0017] In the figure: 1. Peripheral copper area, 2. In-plane metal grid area, 3. Photoresist, 4. Peripheral copper lead area, 5. CU conductive layer, 6. Support mechanism, 601. Insulation ring, 602. Support seat, 603. Support ring, 7. Slot, 8. Leveling mechanism, 801. Rubber clamp, 802. Connecting block, 803. Tubular level. DETAILED DESCRIPTION

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] Example 1:

[0020] See also Figure 1-6: In this embodiment, a metal grid for improving the adhesion of photoresist includes a peripheral copper area 1 and an in-plane metal grid area 2. The in-plane metal grid area 2 is installed at the lower end of the peripheral copper area 1, the upper end of the peripheral copper area 1 is in contact with the photoresist 3, the outer wall of the peripheral copper area 1 is fixedly connected to the peripheral copper lead area 4, and the lower end of the peripheral copper lead area 4 is electrically connected to the CU conductive layer 5. The CU conductive layer is copper foil, which is a cathodic electrolytic material. It is easy to adhere to the insulating layer, accept the printed protective layer, and form a circuit after corrosion. The outer wall of the patterned peripheral copper lead area 4 is connected to the supporting mechanism 6.

[0021] The support mechanism 6 includes an insulating ring 601, which forms a fitting effect with the outer copper area 1 and the insulating ring 601 made of silicone material, and the support ring 603 at the lower end of the support seat 602 will form a high support effect on the outer copper area 1. The outer wall of the insulating ring 601 fits with the outer copper lead area 4, the outer wall of the outer overlap area 601 is fixedly connected to the support seat 602, and the lower end of the support seat 602 is fixedly connected to the support ring 603.

[0022] The inner wall of the support base 602 is processed with a slot 7, and an external object is inserted into the slot 7, which makes the support base 602 more diversified in the lifting method, and convenient for the support base to move. The outer wall of the support base 602 is connected to the leveling mechanism 8, and the water drop display of the tubular level 803 on the connecting blocks 802 around the support base 602 is in the center position, so that the support base 602 can adjust the placement of the peripheral copper area 1 and the in-plane metal grid area 2 more horizontally. The leveling mechanism 8 includes a rubber clamping block 801, the outer wall of the rubber clamping block 801 is fixedly connected to the support base 602, the inner wall of the rubber clamping block 801 is tightly pressed against the connecting block 802, the inner wall of the connecting block 802 is fixedly connected to the tubular level 803, and the outer wall of the insulating ring 601 is movably connected to the peripheral copper area 1;

[0023] The internal position of the tubular level 803 on the connecting blocks 802 around the support seat 602 shows the horizontal effect. At this time, the photoresist 3 can be transferred more accurately and evenly to the in-plane metal grid area 2 to be processed, so that the photoresist 3 can be more accurately and evenly attached to the in-plane metal grid area 2, thereby improving the metal grid effect of the photoresist adhesion.

[0024] Working principle:

[0025] A metal grid to be processed is formed by the outer copper area 1, the in-plane metal grid area 2, and the outer copper lead area 4. The metal grid to be processed, including the outer copper area 1 and the in-plane metal grid area 2, is placed inside the support seat 602. The outer copper area 1 forms a fitting effect with the insulating ring 601 made of silicone material, and the support ring 603 at the lower end of the support seat 602 will form a height limiting effect on the outer copper area 1. By displaying the water droplets on the tubular level 803 on the connecting blocks 802 around the support seat 602 at the center position, the support seat 602 is placed more horizontally. At this time, the photoresist 3 can transfer the required fine patterns from the mask (mask) to the in-plane metal grid area 2 to be processed through photochemical reaction through exposure, development and other photolithography processes. By controlling the outer copper area 1 and the in-plane metal grid area 2 to be placed more horizontally, the photoresist 3 is more accurately and evenly attached to the in-plane metal grid area 2, and the metal grid effect of the photoresist adhesion is also improved.

[0026] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A metal grid for improving photoresist adhesion, comprising a peripheral copper region (1) and an in-plane metal grid region (2), wherein the in-plane metal grid region (2) is mounted at the lower end of the peripheral copper region (1), and characterized in that: The upper end of the peripheral copper area (1) is in contact with the photoresist (3), the outer wall of the peripheral copper area (1) is fixedly connected to the peripheral copper lead area (4), the lower end of the peripheral copper lead area (4) is electrically connected to the CU conductive layer (5), and the outer wall of the peripheral copper lead area (4) is connected to a supporting mechanism (6).

2. The metal grid for improving photoresist adhesion according to claim 1, wherein: The support mechanism (6) comprises an insulating ring (601), the outer wall of the insulating ring (601) is in contact with the outer peripheral copper lead area (4), the outer wall of the insulating ring (601) is fixedly connected to the support seat (602), and the lower end of the support seat (602) is fixedly connected to the support ring (603).

3. The metal grid for improving photoresist adhesion according to claim 2, wherein: The inner wall of the support seat (602) is processed with a slot (7), and the outer wall of the support seat (602) is connected to a leveling mechanism (8).

4. The metal grid for improving photoresist adhesion according to claim 3, wherein: The leveling mechanism (8) comprises a rubber clamping block (801), the outer wall of the rubber clamping block (801) is fixedly connected to the support seat (602), the inner wall of the rubber clamping block (801) is tightly abutted against the connecting block (802), and the inner wall of the connecting block (802) is fixedly connected to the tubular level (803).

5. The metal grid for improving photoresist adhesion according to claim 2, wherein: The outer wall of the insulating ring (601) is movably connected to the peripheral copper area (1).

Images