Alloy resistor material sheet degumming device

Abstract

The utility model discloses an alloy resistor material sheet degumming device which comprises a supporting machine frame, a horizontal driving mechanism is arranged on the top face of the supporting machine frame in the length direction of the supporting machine frame, and a bearing base plate is fixedly arranged at the output end of the horizontal driving mechanism. The device further comprises a mounting frame, the mounting frame is fixedly arranged above the middle of the supporting rack through supporting side plates on the two sides, a vertical driving mechanism is arranged on the mounting frame, a scraper is downwards arranged at the output end of the vertical driving mechanism, and the scraper is obliquely and downwards arranged. And horizontal shaping compression rollers are rotatably arranged in the middles of the two supporting side plates. According to the utility model, when the bearing substrate drives the alloy resistor material sheet to pass below the scraper, the scraper can automatically scrape the adhesive tape on the surface of the alloy resistor material sheet, so that the removal is accurate and convenient, the operation is simple and convenient, and the yield of the alloy resistor material sheet is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of alloy resistor production, in particular to a device for removing glue from alloy resistor sheets. Background Art

[0002] Alloy resistors use an alloy as a current medium. They are often used to sample current in circuits and provide feedback on current fluctuations in the circuit, allowing for further control or influence of current changes. They are commonly used in products such as battery protection boards, power supplies, inverters, lamps, and motors.

[0003] The production process of alloy resistors involves processes such as trimming, debonding, and cutting. In the relevant debonding technology, a glue channel will be reserved on the packaging mold of the alloy resistor sheet. During packaging, the alloy resistor sheet is placed in the packaging mold and then the mold is closed. The heated and molten plastic sealing material will flow through the glue channel to the surface of the alloy resistor sheet and cool on the surface of the alloy resistor sheet to form a protective layer. The plastic sealing material remaining in the glue channel will cool on the surface of the alloy resistor sheet to form a glue strip. In order to ensure the overall appearance of the alloy resistor sheet, the glue strip usually needs to be removed.

[0004] For example, Chinese patent CN202123133525.7 proposes an automatic glue removal machine for chip alloy resistors, which includes two conveyor belts that can move toward or in opposite directions, and the two conveyor belts can convey synchronously. The surface of each conveyor belt is provided with multiple storage slots at equal intervals. The upper surface of the conveyor belt conveys multiple resistors, and the two ends of each resistor are respectively placed in the storage slots of the two conveyor belts. A liftable glue removal component is provided above and below the resistor.

[0005] Existing alloy resistors mostly use manual debonding methods, which is time-consuming and labor-intensive, and the debonding is not clean. In addition, manual removal of the glue strips can easily cause the surface of the alloy resistor sheet to be scratched by the tool, thereby reducing the yield rate. Utility Model Content

[0006] In view of this, the purpose of the present invention is to provide an alloy resistor material stripping device with a simple structure, easy use and high stripping efficiency.

[0007] To achieve the above purpose, the present invention adopts the following contents:

[0008] A device for removing glue from alloy resistor sheets comprises a support frame, the top surface of the support frame is provided with a horizontal drive mechanism along its length direction, and a carrier substrate is fixedly provided on the output end of the horizontal drive mechanism; it also comprises a mounting frame, the mounting frame is fixedly provided on the upper middle part of the support frame through support side plates on both sides, a vertical drive mechanism is provided on the mounting frame, a scraper is provided downwardly at the output end of the vertical drive mechanism, and the scraper is arranged obliquely downward; a horizontal shaping roller is rotatably provided in the middle part of the two support side plates, the shaping roller and the scraper are respectively located on both sides of the support side plates, and the carrier substrate can pass under the shaping roller and the scraper under the control of the horizontal drive mechanism.

[0009] Furthermore, the carrier substrate is provided with four raised positioning pins on the top, bottom, left, and right sides of the carrier substrate. These positioning pins are designed to precisely secure the alloy resistor sheet, precisely corresponding to the pre-set holes in the sheet. These four positioning pins restrict the sheet's freedom of movement, keeping it fixed on the carrier substrate surface, significantly improving the precision and stability of the scraper during adhesive removal.

[0010] Furthermore, the carrier substrate is provided with an internal air cavity, a plurality of adsorption holes are arranged on its surface, and external connection holes are provided on the side of the carrier substrate. Both the adsorption holes and the external connection holes are connected to the air cavity. The external connection holes are connected to an external vacuum pump, which reduces the air pressure inside the air cavity to create a vacuum. This allows the external atmospheric pressure to adsorb and press the alloy resistor sheet against the surface of the carrier substrate, generating an adsorption force. This adsorption force firmly adheres the alloy resistor sheet to the carrier substrate, ensuring that the alloy resistor sheet remains stationary during the debonding process, thereby improving production efficiency.

[0011] Further explanation: the horizontal drive mechanism is a screw drive module, and the drive nut seat of the screw drive module is mounted on the carrier substrate. The low-cost, compact and simple screw drive module is used, and the movement is smooth, ensuring the stability of the horizontal movement of the carrier substrate during the debonding operation.

[0012] Furthermore, the support frame is equipped with slot-shaped photoelectric sensors on either side, and contacts for triggering the slot-shaped photoelectric sensors are located on the side of the drive nut seat of the lead screw drive module. The slot-shaped photoelectric sensors accurately determine the motion position of the carrier substrate, meeting precise control requirements and providing high reliability.

[0013] Further explanation: The vertical drive mechanism includes a vertical cylinder mounted on the mounting frame and vertical plates mounted on either side of the two supporting side plates. The output end of the vertical cylinder is downwardly connected to the intermediate plate, to which the scraper is fixed. A vertical guide rail is mounted on the vertical plate, and a slider is slidably mounted on the vertical guide rail in a snap-fit ​​manner. The slider is connected to the intermediate plate. The vertical cylinder is very easy to use and adjust, controlling the scraper's proximity to the alloy resistor sheet on the carrier substrate. The cooperation between the guide rail and the slider ensures smooth upward and downward movement of the scraper.

[0014] The beneficial effects of the present invention are as follows: the alloy resistor sheet is placed on the surface of the carrier substrate, and the horizontal driving mechanism drives the alloy resistor sheet on the carrier substrate to first pass under the shaping roller so that defects such as warping and bending of the alloy resistor sheet can be effectively corrected, and then the vertical driving mechanism drives the scraper to move downward so that the blade end of the scraper can just contact the top surface of the alloy resistor sheet on the surface of the carrier substrate. When the carrier substrate drives the alloy resistor sheet to pass under the scraper, the scraper will automatically scrape off the rubber strip on the surface of the alloy resistor sheet, and the removal is accurate and convenient, the operation is relatively simple, and the yield rate of the alloy resistor sheet is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings.

[0016] Figure 1 This is a structural diagram of a device for removing glue from alloy resistor sheets according to an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the vertical drive mechanism according to an embodiment of the present utility model;

[0018] Figure 3 It is a cross-sectional schematic diagram of a carrier substrate according to an embodiment of the present utility model;

[0019] In the figures, the reference numerals are:

[0020] 1-support frame, 2-horizontal drive mechanism, 3-carrying base plate, 4-mounting frame, 5-support side plate, 6-vertical drive mechanism, 7-scraper, 8-shaping roller, 21-groove photoelectric sensor, 22-contact piece, 31-positioning pin, 32-air cavity, 33-adsorption hole, 34-external hole, 61-vertical cylinder, 62-middle plate, 63-vertical plate body, 64-vertical guide rail, 65-slider. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments. Those skilled in the art should understand that the following specific description is illustrative rather than restrictive and should not limit the scope of protection of the present invention.

[0022] See also Figures 1 to 3 As shown, in this embodiment, a device for removing glue from alloy resistor sheets includes a supporting frame 1, and the top surface of the supporting frame 1 is provided with a horizontal driving mechanism 2 along its length direction, and a supporting substrate 3 is fixedly provided on the output end of the horizontal driving mechanism 2; it also includes a mounting frame 4, and the mounting frame 4 is fixedly provided on the upper middle part of the supporting frame 1 through the supporting side plates 5 on both sides, and a vertical driving mechanism 6 is provided on the mounting frame 4, and a scraper 7 is provided downwardly at the output end of the vertical driving mechanism 6, and the scraper 7 is arranged obliquely downward; a horizontal shaping roller 8 is rotatably provided in the middle of the two supporting side plates 5, and the shaping roller 8 and the scraper 7 are respectively located on both sides of the supporting side plates 5, and the supporting substrate 3 can pass under the shaping roller 8 and the scraper 7 under the control of the horizontal driving mechanism 2.

[0023] During use, the alloy resistor sheet is placed on the surface of the carrier substrate 3, and the horizontal drive mechanism 2 drives the alloy resistor sheet on the carrier substrate 3 to pass under the shaping roller 8 first, so that defects such as warping and bending of the alloy resistor sheet can be effectively corrected. Then, the vertical drive mechanism 6 drives the scraper 7 to move downward so that the blade end of the scraper 7 can just contact the top surface of the alloy resistor sheet on the surface of the carrier substrate 3. When the carrier substrate 3 drives the alloy resistor sheet to pass under the scraper 7, the scraper 7 will automatically scrape off the rubber strip on the surface of the alloy resistor sheet.

[0024] In this embodiment, four raised positioning pins 31 are provided on the upper, lower, left, and right sides of the carrier substrate 3. The positioning pins are positioned to precisely secure the alloy resistor sheet, precisely corresponding to the pre-set holes in the sheet. These four positioning pins restrict the sheet's freedom of movement, maintaining a fixed position on the carrier substrate surface, significantly improving the precision and stability of the scraper during adhesive removal.

[0025] Furthermore, an air cavity 32 is provided within the carrier substrate 3, and a plurality of adsorption holes 33 are arranged on the surface of the carrier substrate 3. External connection holes 34 are provided on the side of the carrier substrate 3. Both the adsorption holes 33 and the external connection holes 34 are connected to the air cavity 32. The external connection holes are used to connect to an external vacuum pump device, reducing the air pressure inside the air cavity to create a vacuum. This allows the external atmospheric pressure to adsorb and press the alloy resistor sheet against the surface of the carrier substrate, generating an adsorption force. This adsorption force firmly adheres the alloy resistor sheet to the carrier substrate, ensuring that the alloy resistor sheet remains stationary during the debonding process, thereby improving production efficiency.

[0026] In this embodiment, the horizontal drive mechanism 2 is a screw drive module, and the drive nut seat of the screw drive module is mounted on the carrier substrate 3. The use of a low-cost, compact and simple screw drive module ensures smooth movement and ensures the stability of the horizontal movement of the carrier substrate during the debonding operation.

[0027] Furthermore, slot-shaped photoelectric sensors 21 are provided on both sides of the support frame 1, and contact pieces 22 for triggering the slot-shaped photoelectric sensors 21 are provided on the sides of the drive nut seat of the screw drive module. The slot-shaped photoelectric sensors accurately determine the movement position of the carrier substrate, thereby meeting precise control requirements and having high reliability.

[0028] In this embodiment, the vertical drive mechanism 6 comprises a vertical cylinder 61 mounted on the mounting frame 4 and vertical plates 63, each mounted on one side of the two supporting side plates 5. The output end of the vertical cylinder 61 is downwardly connected to an intermediate plate 62, to one side of which a scraper 7 is fixed. A vertical guide rail 64 is provided on the vertical plate 63, on which a slider 65 is slidably mounted in a snap-fit ​​manner. The slider 65 is connected to the intermediate plate 62. The vertical cylinder is very easy to use and adjust, controlling the scraper blade to approach the alloy resistor sheet on the carrier substrate. The cooperation between the guide rail and the slider ensures smooth upward and downward movement of the scraper blade.

[0029] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A device for removing glue from alloy resistor sheets, characterized in that: The machine comprises a supporting frame, the top surface of which is provided with a horizontal driving mechanism along its length direction, and a supporting substrate is fixedly provided on the output end of the horizontal driving mechanism; the machine also comprises a mounting frame, which is fixedly provided on the upper middle part of the supporting frame through the supporting side plates on both sides, and a vertical driving mechanism is provided on the mounting frame, and a scraper is provided downwardly at the output end of the vertical driving mechanism, and the scraper is arranged obliquely downward; a horizontal shaping roller is rotatably provided at the middle part of the two supporting side plates, and the shaping roller and the scraper are respectively located on both sides of the supporting side plates, and the supporting substrate can pass under the shaping roller and the scraper under the control of the horizontal driving mechanism.

2. The device for removing adhesive from alloy resistor sheet according to claim 1, characterized in that: Four raised positioning pins are arranged on the upper, lower, left and right sides of the surface of the carrier substrate.

3. The device for removing adhesive from alloy resistor sheet according to claim 2, characterized in that: An air cavity is arranged inside the carrier substrate, a plurality of adsorption holes are arranged on the surface of the carrier substrate, and external connection holes are arranged on the side of the carrier substrate. The adsorption holes and the external connection holes are both connected with the air cavity.

4. The device for removing adhesive from alloy resistor sheet according to claim 1, characterized in that: The horizontal driving mechanism is a screw driving module, and the driving nut seat of the screw driving module is installed with the supporting base plate.

5. The device for removing adhesive from alloy resistor sheet according to claim 4, characterized in that: Slot-type photoelectric sensors are respectively arranged on both sides of one side of the support frame, and contact pieces for triggering the slot-type photoelectric sensors are arranged on the side of the driving nut seat of the screw drive module.

6. The device for removing adhesive from alloy resistor sheet according to claim 1, characterized in that: The vertical drive mechanism includes a vertical cylinder arranged on the mounting frame and a vertical plate body respectively arranged on one side of the two supporting side plates. The output end of the vertical cylinder is downwardly connected to the middle plate, and the scraper is fixed on one side of the middle plate. A vertical guide rail is provided on the vertical plate body, and a slider is slidably installed on the vertical guide rail in a clamping form, and the slider is connected to the middle plate.

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