Independent host heat dissipation equipment and vehicle
By separating the heat dissipation structure from the host device and fixing it to the vehicle screen position with a bracket, the problems of complex and high cost of the internal structure of the host device are solved, and structural simplification and cost reduction are achieved.
Patent Information
- Application Number
- CN202422182353.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-09-05
AI Technical Summary
The internal structure and heat dissipation structure of the existing host device are complex, which leads to high costs and is difficult to adjust.
The independent host heat dissipation device is used to separate the heat dissipation structure from the host device, and is fixed to the screen position of the vehicle through a bracket, and is connected to the PCB board for heat dissipation, simplifying the internal structure.
The internal structure of the host device is simplified, the cost is reduced, and the heat dissipation efficiency is improved.
Smart Images
Figure CN223310138U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of host heat dissipation, and in particular to an independent host heat dissipation device and a vehicle. Background Art
[0002] Currently, most conventional vehicle head units on the market utilize integrated single-DIN or double-DIN rectangular structures. However, existing heat dissipation structures are integral to the head unit, permanently connected to it. These structures also require connection to a printed circuit board (PCB) for heat dissipation. Furthermore, the head unit's other internal components occupy a significant amount of space. Furthermore, the presence of the heat dissipation structure makes adjustments difficult, requiring the installation of two or more PCBs. Consequently, existing head unit internal components and heat dissipation structures are complex, leading to high costs. Utility Model Content
[0003] The embodiments of the present invention provide an independent host heat dissipation device and a vehicle, aiming to solve the problems of other internal structures and heat dissipation structures of existing host devices being complex and having high costs.
[0004] In order to solve the above problems, in the first aspect, an embodiment of the present invention provides an independent host heat dissipation device, which is applied to the host device of a vehicle, including a heat dissipation structure, a PCB board and a bracket; the heat dissipation structure is connected to a PCB board; a PCB board is connected to the bracket and is also communicated with the host device; the bracket is connected to the screen of the vehicle; wherein the heat dissipation structure is used to dissipate heat for a PCB board, a PCB board is used to communicate with the host device, and the bracket is used to fix the heat dissipation structure and a PCB board at the position of the screen of the vehicle.
[0005] In a second aspect, an embodiment of the present invention provides a vehicle, which includes the independent host heat dissipation device as described in the first aspect, and also includes a host device and a screen; the independent host heat dissipation device is applied to the host device of the vehicle, and includes a heat dissipation structure, a PCB board and a bracket; the heat dissipation structure is connected to a PCB board; a PCB board is connected to the bracket and is also connected to the host device for communication; the bracket is connected to the screen of the vehicle; wherein the heat dissipation structure is used to dissipate heat for a PCB board, a PCB board is used to communicate with the host device, and the bracket is used to fix the heat dissipation structure and a PCB board at the position of the screen of the vehicle.
[0006] An embodiment of the present invention provides an independent host heat dissipation device and a vehicle, wherein the vehicle includes the independent host heat dissipation device, a host device, and a screen; the independent host heat dissipation device is applied to the vehicle's host device and includes a heat dissipation structure, a PCB board, and a bracket; the heat dissipation structure is connected to a PCB board; the PCB board is connected to the bracket and is also connected to the host device for communication; the bracket is connected to the vehicle's screen; wherein the heat dissipation structure is used to dissipate heat from the PCB board, the PCB board is used to communicate with the host device, and the bracket is used to secure the heat dissipation structure and the PCB board to the position of the screen. Implementing the embodiment of the present invention achieves the separation of the heat dissipation structure from the host device through the independent host heat dissipation device, wherein the heat dissipation structure is configured with a PCB board for communication with the host device and is combined with the bracket, thereby simplifying the internal structure of the host device and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0008] Figure 1 This is a front schematic structural diagram of an independent host heat dissipation device of the present utility model;
[0009] Figure 2 This is a side schematic structural diagram of an independent host heat dissipation device of the present utility model;
[0010] Figure 3 This is a schematic structural exploded diagram of a stand-alone host heat dissipation device of the present invention;
[0011] Figure 4 This is a schematic structural diagram of the frame of a vehicle according to the present invention.
[0012] Among them, the reference numerals in the figures are:
[0013] 1. Standalone host cooling device; 10. Cooling structure; 11. First cooling fin; 12. Second cooling fin; 13. Third cooling fin; 14. Connecting hole; 141. First threaded hole; 142. Second threaded hole; 143. Third threaded hole; 144. Fourth threaded hole; 145. Fifth threaded hole; 146. First fixing hole; 147. Second fixing hole; 15. Several cooling holes; 20. One PCB board; 21. PCB threaded hole; 30. Bracket; 31. Bracket threaded hole; 32. Positioning hole; 33. Bracket fixing hole;
[0014] 2. Vehicle; 40. Host device; 50. Screen. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0016] Directional terms used in this disclosure, such as "upper," "lower," "front," "back," "left," "right," "inner," "outer," and "one side," refer only to directions in the accompanying drawings. Therefore, these directional terms are intended to illustrate and facilitate understanding of this disclosure and are not intended to limit this disclosure. Furthermore, in the accompanying drawings, similar or identical structures are denoted by the same reference numerals.
[0017] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.
[0018] It should also be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in this specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.
[0019] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0020] Traditional vehicle host devices have standardized dimensions: if they are integrated into a single-DIN configuration, the dimensions are 178*130*50; if they are integrated into a double-DIN configuration, the dimensions are 220*150*70. However, when in-vehicle navigation systems have more functions, the vehicle host device typically adopts an integrated double-DIN configuration. Due to the presence of heat dissipation structures, other internal components of the vehicle host device are difficult to adjust. Configuration requires the addition of two or more PCBs, sockets to connect the two or more PCBs, and corresponding heat dissipation structures. This results in a relatively redundant overall host device structure and high costs.
[0021] See also Figures 1 to 4 , Figure 1 This is a front schematic structural diagram of an independent host heat dissipation device of the present utility model; Figure 2 This is a side schematic structural diagram of an independent host heat dissipation device of the present utility model; Figure 3 This is a schematic structural exploded diagram of a stand-alone host heat dissipation device of the present invention; Figure 4 This is a schematic structural diagram of the frame of a vehicle according to the present invention.
[0022] like Figure 1-3 As shown, an embodiment of the present invention provides an independent host heat dissipation device 1, which is applied to a host device 40 of a vehicle 2, and includes a heat dissipation structure 10, a PCB board 20 and a bracket 30; the heat dissipation structure 10 is connected to a PCB board 20; a PCB board 20 is connected to the bracket 30 and is also connected to the host device 40 for communication; the bracket 30 is connected to the screen 50 of the vehicle 2; wherein, the heat dissipation structure 10 is used to dissipate heat for a PCB board 20, a PCB board 20 is used to communicate with the host device 40, and the bracket 30 is used to fix the heat dissipation structure 10 and a PCB board 20 at the position of the screen 50 of the vehicle 2.
[0023] In this embodiment, if Figure 1-3 As shown, the host device 40 refers to the vehicle 2 host used in the vehicle navigation system, which can be used on various types of vehicles 2. For example, the vehicle 2 can be a car, a truck, a bus, a trailer, etc., that is, the host device 40 is configured in the vehicle navigation system of the vehicle 2 such as a car, a truck, a bus, a trailer, etc.
[0024] Compared with traditional heat dissipation technology, the present invention separates the heat dissipation structure 10 from the host device 40 of the vehicle 2, that is, the heat dissipation structure 10 is set independently. In this way, there is no space restriction. The heat dissipation structure 10 can be configured with a larger PCB board 20 for communication connection with the host device 40 of the vehicle 2, and combined with the bracket 30, thereby simplifying the internal structure of the host device 40 and reducing costs.
[0025] The material of the heat dissipation structure 10 can be aluminum alloy, etc.; the heat dissipation structure 10 is a hollow structure, and heat conductive materials such as heat dissipation oil and heat dissipation silicone can be used for conduction between the heat dissipation structure 10 and a PCB board 20, so as to conduct heat from a PCB board 20 to the heat dissipation structure 10 for heat dissipation. Specifically, the heat dissipation silicone transfers the heat generated by a PCB board 20 to the heat dissipation fins on the heat dissipation structure 10 through the heat conductive material, and the heat dissipation fins on the heat dissipation structure 10 transfer the heat to the outside of the vehicle 2.
[0026] From the above embodiments, it can be seen that the heat dissipation structure 10 is independently provided and connected to a PCB board 20, thereby achieving a simple structure, convenient installation, and reduced cost.
[0027] In one embodiment, if Figure 1-3 As shown, the upper surface of the heat dissipation structure 10 is provided with a first heat dissipation fin 11, a second heat dissipation fin 12 and a third heat dissipation fin 13; the first heat dissipation fin 11 and the second heat dissipation fin 12 are spliced with each other, and the second heat dissipation fin 12 and the third heat dissipation fin 13 are spliced with each other.
[0028] In this embodiment, if Figure 1-3 As shown, the first heat sink fins 11 and the second heat sink fins 12 can be spliced together. The length ratio of the spliced fins or the smoothness of the connection (the tilt angle at the connection) can be adaptively set according to the height or density of components requiring heat dissipation on a PCB board 20. Similarly, the second heat sink fins 12 and the third heat sink fins 13 can be spliced together. The length ratio of the spliced fins or the smoothness of the connection (the tilt angle at the connection) can be adaptively set according to the height or density of components requiring heat dissipation on a PCB board 20.
[0029] It should be noted that the first heat dissipation fin 11 can also be spliced with the third heat dissipation fin 13. The length ratio of the splicing or the smoothness of the connection (the tilt angle of the connection) can be adaptively set according to the height or density of the components that need heat dissipation on a PCB board 20.
[0030] Each heat dissipation fin formed by splicing each other is parallel to each other, and a plurality of heat dissipation fins are provided, and the fin height, fin length and fin density are positively correlated with the height or density of the components that need heat dissipation on a PCB board 20, and can be specifically set according to actual conditions; each heat dissipation fin is wavy, used to dissipate heat for a PCB board 20, and can better conduct heat to the air away from a PCB board 20, so as to transfer it to the outside of the vehicle 2.
[0031] The side surface of the heat dissipation structure 10 is provided with a plurality of heat dissipation holes 15, and the plurality of heat dissipation holes 15 are used to increase the heat dissipation effect on a PCB board 20. Specifically, Figure 3 As shown, the upper surface of the heat dissipation structure 10 is provided with a plurality of heat dissipation holes 15, and correspondingly, the lower surface of the heat dissipation structure 10 is also provided with a plurality of heat dissipation holes 15. It should be noted that the plurality of heat dissipation holes 15 on the lower surface of the heat dissipation structure 10 are not shown in the drawing due to angle problems.
[0032] Through the above embodiment, the first heat dissipation fin 11 and the second heat dissipation fin 12 are spliced with each other, and the second heat dissipation fin 12 and the third heat dissipation fin 13 are spliced with each other. In this way, each heat dissipation fin formed by splicing each other can be better adapted to a PCB board 20, thereby improving the adaptability of the device.
[0033] In one embodiment, if Figure 1-3 As shown, the plane height of the first heat dissipation fins 11 is greater than the plane height of the second heat dissipation fins 12 , and the plane height of the second heat dissipation fins 12 is greater than the plane height of the third heat dissipation fins 13 .
[0034] In this embodiment, if Figure 1-3 As shown, the plane height of the first heat dissipation fin 11 refers to the vertical height from the top of the first heat dissipation fin 11 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the first heat dissipation fin 11 is the vertical height from the top of the first heat dissipation fin 11 to the plane away from the first heat dissipation fin 11; the plane height of the second fin refers to the vertical height from the top of the second heat dissipation fin 12 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the second fin is the vertical height from the top of the second heat dissipation fin 12 to the plane away from the second heat dissipation fin 12; the plane height of the third fin refers to the vertical height from the top of the third heat dissipation fin 13 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the third fin is the vertical height from the top of the third heat dissipation fin 13 to the plane away from the third heat dissipation fin 13.
[0035] The plane height of the first heat dissipation fin 11 is greater than the plane height of the second heat dissipation fin 12, and the plane height of the second heat dissipation fin 12 is greater than the plane height of the third heat dissipation fin 13. In this way, the plane height of the heat dissipation fins at the corresponding position can be adaptively set according to the height or density of the components that need heat dissipation on a PCB board 20, which reduces the occupied space, simplifies the structural design, and saves costs.
[0036] In one embodiment, if Figure 1-3 As shown, the thickness of the first heat dissipation fins 11 , the second heat dissipation fins 12 and the third heat dissipation fins 13 are all 3 mm.
[0037] In this embodiment, if Figure 1-3 As shown, the thickness of the first heat dissipation fins 11, the second heat dissipation fins 12 and the third heat dissipation fins 13 are all set to 3 mm, which effectively increases the heat dissipation area of the heat dissipation structure 10, and combined with the aluminum alloy material of the heat dissipation structure 10, thereby improving the heat dissipation efficiency.
[0038] In one embodiment, if Figure 1-3 As shown, the upper surface and side surfaces of the heat dissipation structure 10 are provided with connection holes 14 , and are connected to a PCB board 20 , the bracket 30 and the vehicle 2 through the connection holes 14 .
[0039] In this embodiment, if Figure 1-3 As shown, the edge portion of the side surface and the upper surface of the heat dissipation structure 10 are provided with connection holes 14, and the connection holes 14 are used to connect and fix the PCB board 20, the bracket 30 and the vehicle 2, thereby improving the stability of the device.
[0040] In one embodiment, if Figure 1-3 As shown, the connecting hole 14 includes a first threaded hole 141, a second threaded hole 142, a third threaded hole 143, a fourth threaded hole 144 and a fifth threaded hole 145. The first threaded hole 141, the second threaded hole 142, the third threaded hole 143 and the fourth threaded hole 144 are arranged on the side surface of the heat dissipation structure 10, and the fifth threaded hole 145 is arranged on the upper surface of the heat dissipation structure 10; the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144 and the fifth threaded hole 145 are configured with corresponding screws, and the screws pass through a PCB board 20 and the bracket 30 in sequence through the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144 and the fifth threaded hole 145.
[0041] In this embodiment, if Figure 1-3 As shown, a PCB board 20 is provided with a PCB threaded hole 21 corresponding to the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144 and the fifth threaded hole 145, and the bracket 30 is provided with a bracket threaded hole 31 corresponding to the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144 and the fifth threaded hole 145; at the same time, the screw is also adapted to the PCB threaded hole 21 and the bracket threaded hole 31; in this way, the screw passes through the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144 and the fifth threaded hole 145 and the corresponding PCB threaded hole 21 and the corresponding bracket threaded hole 31 in sequence, that is, the screw passes through the heat dissipation structure 10, a PCB board 20 and the bracket 30 in sequence to fix the heat dissipation structure 10, a PCB board 20 and the bracket 30.
[0042] The first threaded hole 141, the second threaded hole 142, the third threaded hole 143, and the fourth threaded hole 144 are distributed on the edge portion of the side surface of the heat dissipation structure 10, that is, the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, and the fourth threaded hole 144 are protruding structures that can be set on the left surface and the right surface of the heat dissipation structure 10; the fifth threaded hole 145 is set on the upper surface of the heat dissipation structure 10; in this way, the screw is passed through the first threaded hole 141, the second threaded hole 142, the third threaded hole 143, the fourth threaded hole 144, and the fifth threaded hole 145 in sequence, and the heat dissipation structure 10, a PCB board 20, and the bracket 30 are fixedly connected using matching screws to better perform heat dissipation and improve the stability of the device.
[0043] In one embodiment, if Figure 1-3 As shown, the connection hole 14 further includes a first fixing hole 146 and a second fixing hole 147 , which are arranged on the side surface of the heat dissipation structure 10 , and are used to connect to the vehicle 2 .
[0044] In this embodiment, if Figure 1-3 As shown, the first fixing holes 146 and the second fixing holes 147 are distributed on the edge of the side surface of the heat dissipation structure 10. Specifically, the first fixing holes 146 and the second fixing holes 147 are raised structures provided on the lower surface of the heat dissipation structure 10. The first fixing holes 146 and the second fixing holes 147 can be connected to the vehicle 2 by snapping or screwing. The specific configuration can be determined according to actual conditions. The first fixing holes 146 and the second fixing holes 147 are used to securely connect to the vehicle 2, ensuring a stable connection and improving stability.
[0045] In this embodiment, the bracket 30 is provided with a raised positioning hole 32 for positioning during installation, so as to enable quick and accurate installation, ensure positioning accuracy, and improve operability; the bracket 30 is also provided with a bracket fixing hole 33, and the bracket fixing hole 33 is used to be fixed to the position on the back of the screen 50 of the vehicle 2, ensuring a stable connection and improving stability.
[0046] like Figure 1-4 As shown, the embodiment of the present utility model further provides a vehicle 2, comprising Figure 1-3The independent host heat dissipation device 1 also includes a host device 40 and a screen 50; the independent host heat dissipation device 1 is applied to the host device 40 of the vehicle 2, and includes a heat dissipation structure 10, a PCB board 20 and a bracket 30; the heat dissipation structure 10 is connected to a PCB board 20; a PCB board 20 is connected to the bracket 30 and is also connected to the host device 40 for communication; the bracket 30 is connected to the screen 50 of the vehicle 2; wherein, the heat dissipation structure 10 is used to dissipate heat for a PCB board 20, a PCB board 20 is used to communicate with the host device 40, and the bracket 30 is used to fix the heat dissipation structure 10 and a PCB board 20 at the position of the screen 50 of the vehicle 2.
[0047] In this embodiment, if Figure 1-4 As shown, the host device 40 refers to the vehicle 2 host used in the vehicle navigation system, which can be used on various types of vehicles 2. For example, the vehicle 2 can be a car, a truck, a bus, a trailer, etc., that is, the host device 40 is configured in the vehicle navigation system of the vehicle 2 such as a car, a truck, a bus, a trailer, etc.
[0048] Compared with traditional heat dissipation technology, the present invention separates the heat dissipation structure 10 from the host device 40 of the vehicle 2, that is, the heat dissipation structure 10 is set independently. In this way, there is no space limitation, and a larger PCB board 20 can be configured to communicate with the host device 40 of the vehicle 2, thereby simplifying the internal structure of the host device 40 and reducing costs.
[0049] The material of the heat dissipation structure 10 can be aluminum alloy, etc.; the heat dissipation structure 10 is a hollow structure, and heat conductive materials such as heat dissipation oil and heat dissipation silicone can be used for conduction between the heat dissipation structure 10 and a PCB board 20, so as to conduct heat from a PCB board 20 to the heat dissipation structure 10 for heat dissipation. Specifically, the heat dissipation silicone transfers the heat generated by a PCB board 20 to the heat dissipation fins on the heat dissipation structure 10 through the heat conductive material, and the heat dissipation fins on the heat dissipation structure 10 transfer the heat to the outside of the vehicle 2.
[0050] From the above embodiments, it can be seen that the heat dissipation structure 10 is independently provided and connected to a PCB board 20, thereby achieving a simple structure, convenient installation, and reduced cost.
[0051] In one embodiment, if Figure 1-4 As shown, the upper surface of the heat dissipation structure 10 is provided with a first heat dissipation fin 11, a second heat dissipation fin 12 and a third heat dissipation fin 13; the first heat dissipation fin 11 and the second heat dissipation fin 12 are spliced with each other, and the second heat dissipation fin 12 and the third heat dissipation fin 13 are spliced with each other.
[0052] In this embodiment, if Figure 1-4 As shown, the first heat sink fins 11 and the second heat sink fins 12 can be spliced together. The length ratio of the spliced fins or the smoothness of the connection (the tilt angle at the connection) can be adaptively set according to the height or density of components requiring heat dissipation on a PCB board 20. Similarly, the second heat sink fins 12 and the third heat sink fins 13 can be spliced together. The length ratio of the spliced fins or the smoothness of the connection (the tilt angle at the connection) can be adaptively set according to the height or density of components requiring heat dissipation on a PCB board 20.
[0053] It should be noted that the first heat dissipation fin 11 can also be spliced with the third heat dissipation fin 13. The length ratio of the splicing or the smoothness of the connection (the tilt angle of the connection) can be adaptively set according to the height or density of the components that need heat dissipation on a PCB board 20.
[0054] Each heat dissipation fin formed by splicing each other is parallel to each other, and a plurality of heat dissipation fins are provided, and the fin height, fin length and fin density are positively correlated with the height or density of the components that need heat dissipation on a PCB board 20, and can be specifically set according to actual conditions; each heat dissipation fin is wavy, used to dissipate heat for a PCB board 20, and can better conduct heat to the air away from a PCB board 20, so as to transfer it to the outside of the vehicle 2.
[0055] The side surface of the heat dissipation structure 10 is provided with a plurality of heat dissipation holes 15, and the plurality of heat dissipation holes 15 are used to increase the heat dissipation effect on a PCB board 20. Specifically, Figure 3 As shown, the upper surface of the heat dissipation structure 10 is provided with a plurality of heat dissipation holes 15, and correspondingly, the lower surface of the heat dissipation structure 10 is also provided with a plurality of heat dissipation holes 15. It should be noted that the plurality of heat dissipation holes 15 on the lower surface of the heat dissipation structure 10 are not shown in the drawing due to angle problems.
[0056] Through the above embodiment, the first heat dissipation fin 11 and the second heat dissipation fin 12 are spliced with each other, and the second heat dissipation fin 12 and the third heat dissipation fin 13 are spliced with each other. In this way, each heat dissipation fin formed by splicing each other can be better adapted to a PCB board 20, thereby improving the adaptability of the device.
[0057] In one embodiment, if Figure 1-4 As shown, the plane height of the first heat dissipation fins 11 is greater than the plane height of the second heat dissipation fins 12 , and the plane height of the second heat dissipation fins 12 is greater than the plane height of the third heat dissipation fins 13 .
[0058] In this embodiment, if Figure 1-4 As shown, the plane height of the first heat dissipation fin 11 refers to the vertical height from the top of the first heat dissipation fin 11 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the first heat dissipation fin 11 is the vertical height from the top of the first heat dissipation fin 11 to the plane away from the first heat dissipation fin 11; the plane height of the second fin refers to the vertical height from the top of the second heat dissipation fin 12 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the second fin is the vertical height from the top of the second heat dissipation fin 12 to the plane away from the second heat dissipation fin 12; the plane height of the third fin refers to the vertical height from the top of the third heat dissipation fin 13 to the plane where the lower surface relative to the upper surface of the heat dissipation structure 10 is located, that is, the plane height of the third fin is the vertical height from the top of the third heat dissipation fin 13 to the plane away from the third heat dissipation fin 13.
[0059] The plane height of the first heat dissipation fin 11 is greater than the plane height of the second heat dissipation fin 12, and the plane height of the second heat dissipation fin 12 is greater than the plane height of the third heat dissipation fin 13. In this way, the plane height of the heat dissipation fins at the corresponding position can be adaptively set according to the height or density of the components that need heat dissipation on a PCB board 20, which reduces the occupied space, simplifies the structural design, and saves costs.
[0060] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific applications of the vehicle described above may refer to the corresponding applications in the aforementioned device embodiments and will not be repeated here.
[0061] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.
Claims
1. An independent host heat dissipation device, characterized in that: A host device used in a vehicle includes a heat dissipation structure, a PCB board, and a bracket; the heat dissipation structure is connected to a PCB board; a PCB board is connected to the bracket and is also connected to the host device for communication; the bracket is connected to the vehicle's screen; wherein the heat dissipation structure is used to dissipate heat from a PCB board, a PCB board is used to communicate with the host device, and the bracket is used to fix the heat dissipation structure and a PCB board to the position of the vehicle's screen.
2. The device according to claim 1, characterized in that The upper surface of the heat dissipation structure is provided with a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin; the first heat dissipation fin and the second heat dissipation fin are spliced with each other, and the second heat dissipation fin and the third heat dissipation fin are spliced with each other.
3. The device according to claim 2, characterized in that The plane height of the first heat dissipation fin is greater than the plane height of the second heat dissipation fin, and the plane height of the second heat dissipation fin is greater than the plane height of the third heat dissipation fin.
4. The device according to claim 2, characterized in that The thickness of the first heat dissipation fins, the second heat dissipation fins, and the third heat dissipation fins are all 3 mm.
5. The device according to claim 1, characterized in that The upper surface and side surfaces of the heat dissipation structure are provided with connection holes, and are connected to a PCB board, the bracket and the vehicle through the connection holes.
6. The device according to claim 5, characterized in that The connecting hole includes a first threaded hole, a second threaded hole, a third threaded hole, a fourth threaded hole and a fifth threaded hole. The first threaded hole, the second threaded hole, the third threaded hole and the fourth threaded hole are arranged on the side surface of the heat dissipation structure, and the fifth threaded hole is arranged on the upper surface of the heat dissipation structure; the first threaded hole, the second threaded hole, the third threaded hole, the fourth threaded hole and the fifth threaded hole are configured with corresponding screws, and the screws pass through a PCB board and the bracket in sequence through the first threaded hole, the second threaded hole, the third threaded hole, the fourth threaded hole and the fifth threaded hole.
7. The device according to claim 5, characterized in that The connection hole further includes a first fixing hole and a second fixing hole, wherein the first fixing hole and the second fixing hole are provided on a side surface of the heat dissipation structure, and the first fixing hole and the second fixing hole are used for connection with the vehicle.
8. A vehicle, characterized in that: The independent host heat dissipation device comprises the independent host heat dissipation device described in any one of claims 1 to 7, and also comprises a host device and a screen; the independent host heat dissipation device is applied to the host device of the vehicle, and comprises a heat dissipation structure, a PCB board and a bracket; the heat dissipation structure is connected to a PCB board; a PCB board is connected to the bracket and is also connected to the host device for communication; the bracket is connected to the screen of the vehicle; wherein, the heat dissipation structure is used to dissipate heat for a PCB board, a PCB board is used to communicate with the host device, and the bracket is used to fix the heat dissipation structure and a PCB board at the position of the screen of the vehicle.
9. The vehicle according to claim 8, characterized in that: The upper surface of the heat dissipation structure is provided with a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin; the first heat dissipation fin and the second heat dissipation fin are spliced with each other, and the second heat dissipation fin and the third heat dissipation fin are spliced with each other.
10. The vehicle according to claim 9, characterized in that: The plane height of the first heat dissipation fin is greater than the plane height of the second heat dissipation fin, and the plane height of the second heat dissipation fin is greater than the plane height of the third heat dissipation fin.