Chip clamping device

Abstract

The utility model provides a chip clamping device. The chip clamping device comprises two nickel sheets, the number of which is two, and the fixed ends of the two nickel sheets are connected; the clamping parts are arranged in one-to-one correspondence with the nickel sheets, and the clamping parts are detachably connected with the nickel sheets; wherein each clamping part is bent towards the outer side to form a bending part, the grooves in the inner sides of the two bending parts are aligned to form a clamping space, and the clamping space is used for clamping a chip to be clamped. According to the chip clamping device, the operation difficulty can be reduced, the problem that the to-be-clamped chip slides off and is damaged due to the fact that the to-be-clamped chip slides off is effectively solved, and the clamping part is easy to replace.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip manufacturing, and in particular to a chip clamping device. Background Art

[0002] During the semiconductor chip manufacturing process, when a failed chip occurs, the experimenter needs to use tweezers to pick up the failed chip and send it to the failure analysis department for failure analysis.

[0003] However, it is difficult to pick up chips with traditional tweezers, and the chips are prone to slipping and damage. In addition, different tweezers often need to be replaced according to chip specifications, which seriously affects production efficiency.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Utility Model Content

[0005] Based on this, the present application provides a chip clamping device that can reduce the difficulty of operation, effectively avoid the chip to be clamped from slipping and the damage caused by it, and the clamping part is also easy to replace.

[0006] The chip clamping device provided in this application includes:

[0007] Two nickel sheets are provided, and the fixed ends of the two nickel sheets are connected;

[0008] A clamping portion is provided corresponding to each of the nickel sheets, and the clamping portion is detachably connected to the nickel sheet;

[0009] Each of the clamping portions is bent outward to form a bent portion, and the grooves inside the two bent portions are aligned with each other to form a clamping space, and the clamping space is used to clamp the chip to be clamped.

[0010] In some embodiments, the angle formed by the extended ends of the two nickel sheets is less than or equal to 15°.

[0011] In some embodiments, the nickel sheet comprises a resilient stainless steel nickel sheet.

[0012] In some embodiments, the width of the nickel sheet is greater than or equal to 10 mm.

[0013] In some embodiments, the clamping portion is detachably connected to the corresponding nickel sheet via a nut.

[0014] In some embodiments, the diameter of the nut is greater than or equal to 1 / 2 of the width of the nickel sheet.

[0015] In some embodiments, each of the clamping portions is detachably connected to the corresponding nickel sheet via at least two nuts.

[0016] In some embodiments, the clamping portion comprises a polyetheretherketone clamping portion.

[0017] In some embodiments, the clamping portion is configured such that when the chip clamping device clamps the chip to be clamped, the angle formed by the extension direction of the distal end of the clamping portion and the bottom surface of the chip to be clamped is 45°.

[0018] In some embodiments, the angle formed by each of the bent portions is an obtuse angle.

[0019] The chip clamping device provided in this application can or at least has the following advantages:

[0020] In an embodiment of the present application, each clamping portion is designed to have a bent portion formed by bending outward, and the clamping space formed by the mutual alignment of the grooves on the inner sides of the two bent portions is used to clamp the chip to be clamped, which reduces the difficulty of operation and can effectively prevent the chip to be clamped from slipping and the damage caused by it. In an embodiment of the present application, each clamping portion is detachably connected to the corresponding nickel sheet for easy replacement. For example, it is convenient to replace clamping portions of different specifications to meet the clamping requirements of chips to be clamped of different specifications, which is conducive to improving production efficiency; for example, it is convenient to replace a new clamping portion in time after the clamping portion is damaged, etc.

[0021] Other advantages, objectives, and features of the present application will be described in detail in the following description and, to some extent, will be apparent to those skilled in the art upon examination and study of the following, or may be taught from practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings.

[0023] Figure 1 A schematic side view of a chip clamping device provided in some embodiments of the present application;

[0024] Figure 2 A schematic front view of a chip clamping device provided in some embodiments of the present application;

[0025] Figure 3 for Figure 2 A partial enlarged view of area A in the chip clamping device shown.

[0026] Reference numerals:

[0027] 101, nickel sheet; 102, clamping portion; 102', bending portion; 103, nut. DETAILED DESCRIPTION

[0028] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0030] In the following embodiments, when layers, regions, or elements are “connected,” it may be understood that the layers, regions, or elements are not only directly connected but also connected via other constituent elements interposed therebetween.

[0031] Although the terms "above", "below", "between", etc. may be used in this specification to describe different exemplary features and elements of the present application, these terms are used herein for convenience only, such as the orientation of the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this application. Furthermore, the illustrations provided in this embodiment only illustrate the basic concept of the present disclosure in a schematic manner. Although the illustrations only show components related to the present disclosure and are not drawn according to the number, shape and size of components in actual implementation, the type, quantity and proportion of each component in actual implementation may be changed at will, and the component layout type may also be more complex.

[0032] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0033] During the semiconductor chip manufacturing process, when a failed chip occurs, researchers need to use tweezers to pick it up and transfer it to the failure analysis department for analysis. However, traditional tweezers are difficult to grasp and can easily cause the chip to slip and become damaged. Furthermore, the tweezers often need to be changed depending on the chip specifications, severely impacting production efficiency.

[0034] In view of the shortcomings of the above-mentioned related technologies, the present application provides a chip clamping device that can reduce the difficulty of operation, effectively prevent the chip to be clamped from slipping and causing damage, and the clamping part is easy to replace. The details will be explained in the subsequent embodiments.

[0035] See also Figure 1 The chip clamping device provided in this application may specifically include: a nickel sheet 101 and a clamping portion 102.

[0036] Specifically, two nickel sheets 101 are provided, for example Figure 2 and Figure 3 The nickel sheet 101a and the nickel sheet 101b shown in the figure have the same structure and are symmetrically arranged; the fixed ends of the two nickel sheets 101 are connected, for example Figure 2 and Figure 3 The fixed end of the middle nickel sheet 101a is connected to the fixed end of the nickel sheet 101b to form a joint.

[0037] The clamping portion 102 is arranged in a one-to-one correspondence with the nickel sheet 101, for example Figure 2 and Figure 3 As shown, the clamping portion 102a corresponds to the nickel sheet 101a, and the clamping portion 102b corresponds to the nickel sheet 101b.

[0038] It is worth noting that the clamping portion 102 is detachably connected to the nickel sheet 101. Figure 2 and Figure 3 The clamping portion 102a) shown in the figure is bent outward to form a bent portion 102', and the grooves inside the two bent portions 102' are aligned with each other to form a clamping space, which is used to clamp the chip to be clamped.

[0039] The chip clamping device provided in the present application is designed to have each clamping portion 102 with a bent portion 102' bent outward. The clamping space formed by the mutual alignment of the grooves on the inner sides of the two bent portions 102' is used to clamp the chip to be clamped, which reduces the difficulty of operation and can effectively prevent the chip to be clamped from slipping and the resulting damage.

[0040] In the embodiment of the present application, each clamping portion 102 is detachably connected to the corresponding nickel sheet 101 to facilitate replacement. For example, different sizes of clamping portions 102 can be easily replaced to accommodate different sizes of chips to be clamped, thereby improving production efficiency. Another example is that a clamping portion 102 can be easily replaced with a new one if it is damaged.

[0041] Please continue reading Figure 2In some embodiments, the angle α formed by the extended ends of the two nickel sheets 101 (e.g., nickel sheet 101a and nickel sheet 101b) is less than or equal to 15°. For example, the angle α formed by the extended ends of the two nickel sheets 101 can be 15°, 12°, or 10°, etc.

[0042] In the above embodiment, the angle α formed by the extended end of the nickel sheet 101 is less than or equal to 15°, which can provide appropriate elastic rebound force and effectively control the clamping force, thereby reducing the chip to be clamped from slipping or breaking during the clamping process, and further improving the clamping stability.

[0043] The present embodiment does not specifically limit the material of the nickel sheet 101. In some embodiments, the nickel sheet 101 comprises a resilient stainless steel nickel sheet. Using resilient stainless steel not only increases durability but also provides flexibility and corrosion resistance, thereby extending the life of the chip gripping device.

[0044] The embodiments of the present application do not specifically limit the size of the nickel sheet 101. In some embodiments, the width of the nickel sheet 101 is greater than or equal to 10 mm. For example, the width of the nickel sheet 101 can be 10 mm, 9 mm, or 8 mm, etc. A wider nickel sheet 101 can enhance the stability of the chip gripping device and make it easier for the operator to control, for example, making it easier for an operator wearing gloves to use and pick up the chip gripping device, thereby improving the operating comfort of the chip gripping device.

[0045] In this application, the clamping portion 102 is detachably connected to the nickel sheet 101. As an example, please continue to refer to Figure 1 The clamping portion 102 can be detachably connected to the corresponding nickel sheet 101 through a nut 103. By using the nut 103 to achieve a detachable connection between the clamping portion 102 and the nickel sheet 101, the clamping portion 102 can be quickly and conveniently replaced, thereby facilitating subsequent maintenance and meeting different operational requirements, which is conducive to reducing the maintenance cost of the chip clamping device. For example, by using the nut 103 to achieve a detachable connection between the clamping portion 102 and the nickel sheet 101, it is convenient to replace the clamping portion 102 of different specifications and / or styles to meet the clamping requirements of different types of chips to be clamped, which is conducive to improving production efficiency; for example, it is convenient to replace the clamping portion 102 with a new one in a timely manner after the clamping portion 102 is damaged.

[0046] In some embodiments, the diameter of the nut 103 is greater than or equal to 1 / 2 of the width of the nickel sheet 101, which helps to ensure that the connection between the clamping portion 102 and the nickel sheet 101 is more stable and not easy to loosen, thereby improving the stability of the overall structure of the chip clamping device and preventing the clamping portion 102 from falling off during operation.

[0047] For example, the width of the nickel sheet 101 may be 10 mm, and in this case the diameter of the nut 103 may be 5 mm.

[0048] As an example, see Figure 1 Each clamping portion 102 can be detachably connected to the corresponding nickel sheet 101 through two nuts 103. In other embodiments, each clamping portion 102 can also be detachably connected to the corresponding nickel sheet 101 through a greater number of nuts 103.

[0049] Each clamping portion 102 is connected to the nickel sheet 101 via at least two nuts 103 , so that the clamping portion 102 is fixed more firmly, further reducing the risk of the clamping portion 102 loosening during operation, thereby improving the safety and stability of chip clamping.

[0050] In some embodiments, the clamping portion 102 may specifically comprise a polyetheretherketone (PEEK) clamping portion, but is not limited thereto. The clamping portion 102 utilizes PEEK, which exhibits excellent properties such as resistance to acid and alkali corrosion, high-temperature aging, and wear. It also offers advantages such as anti-static properties, high friction resistance, and light weight. This significantly improves the durability of the clamping portion 102, further reducing the frequency of clamping portion 102 replacement and thereby extending the overall service life of the chip gripping device.

[0051] Please continue reading Figure 2 and Figure 3 In some embodiments, when the chip clamping device clamps the chip to be clamped, the angle β formed by the extension direction of the distal end of the clamping portion 102 and the bottom surface of the chip to be clamped is 45°.

[0052] It should be noted that the above embodiment includes not only the case where the angle β is absolutely equal to 45°, but also the case where the angle β is approximately equal to 45° as commonly known in the semiconductor manufacturing field, that is, there may be a certain error, such as the case where the angle β has a deviation range of -2% to 2%.

[0053] In the above embodiment, the bent portion 102' of the clamping portion 102 is designed so that the angle β formed by the extension direction of its distal end and the bottom surface of the chip to be clamped is 45°, so that the chip clamping device can form a 45° angle when clamping the chip, thereby facilitating the side-entry into the bottom of the chip to be clamped for clamping. This not only makes the operation more flexible, but also effectively reduces the pressure applied to the chip to be clamped during the clamping process, thereby reducing the risk of the chip to be clamped being broken.

[0054] Please continue reading Figure 2 and Figure 3In some embodiments, the angle γ formed by each bent portion 102' is an obtuse angle. This helps to more evenly distribute the pressure applied by the chip clamping device to the chip during the clamping process, preventing the clamping force from being concentrated at a single point on the chip, thereby effectively protecting the chip and further improving the safety and reliability of the chip clamping process.

[0055] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A chip clamping device, characterized in that: include: Two nickel sheets are provided, and the fixed ends of the two nickel sheets are connected; A clamping portion is provided corresponding to each of the nickel sheets, and the clamping portion is detachably connected to the nickel sheet; Each of the clamping portions is bent outward to form a bent portion, and the grooves inside the two bent portions are aligned with each other to form a clamping space, and the clamping space is used to clamp the chip to be clamped.

2. The chip clamping device according to claim 1, characterized in that: The angle formed by the extended ends of the two nickel sheets is less than or equal to 15°.

3. The chip clamping device according to claim 1, characterized in that: The nickel sheet comprises an elastic stainless steel nickel sheet.

4. The chip clamping device according to claim 1, characterized in that: The width of the nickel sheet is greater than or equal to 10 mm.

5. The chip clamping device according to claim 1, characterized in that: The clamping portion is detachably connected to the corresponding nickel sheet through a nut.

6. The chip gripping device according to claim 5, characterized in that: The diameter of the nut is greater than or equal to 1 / 2 of the width of the nickel sheet.

7. The chip gripping device according to claim 5, characterized in that: Each of the clamping parts is detachably connected to the corresponding nickel sheet through at least two nuts.

8. The chip gripping device according to claim 1, wherein: The clamping portion includes a polyetheretherketone clamping portion.

9. The chip gripping device according to claim 1, wherein: The clamping portion is configured such that when the chip clamping device clamps the chip to be clamped, the angle formed by the extending direction of the distal end of the clamping portion and the bottom surface of the chip to be clamped is 45°.

10. The chip gripping device according to claim 9, characterized in that: The angle formed by each of the bent portions is an obtuse angle.

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