Liquid-cooled cooling device

Abstract

The utility model relates to the technical field of electronic devices, and discloses a liquid-cooled cooling device, which comprises a shell provided with an inner wall and a plurality of outer walls, a partition plate is arranged in the shell to form an upper heat conduction layer above the partition plate and a lower heat conduction layer below the partition plate, and a circulation port is arranged between the partition plate and the inner wall; the first pipe opening is formed in the shell and communicates with the upper heat conduction layer; the second pipe opening is formed in the shell and is close to the first pipe opening, and the second pipe opening communicates with the lower heat conduction layer; the upper cooling liquid flow guide module is arranged in the upper heat conduction layer and provided with a plurality of upper plate-shaped fins, and an upper cooling liquid flowing gap is formed between every two adjacent upper plate-shaped fins; and the lower cooling liquid flow guide module is arranged in the lower heat conduction layer and is provided with a plurality of lower plate-shaped fins, and a lower cooling liquid flow gap is formed between every two adjacent lower plate-shaped fins. In this way, the heat dissipation effect can be effectively improved while the voltage drop is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a liquid-cooled cooling device. Background Art

[0002] Electronic components generate heat during operation. In recent years, as computer system performance has steadily improved, the amount of heat generated by chips and other electronic components has inevitably increased. To address this heat problem, a cooling system is often required to quickly dissipate the heat and prevent the components from overheating, which could shorten their lifespan or even damage them. Existing cooling systems primarily include air cooling and liquid cooling. Liquid cooling, due to its superior heat dissipation performance and low noise levels, has been widely used for chip cooling and has become a key development trend in computer cooling systems.

[0003] However, the structures of most liquid-cooled radiators currently available are relatively simple, and the coolant inside them participates in heat dissipation for a short time. The coolant with a heat source flows out before it is fully cooled in the liquid-cooled radiator, resulting in poor heat dissipation effect. Moreover, the pipelines at the first and second pipe openings of the liquid-cooled radiator are usually bent, resulting in increased pressure drop and inconvenient installation. The heat exchange between the inside of the liquid-cooled radiator and the liquid is insufficient, resulting in poor heat dissipation effect. Utility Model Content

[0004] The purpose of the utility model is to provide a liquid-cooled cooling device that can effectively improve the heat dissipation effect while reducing the pressure drop.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A liquid-cooled cooling device comprises: an outer shell having an inner wall and multiple outer walls, and a partition is provided inside the outer shell to form an upper heat-conducting layer located above the partition and a lower heat-conducting layer located below the partition, and a flow opening is provided between the partition and the inner wall; a first pipe opening is provided in the outer shell and is connected to the upper heat-conducting layer; a second pipe opening is provided in the outer shell and is arranged close to the first pipe opening, and the second pipe opening is connected to the lower heat-conducting layer; an upper cooling liquid guide module is provided in the upper heat-conducting layer, has multiple upper plate-shaped fins, and an upper cooling liquid flow gap is formed between two adjacent upper plate-shaped fins; and a lower cooling liquid guide module is provided in the lower heat-conducting layer, has multiple lower plate-shaped fins, and a lower cooling liquid flow gap is formed between two adjacent lower plate-shaped fins.

[0007] Preferably, the cross section of the upper plate-shaped fin is wavy, and the spacing between two adjacent upper plate-shaped fins is the same and they are arranged in parallel.

[0008] Preferably, the cross section of the lower plate-shaped fin is wavy, and the spacing between two adjacent lower plate-shaped fins is the same and they are arranged in parallel.

[0009] Preferably, a first guide plate and a second guide plate are provided near the first pipe opening. After the coolant flows into the first pipe opening, it diffuses in a fan shape along the first guide plate and the second guide plate to the upper coolant guide module.

[0010] Preferably, the length of the first guide plate is greater than the length of the second guide plate.

[0011] Preferably, a third guide plate and a fourth guide plate are provided near the second pipe opening, and the coolant flows out from the lower coolant guide module and then flows out in a fan shape along the third guide plate and the fourth guide plate to the second pipe opening.

[0012] Preferably, the length of the third guide plate is greater than the length of the fourth guide plate.

[0013] Preferably, the first pipe opening and the second pipe opening are both arranged on the outer wall of the same side of the shell, and are arranged diagonally on the outer wall.

[0014] Preferably, the coolant flows into the upper coolant guide module from the first pipe port, passes through the upper coolant flow gap, enters the lower coolant guide module through the flow port, and finally flows out through the second pipe port after passing through the lower coolant flow gap.

[0015] Preferably, the coolant flows into the lower coolant guide module from the second pipe port, passes through the lower coolant flow gap, enters the upper coolant guide module through the flow port, and finally flows out through the first pipe port after passing through the upper coolant flow gap.

[0016] Compared with the prior art, the present invention has the following advantages: This method allows for sufficient heat exchange between the coolant inside the housing and between the upper and lower coolant guide modules. Furthermore, the structural arrangement of the upper and lower layers, coupled with the provision of multiple upper and lower coolant flow gaps and the provision of flow ports, allows the coolant to flow between the upper and lower layers, significantly reducing the backflow effect of the coolant at corners and effectively reducing pressure drop, thereby achieving improved heat dissipation and effectively resolving the shortcomings of the prior art. Secondly, the partition is integrally formed with the housing to enhance the structural strength of the partition within the housing and extend its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of a liquid-cooled cooling device according to an embodiment of the present utility model;

[0018] Figure 2 Schematic diagram of the internal structure of the housing according to an embodiment of the present utility model;

[0019] Figure 3 Schematic diagram of the internal structure of the housing according to an embodiment of the present utility model;

[0020] Figure 4 Schematic diagram of the internal structure of the upper heat-conducting layer according to an embodiment of the present utility model;

[0021] Figure 5 Schematic diagram of the internal structure of the lower heat-conducting layer according to an embodiment of the present utility model;

[0022] Figure 6 Schematic diagram of the flow direction of the coolant flowing into the housing from the first pipe opening and then flowing out from the second pipe opening according to an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the flow direction of the coolant according to an embodiment of the present invention, which flows into the housing through the second pipe opening and then flows out through the first pipe opening. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0028] Figure 1 and Figure 2 Schematic diagram of a liquid-cooled cooling device 100 according to an embodiment of the present invention. Figure 1 The liquid cooling device 100 shown is provided with a heat conducting plate below, through which the heat from the heat source is transferred to the liquid cooling device 100. Common heat sources generally include high-power electronic devices and high-performance microprocessors. Figure 1 and Figure 2The liquid-cooled cooling device 100 shown includes a housing 110, a first nozzle 120, a second nozzle 130, an upper coolant flow guide module 140a, and a lower coolant flow guide module 140b. First, the housing 110 includes an inner wall 111 and multiple outer walls 112. A partition 113 is provided within the housing 110 to form an upper heat-conducting layer 114a located above the partition 113 and a lower heat-conducting layer 114b located below the partition 113. A flow port 115 is provided between the partition 113 and the inner wall 111. Next, the first nozzle 120 is provided on the housing 110 and communicates with the upper heat-conducting layer 114a. The first nozzle 120 is used for the inflow or outflow of coolant. Then, the second nozzle 130 is also provided on the housing 110 and communicates with the lower heat-conducting layer 114b. It is also used for the inflow or outflow of coolant. Next, an upper coolant flow guide module 140a is disposed in the upper heat-conducting layer. The upper coolant flow guide module 140a has a plurality of upper plate-shaped fins 141a. An upper coolant flow gap 142a is formed between adjacent upper plate-shaped fins 141a. This upper coolant flow gap 142a is used for the flow of coolant. Next, a lower coolant flow guide module 140b is disposed in the lower heat-conducting layer 114b. The lower coolant flow guide module 140b has a plurality of lower plate-shaped fins 141b. A lower coolant flow gap 142b is formed between adjacent lower plate-shaped fins 141b. This lower coolant flow gap 142b is also used for the flow of coolant. Among them, as a preferred embodiment, the coolant can flow from the first nozzle 120 into the upper coolant guide module 140a, and after passing through the upper coolant flow gap 142a, enter the lower coolant guide module 140b through the circulation port 115, and finally flow out through the lower coolant flow gap 142b through the second nozzle 130. In this way, the coolant can fully exchange heat between the upper coolant guide module 140a and the lower coolant guide module 140b inside the shell 110. Moreover, the structural arrangement of the upper and lower layers, coupled with the arrangement of multiple upper coolant flow gaps 142a and lower coolant flow gaps 142b and the arrangement of the circulation port 115, allows the coolant to flow between the upper and lower layers, which can greatly reduce the backflow effect of the coolant at the bend, effectively reduce the pressure drop, thereby achieving the effect of improving the heat dissipation effect, and well solve the shortcomings existing in the background technology. Secondly, the partition is integrally formed with the shell 110 to improve the structural strength of the partition inside the shell 110 and extend its service life.

[0029] Next, refer to Figure 3 and Figure 4The cross-section of the upper plate-shaped fin 141a is wavy, and the spacing between two adjacent upper plate-shaped fins 141a is the same and they are arranged in parallel. The wavy upper plate-shaped fin 141a can cause the coolant to be disturbed when flowing through the upper plate-shaped fin 141a. Liquid disturbance can promote heat convection. For example, in the Bernal experiment, the liquid begins to flow due to static equilibrium instability, forming a regular laminar flow, thereby improving the heat transfer efficiency, thereby improving the heat exchange efficiency between the liquid and the upper plate-shaped fin 141a, and effectively improving the heat dissipation efficiency. Moreover, in the process of the coolant leaving the wavy upper plate-shaped fin 141a and entering the lower heat-conducting layer 114b through the flow port 115, the wavy structure will also cause the coolant to generate eddy currents when flowing, which will greatly increase the disturbance of the coolant, enhance the fluid turbulence, mix the coolants with temperature differences, and further improve the fluid heat exchange efficiency. Secondly, the wavy upper plate-shaped fin 141a has high structural strength, reduces the occurrence of structural bending and thermal strain, and prolongs the service life. Figure 3 and Figure 5 As shown in the figure, the cross-section of the lower plate-shaped fin 141b is wavy, and the spacing between two adjacent lower plate-shaped fins 141b is the same and they are arranged in parallel. Similarly, the wavy lower plate-shaped fins 141b can cause the coolant to be disturbed when flowing through the lower plate-shaped fins 141b. Liquid disturbance can promote heat convection. For example, in the Bernal experiment, the liquid begins to flow due to static equilibrium instability, forming a regular laminar flow, thereby improving the heat transfer efficiency, thereby improving the heat exchange efficiency between the liquid and the lower plate-shaped fins 141b, and effectively improving the heat dissipation efficiency. Moreover, when the coolant flowing down from the upper heat-conducting layer 114a through the flow port 115 leaves the wavy lower plate-shaped fin 141b, its wavy structure will also cause the coolant to generate eddies when flowing, which will greatly increase the disturbance of the coolant, enhance the fluid turbulence, mix the coolants with temperature differences, and further improve the fluid heat exchange efficiency. Secondly, the wavy lower plate-shaped fins 141b have high structural strength, which reduces the occurrence of structural bending and thermal strain, thereby extending the service life.

[0030] Furthermore, assuming that the coolant flows in from the first pipe opening 120 and flows out from the second pipe opening 130, refer to Figure 3 and Figure 4, a first guide plate 151 and a second guide plate 152 are provided near the first pipe opening 120. After the coolant flows in from the first pipe opening 120, it diffuses in a fan shape along the first guide plate 151 and the second guide plate 152 to the upper coolant guide module 140a. The shape of the first guide plate 151 and the second guide plate 152 is similar to a trumpet shape. Through such a structure, the coolant can be smoothly guided into the upper coolant guide module 140a, which can reduce the pressure fluctuation caused by the sudden change in speed and improve the stability. Moreover, in order to enhance the structural strength, the first guide plate 151 and the second guide plate 152 are both integrally formed with the outer shell 110. Secondly, in order to form the above-mentioned shape that facilitates the diffusion of the coolant, the length of the first guide plate 151 is greater than the length of the second guide plate 152. Similarly, referring to Figure 3 and Figure 5 A third guide plate 161 and a fourth guide plate 162 are provided near the second nozzle 130. After the coolant flows out of the lower coolant guide module 140b, it flows along the third guide plate 161 and the fourth guide plate 162 in a fan-shaped manner to the second nozzle 130. The shape of the third guide plate 161 and the fourth guide plate 162 is similar to a trumpet shape. Through such a structure, the coolant can be smoothly guided out of the lower heat-conducting layer 114b, which can reduce pressure fluctuations caused by sudden changes in speed and improve stability. Moreover, in order to enhance structural strength, the third guide plate 161 and the fourth guide plate 162 are both integrally formed with the housing 110. Secondly, in order to form the above-mentioned shape that facilitates the discharge of coolant, the length of the third guide plate 161 is greater than that of the fourth guide plate 162.

[0031] Then, refer to Figure 1 and Figure 2 , the first pipe opening 120 and the second pipe opening 130 are both arranged on the outer wall of the same side of the shell 110. By arranging the first pipe opening 120 and the second pipe opening 130 on the same side, the pipeline configuration on the liquid-cooled cooling device 100 can be optimized, the impact of unreasonable pipeline configuration on the pressure drop of the cooling liquid can be reduced, and the loss of the pressure drop of the coolant in the liquid cooling device can be reduced. Next, as a preferred embodiment, the first pipe opening 120 and the second pipe opening 130 are arranged diagonally on the outer wall of the same side to adapt to the changes of different heat sources. When encountering the situation of uneven heat distribution of the heat source, the pipe openings into which the coolant flows will also be different. For example, assuming that the heat of the heat source changes along the lateral direction of the liquid-cooled cooling device 100, there are two situations: the first is if the temperature of the heat away from the second pipe opening 130 is significantly higher than the temperature of the heat close to the second pipe opening 130, refer to Figure 7In order to make the coolant with a relatively low temperature act on the heat with a higher temperature, the coolant will flow into the first pipe opening 120 and then out of the second pipe opening 130, so that the coolant will first contact the heat with a higher temperature to achieve the maximum heat dissipation effect; the second situation is if the temperature of the heat far away from the first pipe opening 120 is significantly lower than the temperature of the heat close to the first pipe opening 120, refer to Figure 6 In order to allow the coolant with a relatively low temperature to act on the heat with a higher temperature, the coolant will flow in from the second nozzle 130 and then out from the first nozzle 120, so that the heat with a higher temperature will first contact the coolant to achieve the maximum heat dissipation effect. Similarly, as another preferred embodiment, assuming that the heat of the heat source changes along the longitudinal direction of the liquid-cooled cooling device 100, first, if the first nozzle 120 is set close to the left side of the liquid-cooled cooling device 100, then the second nozzle 130 is set close to the right side of the liquid-cooled cooling device 100, and then there will be two situations: the first is assuming that the temperature of the heat away from the left side of the liquid-cooled cooling device 100 is significantly higher than the temperature of the heat close to the left side of the liquid-cooled cooling device 100, refer to Figure 6 In order to allow the coolant with a relatively low temperature to act on the heat with a higher temperature, the coolant will flow in from the second pipe opening 130 and then out from the first pipe opening 120, so that the coolant will first contact the heat with a higher temperature to achieve the maximum heat dissipation effect; the second is assuming that the temperature of the heat far from the left side of the liquid-cooled cooling device 100 is significantly lower than the temperature of the heat close to the left side of the liquid-cooled cooling device 100, refer to Figure 7 In order to allow the relatively low-temperature coolant to act on the higher-temperature heat, the coolant is allowed to flow in from the first pipe port 120 and then out from the second pipe port 130, so that the coolant first contacts the higher-temperature heat to achieve the maximum heat dissipation effect.

[0032] In addition, the flow rates between coolants with different viscosities are different. It can be understood that the viscosity of the liquid, also known as viscous force, is a force of mutual attraction between the molecules inside the liquid. This force resists the relative sliding between the layers of the fluid. The viscosity of the liquid is determined by its molecular structure and chemical properties and is an inherent physical property. If the heat dissipation efficiency is reduced due to the influence of the movement speed caused by the viscosity of the coolant itself, it can be overcome by changing the inflow and outflow position of the coolant. For example, if the viscosity of the coolant is low, such as deionized water, ethylene glycol solution or special fluid, its low viscosity brings efficient heat transfer performance and low flow resistance. The friction loss of low-viscosity liquids during the flow process is small, which helps to improve the overall heat transfer coefficient so that more energy can be used for heat transfer. Therefore, refer to Figure 6The coolant can flow in from the second nozzle 130, then pass through the lower coolant guide module 140b and the upper coolant guide module 140a, and finally flow out from the first nozzle 120. This allows the low-viscosity coolant to be drawn in from the bottom and discharged from the top in a rapid flow pattern to maximize heat transfer performance. On the other hand, if the coolant has a higher viscosity, such as modified silicone oil, composite fluorine oil, or professional coolant, its high viscosity results in a higher heat capacity and better thermal conductivity, allowing it to absorb more heat and increase the temperature more slowly. Therefore, Figure 7 The coolant can flow in from the first pipe port 120, pass through the upper coolant guide module 140a and the lower coolant guide module 140b in sequence, and finally flow out through the second pipe port 130. This allows the high-viscosity coolant to be sucked in from the top and discharged from the bottom to absorb more heat, allowing the internal heat exchange to be fully carried out and maximizing the heat transfer performance.

[0033] Based on the disclosure and teachings of the above description, those skilled in the art may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and any modifications and variations of the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although certain specific terms are used in this description, these terms are for convenience of description only and do not constitute any limitation to the present invention.

Claims

1. A liquid-cooled cooling device (100), characterized in that: include: A housing (110) having an inner wall (111) and a plurality of outer walls (112), wherein a partition (113) is provided inside the housing (110) to form an upper heat-conducting layer (114a) located above the partition (113) and a lower heat-conducting layer (114b) located below the partition (113), and a flow opening (115) is provided between the partition (113) and the inner wall (111); a first pipe opening (120) provided on the outer shell (110) and communicating with the upper heat-conducting layer (114a); a second pipe opening (130) disposed on the housing (110) and close to the first pipe opening (120), the second pipe opening (130) being in communication with the lower heat-conducting layer (114b); an upper cooling liquid flow guide module (140a) disposed in the upper heat-conducting layer (114a), comprising a plurality of upper plate-shaped fins (141a), wherein an upper cooling liquid flow gap (142a) is formed between two adjacent upper plate-shaped fins (141a); and A lower cooling liquid flow guide module (140b) is provided in the lower heat-conducting layer (114b) and has a plurality of lower plate-shaped fins (141b), with a lower cooling liquid flow gap (142b) formed between two adjacent lower plate-shaped fins (141b).

2. The liquid-cooled cooling device (100) according to claim 1, characterized in that: The cross section of the upper plate-shaped fins (141a) is wavy, and the spacing between two adjacent upper plate-shaped fins (141a) is the same and they are arranged in parallel.

3. The liquid-cooled cooling device (100) according to claim 1, characterized in that: The cross section of the lower plate-shaped fins (141b) is wavy, and the spacing between two adjacent lower plate-shaped fins (141b) is the same and they are arranged in parallel.

4. The liquid-cooled cooling device (100) according to claim 1, characterized in that A first guide plate (151) and a second guide plate (152) are provided near the first pipe opening (120); after the coolant flows in from the first pipe opening (120), it diffuses in a fan shape along the first guide plate (151) and the second guide plate (152) to the upper coolant guide module (140a).

5. The liquid-cooled cooling device (100) according to claim 4, characterized in that: The length of the first guide plate (151) is greater than the length of the second guide plate (152).

6. The liquid-cooled cooling device (100) according to claim 1, characterized in that A third guide plate (161) and a fourth guide plate (162) are provided near the second pipe opening (130); after the coolant flows out from the lower coolant guide module (140b), it flows along the third guide plate (161) and the fourth guide plate (162) in a fan shape and then flows out from the second pipe opening (130).

7. The liquid-cooled cooling device (100) according to claim 6, characterized in that: The length of the third guide plate (161) is greater than the length of the fourth guide plate (162).

8. The liquid-cooled cooling device (100) according to claim 1, characterized in that The first pipe opening (120) and the second pipe opening (130) are both arranged on the same side outer wall (112) of the shell (110), and are arranged diagonally on the outer wall (112).

9. The liquid-cooled cooling device (100) according to claim 1, characterized in that: The coolant flows from the first pipe opening (120) into the upper coolant guide module (140a), passes through the upper coolant flow gap (142a), enters the lower coolant guide module (140b) through the circulation port (115), and finally flows out through the second pipe opening (130) after passing through the lower coolant flow gap (142b).

10. The liquid-cooled cooling device (100) according to claim 1, characterized in that: The coolant flows from the second pipe opening (130) into the lower coolant guide module (140b), passes through the lower coolant flow gap (142b), and then enters the upper coolant guide module (140a) through the circulation port (115), and finally flows out through the first pipe opening (120) after passing through the upper coolant flow gap (142a).

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