Full-light-emitting type LED lamp bead and rubber-covered wire lamp

Abstract

The utility model relates to the technical field of LED light emitting, in particular to a full-light-emitting type LED lamp bead and a rubber-covered wire lamp, which comprise a transparent support, a metal substrate, an LED chip and a fluorescent packaging layer positioned above the LED chip, the transparent support is provided with a mounting groove, the metal substrate is arranged in the middle of the transparent support, the LED chip is arranged in the mounting groove, and the fluorescent packaging layer is arranged in the mounting groove. The LED chip is mounted on the metal substrate, the metal substrate is electrically connected with the LED chip, and the fluorescent packaging layer is arranged in the mounting groove. When the LED chip emits light, due to the arrangement of the transparent supports, light rays emitted by the LED lamp beads can penetrate through the fluorescent packaging layer located above the LED chip and can also be emitted outwards from the transparent supports located on the other faces of the LED chip, and therefore the light emitting range of the LED lamp beads can be enlarged, and the light emitting effect of the LED lamp beads is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lighting, in particular to a full-luminous LED lamp bead and a leather wire lamp. Background Art

[0002] As a new light source, LED lamp beads have been widely used in various lighting facilities due to their advantages such as good energy saving and long life. LEDs change the principle of tungsten filament light emission of incandescent lamps and three-primary color powder light emission of fluorescent lamps. They use electric fields to emit light, and have the advantages of high light efficiency, no radiation, long life, low power consumption and environmental protection.

[0003] Existing LED lamp beads are first injection-molded onto a metal substrate to form a bracket. The LED chip is then die-bonded onto the metal substrate, and the LED chip and metal substrate are electrically connected via wire bonding. Finally, phosphor glue is applied to the bracket to form the LED package. The bracket is typically made of a white insulating organic material such as PPA through injection molding and is generally opaque. As a result, the majority of the luminous surface of the final LED lamp bead is concentrated in the phosphor glue above the LED chip, resulting in a limited luminous range, dark areas, and poor luminous effect. Utility Model Content

[0004] Based on the technical problems existing in the above-mentioned prior art, the utility model provides a full-luminous LED lamp bead, which can increase the luminous range of the LED lamp bead and improve the luminous effect of the LED lamp bead.

[0005] The technical solution adopted by the utility model to solve its technical problems is: to provide a fully luminous LED lamp bead, including a transparent bracket, a metal substrate, an LED chip, and a fluorescent packaging layer located above the LED chip, the transparent bracket is provided with a mounting groove, the metal substrate is arranged in the middle of the transparent bracket, the LED chip is mounted on the metal substrate, and the metal substrate and the LED chip are electrically connected, and the fluorescent packaging layer is arranged in the mounting groove.

[0006] Furthermore, the metal substrate is provided with a plurality of injection molding cavities, the transparent bracket is provided with a mounting protrusion that is compatible with the injection molding cavity, the transparent bracket and the metal substrate are connected by injection molding, and when the transparent bracket and the metal substrate are connected by injection molding, the mounting protrusion is located in the injection molding cavity.

[0007] Furthermore, the side walls of the mounting groove are tapered, and the size of the top end of the mounting groove is larger than the size of the bottom end of the mounting groove.

[0008] Furthermore, the metal substrate is provided with a mounting groove 1, which passes through the metal substrate along the thickness direction of the metal substrate, and the transparent bracket is provided with a mounting protrusion 2 that is compatible with the mounting groove 1. When the transparent bracket and the metal substrate are connected by injection molding, the mounting protrusion 2 is located in the mounting groove 1, and the bottom surface of the mounting protrusion 2 is flush with the bottom surface of the metal substrate.

[0009] Furthermore, the fully luminous LED lamp bead also includes a diffusion layer arranged at the bottom end of the metal substrate, the diffusion layer is in contact with the mounting protrusions, a plurality of diffusion particles are arranged in the diffusion layer, and the diffusion layer is provided with a mounting groove for exposing the metal substrate.

[0010] Furthermore, the wall of the first installation slot is provided with a plurality of continuous reflecting surfaces.

[0011] Based on the above problems existing in the prior art, the second purpose of the embodiment of the present utility model is to provide a leather wire lamp having a full-luminous LED lamp bead in any of the above solutions.

[0012] Furthermore, the leather wire lamp also includes a wire and a covering sleeve, the wire and the metal substrate are connected by soldering, a plurality of diffusion powders are provided in the covering sleeve, and the covering sleeve wraps and encapsulates the wire and the full-luminous LED lamp bead.

[0013] The beneficial effects of the present invention are: providing a fully luminous LED lamp bead, comprising a transparent bracket, a metal substrate, an LED chip, and a fluorescent encapsulation layer located above the LED chip, wherein the transparent bracket is provided with a mounting groove, the metal substrate is disposed in the middle of the transparent bracket, the LED chip is mounted on the metal substrate, and the metal substrate and the LED chip are electrically connected, and the fluorescent encapsulation layer is disposed within the mounting groove. When the LED chip emits light, due to the provision of the transparent bracket, the light emitted by the LED lamp bead not only passes through the fluorescent encapsulation layer located above the LED chip, but can also be emitted outward from the transparent bracket located on several other surfaces of the LED chip, thereby increasing the luminous range of the LED lamp bead and improving the luminous effect of the LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] In the picture: Figure 1 A top view of a fully luminous LED lamp bead provided in Example 1 of the present utility model (excluding the fluorescent packaging layer);

[0016] Figure 2 for Figure 1Bottom view of the fully luminous LED lamp bead shown;

[0017] Figure 3 for Figure 1 A cross-sectional view of the fully luminous LED lamp bead shown (excluding the fluorescent packaging layer);

[0018] Figure 4 for Figure 1 A cross-sectional view of the fully luminous LED lamp bead from another perspective;

[0019] Figure 5 A cross-sectional view of a leather wire lamp provided in Example 1 of the present utility model;

[0020] Figure 6 This is a bottom view of the leather wire lamp provided in Example 2 of the present utility model (excluding the covering sleeve);

[0021] Figure 7 for Figure 6 A cross-sectional view of the leather-line lamp shown (excluding the fluorescent encapsulation layer and the covering sleeve);

[0022] Figure 8 for Figure 7 Enlarged view of point A in the middle;

[0023] Figure 9 for Figure 6 A cross-sectional view of the leather wire lamp from another perspective is shown.

[0024] Explanation of the reference numerals: 100, fully luminous LED lamp bead; 10, transparent bracket; 11, mounting groove; 12, mounting protrusion one; 13, mounting protrusion two; 20, metal substrate; 21, injection molding cavity; 22, mounting through groove one; 221, reflecting surface; 30, LED chip; 31, pin one; 32, pin two; 33, adhesive layer; 40, fluorescent encapsulation layer; 50, diffusion layer; 51, mounting through groove two; 200, leather wire lamp; 201, wire; 202, covering sleeve. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention is now described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basics of the present invention in an illustrative manner, and therefore only shows the structures related to the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] Example 1

[0027] Please refer to Figure 1-5A fully luminous LED lamp bead 100 includes a transparent bracket 10, a metal substrate 20, an LED chip 30, and a fluorescent packaging layer 40 located above the LED chip 30, and the metal substrate 20 and the LED chip 30 are electrically connected.

[0028] The transparent bracket 10 defines a mounting groove 11 with tapered sidewalls, where the top of the groove 11 is larger than the bottom. A metal substrate 20 is positioned in the center of the transparent bracket 10. The bottom of the transparent bracket 10 is provided with a plurality of mounting protrusions 12 and 13. A fluorescent encapsulation layer 40 is positioned within the mounting groove 11. Specifically, in this embodiment, the transparent bracket 10 is made of polyphthalamide resin or poly(1,4-cyclohexane dimethyl terephthalate) plastic. The transparent bracket 10 and the metal substrate 20 are connected by injection molding.

[0029] The included angle between the inner walls at both ends of the mounting groove 11 in the length direction is 73.5°, and the included angle between the inner walls at both ends of the mounting groove 11 in the width direction is 98.5°.

[0030] The LED chip 30 is provided with a first pin 31 and a second pin 32, both of which are electrically connected to the metal substrate 20 via solder. Specifically, in this embodiment, the electrodes corresponding to the first pin 31 and the second pin 32 are opposite. If the first pin 31 is the positive electrode pin, the second pin 32 is the negative electrode pin; if the first pin 31 is the negative electrode pin, the second pin 32 is the positive electrode pin.

[0031] An adhesive layer 33 is provided at the bottom of the LED chip 30 , and the LED chip 30 is bonded to the metal substrate 20 via the adhesive layer 33 .

[0032] The metal substrate 20 is provided with a plurality of injection molding cavities 21 , which are matched with the mounting protrusions 12 . When the transparent bracket 10 and the metal substrate 20 are connected by injection molding, the mounting protrusions 12 are located in the injection molding cavities 21 .

[0033] The metal substrate 20 is provided with a mounting groove 22, which penetrates the metal substrate 20 along the thickness direction of the metal substrate 20. When the transparent bracket 10 and the metal substrate 20 are injection-molded, the mounting protrusion 13 is located in the mounting groove 22, and the bottom surface of the mounting protrusion 13 is flush with the bottom surface of the metal substrate 20.

[0034] Specifically, in this embodiment, the types of phosphor and encapsulation adhesive used in the phosphor encapsulation layer 40 and the mixing ratio of the phosphor and encapsulation adhesive are not limited and are selected according to the type of LED chip and the type of color and color temperature that need to be finally achieved.

[0035] Beneficial effect: When the LED chip 30 emits light, due to the setting of the transparent bracket 10, the light emitted by the LED lamp bead can not only pass through the fluorescent packaging layer 40 located above the LED chip 30, but also be emitted outward from the transparent bracket 10, thereby increasing the light-emitting range of the LED lamp bead and improving the light-emitting effect of the LED lamp bead.

[0036] Example 2

[0037] Please refer to Figure 6-9 The difference between Example 2 and Example 1 is that the fully luminous LED lamp bead 100 further includes a diffusion layer 50 disposed at the bottom end of the metal substrate 20. The diffusion layer 50 contacts the mounting protrusion 2 13 and is connected to the bottom end of the metal substrate 20. Optionally, the diffusion layer 50 and the bottom end of the metal substrate 20 are bonded together using glue (not shown). The diffusion layer 50 is made of a composite of polycarbonate and polymethyl methacrylate.

[0038] A plurality of diffusion particles are disposed within the diffusion layer 50. Optionally, the diffusion particles are made of polystyrene microspheres, polymethyl methacrylate, or silicone microspheres. In this embodiment, the diffusion particles are made of polystyrene microspheres. Optionally, the distance between the diffusion particles is 1 to 5 microns. The concentration of the diffusion particles within a single diffusion layer 50 is set to 1%.

[0039] The diffusion layer 50 is provided with a second mounting groove 51 for exposing the metal substrate 20. Specifically, in this embodiment, the second mounting groove 51 and the first mounting groove 22 are staggered.

[0040] The wall of the mounting groove 22 is provided with a plurality of continuous reflective surfaces 221. Specifically, in this embodiment, the angle between adjacent reflective surfaces 221 is 60 degrees, and the plurality of reflective surfaces 221 are all located on the inner wall of the mounting groove 22 away from the LED chip 30.

[0041] Please refer to Figure 9 After light is emitted from the LED chip 30, it is directed toward the bottom of the transparent bracket 10. It is first reflected multiple times by the reflective surfaces 221 within the second mounting groove 51 and the inner wall of the mounting groove. It is then reflected from the reflective surfaces 221 to the diffusion layer 50, where it is diffused by the diffusion particles within the diffusion layer 50. This reduces the problem of the limited luminous range at the bottom of the transparent bracket 10 due to the metal substrate 20 blocking the bottom surface of the transparent bracket 10, further increases the luminous range of the LED chip 30, and thus enhances the luminous effect of the LED lamp beads.

[0042] Specifically, Figure 9Only the light path of the light emitted from the LED chip 30 toward the bottom end of the transparent bracket 10 from the LED chip 30 to the diffusion layer 50 is shown. The light path of the light in the diffusion layer 50 is relatively complex and is not convenient for display.

[0043] The present invention also provides a wire-worn lamp 200, which includes the fully luminous LED lamp bead 100 provided in any of the above embodiments. Because the wire-worn lamp 200 has all the technical features of the fully luminous LED lamp bead 100 provided in the above embodiments, it has the same technical effects as the fully luminous LED lamp bead 100.

[0044] The wire lamp 200 also includes a conductor 201 and a sheath 202. The conductor 201 is connected to the metal substrate 20 via soldering. The sheath 202 is provided with a diffusion powder, which encapsulates the conductor 201 and the fully luminous LED lamp bead 100. When soldering the fully luminous LED lamp bead 100 to the conductor 201 in Example 2, the conductor 201 is placed within the second mounting groove 51 and then connected to the exposed metal substrate 20 within the second mounting groove 51 via soldering. Specifically, in this embodiment, the sheath 202 is made of polyphthalamide resin or poly(1,4-cyclohexane dimethyl terephthalate) plastic, and the diffusion powder is a silicone light diffuser.

[0045] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0046] It should be understood that the terms "length", "width", "up", "down", "front and back", "left and right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0047] The above description is based on the ideal embodiment of the present invention. Based on the above description, relevant personnel can make various changes and modifications without departing from the scope of the present invention. The technical scope of this utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A full-luminous LED lamp bead, characterized in that : It includes a transparent bracket, a metal substrate, an LED chip, and a fluorescent packaging layer located above the LED chip, the transparent bracket is provided with a mounting groove, the metal substrate is arranged in the middle of the transparent bracket, the LED chip is mounted on the metal substrate, and the metal substrate and the LED chip are electrically connected, and the fluorescent packaging layer is arranged in the mounting groove; the metal substrate is provided with a plurality of injection molding cavities, the transparent bracket is provided with a mounting protrusion that is compatible with the injection molding cavity, the transparent bracket and the metal substrate are connected by injection molding, and when the transparent bracket and the metal substrate are injection-molded, the mounting A protrusion 1 is located in the injection molding cavity; a mounting groove 1 is provided on the metal substrate, and the mounting groove 1 penetrates the metal substrate along the thickness direction of the metal substrate; the transparent bracket is provided with a mounting protrusion 2 adapted to the mounting groove 1; when the transparent bracket and the metal substrate are connected by injection molding, the mounting protrusion 2 is located in the mounting groove 1, and the bottom surface of the mounting protrusion 2 is flush with the bottom surface of the metal substrate; the fully luminous LED lamp bead also includes a diffusion layer arranged at the bottom end of the metal substrate; a plurality of diffusion particles are provided in the diffusion layer; and the groove wall of the mounting groove 1 is provided with a plurality of continuous reflective surfaces.

2. The full-luminous LED lamp bead according to claim 1, characterized in that :The side walls of the mounting groove are tapered, and the size of the top end of the mounting groove is larger than the size of the bottom end of the mounting groove.

3. The full-luminous LED lamp bead according to claim 2, characterized in that The diffusion layer is in contact with the second mounting protrusion, and the diffusion layer is provided with a second mounting through groove for exposing the metal substrate.

4. A leather wire lamp, characterized in that: It comprises the full-luminous LED lamp bead as described in any one of claims 1 to 3.

5. The leather wire lamp according to claim 4, characterized in that: The leather wire lamp also includes a wire and a covering sleeve. The wire and the metal substrate are connected by soldering. A plurality of diffusion powders are arranged in the covering sleeve. The covering sleeve wraps and encapsulates the wire and the full-luminous LED lamp bead.

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