Heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device which comprises a main body cold plate and a plurality of heat conduction assemblies. Wherein a plurality of slideways are arranged on the main body cold plate. And each heat conduction assembly is slidably arranged on the slide way, so that the multiple heat conduction assemblies correspond to the positions of the multiple heat sources correspondingly, and the heat conduction assemblies are used for absorbing heat of the heat sources and transmitting the heat to the main body cold plate. According to the heat dissipation device, multi-heat-source heat dissipation can be achieved, complex series-parallel connection pipelines do not need to be arranged, the difficulty of mounting and dismounting is greatly reduced, and the cost of pipelines and connectors is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device. Background Art

[0002] Traditional heat dissipation cold plates are directly attached to the heat source (electronic power-consuming devices). Direct contact with the heat source can reduce thermal resistance and improve the heat dissipation effect. The heat dissipation requirements of servers are becoming increasingly complex. When multiple groups of heat sources need to dissipate heat simultaneously, the existing technology generally adopts a design that connects multiple single cold heads in series and parallel. Multiple single cold heads correspond to multiple groups of heat sources to ensure the heat dissipation effect. However, the series and parallel structure of this design is complex and difficult to install and disassemble. The more cold heads there are, the more corresponding pipes and joints there are. Not only is installation difficult, but the production cost also increases exponentially with the increase in cold heads. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation device that can achieve heat dissipation from multiple heat sources, reduce the difficulty of installation and disassembly, and reduce production costs.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A heat dissipation device is provided, comprising:

[0006] A main body cold plate, wherein the main body cold plate is provided with a plurality of slideways;

[0007] Multiple heat-conducting components, each of which can be slidably arranged on the slide, so that the multiple heat-conducting components correspond to the positions of multiple heat sources respectively, and the heat-conducting components are used to absorb the heat of the heat source and transfer it to the main cold plate.

[0008] Optionally, each of the heat-conducting components includes a heat absorbing component, and the heat absorbing component is attached to the heat source.

[0009] Optionally, the heat absorption element is a semiconductor refrigerator.

[0010] Optionally, a controller is further included, which is communicatively connected to the semiconductor refrigerators of the plurality of heat-conducting components, and the controller can adjust the cooling capacity of the semiconductor refrigerators.

[0011] Optionally, each of the heat-conducting components includes a heat-conducting seat, the heat-conducting seat is slidably arranged on the slideway, and the heat absorption component is arranged on the heat-conducting seat.

[0012] Optionally, the heat conducting seat has a first accommodating cavity, the first accommodating cavity is filled with a first phase change metal, and when the heat source is in a working state, the first phase change metal can absorb heat and melt;

[0013] And / or, the heat conducting seat has a second accommodating cavity, the second accommodating cavity is filled with a second phase change metal, and when the heat source is in a thermal runaway state, the second phase change metal can absorb heat and melt.

[0014] Optionally, the first accommodating cavity is arranged closer to the heat absorbing component than the second accommodating cavity.

[0015] Optionally, each of the heat-conducting components includes a heat-conducting pad, which is attached to the end surface of the heat-conducting base facing the main body cold plate, and is sandwiched between the heat-conducting base and the main body cold plate.

[0016] Optionally, a plurality of fixing members are further included, and the fixing members can fix the position of the heat conducting component on the main body cold plate.

[0017] Optionally, each of the fixing parts includes a main rod and a telescopic part, the main rod is provided with an internal threaded hole, the telescopic part has an external thread, the telescopic part can be rotatably inserted into the internal threaded hole, the main rod is connected to the heat conduction component, the telescopic part can be rotated and extended to abut the side wall of the slide, and the telescopic part can also be rotated and retracted to disengage from the side wall of the slide.

[0018] Beneficial effects of the utility model:

[0019] The utility model provides a heat dissipation device comprising a main cold plate and a plurality of heat-conducting components. The main cold plate is provided with a plurality of slideways. Each heat-conducting component can be slidably mounted on the slideway so that the plurality of heat-conducting components correspond to the positions of a plurality of heat sources. The heat-conducting components are used to absorb heat from the heat sources and transfer it to the main cold plate. This heat dissipation device not only achieves heat dissipation from multiple heat sources but also eliminates the need for complex series and parallel piping, greatly reducing the difficulty of installation and disassembly and eliminating the cost of piping and connectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of the heat dissipation device provided by an embodiment of the present utility model from a first perspective;

[0021] Figure 2 This is a schematic structural diagram of the heat dissipation device provided by an embodiment of the present utility model from a second perspective;

[0022] Figure 3 This is a schematic structural diagram of the heat dissipation device provided by an embodiment of the present utility model from a third perspective;

[0023] Figure 4 This is a partial structural diagram of the heat dissipation device provided by an embodiment of the present utility model;

[0024] Figure 5 yes Figure 4 AA section view in.

[0025] In the picture:

[0026] 1. Main cold plate; 11. Slide; 111. Slide side wall; 12. Medium inlet; 13. Medium outlet;

[0027] 2. Semiconductor refrigerator; 3. Controller; 4. Thermal seat; 41. First accommodating cavity; 42. Second accommodating cavity; 43. Sliding protrusion; 5. Thermal pad; 6. Fixing member; 61. Main rod; 62. Telescopic member. DETAILED DESCRIPTION

[0028] The technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the present invention, and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of it.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0031] like Figure 1-Figure 5 As shown, the heat dissipation device of this embodiment includes a main cold plate 1 and multiple heat-conducting components. Specifically, multiple slideways 11 are provided on the main cold plate 1. Each heat-conducting component can be slidably arranged on the slideway 11, so that the multiple heat-conducting components correspond to the positions of multiple heat sources. The heat-conducting components are used to absorb heat from the heat sources and transfer it to the main cold plate 1. The heat sources can be common heat-generating components in servers, such as heat source device chips, MOS power supplies, CRPS power modules, inductors, DDR memory chips, etc.

[0032] This heat sink not only dissipates heat from multiple heat sources, but also eliminates the need for complex series and parallel piping, significantly reducing the difficulty of installation and disassembly, and saving the cost of piping and connectors. Furthermore, the position of the heat sink's multiple heat-conducting components can be adjusted to accommodate multiple heat source items of varying structures, offering a wider range of adaptability.

[0033] Optionally, multiple heat-conducting components are attached one by one to multiple heat sources to reduce thermal resistance, and multiple heat-conducting components are attached to the bottom wall of the slide 11, that is, the main cold plate 1, to ensure that heat can be transferred to the main cold plate 1 in time and dissipated by the main cold plate 1.

[0034] Optionally, a flow channel for liquid cooling medium is provided within the main cold plate 1, with a medium inlet 12 and a medium outlet 13 at either end of the flow channel. In this embodiment, the medium inlet 12 and the medium outlet 13 are optionally located on the side of the main cold plate 1, with the flow channel arranged in an S-shape. Optionally, the flow channel can be divided into multiple flow channel segments, each corresponding to a slide 11, to ensure that heat from the heat-conducting components within each slide 11 is promptly transferred to the liquid cooling medium and carried out of the main cold plate 1 through the flow of the liquid cooling medium.

[0035] Optionally, the plurality of slides 11 provided on the main cold plate 1 are arranged in sequence, and the length directions of the plurality of slides 11 are parallel. Of course, in other embodiments, the arrangement of the slides 11 can also be adjusted according to the positions of the plurality of heat sources, for example, the length directions of the plurality of slides 11 are not consistent, which is not limited here.

[0036] Optionally, each heat-conducting component includes a heat-absorbing element attached to the heat source. Optionally, the heat-absorbing element is a semiconductor cooler 2. As can be seen, the cold end of the semiconductor cooler 2 faces the heat source, while the hot end faces the heat-conducting component. By utilizing the thermoelectric effect of the semiconductor cooler 2 to lower the surface temperature of the cold end, the efficiency of heat absorption at the heat source can be enhanced, accelerating the cooling of the heat source.

[0037] Optionally, the heat dissipation device further includes a controller 3, which is communicatively connected to the semiconductor coolers 2 of the multiple heat-conducting components and is capable of adjusting the cooling capacity of the semiconductor coolers 2. Optionally, in this embodiment, the controller 3 is connected to the semiconductor coolers 2 of the multiple heat-conducting components via circuits. The controller 3 can adjust the cooling capacity of the semiconductor coolers 2 by adjusting the current, thereby adjusting the heat dissipation efficiency for different heat sources, the heat dissipation bottleneck temperature, and other factors, thereby achieving more precise heat dissipation and temperature control.

[0038] Optionally, in this embodiment, the controller 3 includes a built-in control circuit. One end of the control circuit is connected to all semiconductor coolers 2, and the other end is connected to the server motherboard via a 4-pin interface. The server motherboard can control multiple semiconductor coolers 2, adjusting the input current to change the thermoelectric cooling efficiency of the semiconductor coolers 2, thereby actively regulating the surface temperature of the heat source device.

[0039] During application, a temperature threshold can be set for each heat source. When a heat source is fully loaded, if the server motherboard detects a rapid temperature rise exceeding the threshold via the temperature detection device, the server motherboard will adjust the current of the semiconductor cooler 2 for that heat source via the controller 3. The sudden increase in power consumption is first transferred to the first phase-change metal in the first accommodating cavity 41 within the thermal base 4. The first phase-change metal melts and absorbs heat, maintaining a slow temperature rise, preventing a sudden temperature rise. The excess heat is then transferred to the main cold plate 1 for efficient heat dissipation through liquid cooling.

[0040] When the heat source is in standby or normal (low-frequency) working power consumption decreases, if the server motherboard monitors through the temperature detection device that the temperature of the heat source becomes lower and is lower than its temperature threshold, the server motherboard adjusts the current of the semiconductor cooler 2 of the heat source through the controller 3 to decrease accordingly. At this time, the first phase change metal will absorb heat and release it, and restore to a solid phase state.

[0041] Optionally, each heat conducting assembly includes a heat conducting seat 4, which is slidably disposed on the slideway 11, and a heat absorbing member is disposed on the heat conducting seat 4. That is, the hot end of the semiconductor cooler 2 is attached to the heat conducting seat 4 to quickly transfer heat from the heat source to the heat conducting seat 4, and then to the main cold plate 1 through the heat conducting seat 4.

[0042] Optionally, a limiting groove is provided at the top of the heat conducting seat 4, and the semiconductor cooler 2 is plate-shaped and arranged in the limiting groove to ensure that the semiconductor cooler 2 is in full contact with the bottom of the limiting groove of the heat conducting seat 4, thereby improving the heat transfer efficiency.

[0043] Optionally, the thermal base 4 includes a first accommodating cavity 41 filled with a first phase-change metal. When the heat source is operating, the first phase-change metal absorbs heat and melts. Optionally, in this embodiment, the melting point of the first phase-change metal is 65°C. This first phase-change metal not only melts and absorbs heat, enhancing the thermal storage capacity of the thermal base 4, but also exhibits excellent thermal conductivity, ensuring rapid heat transfer.

[0044] The first phase-change metal continuously absorbs and releases heat, stabilizing the temperature. During normal operation of the electronic device, the first phase-change metal melts and absorbs heat. When the electronic device is deactivated and powered off, the first phase-change metal solidifies, releasing heat and slowly cooling the surface temperature of the thermally conductive base 4. Because high-power electronic devices often experience a significant temperature difference between their operating temperature and the cooling medium, the presence of the first phase-change metal protects the electronic device from repeated thermal shocks that could cause device failure or solder joint breakage.

[0045] Optionally, the first phase-change metal material is a bismuth-indium-tin alloy having the following components and mass fractions: 51% indium, 32% bismuth, 16% tin, and 1% silicon dioxide. The addition of silicon dioxide provides condensation nuclei, effectively reducing the metal's undercooling and preventing the metal from condensing below its freezing point.

[0046] Optionally, the heat conducting base 4 has a second accommodating cavity 42 filled with a second phase change metal. When the heat source is in a thermal runaway state, the second phase change metal can absorb heat and melt. Optionally, in this embodiment, the melting temperature of the first phase change metal is 105°C.

[0047] The second phase change metal also has good thermal conductivity and can ensure rapid heat transfer. It is known that the second phase change metal does not undergo phase change when the heat source is in working condition. Its main function is to prevent thermal runaway and prolong the processing time. When the external refrigeration cycle fails and the liquid cooling medium cannot be cooled, or the heat source device is short-circuited and the temperature rises rapidly, the external temperature monitoring equipment monitors the rapid rise in the heat source temperature, and the semiconductor refrigerator 2 can be turned on by the controller 3 for cooling, and the heat is transferred to the heat conductor 4. The second phase change metal absorbs heat through phase change, which can maintain a period of time so that the heat source will not be further overheated, providing more reaction processing time for operation and maintenance.

[0048] Optionally, in this embodiment, the material of the second phase-change metal is an indium-tin alloy, and the components and mass fractions thereof are as follows: 51% indium, 47.2% tin, and 1.8% zinc.

[0049] The low-melting-point phase-change liquid metal is selected as the buffer material in consideration of the excellent thermal conductivity and considerable latent heat of the metal material. Compared with traditional phase-change materials such as paraffin and inorganic salts, while achieving the same phase-change heat absorption capacity, the low-melting-point phase-change liquid metal has a smaller volume, stronger heat diffusion capacity, faster overall heat absorption, and faster heat conduction. It will not affect the thermal conductivity of the heat-conducting seat 4, and can quickly absorb heat and transfer excess heat to the main cold plate 1.

[0050] Optionally, the first accommodating chamber 41 is positioned closer to the heat sink than the second accommodating chamber 42. Optionally, to increase the contact area between the first phase-change metal and the main body of the thermally conductive base 4 and improve the heat exchange efficiency between the first phase-change metal and the main body of the thermally conductive base 4, multiple first accommodating chambers 41 are provided, and the multiple first accommodating chambers 41 are arranged in parallel and spaced apart from each other. Optionally, the extension direction of each first accommodating chamber 41 is parallel to the bottom of the limiting groove. Optionally, to increase the contact area between the second phase-change metal and the main body of the thermally conductive base 4 and improve the heat exchange efficiency between the second phase-change metal and the main body of the thermally conductive base 4, multiple second accommodating chambers 42 are also provided, and the multiple second accommodating chambers 42 are arranged in parallel and spaced apart from each other. Optionally, the extension direction of each second accommodating chamber 42 is parallel to the bottom of the limiting groove. Optionally, in this embodiment, the multiple first accommodating chambers 41 are arranged in a row, and the multiple second accommodating chambers 42 are arranged in a row, and the extension directions of the first accommodating chambers 41 and the second accommodating chambers 42 are parallel.

[0051] Optionally, each thermally conductive component includes a thermal pad 5, which is attached to the end surface of the thermal base 4 facing the main cold plate 1. The thermal pad 5 is sandwiched between the thermal base 4 and the main cold plate 1. Optionally, because the top surface of the thermal base 4 is provided with a heat absorber and the bottom surface faces the main cold plate 1, the thermal pad 5 is attached to the bottom surface of the thermal base 4. The thermal pad 5 can effectively fill the gap between the thermal base 4 and the main cold plate 1, reducing the contact thermal resistance and improving the heat dissipation effect.

[0052] Optionally, the thickness of the thermal pad 5 is 0.3mm, 0.4mm or 0.5mm. Optionally, the middle inner layer of the thermal pad 5 is a silicone gasket filled with thermally conductive particles, and the upper and lower surfaces of the silicone gasket are both provided with adhesive. A 0.05mm or 0.1mm thick protective film is adhered to the side of the silicone gasket facing the main cold plate 1. The material of the protective film is PI film or silicone cloth. The side of the protective film facing the main cold plate 1 is infiltrated with lubricating silicone oil to prevent the thermal pad 5 from being damaged and torn during the sliding process of the thermal seat 4. The side of the silicone gasket facing away from the main cold plate 1 is adhered to the bottom surface of the thermal seat 4.

[0053] like Figure 3 As shown, optionally, the main cold plate 1 includes a plurality of protruding slide side walls 111, with two slide side walls 111 arranged opposite to each other to enclose and form a slide 11. Optionally, two protrusions are provided on the side surfaces of the bottom of the thermal conductive seat 4, which are respectively inserted into the grooves of the two slide side walls 111. The slide side walls 111 can restrict the thermal conductive seat 4 from separating from the main cold plate 1, and the thermal conductive seat 4 can slide within the slide 11. Optionally, the ends of the slide side walls 111 are provided with plugs to prevent the thermal conductive seat 4 from slipping off the slide 11.

[0054] Optionally, the heat dissipation device further includes a plurality of fixing members 6, which can fix the position of the heat conducting assembly on the main cold plate 1. The main cold plate 1 is fixed relative to the heat source. After the heat conducting assembly is adjusted according to the position of the heat source, the fixing members 6 can be used to fix the heat conducting assembly to prevent subsequent misalignment of the heat conducting assembly and the heat source.

[0055] Optionally, each fixing member 6 comprises a main rod 61 and a telescopic member 62. The main rod 61 has an internally threaded hole, and the telescopic member 62 has external threads. The telescopic member 62 is rotatably inserted into the internally threaded hole. The main rod 61 is connected to the heat conducting assembly. The telescopic member 62 can be rotated and extended to abut the slide side wall 111 to fix the position of the heat conducting base 4 on the main cold plate 1. The telescopic member 62 can also be rotated and retracted to disengage the slide side wall 111 to allow the heat conducting base 4 to slide within the slide 11. Optionally, a telescopic member 62 is provided at each end of the main rod 61, so that the two telescopic members 62 respectively abut the two slide side walls 111 of a slide 11, further improving the stability of the fixation. Optionally, the length direction of the fixing member 6 is perpendicular to the wall surface of the slide side wall 111. Optionally, a fixing member 6 is provided at both ends of a heat conducting base 4 along the extension direction of the slide 11, that is, two fixing members 6 are provided for each heat conducting base 4, further improving the stability of the fixation.

[0056] Optionally, the end of the telescopic member 62 is embedded with nylon material to avoid scratching the slide side wall 111 when abutting against the slide side wall 111 .

[0057] This heat sink is suitable for applications with multiple heat sources, compact space, high power consumption, and large temperature differentials. It eliminates the need for liquid cooling medium connection piping and quick connectors, making it simpler to manufacture and reducing installation complexity and cost. Furthermore, by isolating the liquid cooling medium from the electronic components, it reduces the impact of leakage on the electronic components, providing enhanced safety. Furthermore, the heat sink incorporates a slideway 11, which allows the thermal components to be adjusted on the main cold plate 1, ensuring that each component is perfectly aligned with and positioned above the heat source. The adjustable heat dissipation position of this heat sink accommodates a variety of circuit board configurations. The heat sink utilizes a semiconductor cooler 2 for active temperature control, actively regulating the heat source temperature and effectively reducing the chip surface temperature. This improves the high thermal resistance and poor heat dissipation performance of traditional non-contact heat-conducting structures. The heat sink also incorporates two liquid metal materials with different melting temperatures within the heat-conducting base 4. The lower melting point liquid metal's phase transition heat absorption maintains temperature stability, while the higher melting point liquid metal improves disaster recovery in the event of thermal runaway, extending maintenance personnel's emergency response time.

[0058] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A main body cold plate (1), wherein a plurality of slideways (11) are provided on the main body cold plate (1); Multiple heat-conducting components, each of which can be slidably arranged on the slideway (11) so that the multiple heat-conducting components correspond to the positions of multiple heat sources respectively, and the heat-conducting components are used to absorb the heat of the heat source and transfer it to the main cold plate (1).

2. The heat dissipation device according to claim 1, characterized in that: Each of the heat-conducting components includes a heat absorbing component, and the heat absorbing component is attached to the heat source.

3. The heat dissipation device according to claim 2, characterized in that: The heat absorbing component is a semiconductor refrigerator (2).

4. The heat dissipation device according to claim 3, characterized in that: The invention also comprises a controller (3), wherein the controller (3) is communicatively connected with the semiconductor refrigerators (2) of the plurality of heat-conducting components, and the controller (3) is capable of adjusting the cooling capacity of the semiconductor refrigerators (2).

5. The heat dissipation device according to any one of claims 2 to 4, characterized in that: Each of the heat-conducting components comprises a heat-conducting seat (4), the heat-conducting seat (4) is slidably arranged on the slideway (11), and the heat-absorbing element is arranged on the heat-conducting seat (4).

6. The heat dissipation device according to claim 5, characterized in that: The heat conducting seat (4) has a first accommodating cavity (41), the first accommodating cavity (41) is filled with a first phase-change metal, and when the heat source is in a working state, the first phase-change metal can absorb heat and melt; And / or, the heat conducting seat (4) has a second accommodating cavity (42), the second accommodating cavity (42) is filled with a second phase change metal, and when the heat source is in a thermal runaway state, the second phase change metal can absorb heat and melt.

7. The heat dissipation device according to claim 6, characterized in that: The first accommodating cavity (41) is arranged closer to the heat absorbing component than the second accommodating cavity (42).

8. The heat dissipation device according to claim 5, characterized in that: Each of the heat-conducting components comprises a heat-conducting pad (5), which is attached to the end surface of the heat-conducting seat (4) facing the main cold plate (1), and the heat-conducting pad (5) is sandwiched between the heat-conducting seat (4) and the main cold plate (1).

9. The heat dissipation device according to claim 5, characterized in that: It also includes a plurality of fixing members (6), and the fixing members (6) are capable of fixing the position of the heat-conducting component on the main body cold plate (1).

10. The heat dissipation device according to claim 9, characterized in that: Each of the fixing members (6) includes a main rod (61) and a telescopic member (62), wherein the main rod (61) is provided with an internal threaded hole, and the telescopic member (62) has an external thread, and the telescopic member (62) can be rotatably inserted into the internal threaded hole, and the main rod (61) is connected to the heat-conducting component, and the telescopic member (62) can be rotated and extended to abut against the slide side wall (111), and the telescopic member (62) can also be rotated and retracted to separate from the slide side wall (111).

Images