Handheld semiconductor refrigeration fan

Abstract

The utility model discloses a handheld semiconductor refrigeration fan, and belongs to the field of handheld fans. Comprising a handle and a fan head, the fan head comprises a main shell, a fan assembly and a semiconductor refrigeration assembly, the main shell is rotationally connected with the handle, and the fan assembly and the semiconductor refrigeration assembly are both installed on the main shell; the semiconductor refrigeration assembly is located in front of the fan assembly, and the front end of the semiconductor refrigeration assembly protrudes out of the main shell. Compared with the prior art, the handheld fan has the advantages that the fan head of the handheld fan is rotationally connected with the handle, so that the blowing angle can be conveniently adjusted, and the handheld fan can be folded to be placed on a tabletop for use and is more convenient to use.

Description

Technical Field

[0001] The utility model belongs to the field of handheld fans, in particular to a handheld semiconductor refrigeration fan. Background Art

[0002] Handheld fans are small in size, easy to store, and can be held in one hand, making them easy to use. They have gradually become the main tool for office workers to combat hot weather.

[0003] Common handheld fans do not have refrigeration effect usually, and when the weather temperature is high, the cooling effect is limited. Based on this, handheld fans that can refrigerate have appeared in the prior art.

[0004] For example, the patent with application number CN202022748460.6 discloses a handheld fan, including a shell, a fan assembly, a semiconductor refrigeration plate, and a cooling element. The fan assembly is installed in the shell and close to the rear of the shell; the semiconductor refrigeration plate is installed in the shell and is located in front of the fan assembly, and the front end surface of the semiconductor refrigeration plate is the cooling surface; the cooling element is located at the front end of the shell, and the cooling element is attached to the front end surface of the semiconductor refrigeration plate, and an air outlet is left between the cooling element and the shell; when in use, the user can directly place the front end surface of the cooling element directly on the skin, and cooperate with the airflow generated by the fan assembly to perform the most direct double cooling of the human body and obtain a better cooling effect.

[0005] Although the handheld fan disclosed in the above patent has a cooling effect, its fan head and handle are an integrated structure, the fan head cannot be movable, and it is inconvenient to adjust the blowing angle of the fan; and the fan can only be used by hand and cannot be placed stably on the desktop, and the usage scenario is relatively single. Utility Model Content

[0006] In order to solve the above problems, the primary purpose of the present invention is to provide a handheld semiconductor cooling fan that can easily adjust the blowing angle of the fan.

[0007] Another object of the present invention is to provide a handheld semiconductor cooling fan that can be folded and placed on a desktop for use.

[0008] To achieve the above purpose, the technical solution of the utility model is as follows:

[0009] The utility model provides a handheld semiconductor refrigeration fan, comprising a handle and a fan head. The fan head comprises a main shell, a fan assembly, and a semiconductor refrigeration assembly. The main shell is rotatably connected to the handle, and the fan assembly and the semiconductor refrigeration assembly are both installed in the main shell; the semiconductor refrigeration assembly is located in front of the fan assembly, and the front end of the semiconductor refrigeration assembly protrudes out of the main shell.

[0010] When the handheld fan of the present application is in use, a dual cooling effect can be achieved by cooperating with the semiconductor refrigeration component and the fan component; at the same time, the fan component and the semiconductor refrigeration component can rotate around the handle under the drive of the main shell, which can not only facilitate the adjustment of the blowing angle, but also can be folded and placed on the desktop for use.

[0011] Furthermore, a rotating protrusion is provided at the bottom of the main shell, a rotating groove is provided at the upper part of the handle, a rotating shaft is provided in the rotating groove, the rotating protrusion is movably provided in the rotating groove, the rotating shaft passes through the rotating protrusion, and both ends of the rotating shaft are connected to the side walls of the rotating groove.

[0012] Furthermore, a rotating shaft pressing piece and a buffer piece are provided in the handle. The rotating shaft pressing piece is fixed to the handle, and the rotating shaft pressing piece is pressed on the rotating protrusion through the buffer piece, which can improve the stability of the rotating structure.

[0013] Furthermore, the fan assembly includes a fan and a fan bracket, the main shell body has an installation cavity, the fan bracket is arranged at the rear of the installation cavity and is connected to the inner wall of the main shell body; the fan bracket is provided with a first installation position on a side facing away from the semiconductor refrigeration assembly, and the fan is fixed in the first installation position; the semiconductor refrigeration assembly includes a semiconductor refrigeration plate, a heat sink, and a cooling member, the fan bracket is provided with a second installation position on a side facing away from the fan, and the heat sink is provided on the second installation position; the cooling member is provided at the front of the installation cavity and protrudes from the main shell body; the semiconductor refrigeration plate is provided between the heat sink and the cooling member, and the hot end of the semiconductor refrigeration plate is in contact with the heat sink, and the cold end faces the cooling member.

[0014] Furthermore, a guide positioning piece is provided on the inner side wall of the main housing, and a guide positioning slot with two open ends is provided on the outer side wall of the fan bracket. The guide positioning piece is inserted into the guide positioning slot and can slide in or out of the opening of the guide positioning slot. In the present application, the structure formed by the guide positioning piece and the guide positioning slot can facilitate both the fixing of the fan bracket and the assembly between the fan bracket and the main housing.

[0015] Furthermore, a card slot with an open end is provided on the inner side wall of the second mounting position, and a card connecting piece is provided on the peripheral side of the heat sink. The card connecting piece is engaged in the card slot and can slide in or out from the opening of the card slot. In the present application, the structure formed by the card slot and the card connecting piece can facilitate the fixing of the heat sink and the assembly between the fan bracket and the heat sink.

[0016] Furthermore, the edge of the cooling element is attached to the heat sink, forming a closed cold storage cavity between the cooling element and the heat sink. The semiconductor cooling sheet is disposed within the cold storage cavity. During use, the cooling element is placed against the skin of the user. The cold energy generated by the semiconductor cooling sheet is stored in the cold storage cavity and dissipated through the cooling element, providing deep and lasting cooling to the skin.

[0017] Furthermore, a clamping bracket is installed on the main shell, and the clamping bracket is fixed to the front end of the main shell. A limiting through hole is provided on the clamping bracket, and the cooling member is located in the limiting through hole, and the front end of the cooling member protrudes out of the limiting through hole; a clamping step is provided on the side wall of the limiting through hole, and the edge of the cooling member extends into a clamping edge, and the inner side surface of the clamping bracket is in contact with the heat sink, so that the clamping edge is pressed between the clamping step and the heat sink.

[0018] Furthermore, a buckle is provided on the inner side wall of the main shell, and a clamping hole adapted to the buckle is provided on the inner side surface of the clamping bracket, and the buckle is clamped in the clamping hole.

[0019] With the above structure, when the compression bracket is installed on the main housing, the cooling element, the heat sink and the fan bracket can be compressed into the main housing, making the structure of the entire fan head more stable and having greater structural stability.

[0020] Furthermore, the fan bracket includes a frame and a mounting plate, and the first mounting position and the second mounting position are respectively arranged on the front and back sides of the mounting plate; the mounting plate is arranged in the middle of the frame, and the mounting plate and the frame are connected by several spaced connecting plates, so that the frame and the mounting plate form an air duct; the heat sink and the clamping bracket are provided with ventilation holes corresponding to the position of the air duct.

[0021] Furthermore, the handheld semiconductor refrigeration fan also includes a control module, which includes a main control PCB board and control buttons. The main control PCB board is arranged in the handle, and the main control PCB board is connected to the fan, semiconductor refrigeration plate, and control buttons; the control buttons are installed on the handle and protrude outside the handle.

[0022] Furthermore, the handheld semiconductor refrigeration fan also includes a battery, which is arranged on the handle and electrically connected to the main control PCB board.

[0023] Furthermore, the handheld semiconductor cooling fan also includes a display module, which includes a display screen, a screen bracket, and a protective lens. The screen bracket is fixed in the handle, the display screen is mounted on the screen bracket, and the protective lens is mounted on the handle and arranged on the outside of the display screen.

[0024] Furthermore, the main housing is provided with a wire trough, one end of which extends into the mounting cavity and the other end of which passes through the rotating protrusion and extends into the handle. A wire pressing member is also mounted on the main housing and is disposed outside the wire trough. The wire trough can be used for routing wires, facilitating electrical connections between the fan, semiconductor cooling fins, and the main control PCB. The wire pressing member can be used to secure wires and improve structural stability.

[0025] Compared with the prior art, the utility model provides a handheld fan with a fan head and a handle that are rotatably connected, which not only facilitates the adjustment of the blowing angle but also allows the fan to be folded and placed on a desktop for use, making it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of the first viewing angle of this embodiment.

[0027] Figure 2 2 is a schematic structural diagram of the second viewing angle of this embodiment.

[0028] Figure 3 It is an exploded view of this embodiment.

[0029] Figure 4 This is a cross-sectional view of the fan head.

[0030] Figure 5 It is a structural diagram of the main shell.

[0031] Figure 6 This is a schematic diagram of the structure of the fan bracket from the first perspective.

[0032] Figure 7 This is a structural diagram of the fan bracket from a second perspective.

[0033] Figure 8 It is a structural diagram of the compression bracket.

[0034] Figure 9 It is a structural diagram of the assembled state of the shaft pressing part, buffer part and wire pressing part.

[0035] In the figure: 1. handle; 11. rotation slot; 2. fan head; 21. main housing; 211. mounting cavity; 212. guide and positioning piece; 213. buckle; 214. wire groove; 22. fan assembly; 221. fan; 222. fan bracket; 2221. frame; 2222. mounting plate; 2223. connecting piece; 223. first mounting position; 224. second mounting position; 225. guide and positioning slot; 226. clamping slot; 23. semiconductor cooling assembly; 231. semiconductor cooling chip; 23 2. Heat sink; 233. Cooling conductor; 2331. Pressing edge; 234. Snap-in piece; 235. Cold storage chamber; 24. Rotating protrusion; 25. Pressing bracket; 251. Limiting through hole; 252. Pressing step; 253. Snap-in hole; 26. Air duct; 27. Ventilation hole; 3. Shaft pressing piece; 4. Buffer; 5. Control module; 51. Main control PCB board; 52. Control button; 6. Battery; 7. Display module; 71. Display screen; 72. Screen bracket; 73. Protective lens; 8. Wire pressing piece. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] To achieve the above purpose, the technical solution of the utility model is as follows:

[0038] See also Figure 1-9 As shown, this embodiment provides a handheld semiconductor cooling fan, including a handle 1 and a fan head 2. The fan head 2 includes a main shell 21, a fan assembly 22, and a semiconductor cooling assembly 23. The main shell 21 is rotatably connected to the handle 1, and the fan assembly 22 and the semiconductor cooling assembly 23 are installed on the main shell 21; the semiconductor cooling assembly 23 is located in front of the fan assembly 22, and the front end of the semiconductor cooling assembly 23 protrudes out of the main shell 21. When in use, it is convenient for the user to fit the skin against the semiconductor cooling assembly 23 and cooperate with the fan assembly 22 to implement a double cooling effect; at the same time, the fan assembly 22 and the semiconductor cooling assembly 23 can rotate around the handle 1 driven by the main shell 21, which can not only facilitate the adjustment of the blowing angle, but also can be folded and placed on the desktop for use.

[0039] Furthermore, a rotating protrusion 24 is provided at the bottom of the main shell 21. The handle 1 is composed of two handle shells, and the interior is a hollow cavity. A rotating groove 11 is provided on the upper part of the handle 1, and a rotating shaft (not shown) is provided in the rotating groove 11. The rotating protrusion 24 is movably arranged in the rotating groove 11, and the rotating shaft passes through the rotating protrusion 24, and the two ends of the rotating shaft are connected to the side walls of the rotating groove 11.

[0040] Furthermore, a shaft pressing piece 3 and a buffer piece 4 are provided in the handle 1 . The shaft pressing piece 3 is fixed to the handle 1 , and the shaft pressing piece 3 is pressed on the rotating protrusion 24 through the buffer piece 4 , which can improve the stability of the rotating structure.

[0041] Furthermore, the fan assembly 22 includes a fan 221 and a fan bracket 222. The main shell 21 has an installation cavity 211. The fan bracket 222 is arranged at the rear of the installation cavity 211 and is connected to the inner side wall of the main shell 21; a first installation position 223 is provided on the side of the fan bracket 222 facing away from the semiconductor refrigeration assembly, and the fan 221 is fixed in the first installation position 223; the semiconductor refrigeration assembly 23 includes a semiconductor refrigeration plate 231, a heat sink 232, and a cooling member 233. A second installation position 224 is provided on the side of the fan bracket 222 facing away from the fan 221, and the heat sink 232 is arranged on the second installation position 224; the cooling member 233 is arranged at the front of the installation cavity 211 and protrudes from the main shell 21; the semiconductor refrigeration plate 231 is arranged between the heat sink 232 and the cooling member 233, and the hot end of the semiconductor refrigeration plate 231 is in contact with the heat sink 232, and the cold end faces the cooling member 233.

[0042] Furthermore, a guide locating piece 212 is provided on the inner side wall of the main housing 21, and a guide locating slot 225 with open ends is provided on the outer side wall of the fan bracket 222. The guide locating piece 212 is snapped into the guide locating slot 225 and can slide in and out of the opening of the guide locating slot 225. In this embodiment, the structure formed by the guide locating piece 212 and the guide locating slot 225 can facilitate both the fixing of the fan bracket 222 and the assembly between the fan bracket 222 and the main housing 21.

[0043] Furthermore, a slot 226 with an open end is provided on the inner side wall of the second mounting position 224, and a snap-in piece 234 is provided on the peripheral side of the heat sink 232. The snap-in piece 234 is snapped into the slot 226 and can slide in or out from the opening of the slot 226. In this embodiment, the structure formed by the slot 226 and the snap-in piece 234 can facilitate the fixing of the heat sink 232 and the assembly between the fan bracket 222 and the heat sink 232.

[0044] Furthermore, the edge of the cooling element 233 is attached to the heat sink 232, forming a closed cold storage chamber 235 between the cooling element 233 and the heat sink 232. The semiconductor cooling sheet 231 is disposed within the cold storage chamber 235. During use, the cooling element 233 is placed against the human skin. The cold energy generated by the semiconductor cooling sheet 231 is stored in the cold storage chamber 235 and dissipated through the cooling element 233, providing deep and lasting cooling of the human skin.

[0045] Furthermore, a clamping bracket 25 is installed on the main shell 21, and the clamping bracket 25 is fixed to the front end of the main shell 21. A limiting through hole 251 is provided on the clamping bracket 25, and the cooling member 233 is located in the limiting through hole 251, and the front end of the cooling member 233 protrudes out of the limiting through hole 251; a clamping step 252 is provided on the side wall of the limiting through hole 251, and the edge of the cooling member 233 extends into a clamping edge 2331, and the inner side surface of the clamping bracket 25 is in contact with the heat sink 232, so that the clamping edge 2331 is pressed between the clamping step 252 and the heat sink 232.

[0046] Furthermore, a buckle 213 is provided on the inner side wall of the main shell 21 , and a clamping hole 253 matching the buckle 213 is provided on the inner side surface of the clamping bracket 25 , and the buckle 213 is clamped in the clamping hole 253 .

[0047] With the above structure, when the clamping bracket 25 is installed on the main housing 21, the cooling member 233, the heat sink 232, and the fan bracket 222 can be pressed into the main housing 21, making the structure of the entire fan head 2 more stable and having strong structural stability.

[0048] Furthermore, the fan bracket 222 includes a frame 2221 and a mounting plate 2222, and the first mounting position 223 and the second mounting position 224 are respectively arranged on the front and back sides of the mounting plate 2222; the mounting plate 2222 is arranged in the middle of the frame 2221, and the mounting plate 2222 and the frame 2221 are connected by several spaced connecting plates 2223, so that the frame 2221 and the mounting plate 2222 form an air duct 26; the heat sink 232 and the clamping bracket 25 are provided with ventilation holes 27 corresponding to the position of the air duct 26.

[0049] Furthermore, the handheld semiconductor cooling fan also includes a control module 5, which includes a main control PCB board 51 and a control button 52. The main control PCB board 51 is arranged in the handle 1, and the main control PCB board 51 is connected to the fan 221, the semiconductor cooling plate 231, and the control button 52; the control button 52 is installed on the handle 1 and protrudes out of the handle 1.

[0050] Furthermore, the handheld semiconductor cooling fan further includes a battery 6 , which is disposed on the handle 1 and electrically connected to the main control PCB board 51 .

[0051] Furthermore, the handheld semiconductor cooling fan also includes a display module 7, which includes a display screen 71, a screen bracket 72, and a protective lens 73. The screen bracket 72 is fixed in the handle 1, the display screen 71 is installed on the screen bracket 72, and the protective lens 73 is installed on the handle 1 and is arranged on the outside of the display screen 71.

[0052] Furthermore, the main housing 21 is provided with a wire groove 214, one end of which extends into the mounting cavity 211, and the other end of which passes through the rotating protrusion 24 and extends into the handle 1. The main housing 21 is also provided with a wire pressing member 8, which is disposed outside the wire groove 214. The wire groove 214 can be used for routing wires, facilitating electrical connections between the fan 221, the semiconductor cooling plate 231, and the main control PCB 51. The wire pressing member 8 can be used to secure the wires and improve the stability of the structure.

[0053] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A handheld semiconductor cooling fan, characterized in that: It includes a handle and a fan head. The fan head includes a main shell, a fan assembly, and a semiconductor refrigeration assembly. The main shell is rotatably connected to the handle. The fan assembly and the semiconductor refrigeration assembly are both installed in the main shell. The semiconductor refrigeration assembly is located in front of the fan assembly, and the front end of the semiconductor refrigeration assembly protrudes out of the main shell.

2. A handheld semiconductor cooling fan as claimed in claim 1, characterized in that: A rotating protrusion is provided at the bottom of the main shell, a rotating groove is provided at the upper part of the handle, a rotating shaft is provided in the rotating groove, the rotating protrusion is movably provided in the rotating groove, the rotating shaft passes through the rotating protrusion, and both ends of the rotating shaft are connected to the side walls of the rotating groove.

3. A handheld semiconductor cooling fan as claimed in claim 2, characterized in that: A rotating shaft pressing piece and a buffer piece are provided in the handle. The rotating shaft pressing piece is fixed to the handle, and the rotating shaft pressing piece is pressed on the rotating protrusion through the buffer piece.

4. A handheld semiconductor cooling fan as claimed in claim 2, characterized in that: The fan assembly includes a fan and a fan bracket. The main housing has a mounting cavity. The fan bracket is arranged at the rear of the mounting cavity and connected to the inner side wall of the main housing. A first mounting position is provided on a side of the fan bracket facing away from the semiconductor refrigeration assembly, and the fan is fixed in the first mounting position. The semiconductor refrigeration assembly includes a semiconductor refrigeration fin, a heat sink, and a cooling member. A second mounting position is provided on a side of the fan bracket facing away from the fan, and the heat sink is arranged on the second mounting position. The cooling member is arranged at the front of the mounting cavity and protrudes from the main housing. The semiconductor refrigeration sheet is arranged between the heat sink and the cooling member, with the hot end of the semiconductor refrigeration sheet in contact with the heat sink and the cold end facing the cooling member.

5. A handheld semiconductor cooling fan as claimed in claim 4, characterized in that: A guide positioning piece is provided on the inner side wall of the main shell, and a guide positioning groove with two ends open is provided on the outer side wall of the fan bracket. The guide positioning piece is inserted into the guide positioning groove and can slide in or out from the opening of the guide positioning groove.

6. A handheld semiconductor cooling fan as claimed in claim 4, characterized in that: A slot with an open end is provided on the inner side wall of the second mounting position, and a clamping piece is provided on the peripheral side of the heat sink. The clamping piece is clamped in the slot and can slide in or out of the opening of the slot.

7. A handheld semiconductor cooling fan as claimed in claim 4, characterized in that: A clamping bracket is installed on the main shell, and the clamping bracket is fixed to the front end of the main shell. A limiting through hole is provided on the clamping bracket, and the cooling member is located in the limiting through hole, and the front end of the cooling member protrudes out of the limiting through hole; a clamping step is provided on the side wall of the limiting through hole, and the edge of the cooling member extends into a clamping edge, and the inner side surface of the clamping bracket is in contact with the heat sink, so that the clamping edge is pressed between the clamping step and the heat sink.

8. A handheld semiconductor cooling fan as claimed in claim 7, characterized in that: The inner side wall of the main shell is further provided with a buckle, and the inner side surface of the clamping bracket is provided with a clamping hole adapted to the buckle, and the buckle is clamped in the clamping hole.

9. The handheld semiconductor cooling fan according to claim 4, characterized in that: The fan bracket includes a frame and a mounting plate, wherein the first mounting position and the second mounting position are respectively arranged on the front and back sides of the mounting plate; the mounting plate is arranged in the middle of the frame, and the mounting plate and the frame are connected by several spaced connecting pieces, so that the frame and the mounting plate form an air duct; the heat sink and the clamping bracket are provided with ventilation holes corresponding to the positions of the air duct.

10. The handheld semiconductor cooling fan according to claim 4, characterized in that: The main shell is also provided with a wire groove, one end of which extends into the installation cavity, and the other end passes through the rotating protrusion and extends into the handle. The main shell is also provided with a wire pressing piece, which is arranged on the outside of the wire groove.

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