Heat dissipation module, circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model discloses a heat dissipation module, a circuit board assembly and electronic equipment, relates to the technical field of circuit board connection, and solves the problems that when an existing jet cooling device is fallen or impacted, a chip is flapped, so that the cracking risk of the chip occurs, and a welding ball in the chip packaged by a ball grid array is pressed, so that the failure risk occurs. The laser chip comprises a jet flow liquid cooling radiator, a locking piece, a tolerance filling structure and a supporting piece. The locking piece penetrates through the jet flow liquid cooling radiator. The first end of the locking piece penetrates through the circuit board and is fixedly connected with the handle strip bottom plate. The tolerance filling structure is connected between the second end and the jet flow liquid cooling radiator. The supporting piece is arranged between the jet flow liquid cooling radiator and the circuit board and makes contact with the jet flow liquid cooling radiator and the circuit board. When the jet flow liquid cooling radiator is fallen off or impacted, the jet flow liquid cooling radiator transmits impact force to the supporting piece and the handle strip bottom plate through the tolerance filling structure and the locking piece, so that the cracking risk of the chip and the failure risk of the solder balls are avoided.

Description

Technical Field

[0001] The present application relates to the field of circuit board connection technology, and in particular to a heat dissipation module, a circuit board assembly, and an electronic device. Background Art

[0002] As the power consumption and power density of chips in communication equipment continue to rise, the thermal resistance of packaged chips accounts for 30% to 40% of the total thermal resistance of communication equipment. To reduce the thermal resistance of packaged chips, jet cooling can be used to cool the chips. Coolant is sprayed onto the surface of the chip at high speed to dissipate heat from the chip, improving heat dissipation performance and achieving better heat dissipation for the chip. Therefore, it can solve the problem of thermal resistance (thermal interface material, TIM) delamination caused by bending at different temperatures due to differences in the coefficient of thermal expansion (CTE) of the film layer structures in various packaged chips.

[0003] The lower cover of the cold plate in existing jet cooling devices can be directly and hermetically connected to the upper surface of the chip to form a sealed cooling space. Coolant can flow within this space, removing heat from the chip. However, localized stress concentration occurs at the connection between the lower cover and the chip, causing the jet cooling device to slap the chip when dropped or impacted, risking cracking. Furthermore, for ball grid array (BGA) packaged chips, the solder balls of the packaged chip will be compressed when dropped or impacted, posing a risk of failure. Utility Model Content

[0004] The present application provides a heat dissipation module, a circuit board assembly, and an electronic device, which solve the problem that the existing jet cooling device may hit the chip and cause the chip to crack when it is dropped or impacted, and the problem that the solder balls between the chip and the circuit board using a ball grid array package may be compressed and cause failure.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation module, which can be mounted on the bottom plate of a handle bar. A circuit board assembly is provided on the bottom plate of the handle bar, and the circuit board assembly includes a circuit board and a packaged chip arranged on the circuit board. The heat dissipation module can be used to dissipate heat for the packaged chip. The above-mentioned heat dissipation module includes a jet liquid cooling radiator, a locking member, a tolerance filling structure and a support member. Among them, the locking member is arranged through the jet liquid cooling radiator. The locking member has a first end and a second end relative to each other. The first end and the second end are respectively located on both sides of the outside of the jet liquid cooling radiator. In addition, the first end passes through the circuit board and is fixedly connected to the bottom plate of the handle bar. The tolerance filling structure is connected between the locking member and the jet liquid cooling radiator. The support member can be arranged between the jet liquid cooling radiator and the circuit board, and is in contact with both the jet liquid cooling radiator and the circuit board.

[0007] Compared to the prior art, when the heat dissipation module of the embodiment of the present application is used to dissipate heat for the packaged chip, the tolerance filling structure connects the second end of the locking member to the jet liquid cooling radiator, and the first end of the locking member passes through the circuit board and is fixedly connected to the bottom plate of the handle bar. Therefore, when dropped or impacted, the jet liquid cooling radiator transmits the impact force to the bottom plate of the handle bar through the tolerance filling structure and the locking member. In addition, the support member can support the jet liquid cooling radiator. Therefore, the chip will not be hit, avoiding the risk of cracking the chip. Even if the packaged chip adopts a ball grid array package, the solder balls of the packaged chip will not be compressed and fail at risk.

[0008] Based on the structure of the above-mentioned heat dissipation module, in some embodiments of the present application, the above-mentioned jet liquid cooling radiator is provided with a mounting hole. The locking member is a locking bolt. The first end of the locking bolt has a thread, and the first end of the locking bolt is set through the mounting hole. A matching hole is provided at a position corresponding to the mounting hole on the circuit board. In addition, a threaded connection structure that cooperates with the locking bolt, such as a threaded hole or a screw hole column, is provided on the bottom plate of the handle bar. The first end of the locking bolt passes through the mounting hole, the matching hole and the threaded connection structure on the bottom plate of the handle bar in sequence. The structure of the locking member is relatively simple.

[0009] Correspondingly, the support member is a bolt sleeve. The bolt sleeve fits over the locking bolt and connects to the external threads of the screw on the locking bolt. One end face of the bolt sleeve can contact the jet liquid cooling radiator, while the other end face of the bolt sleeve can contact the surface of the circuit board where the packaged chip is located. The support member also has a relatively simple structure, and its connection to the locking member is highly reliable.

[0010] In some examples of the present application, the second end of the locking bolt has a bolt head. The tolerance filling structure includes a tolerance filling pad and a connecting material, and the tolerance filling pad is sleeved outside the locking bolt. In addition, the tolerance filling pad is located between the bolt head of the locking bolt and the jet liquid cooling radiator. The connecting material is filled between the tolerance filling pad and the bolt head of the locking bolt, and between the tolerance filling pad and the jet liquid cooling radiator. Therefore, the tolerance filling structure can adjust the amount of connecting material that needs to be filled according to the size of the tolerance, so as to ensure that the tolerance filling structure can reliably connect the bolt head of the locking bolt to the jet liquid cooling radiator, and has good adaptability.

[0011] Based on the above tolerance filling structure, in some embodiments of the present application, the above connection material is solder, which welds the tolerance filling pad to the bolt head of the locking bolt and welds the tolerance filling pad to the jet liquid cooling radiator.

[0012] In some other embodiments of the present application, the connection material is an adhesive, which bonds the tolerance filling pad to the bolt head of the locking bolt and bonds the tolerance filling pad to the jet liquid cooling radiator.

[0013] In a second aspect, embodiments of the present application further include a circuit board assembly comprising a circuit board, a packaged chip, a jet-cooled heat sink, a locking member, a tolerance filling structure, and a support member. The packaged chip is disposed on a first side of the circuit board. The jet-cooled heat sink is disposed on a side of the packaged chip away from the circuit board. Furthermore, the jet-cooled heat sink is sealed to the packaged chip. A locking member is sequentially disposed through the jet-cooled heat sink and the circuit board. The locking member has a first end and a second end that are opposed to each other. The first end and the second end are respectively located on opposite sides of the exterior of the jet-cooled heat sink, and the first end is configured to be fixedly connected to a handle bar base plate. Furthermore, the locking member is fixedly connected to the handle bar base plate on a second side of the circuit board. The second side is opposite to the first side. The tolerance filling structure is connected between the second end of the locking member and the jet-cooled heat sink. The support member is disposed between the jet-cooled heat sink and the circuit board. Furthermore, the support member contacts both the jet-cooled heat sink and the circuit board. Since the jet liquid-cooled radiator, locking member, tolerance filling structure and support member in the circuit board assembly of the embodiment of the present application are the same as the jet liquid-cooled radiator, locking member, tolerance filling structure and support member structure in the heat dissipation module described in the above embodiment, both can solve the same technical problems and obtain the same technical effects, they will not be repeated here.

[0014] Based on the above structure, in some embodiments of the present application, the jet liquid cooling radiator is provided with a mounting hole, and a mating hole is provided on the circuit board at a position corresponding to the mounting hole. The handle bar base plate is provided with a threaded connection structure, such as a threaded hole or a screw hole column, that mates with the locking bolt. The locking member is a locking bolt. The first end of the locking bolt has a thread, and the first end of the locking bolt sequentially passes through the mounting hole and the mating hole to connect with the threaded connection structure on the handle bar base plate. The structure of the locking member is relatively simple.

[0015] Correspondingly, the support member is a bolt sleeve. The bolt sleeve fits over the locking bolt and connects to the external threads of the screw on the locking bolt. One end face of the bolt sleeve can contact the jet liquid cooling radiator, while the other end face of the bolt sleeve can contact the surface of the circuit board where the packaged chip is located. The support member also has a relatively simple structure, and its connection to the locking member is highly reliable.

[0016] In some examples of the present application, the second end of the locking bolt has a bolt head. The tolerance filling structure includes a tolerance filling pad and a connecting material, and the tolerance filling pad is sleeved outside the locking bolt. In addition, the tolerance filling pad is located between the bolt head of the locking bolt and the jet liquid cooling radiator. The connecting material is filled between the tolerance filling pad and the bolt head of the locking bolt, and between the tolerance filling pad and the jet liquid cooling radiator. Therefore, the tolerance filling structure can adjust the amount of connecting material that needs to be filled according to the size of the tolerance, so as to ensure that the tolerance filling structure can reliably connect the bolt head of the locking bolt to the jet liquid cooling radiator, and has good applicability.

[0017] Based on the above tolerance filling structure, in some embodiments of the present application, the above connection material is solder, which welds the tolerance filling pad to the bolt head of the locking bolt and welds the tolerance filling pad to the jet liquid cooling radiator.

[0018] In some other embodiments of the present application, the connection material is an adhesive, which bonds the tolerance filling pad to the bolt head of the locking bolt and bonds the tolerance filling pad to the jet liquid cooling radiator.

[0019] Furthermore, in some examples of the present application, the packaged chip includes a substrate, a bare chip, and a metal ring. The bare chip and the metal ring are disposed in the same layer on the substrate. The metal ring surrounds the chip. The metal ring is located at the edge of the substrate. The metal ring is sealed to the jet liquid cooling heat sink by welding or gluing. Compared to using a sealing ring, welding or gluing can improve the long-term sealing reliability between the metal ring and the jet liquid cooling heat sink.

[0020] On the third aspect, the embodiment of the present application also includes an electronic device, including the circuit board assembly and the handle bar bottom plate described in the above embodiment. The handle bar bottom plate is located on the second side of the circuit board in the circuit board assembly. In addition, the first end of the locking member in the circuit board assembly passes through the circuit board and is connected to the handle bar bottom plate. Since the circuit board assembly in the electronic device of the embodiment of the present application has the same structure as the circuit board assembly described in the above embodiment, the two can solve the same technical problems and obtain the same technical effects, and they will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0022] Figure 1 This is a structural diagram of the optical terminal according to an embodiment of the present application;

[0023] Figure 2 This is a structural diagram of the handle bar bottom plate in the optical terminal of the embodiment of the present application;

[0024] Figure 3 This is a schematic structural diagram of some components of the circuit board assembly in the optical terminal according to an embodiment of the present application;

[0025] Figure 4 This is a cross-sectional view of a circuit board assembly in the related art;

[0026] Figure 5 This is one of the cross-sectional schematic diagrams of the circuit board assembly in the optical terminal according to the embodiment of the present application;

[0027] Figure 6 This is the second cross-sectional schematic diagram of the circuit board assembly in the optical terminal according to the embodiment of the present application.

[0028] Figure Number:

[0029] 1000-optical terminal; 100-box; 200-handle bar bottom plate; 2001-screw hole column; 300-circuit board assembly; 10-circuit board; 10a-first side; 10b-second side; 101-matching hole; 20-chip; 20S-packaged chip; 201-substrate; 202-bare chip; 203-metal ring; 30-heat dissipation module; 1-jet liquid cooling radiator; 11-mounting hole; 2-locking piece; 21-first end; 22-second end; 211-bolt head; 3-tolerance filling structure; 31-tolerance filling pad; 32-connecting material; 4-support member. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0031] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0032] In addition, in this application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0033] In this application, unless otherwise specified or limited, the term "connection" should be understood broadly. For example, "connection" can refer to mechanical or physical connections. It can be fixed, removable, or integrated; it can be direct or indirectly connected through an intermediary. It can also be understood as physical contact and electrical continuity between components, or as a circuit structure in which different components are connected through physical circuits such as PCB copper foil or wires that can transmit electrical signals.

[0034] The present application provides an electronic device, which may include a mobile phone, a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, optical terminals, routers, switches, servers and workstations. The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic devices. For the convenience of explanation, the following are all based on the electronic device as follows. Figure 2 The optical terminal (i.e., terminal equipment for optical signal transmission) is used as an example for illustration.

[0035] Please refer to Figure 1 、 Figure 2 and Figure 3 , Figure 1 A three-dimensional diagram of an optical terminal provided in some embodiments of the present application. Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure of the handle bar in the electronic device shown. Figure 3FIG is a schematic cross-sectional view of a circuit board assembly in an electronic device. As can be seen from the above, in this embodiment, the electronic device is an optical terminal 1000. The optical terminal 1000 may include a housing 100, Figure 2 The handle bar bottom plate 200 and Figure 3 The circuit board assembly 300 shown. The handle bar bottom plate 200 is installed on the box body 100. The circuit board assembly 300 is arranged on the handle bar bottom plate 200. The handle bar bottom plate 200 in the optical terminal 1000 can be one, or two or more, and this application does not limit this. The above-mentioned circuit board assembly 300 includes a circuit board 10 and one or more chips 20. The one or more chips 20 are all arranged on the circuit board 10 and are located on the side of the circuit board 10 away from the handle bar bottom plate 200. The circuit board 10 has a first side 10a and a second side 10b opposite to each other. The chip 20 is located on the first side 10a of the circuit board 10. The handle bar bottom plate 200 is located on the second side 10b of the circuit board 10. In addition, the chip 20 can be packaged in different forms, such as a lidded package and a package using a lid. Figure 3 The present application does not limit the lidless package shown.

[0036] It is understandable that Figure 1 、 Figure 2 and Figure 3 Only some components of the electronic device 1000 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 2 and Figure 3 In some other examples, the circuit board assembly 300 further includes an optical attenuator, a waveguide, an optical interface, and some auxiliary components such as a heat dissipation module.

[0037] The heat dissipation module 30 can be provided on the high-power packaged chip 20S to dissipate heat from the packaged chip 20S. Specifically, the heat dissipation module 30 can include an air-cooled heat sink or a liquid-cooled heat sink. In an embodiment of the present application, the heat dissipation module 30 includes a jet liquid-cooled heat sink 1, which cools the packaged chip 20S by ejecting coolant at high speed.

[0038] like Figure 4 As shown, if the jet liquid cooling radiator 1 can be directly sealed and connected (lidless) to the side surface of the packaged chip 20S away from the circuit board 10 (i.e. Figure 4The jet liquid cooling radiator 1 can spray the coolant onto the surface of the packaged chip 20S, taking away the heat generated by the packaged chip 20S (the hollow arrow in the figure shows the flow direction of the coolant). However, local stress concentration will occur at the connection between the jet liquid cooling radiator 1 and the packaged chip 20S, causing the jet liquid cooling radiator 1 to slap the packaged chip 20S when it is dropped or impacted, making the packaged chip 20S prone to cracking. In addition, for the chip 20 packaged in a ball grid array, when it is dropped or impacted, the solder balls A of the chip 20 will be compressed, making the solder balls A prone to failure.

[0039] In order to solve this problem, the embodiment of the present application provides an improved heat dissipation module 30. Figure 5 The heat dissipation module 30 includes a jet liquid cooling radiator 1, a locking member 2, a tolerance filling structure 3 and a support member 4. The locking member 2 has a first end 21 and a second end 22 relative to each other. The first end 21 of the locking member 2 passes through the jet liquid cooling radiator 1, the circuit board 10 and is fixedly connected to the handle bar bottom plate 200 in sequence. The second end 22 of the locking member 2 is located on the side of the jet liquid cooling radiator 1 away from the circuit board 10. The tolerance filling structure 3 is connected between the second end 22 of the locking member 2 and the jet liquid cooling radiator 1. The support member 4 is arranged between the jet liquid cooling radiator 1 and the circuit board 10, and is in contact with both the jet liquid cooling radiator 1 and the circuit board 10.

[0040] Compared with the prior art, the tolerance filling structure 3 in the heat dissipation module 30 of the embodiment of the present application connects the locking member 2 and the jet liquid cooling radiator 1 together, and the first end 21 of the locking member 2 passes through the circuit board 10 and is fixedly connected to the handle bar bottom plate 200. Therefore, when the circuit board assembly 300 is dropped or impacted, the jet liquid cooling radiator 1 will transfer the impact force to the handle bar bottom plate 200 through the tolerance filling structure 3 and the locking member 2. In addition, the support member 4 can support the jet liquid cooling radiator 1. Therefore, the chip 20 will not be slapped, and the risk of cracking of the chip 20 is avoided. In addition, even if the packaged chip 20S adopts a ball grid array package, the solder balls of the packaged chip 20S will not be compressed and fail at risk.

[0041] Based on the structure of the heat dissipation module 30, in some embodiments of the present application, the jet liquid cooling radiator 1 is provided with a mounting hole 11. A matching hole 101 is provided on the circuit board 10 at a position corresponding to the mounting hole 11. In addition, a threaded connection structure, such as a threaded hole, or a screw threaded hole, is provided on the handle bar bottom plate 200 to match the locking bolt. Figure 2 and Figure 5The screw hole column 2001 is shown. The locking member 2 is a locking bolt. The first end 21 of the locking bolt is threaded and is installed through the mounting hole 11. The first end 21 of the locking bolt passes through the mounting hole 11 and the matching hole 101 in sequence and is installed in the screw hole column 2001 on the handle bar base plate 200. The structure of the locking member 2 is relatively simple.

[0042] It is understandable that in some other examples of the present application, the above-mentioned locking member 2 can also be replaced by a screw, which can also pass through the mounting hole 11 and the matching hole 101 in sequence to connect with the threaded connection structure on the handle bar base plate 200.

[0043] And, refer to Figure 5 The support member 4 is a bolt sleeve (with internal threads), which is sleeved outside the locking bolt and connected to the external threads of the screw on the locking bolt. One end face of the bolt sleeve can contact the jet liquid cooling radiator 1, and the other end face of the bolt sleeve can contact the side surface of the circuit board 10 where the packaged chip 20S is provided (i.e. Figure 5 The bolt sleeve is in contact with the upper surface of the circuit board 10 shown. That is, the height of the bolt sleeve is equal to or approximately equal to the distance between the upper end surface of the mating hole 101 on the circuit board 10 and the lower surface of the mounting hole 11 on the jet liquid cooling heat sink 1. Here, "approximately equal" refers to the accuracy error caused by factors such as installation error or machining error.

[0044] Based on this, in some examples of the present application, the second end 22 of the locking bolt has a bolt head 211. The bolt head 211 of the locking bolt is located above the mounting hole 11 of the jet liquid cooling radiator 1. Figure 6 The tolerance filling structure 3 includes a tolerance filling pad 31 and a connecting material 32. The tolerance filling pad 31 is sleeved over the locking bolt. Furthermore, the tolerance filling pad 31 is located between the bolt head 211 of the locking bolt and the jet liquid cooling radiator 1. The connecting material 32 is filled between the tolerance filling pad 31 and the bolt head 211 of the locking bolt, as well as between the tolerance filling pad 31 and the jet liquid cooling radiator 1, thereby securing the tolerance filling pad 31 to the bolt head 211 of the locking bolt and the jet liquid cooling radiator 1. The above structure has low machining accuracy requirements for the tolerance filling pad 31. The amount of connecting material 32 filled between the tolerance filling pad 31 and the bolt head 211 of the locking bolt, as well as between the tolerance filling pad 31 and the jet liquid cooling radiator 1, can be adjusted according to actual working conditions to ensure that the tolerance filling structure 3 can reliably connect the bolt head 211 of the locking bolt to the jet liquid cooling radiator 1, thus providing wide applicability.

[0045] Based on the tolerance filling structure 3, in some embodiments of the present application, the connecting material 32 is solder. The connecting material 32 welds the tolerance filling pad 31 to the bolt head 211 of the locking bolt, and welds the tolerance filling pad 31 to the jet liquid cooling radiator 1, which is a relatively simple connection method.

[0046] In other embodiments of the present application, the connecting material 32 is an adhesive. The connecting material 32 bonds the tolerance filling pad 31 to the bolt head 211 of the locking bolt, and bonds the tolerance filling pad 31 to the jet liquid cooling radiator 1 , and the connection method is also relatively simple.

[0047] The above is mainly an explanation of the improved heat dissipation module 30. For the above packaged chip 20S, Figure 5 and Figure 6 As shown, the above-mentioned packaged chip 20S includes a substrate 201, a bare chip 202 and a metal ring 203. The bare chip 202 and the metal ring 203 are arranged on the same layer on the substrate 201. That is, the packaged chip 20S adopts a capless package. The metal ring 203 diffracts on the periphery of the bare chip 202, and the metal ring 203 is located in the edge area of ​​the substrate 201. The metal ring 203 is sealed and connected to the jet liquid-cooled radiator 1 by welding or gluing. Specifically, the metal ring 203 is sealed and connected to the lower cover of the cold plate in the jet liquid-cooled radiator 1 by welding or gluing. Compared with sealing with a sealing ring, the use of welding or gluing can improve the reliability of long-term sealing between the metal ring 203 and the jet liquid-cooled radiator 1.

[0048] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation module, characterized in that: include: Jet liquid cooling radiator; A locking member, the locking member being disposed through the jet liquid cooling radiator; the locking member having a first end and a second end opposite to each other; the first end and the second end being respectively located on opposite sides of the exterior of the jet liquid cooling radiator, and the first end being configured to pass through a circuit board and be fixedly connected to the handle bar bottom plate; a tolerance filling structure connected between the second end of the locking member and the jet liquid cooling radiator; A support member is used to be arranged between the jet liquid cooling radiator and the circuit board, and is in contact with both the jet liquid cooling radiator and the circuit board.

2. The heat dissipation module according to claim 1, characterized in that: The jet liquid cooling radiator is provided with a mounting hole; the locking member is a locking bolt, the first end of which has a thread, the first end of which is arranged through the mounting hole and is used to be threadedly connected to the handle bar base plate through the matching hole on the circuit board.

3. The heat dissipation module according to claim 2, characterized in that: The second end of the locking bolt has a bolt head; the tolerance filling structure includes a tolerance filling pad and a connecting material, the tolerance filling pad is arranged outside the locking bolt and is located between the bolt head of the locking bolt and the jet liquid cooling radiator; the connecting material is filled between the tolerance filling pad and the bolt head of the locking bolt, and between the tolerance filling pad and the jet liquid cooling radiator.

4. The heat dissipation module according to claim 3, characterized in that: The connecting material is solder, and the connecting material is used to weld the tolerance filling pad to the bolt head of the locking bolt, and to weld the tolerance filling pad to the jet liquid cooling radiator; Alternatively, the connection material is an adhesive, and the connection material bonds the tolerance filling pad to the bolt head of the locking bolt, and bonds the tolerance filling pad to the jet liquid cooling radiator.

5. A circuit board assembly, characterized in that: include: circuit boards; A package chip, wherein the package chip is arranged on the first side of the circuit board; a jet liquid cooling radiator, the jet liquid cooling radiator being arranged on a side of the packaged chip away from the circuit board and being sealed to the packaged chip; A locking member, the locking member being sequentially arranged through the jet liquid cooling radiator and the circuit board; the locking member having a first end and a second end opposite to each other; the first end and the second end being respectively located on opposite sides of the exterior of the jet liquid cooling radiator, and the first end being used for fixedly connecting to the handle bar bottom plate located on the second side of the circuit board; the second side being opposite to the first side; a tolerance filling structure connected between the second end of the locking member and the jet liquid cooling radiator; A support member is provided between the jet liquid cooling radiator and the circuit board, and is in contact with both the jet liquid cooling radiator and the circuit board.

6. The circuit board assembly according to claim 5, wherein: The jet liquid cooling radiator is provided with a mounting hole, and a matching hole is provided on the circuit board at a position corresponding to the mounting hole; The locking member is a locking bolt, the first end of which has a thread. The first end of the locking bolt passes through the mounting hole and the matching hole in sequence and is used for threaded connection with the handle bar bottom plate.

7. The circuit board assembly according to claim 6, wherein: The second end of the locking bolt has a bolt head; the tolerance filling structure includes a tolerance filling pad and a connecting material, the tolerance filling pad is arranged outside the locking bolt and is located between the bolt head of the locking bolt and the jet liquid cooling radiator; the connecting material is filled between the tolerance filling pad and the locking bolt, and between the tolerance filling pad and the jet liquid cooling radiator.

8. The circuit board assembly according to claim 7, wherein: The connecting material is solder, and the connecting material is used to weld the tolerance filling pad to the bolt head of the locking bolt, and / or to weld the tolerance filling pad to the jet liquid cooling radiator; Alternatively, the connecting material is an adhesive, and the connecting material bonds the tolerance filling pad to the bolt head of the locking bolt, and / or bonds the tolerance filling pad to the jet liquid cooling radiator.

9. The circuit board assembly according to any one of claims 5 to 8, wherein: The packaged chip includes a substrate, a bare chip and a metal ring. The bare chip and the metal ring are arranged in the same layer on the substrate and diffract around the periphery of the bare chip. The metal ring is located in the edge area of ​​the substrate. The metal ring is sealed and connected to the jet liquid cooling radiator by welding or gluing.

10. An electronic device, characterized in that: include: The circuit board assembly according to any one of claims 5 to 9; The handle bar bottom plate is located on the second side of the circuit board in the circuit board assembly; and the first end of the locking member in the circuit board assembly passes through the circuit board and is connected to the handle bar bottom plate.

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