Sucking disc for chip production

Abstract

The utility model discloses a suction cup for chip production, which is used for adsorbing a chip and comprises a supporting part, an annular adsorption part is arranged on the supporting part, a groove is formed between the annular adsorption part and the supporting part, the chip is placed on the annular adsorption part, the middle part of the chip is opposite to the groove, the annular adsorption part is provided with a cavity, and the annular adsorption part is provided with a clamping groove. The upper surface of the annular adsorption part is provided with adsorption holes, the adsorption holes are communicated with the cavity, the bottom of the annular adsorption part is also connected with a negative pressure pipe, and the negative pressure pipe is connected with negative pressure equipment, so that negative pressure generated by the adsorption holes adsorbs the periphery of the chip. The suction cup for chip production is simple in structure, the periphery of the chip is adsorbed through the annular adsorption part, the stress of the middle of the chip in the transportation process is reduced through the groove and the middle of the chip, the adsorption force on the center fragile structure of the chip is further reduced, and the center fragile structure of the chip is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of devices for basic support or tightening of electrical components, in particular to a suction cup for chip production. Background Art

[0002] At present, in the existing chip preparation process, the chip needs to go through a series of operations such as glue coating, photolithography, and development. Among them, a suction cup is needed to realize the transfer of the chip in each process step. However, the traditional suction cup has a large adsorption force on the middle structure of the chip, and the structure in the center of the chip is relatively fragile. Moreover, the central structure is an important part of the chip. When subjected to a large adsorption force, it is easy to crack or break directly, which reduces the yield rate of the entire process.

[0003] Therefore, there is an urgent need for a suction cup that does not generate an adsorption force on the middle part of the chip during the adsorption process. Utility Model Content

[0004] In order to solve the technical problems existing in the background technology, the utility model provides a suction cup for chip production.

[0005] The utility model proposes a suction cup for chip production, which is used for adsorbing chips and includes a supporting part, an annular adsorption part is provided on the supporting part, a groove is formed between the annular adsorption part and the supporting part, the chip is placed on the annular adsorption part and the middle part of the chip is opposite to the groove, the annular adsorption part has a cavity, an adsorption hole is opened on the upper surface of the annular adsorption part, the adsorption hole is connected to the cavity, and the bottom of the annular adsorption part is also connected to a negative pressure tube, which is connected to the negative pressure equipment so that the negative pressure generated by the adsorption hole adsorbs the outer periphery of the chip.

[0006] Preferably, there are a plurality of adsorption holes, and the plurality of adsorption holes are evenly distributed circumferentially on the annular adsorption portion.

[0007] Preferably, the annular adsorption portion is detachably mounted on the support portion.

[0008] Preferably, the support portion is provided with annular mounting holes, and there are multiple groups of annular mounting holes, one group of annular mounting holes is located outside another group of annular mounting holes, and one group of annular mounting holes is used to install annular adsorption portions of one size.

[0009] Preferably, an annular accommodating groove is opened on the supporting portion, the mounting hole is located in the annular accommodating groove, and the bottom of the annular adsorption portion is provided with a mounting portion thinner than the annular adsorption portion, and a step surface is formed between the mounting portion and the annular adsorption portion, and the step surface is in contact with the annular accommodating groove.

[0010] In some embodiments, preferably, there are at least two groups of the annular adsorption parts, and at least two groups of the annular adsorption parts are arranged on the support part, each group of the annular adsorption parts has an idle position and an adsorption position, the upper surface of the annular adsorption part located at the idle position is not higher than the upper surface of the support part, and a groove is formed between the annular adsorption part located at the adsorption position and the support part.

[0011] Preferably, it also includes a base plate, the support part is installed on the base plate through a connecting column, an adjustment space is formed between the base plate and the support part, and a support block is provided on the base plate, and the support block contacts the annular adsorption part to place the annular adsorption part in the adsorption position.

[0012] Preferably, an extension plate is provided on the side of the support block, the extension plate is detachably mounted on the bottom plate, and the position of the support block on the bottom plate is adjustable.

[0013] Preferably, an annular receiving groove is provided on the support portion, the mounting hole is located in the annular receiving groove, a mounting portion thinner than the annular adsorption portion is provided at the bottom of the annular adsorption portion, a stepped surface is formed between the mounting portion and the annular adsorption portion, and when the annular adsorption portion is in an idle position, the stepped surface contacts the annular receiving groove.

[0014] In the present invention, the suction cup for chip production proposed has a simple structure. The outer periphery of the chip is adsorbed by the annular adsorption part, and the force on the middle part of the chip during transportation is reduced by the groove and the middle part of the chip, thereby reducing the adsorption force on the fragile structure in the center of the chip, avoiding damage to the fragile structure in the center of the chip, and further realizing the adsorption of chips of different sizes by setting annular adsorption parts of different sizes, thereby increasing its versatility.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 Cross-sectional view;

[0018] Figure 3 This is a structural diagram of the second embodiment of the present utility model;

[0019] Figure 4 For this utility model Figure 3 Cross-sectional view;

[0020] In the figure: 1. Support part; 10. Mounting hole; 11. Annular receiving groove; 2. Annular adsorption part; 20. Cavity; 21. Adsorption hole; 3. Groove; 4. Negative pressure tube; 5. Mounting part; 6. Support block; 7. Bottom plate; 8. Connecting column; 9. Extension plate; 12. Covering ring disk. DETAILED DESCRIPTION

[0021] The following describes in detail embodiments of the present invention. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar symbols throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention, and should not be construed as limiting the present invention.

[0022] Example 1

[0023] like Figure 1-Figure 2 A suction cup for chip production shown in FIG. 1 includes a support portion 1, on which an annular suction portion 2 is provided. The annular suction portion 2 can be fixed to the support portion 1 or can be integrally formed with the support portion 1. The annular suction portion 2 has an extension portion located above the support portion 1, thereby forming a groove 3 between the annular suction portion 2 and the support portion 1. During the process of adsorbing the chip, the annular suction portion 2 has a cavity 20, and an adsorption hole 21 is opened on the upper surface of the annular suction portion 2. The adsorption hole 21 is connected to the cavity 20. The bottom of the annular suction portion 2 is also connected to a negative pressure tube 4, which is connected to a negative pressure device so that the cavity 20 and the adsorption hole 21 generate negative pressure for adsorbing the chip.

[0024] During use, the chip is placed on the annular adsorption part 2, the outer periphery of the chip contacts the annular adsorption part 2 and the negative pressure generated in the adsorption hole 21 adsorbs and fixes the outer periphery of the chip, and the middle part of the chip is opposite to the groove 3, that is, the middle part of the chip is suspended in the air, thereby reducing the external force on the middle part of the chip, and then reducing the adsorption force on the fragile structure in the center of the chip, thereby avoiding damage to the fragile structure in the center of the chip.

[0025] In order to achieve more uniform adsorption of the chip, that is, uniform force on the periphery of the chip, preferably, a plurality of adsorption holes 21 are provided and the plurality of adsorption holes 21 are evenly distributed circumferentially on the annular adsorption portion 2 .

[0026] It should be noted that the shape of the annular adsorption portion 2 can be designed according to the shape of the chip. If the chip is square, the annular adsorption portion 2 is a square ring. If the chip is round, the annular adsorption portion 2 is a circular ring.

[0027] In some embodiments, preferably, the annular adsorption portion 2 is detachably mounted on the support portion 1, and multiple groups of annular adsorption portions 2 are provided, each group of annular adsorption portions 2 has different models and sizes, and the annular adsorption portions 2 can be replaced according to chips of different sizes and models.

[0028] Specifically, an annular mounting hole 10 is opened on the support part 1, and the mounting hole 10 is a blind hole. There are multiple groups of annular mounting holes 10. In this embodiment, there are four groups of mounting holes 10. One group of annular mounting holes 10 is located on the outside of another group of annular mounting holes 10. One group of annular mounting holes 10 is installed with an annular adsorption part 2 of one size. The annular adsorption part 2 installed by the four groups of mounting holes in this embodiment corresponds to the adsorption of 4-inch, 6-inch, 8-inch and 10-inch chips. Users can install different types of annular adsorption parts 2 according to different types of chips. In order to facilitate the accommodation of the negative pressure tube 4, a connecting hole is opened at the bottom of the mounting hole 10. The negative pressure tube 4 passes through the connecting hole and is connected to the external negative pressure device.

[0029] Preferably, a mounting portion 5 smaller than its thickness is provided below the annular adsorption portion 2, that is, a stepped surface is formed between the mounting portion 5 and the annular adsorption portion 2, and an annular accommodating groove 11 is provided above the support portion 1. The annular adsorption portion 2 is located in the annular accommodating groove 11, and the stepped surface is in contact with the annular accommodating groove 11. The annular mounting hole 10 is provided in the annular accommodating groove 11, and a gap is formed between any two adjacent groups of annular accommodating grooves 11. The mounting portion 5 matches the mounting hole 10, so that when the two groups of annular adsorption portions 2 are installed on the support portion 1, the range of their upper surfaces has an intersecting part, and the negative pressure tube passes through the mounting portion and the connecting hole and is connected to the external negative pressure equipment, thereby increasing its wide application, facilitating the stability of adsorption of chips of different sizes, and further facilitating the transportation of chips.

[0030] It should be noted that in actual practice, the support part 1 is installed on a rotating structure to drive the suction cup to rotate. In order to prevent the negative pressure tube 4 from getting tangled, a through hole coaxial with its rotation axis is opened on the rotating structure, and the negative pressure tube 4 passes through the through hole.

[0031] Example 2

[0032] like Figure 3-4 As shown, the difference between this embodiment and the above embodiment is that, in order to adapt to chips of different models (sizes), at least two groups of annular adsorption parts 2 are provided in this embodiment, and at least two groups of annular adsorption parts 2 are arranged on the support part 1, and the centers of at least two groups of annular adsorption parts 2 are in the same vertical line, that is, one group of annular adsorption parts 2 of two adjacent groups of annular adsorption parts 2 is arranged inside the other group of annular adsorption parts 2;

[0033] Each group of annular adsorption parts 2 has an adsorption position and an idle position. When the annular adsorption part 2 is located at the adsorption position, the annular adsorption part 2 has a portion located above the support part 1. When the annular adsorption part 2 is located at the idle position, the upper surface of the annular adsorption part 2 is not higher than the upper surface of the support part 1, that is, the upper surface of the annular adsorption part 2 located at the idle position is lower than the upper surface of the support part 1 or is located at the same level as the upper surface of the support part 1.

[0034] Preferably, one group of annular adsorption parts 2 adsorbs one type of chip, and only one group of annular adsorption parts 2 is located at the adsorption station, and the other annular adsorption parts 2 are located at idle stations;

[0035] Specifically, the height of each group of annular adsorption parts 2 relative to the support part 1 is adjustable. Specifically, an annular mounting hole 10 is opened on the support part 1, and the annular adsorption part 2 is vertically slidably installed in the mounting hole 10. The mounting hole 10 is a blind hole and also includes a bottom plate 7. There is adjustment space from the upper surface of the bottom plate 7 to the bottom surface of the support part 1. The side of the support part 1 is connected to the bottom plate 7 through a connecting column 8. The support part 1 is installed on the bottom plate 7. A support block 6 is provided on the bottom plate 7. The support block 6 is used to support the annular adsorption part 2 located at the adsorption station. Specifically, a supporting through hole is opened at the bottom of each mounting hole 10. The support block 6 is located in the supporting through hole and supports the annular adsorption part, and the position of the support block 6 on the bottom plate 7 is adjustable. In order to ensure the support In order to ensure the stability of the support of the annular adsorption part 2 by the block 6, there are multiple groups of support blocks 6, and the multiple groups of annular support blocks 6 are distributed along the circumference of the mounting hole 10. The mounting hole 10 is a blind hole. In order to facilitate the fixation of the support block 6, an extension plate 9 is provided on the side of the support block 6. The extension plate 9 is fixed to the bottom plate 7 by a fixing member. The fixing member is a fixing pin or a screw, thereby ensuring the stability of the fixation of the annular adsorption part 2. Of course, in order to facilitate the adjustment of the support of the support block 6 to the annular adsorption part, the height of the support block 6 is adjustable. Since the vertical position of the annular adsorption part 2 needs to be adjusted during the whole process, the negative pressure tube 4 extends out of the support part 1 and can slide relative to the support part 1. Specifically, the negative pressure tube is made of elastic material. In order to avoid the multiple negative pressure tubes 4 from being disturbed during the rotation of the bottom plate 7, a through hole is opened in the middle of the bottom plate 7. The axis of the through hole coincides with the axis of rotation of the bottom plate 7. The negative pressure tube 4 passes through the through hole of the bottom plate 7.

[0036] Specifically, each group of annular adsorption parts 2 has a cavity 20, and each group of annular adsorption parts 2 has an adsorption hole 21 and is connected to a negative pressure tube 4. The negative pressure tube 4 extends out of the adjustment space, and the negative pressure in the cavity 20 of each group of annular adsorption parts 2 is controlled separately, that is, a valve can be set on each negative pressure tube 4, and the valve of the negative pressure tube 4 can be opened or closed according to actual conditions.

[0037] It should be noted that since there are multiple annular adsorption parts 2 on the suction cup, in order to prevent the adsorption holes of the annular adsorption part 2 at the idle workstation from being blocked by external liquid or debris, a covering ring disk 12 is provided on the top of the annular adsorption part 2 at the idle workstation. The covering ring disk 12 can be placed directly on the annular adsorption part 2, or it can be detachably installed on the annular adsorption part 2 by snap-on or other means. Relevant staff can disassemble and install the covering ring disk 12 according to actual conditions.

[0038] Compared with the above embodiment, this embodiment can realize the adsorption of chips of different models and sizes, and at least two groups of annular adsorption parts 2 have adsorption stations and idle stations, which makes it easier for users to adjust the annular adsorption parts 2 to the adsorption station or idle station according to actual conditions, making the operation more convenient.

[0039] In this embodiment, preferably, a mounting portion 5 smaller than the thickness of the annular adsorption portion 2 is provided below the annular adsorption portion 2, that is, a stepped surface is formed between the mounting portion 5 and the annular adsorption portion 2, and an annular accommodating groove 11 is opened above the support portion 1. The annular adsorption portion 2 is located in the annular accommodating groove 11, and the stepped surface is in contact with the annular accommodating groove 11. The mounting hole 10 is opened in the annular accommodating groove 11. When the stepped surface is in contact with the annular accommodating groove 11, the annular adsorption portion 2 is in an idle position. When the support block 6 is in contact with the annular adsorption portion 2, the stepped surface is located above the bottom surface of the annular accommodating groove 11, thereby placing the annular adsorption portion 2 in the adsorption position.

[0040] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0042] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0043] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0044] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A suction cup for chip production, used for adsorbing chips, characterized in that: The invention comprises a support part (1), wherein an annular adsorption part (2) is provided on the support part (1), a groove (3) is formed between the annular adsorption part (2) and the support part (1), a chip is placed on the annular adsorption part (2) and the middle part of the chip is opposite to the groove (3), the annular adsorption part (2) has a cavity (20), an adsorption hole (21) is opened on the upper surface of the annular adsorption part (2), the adsorption hole (21) is connected to the cavity (20), the annular adsorption part (2) is connected to a negative pressure tube (4), and the negative pressure tube (4) is connected to a negative pressure device so that the negative pressure generated by the adsorption hole (21) adsorbs the outer periphery of the chip; At least two groups of the annular adsorption parts (2) are provided, and at least two groups of the annular adsorption parts (2) are both arranged on the support part (1). Each group of the annular adsorption parts (2) has an idle station and an adsorption station. The upper surface of the annular adsorption part (2) located at the idle station is not higher than the upper surface of the support part (1). A groove (3) is formed between the annular adsorption part (2) located at the adsorption station and the support part (1).

2. The chip production suction cup according to claim 1, characterized in that: A plurality of the adsorption holes (21) are provided, and the plurality of adsorption holes (21) are circumferentially distributed on the annular adsorption portion (2).

3. The chip production suction cup according to claim 1, characterized in that: The annular adsorption portion (2) is detachably mounted on the support portion (1).

4. The chip production suction cup according to claim 3, characterized in that: The support portion (1) is provided with an annular mounting hole (10), and the annular mounting holes (10) are provided in multiple groups. One group of annular mounting holes (10) is located outside another group of annular mounting holes (10), and one group of annular mounting holes (10) is provided with an annular adsorption portion (2) of one size.

5. The chip production suction cup according to claim 4, characterized in that: An annular receiving groove (11) is provided on the support portion (1), the mounting hole (10) is located in the annular receiving groove (11), a mounting portion (5) thinner than the annular receiving portion (2) is provided at the bottom of the annular adsorption portion (2), a stepped surface is formed between the mounting portion (5) and the annular adsorption portion (2), and the stepped surface is in contact with the annular receiving groove (11).

6. The suction cup for chip production according to claim 1, characterized in that: The invention also comprises a bottom plate (7), the support portion (1) is mounted on the bottom plate (7) via a connecting column (8), an adjustment space is formed between the bottom plate (7) and the support portion (1), a support block (6) is provided on the bottom plate (7), and the support block (6) contacts the annular adsorption portion (2) so that the annular adsorption portion (2) is in an adsorption position.

7. The suction cup for chip production according to claim 6, characterized in that: An extension plate (9) is provided on the side of the support block (6), and the extension plate (9) is detachably mounted on the bottom plate (7), and the position of the support block (6) on the bottom plate (7) is adjustable.

8. The suction cup for chip production according to claim 4, characterized in that: An annular receiving groove (11) is provided on the support portion (1), the mounting hole (10) is located in the annular receiving groove (11), a mounting portion (5) thinner than the annular receiving portion (2) is provided at the bottom of the annular adsorption portion (2), a stepped surface is formed between the mounting portion (5) and the annular adsorption portion (2), and when the annular adsorption portion (2) is in an idle position, the stepped surface contacts the annular receiving groove (11).

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