Wave-soldering tinning pore plate

Abstract

The utility model relates to the technical field of wave soldering, and discloses a wave soldering upper tin hole plate, which comprises a substrate, an upper hole is arranged on the upper surface of the substrate, a cylindrical part is arranged in the substrate below the upper hole, a lower hole is arranged below the cylindrical part, the lower hole is arranged on the lower surface of the substrate, and the upper surface of the substrate is provided with an upper tin hole. The inner diameter of the cylindrical part is gradually increased in the direction from the upper opening to the lower opening, and a nozzle used for tinning is formed among the upper opening, the cylindrical part and the lower opening. In this way, the nozzle is not prone to being attached and blocked by tin slag, and the machining quality and the machining efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering, in particular to a wave soldering tin hole plate. Background Art

[0002] In the production process of printed circuit boards, a wave soldering process is usually used to solder components installed on the PCB board by manual plug-in. The production equipment required in the wave soldering process is a wave soldering machine. When performing wave soldering, when the PCB board needs to be tinned, the PCB board needs to be moved to the top of the tin bath through the transmission device in the wave soldering machine. The tin bath is provided with an orifice plate formed by multiple through holes. The tin liquid in the tin bath flows from bottom to top through the through holes of the orifice plate to the PCB board through the cooperation of the power device, thereby completing the tinning.

[0003] Currently, the through-holes on these orifice plates are usually of a common opening shape with the same diameter at the top and bottom. This will cause tin slag to easily adhere to the through-holes during tinning, causing blockage and requiring frequent maintenance of the orifice plates. In addition, during tinning, the blockage of some through-holes will increase the upward pressure of the tin liquid in other unblocked through-holes, causing more tin liquid to reach the PCB board, which is prone to tin overflow and copper corrosion on the PCB board, affecting processing quality and efficiency. Summary of the Invention

[0004] The utility model aims to provide a wave soldering tin hole plate, which is not easily attached and blocked by tin slag, has a smooth tin wave, reduces the occurrence of tin overflow and copper corrosion, and improves processing quality and processing efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A wave soldering tinning hole plate is arranged above a tin bath of a wave soldering machine, comprising: a base plate with an upper opening provided on the upper surface, a cylindrical portion provided in the base plate below the upper opening, a lower opening provided below the cylindrical portion, and the lower opening is arranged on the lower surface of the base plate, the inner diameter of the cylindrical portion gradually increases along the direction from the upper opening to the lower opening, wherein a nozzle for tinning is formed between the upper opening, the cylindrical portion and the lower opening.

[0007] Preferably, a plurality of the upper opening, the cylindrical portion, and the lower opening are provided, so that a plurality of the nozzles are formed on the substrate.

[0008] Preferably, the plurality of nozzles are arranged in an array of five or seven rows.

[0009] Preferably, the inner diameter of the upper opening is 4 mm, and the inner diameter of the lower opening is 4.5 mm.

[0010] Preferably, the lower surface of the substrate is connected to a boss, a columnar portion communicating with the nozzle is provided in the boss, an upper opening and a lower opening are formed at the upper and lower ends of the columnar portion on the boss surface respectively, and the upper opening is communicated with the lower opening.

[0011] Preferably, the inner diameter of the cylindrical portion gradually increases along a direction from the upper opening to the lower opening.

[0012] Preferably, the inner diameter of the cylindrical portion along the radial direction thereof is the same.

[0013] Preferably, the inner diameters of the lower opening and the upper opening are both 4 mm, and the inner diameter of the lower opening is 4.5 mm.

[0014] Preferably, the inner diameter of the upper opening is 4 mm, the inner diameters of the lower opening and the upper opening are both 4.5 mm, and the inner diameter of the lower opening is 4.8 mm.

[0015] Preferably, a plurality of mounting holes are further provided on the peripheral side of the substrate.

[0016] Compared to the prior art, the present invention has the following beneficial effects: a nozzle for tinning is formed between the upper opening, the cylindrical portion, and the lower opening. The inner diameter of the cylindrical portion within the nozzle gradually increases from the upper opening to the lower opening, forming a trumpet-shaped nozzle. During tinning, the molten tin flows from bottom to top through the trumpet-shaped nozzle. This design helps reduce the impact of the tin wave, allowing the molten tin to be tinned onto the PCB board in a more stable manner, thereby reducing the impact of excessive impact on the PCB board. Furthermore, the trumpet-shaped nozzle helps the solder flow more evenly to the PCB board, reducing solder spatter and the generation of tin slag, thereby reducing the risk of tin slag adhesion and clogging of the nozzle. It further reduces the impact on the PCB board caused by excessive tinning pressure on other nozzles due to blockage in some locations. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a front structural diagram of a wave soldering tin hole plate according to an embodiment of the present utility model;

[0018] Figure 2 This is a reverse structural diagram of a wave soldering tin hole plate according to an embodiment of the present utility model;

[0019] Figure 3 Schematic diagram of the internal structure of the substrate according to an embodiment of the present utility model;

[0020] Figure 4 It is a schematic diagram of the internal structure after the boss according to an embodiment of the present utility model is installed on the base plate. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0022] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0023] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0025] Figure 1-Figure 4 This is a schematic diagram of a wave soldering tin hole plate according to an embodiment of the present invention. Figure 1-Figure 3The wave soldering tin hole plate includes a substrate 1, an upper opening 201 is provided on the upper surface 101 of the substrate 1, and a cylindrical portion 202 is provided in the substrate 1 below the upper opening 201, and a lower opening 203 is provided below the cylindrical portion 202, and the lower opening 203 is provided on the lower surface 102 of the substrate 1. The upper end of the cylindrical portion 202 is the upper opening 201, and the lower end of the cylindrical portion 202 is the lower opening 203. A nozzle 2 for tinning is formed between the upper opening 201, the cylindrical portion 202 and the lower opening 203. The inner diameter of the cylindrical portion 202 in the nozzle 2 gradually increases from the upper opening 201 to the lower opening 203 so that the nozzle 2 is a trumpet shape. When tinning, the tin liquid flows through the trumpet-shaped nozzle 2 from bottom to top. This design helps to reduce the impact force of the tin wave, so that the tin liquid is tinned onto the PCB board in a more stable manner, thereby reducing the impact on the PCB board due to excessive impact force. Moreover, the trumpet-shaped nozzle 2 helps the solder to flow more evenly to the PCB board, which can reduce the generation of solder splash and slag, thereby reducing the risk of the nozzle 2 being attached to and blocked by slag, and further reducing the impact of excessive tin pressure on other nozzles 2 due to blockage at some positions on the PCB board. Among them, the upper opening 201, the cylindrical portion 202 and the lower opening 203 are each provided in plurality, so that a plurality of nozzles 2 are formed on the substrate 1 to meet different soldering requirements. As a preferred embodiment, the plurality of nozzles 2 are arranged in an array of five or seven rows, and each row is provided with a plurality of nozzles 2. Secondly, in order to facilitate the installation of the wave soldering tin hole plate on the wave soldering machine, a plurality of mounting holes 4 for installation on the wave soldering machine are also provided on the periphery of the substrate 1.

[0026] Next, see Figure 2-Figure 4The lower surface 102 of the substrate 1 is connected to a boss 3, and a columnar portion 301 is provided in the boss 3 to be connected to the nozzle 2. The upper and lower ends of the columnar portion 301 respectively form an upper opening 302 and a lower opening 303 on the surface of the boss (3). The upper opening 302 is connected to the lower opening 303. When tinning, the tin liquid will flow from the lower opening 303 to the upper opening 302, then to the lower opening 203 and the cylindrical portion 202, and finally flow out from the upper opening 201. The setting of the columnar portion 301 in the boss 3 can increase the flow distance of the tin liquid, extend the time for the tin liquid to flow to the PCB board, make the flow of the tin liquid more stable, reduce the phenomenon of tin liquid splashing, and reduce the risk of the nozzle 2 being attached and blocked by tin slag. Among them, as a preferred embodiment, the inner diameter of the cylindrical portion 301 gradually increases along the direction from the upper opening 302 to the lower opening 303, which is equivalent to the cylindrical portion 301 itself forming a trumpet-shaped structure to further reduce the impact force of the tin wave, so that the tin liquid contacts the PCB board in a more stable manner. The trumpet-shaped cylindrical portion 301 can further make the flow of the tin liquid more stable. In addition, as another preferred embodiment, the inner diameter of the cylindrical portion 301 along its radial direction is the same, that is, the inner diameter of the cylindrical portion 301 along its radial direction is the same. The purpose of this design is to increase the flow path of the solder, thereby improving the welding stability and reducing the risk. Secondly, in order to extend the service life of the boss 3 and improve the structural strength, the substrate 1 and the boss 3 are integrally formed.

[0027] It should be noted that in some embodiments, the inner diameter of the upper opening 201 of the nozzle 2 is 4mm, and the inner diameter of the lower opening 203 of the nozzle 2 is 4.5mm, while the inner diameter of the cylindrical portion 202 between them gradually changes from 4mm to 4.5mm along the direction from the upper opening 201 to the lower opening 203, or is a size larger than 4.8mm, which needs to be set in combination with specific circumstances. In other embodiments, after the boss 3 is installed on the substrate 1, there are two situations: the first is when the inner diameters inside the cylindrical portion 301 are consistent. Assuming that the inner diameter of the upper opening 201 of the nozzle 2 is 4mm and the inner diameter of the lower opening 203 is 4.5mm, the inner diameter of the lower opening 203 is the same as that of the upper opening 302. If the inner diameters inside the cylindrical portion 301 are consistent, the inner diameters of the upper opening 302 and the lower opening 303 are both consistent with the inner diameter of the lower opening 203, both of which are 4.5mm; the second is when When the cylindrical portion 301 is also trumpet-shaped, the inner diameters of the upper opening 302 and the lower opening 303 are inconsistent. Assuming that the inner diameter of the upper opening 201 of the nozzle 2 is 4 mm, and the inner diameter of the lower opening 203 is 4.5 mm, the inner diameter of the lower opening 203 is the same as that of the upper opening 302, then the inner diameter of the cylindrical portion 301 will gradually change from 4.5 mm to 4.8 mm along the direction from the upper opening 302 to the lower opening 303, or a size larger than 4.8 mm, which needs to be set according to the specific situation.

[0028] Based on the disclosure and teachings of the above description, those skilled in the art may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and any modifications and variations of the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although certain specific terms are used in this description, these terms are for convenience of description only and do not constitute any limitation to the present invention.

Claims

1. A wave soldering tin hole plate, arranged above a tin bath of a wave soldering machine, characterized in that: include: A substrate (1) is provided with an upper opening (201) on its upper surface (101), a cylindrical portion (202) is provided inside the substrate (1) below the upper opening, a lower opening (203) is provided below the cylindrical portion (202), and the lower opening (203) is provided on the lower surface (102) of the substrate (1), and the inner diameter of the cylindrical portion (202) gradually increases along the direction from the upper opening (201) to the lower opening (203). A nozzle (2) for tinning is formed between the upper opening (201), the cylindrical portion (202) and the lower opening (203).

2. The wave soldering tin hole plate according to claim 1, characterized in that: The upper opening (201), the cylindrical portion (202) and the lower opening (203) are all provided in plurality, so that a plurality of nozzles (2) are formed on the substrate.

3. The wave soldering tin hole plate according to claim 2, characterized in that: The plurality of nozzles (2) are arranged in an array of five or seven rows.

4. The wave soldering tin hole plate according to claim 1, characterized in that: The inner diameter of the upper opening (201) is 4 mm, and the inner diameter of the lower opening (203) is 4.5 mm.

5. The wave soldering tin hole plate according to claim 1, characterized in that: The lower surface (102) of the substrate (1) is connected to a boss (3), and a columnar portion (301) is provided in the boss (3) and is in communication with the nozzle. The upper and lower ends of the columnar portion (301) respectively form an upper opening (302) and a lower opening (303) on the surface of the boss (3), and the upper opening (302) and the lower opening (303) are in communication with each other.

6. The wave soldering tin hole plate according to claim 5, characterized in that: The inner diameter of the cylindrical portion (301) gradually increases along a direction from the upper opening (302) to the lower opening (303).

7. The wave soldering tin hole plate according to claim 5, characterized in that: The inner diameter of the cylindrical portion (301) is the same along its radial direction.

8. The wave soldering tin hole plate according to claim 6, characterized in that: The inner diameters of the lower opening (203) and the upper opening (302) are both 4 mm, and the inner diameter of the lower opening (303) is 4.5 mm.

9. The wave soldering tin hole plate according to claim 6, characterized in that: The inner diameter of the upper opening (201) is 4 mm, the inner diameters of the lower opening (203) and the upper opening (302) are both 4.5 mm, and the inner diameter of the lower opening (303) is 4.8 mm.

10. The wave soldering tin hole plate according to claim 1, characterized in that: A plurality of mounting holes (4) are also provided on the peripheral side of the base plate (1).

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