Heat exchange assembly and semiconductor refrigeration equipment
Through the combined structure of the heat transfer base, heat pipe and fin assembly, the heat transfer medium circulation and air cooling are used to solve the problem of unsatisfactory heat dissipation at the hot end of the semiconductor refrigeration plate, achieve efficient heat transfer and dissipation, and improve the cooling efficiency and cost performance.
Patent Information
- Application Number
- CN202422596856.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-10-25
AI Technical Summary
In the prior art, the heat dissipation effect of the hot end of the semiconductor refrigeration plate is not ideal, which affects its reliability and continuous operation.
It adopts a combined structure of heat transfer base, heat pipe, fin assembly and cooling fan, uses heat transfer medium to circulate in the heat pipe, and performs air cooling and heat dissipation through the fin assembly to achieve rapid heat transfer and dissipation.
The heat dissipation effect of the hot end of the semiconductor refrigeration plate is improved, the cooling efficiency is improved, the energy consumption is reduced, and the market competitiveness of the product is enhanced.
Smart Images
Figure CN223319297U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of refrigeration technology, and in particular to a heat exchange component and a semiconductor refrigeration device. Background Art
[0002] Semiconductor refrigeration refrigerators, also known as thermoelectric refrigerators, use semiconductor refrigeration chips to achieve refrigeration. They do not require refrigerants and mechanical moving parts, solving the application problems of traditional mechanical refrigeration refrigerators such as medium contamination and mechanical vibration.
[0003] Semiconductor coolers utilize a PN junction composed of specialized semiconductor materials to form a thermocouple pair, generating the Peltier effect. This represents a novel refrigeration method utilizing direct current (DC). Because the cold side of a semiconductor cooler generates significant heat at its hot side while simultaneously cooling, timely heat dissipation from the hot side is essential to ensure reliable and continuous operation. However, existing methods for dissipating heat from the hot side of semiconductor coolers often fail to achieve optimal results. Utility Model Content
[0004] Based on this, an embodiment of the present application provides a heat exchange component and a semiconductor refrigeration device.
[0005] In a first aspect, an embodiment of the present application provides a heat exchange assembly, comprising a heat transfer base, a heat pipe, a fin assembly, and a cooling fan, wherein the heat pipe comprises a first pipe section and a second pipe section connected to the heat transfer base, the first pipe section is connected to the heat transfer base, the second pipe section passes through the fin assembly and is connected to the fin assembly, a heat transfer medium is provided in the inner cavity of the heat pipe, and the cooling fan is used to perform air cooling and heat dissipation on the fin assembly.
[0006] In some embodiments, the fin assembly includes a plurality of fins that are spaced apart and parallel to each other, and the heat pipe passes through and is connected to the plurality of fins.
[0007] In some embodiments, there are multiple heat pipes, and the multiple heat pipes are arranged at intervals and parallel to each other.
[0008] In some embodiments, the heat transfer fluid includes ammonia.
[0009] In some embodiments, the heat transfer base includes a first heat transfer portion and a second heat transfer portion that are connected and stacked, and the area of the first heat transfer portion is larger than the area of the second heat transfer portion;
[0010] The heat conducting pipe is connected to the first heat transfer part, and the surface of the second heat transfer part facing away from the first heat transfer part is used to connect to the hot end of the semiconductor refrigeration fin.
[0011] In some embodiments, steps are formed between both sides of the second heat transfer portion and the first heat transfer portion.
[0012] In some embodiments, the heat transfer base, the heat pipe and the fin assembly are all made of metal; and / or,
[0013] The fins are in a flat, arc-shaped, wavy or bent shape.
[0014] In a second aspect, an embodiment of the present application provides a semiconductor refrigeration device, comprising a heat exchange component as described above and a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate has a cold end and a hot end arranged relatively, and the heat transfer base in the heat exchange component is connected to the hot end of the semiconductor refrigeration plate.
[0015] In some embodiments, the semiconductor refrigeration device further includes an inner liner and a shell, the inner liner is arranged in the shell, and the inner liner and the shell are spaced apart, and the heat exchange component and the semiconductor refrigeration plate are both arranged in the space between the inner liner and the shell; and / or,
[0016] A thermal conductive silicone grease layer is provided between the heat transfer base and the hot end of the semiconductor refrigeration plate.
[0017] In some embodiments, the cooling fan is installed on the inner tank and / or the shell.
[0018] The heat exchange assembly provided in the embodiment of the present application utilizes a heat transfer base to absorb heat from the hot end of the semiconductor refrigeration plate. The heat transfer base transfers the heat to the heat pipe, so that the heat transfer medium in the first pipe section of the heat pipe absorbs the heat and is converted into steam. The steam flows to the second pipe section of the heat pipe and is then transferred to the fin assembly. Since the heat of the fin assembly can be quickly carried away by the airflow generated by the cooling fan, the temperature of the second pipe section of the heat pipe is quickly reduced, and the heat transfer medium vapor in the heat pipe can be condensed into liquid. The liquid flows back to the first pipe section of the heat pipe connected to the heat transfer base under the action of capillary pressure, thereby realizing automatic circulation of the heat transfer medium. During the reciprocating circulation of the heat transfer medium, the heat of the heat transfer base is continuously transferred to the fin assembly by the heat transfer medium and is then carried away by the airflow generated by the cooling fan, thereby accelerating the dissipation of heat from the hot end of the semiconductor refrigeration plate, thereby enabling the hot end of the semiconductor refrigeration plate to achieve an ideal heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments.
[0020] Figure 1 A schematic three-dimensional structural diagram of a portion of the heat exchange assembly provided in an embodiment of the present application.
[0021] Figure 2 A schematic side view of a partial structure of a heat exchange assembly provided in an embodiment of the present application.
[0022] Figure 3 A schematic top view of a partial structure of a heat exchange assembly provided in an embodiment of the present application.
[0023] Figure 4 A bottom view schematically shows a partial structure of a heat exchange assembly provided in an embodiment of the present application.
[0024] Component Symbol Description:
[0025] 100. Heat exchange assembly; 20. Heat transfer base; 21. First heat transfer unit; 22. Second heat transfer unit; 30. Heat pipe; 40. Fin assembly; 41. Fin. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.
[0027] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0028] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0029] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0030] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0031] See also Figures 1 to 4 , an embodiment of the present application provides a heat exchange assembly 100, including a heat transfer base 20, a heat pipe 30, a fin assembly 40 and a cooling fan, the heat pipe 30 includes a first pipe section and a second pipe section connected to each other, the first pipe section is connected to the heat transfer base 20, the second pipe section passes through the fin assembly 40 and is connected to the fin assembly 40, a heat transfer medium is provided in the inner cavity of the heat pipe 30, and the cooling fan is used to perform air cooling and heat dissipation on the fin assembly 40.
[0032] The heat exchange assembly 100 provided in the embodiment of the present application utilizes a heat transfer base 20 to absorb heat from the hot end of the semiconductor refrigeration chip. The heat transfer base 20 transfers the heat to the heat pipe 30, so that the heat transfer medium in the first pipe section of the heat pipe 30 absorbs the heat and is converted into steam. The steam flows to the second pipe section of the heat pipe 30 and is then transferred to the fin assembly 40. Since the heat of the fin assembly 40 can be quickly carried away by the airflow generated by the cooling fan, the temperature of the second pipe section of the heat pipe 30 is rapidly reduced, and the heat transfer medium vapor in the heat pipe 30 can be condensed into liquid. The liquid flows back to the first pipe section of the heat pipe 30 connected to the heat transfer base 20 under the action of capillary pressure, thereby realizing automatic circulation of the heat transfer medium. During the reciprocating circulation of the heat transfer medium, the heat of the heat transfer base 20 is continuously transferred by the heat transfer medium to the fin assembly 40 and is then carried away by the airflow generated by the cooling fan, thereby accelerating the heat dissipation of the hot end of the semiconductor refrigeration chip, thereby enabling the hot end of the semiconductor refrigeration chip to achieve an ideal heat dissipation effect.
[0033] Exemplarily, the heat transfer medium includes ammonia.
[0034] See also Figures 1 to 4 For example, one end of the first pipe segment facing away from the second pipe segment and one end of the second pipe segment facing away from the first pipe segment are both closed ends, thereby forming a sealed cavity in the heat pipe 30 to accommodate the heat transfer medium.
[0035] See also Figures 1 to 4 , illustratively, the end of the first pipe segment facing away from the second pipe segment is located inside the heat transfer base 20.
[0036] Illustratively, a blind hole is provided on the heat transfer base 20 , and an end of the first pipe segment facing away from the second pipe segment is located in the blind hole and connected to the hole wall of the blind hole.
[0037] See also Figures 1 to 4 For example, the end of the second tube segment facing away from the first tube segment is located on the side of the fin assembly 40 facing away from the heat transfer base 20 .
[0038] See also Figures 1 to 4 The fin assembly 40 includes a plurality of fins 41 that are spaced apart and parallel to each other, and the heat pipe 30 passes through the plurality of fins 41 and is connected to the plurality of fins 41 .
[0039] Exemplarily, the spacing distance between the plurality of fins 41 may be 8 mm to 40 mm, for example, 8 mm, 10 mm, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, etc.
[0040] See also Figures 1 to 4 For example, each of the plurality of fins 41 is provided with a through hole, and the heat pipe 30 passes through the through holes on the fins 41 and is connected to the hole walls of the through holes.
[0041] See also Figure 1 、 Figure 3 and Figure 4 There are multiple heat pipes 30, and the multiple heat pipes 30 are arranged at intervals and parallel to each other.
[0042] See also Figure 1 、 Figure 2 and Figure 4 The heat transfer base 20 includes a first heat transfer portion 21 and a second heat transfer portion 22 which are connected and stacked. The area of the first heat transfer portion 21 is larger than that of the second heat transfer portion 22.
[0043] The heat conducting pipe 30 is connected to the first heat transfer part 21 , and the surface of the second heat transfer part 22 facing away from the first heat transfer part 21 is used to connect to the hot end of the semiconductor refrigeration fin.
[0044] It can be understood that by designing the heat transfer base 20 to include a first heat transfer part 21 and a second heat transfer part 22, and the area of the first heat transfer part 21 is larger than the area of the second heat transfer part 22, on the one hand, the outer surface area of the heat transfer base 20 can be expanded, thereby improving the heat dissipation efficiency. In addition, the first heat transfer part 21 with a relatively large area can be used to fix the heat pipe 30, and the second heat transfer part 22 with a relatively small area but a larger thickness is used to connect the hot end of the semiconductor refrigeration plate to absorb the heat from the hot end of the semiconductor refrigeration plate.
[0045] See also Figure 1 and Figure 2 For example, steps are formed between both sides of the second heat transfer part 22 and the first heat transfer part 21 .
[0046] Exemplarily, the heat transfer base 20 , the heat pipe 30 , and the fin assembly 40 are all made of metal.
[0047] In some embodiments, the heat transfer base 20 , the heat pipe 30 , and the fin assembly 40 are all made of aluminum.
[0048] See also Figure 1 For example, the shape of the fin 41 can be rectangular or square.
[0049] See also Figures 1 to 4For example, the fins 41 may be flat. In other embodiments, the fins 41 may be curved, wavy, or bent. It is understood that when the fins 41 are curved, wavy, or bent, the surface area of the fins 41 increases, thereby improving the heat dissipation efficiency of the fins 41.
[0050] An embodiment of the present application also provides a semiconductor refrigeration device, including the heat exchange component 100 in any of the above embodiments and a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate has a cold end and a hot end arranged opposite to each other, and the heat transfer base 20 in the heat exchange component 100 is connected to the hot end of the semiconductor refrigeration plate.
[0051] Since the heat exchange component 100 of the embodiment of the present application can achieve a good heat dissipation effect on the hot end of the semiconductor refrigeration plate, it can improve the cooling efficiency of the semiconductor refrigeration equipment, reduce the operating energy consumption of the semiconductor refrigeration equipment, and thus improve the cost performance of the product and enhance the market competitiveness of the product.
[0052] Exemplarily, the semiconductor refrigeration equipment is a refrigerator, a freezer, a cold drink machine, a refrigerated wine cabinet, a freezer, an ice cream machine, an ice maker, etc.
[0053] For example, a layer of thermal grease is provided between the heat transfer base 20 and the hot end of the semiconductor refrigeration chip. Thermal grease is a paste-like material primarily composed of silicone oil and a filler (typically a metal oxide). By providing a layer of thermal grease between the heat transfer base 20 and the hot end of the semiconductor refrigeration chip, the thermal grease layer can be used to fill the small gap between the heat transfer base 20 and the hot end of the semiconductor refrigeration chip, thereby improving the heat transfer efficiency between the heat transfer base 20 and the hot end of the semiconductor refrigeration chip.
[0054] Exemplarily, the semiconductor refrigeration device further includes an inner liner and a shell, the inner liner is arranged in the shell, and the inner liner and the shell are spaced apart, and the heat exchange component 100 and the semiconductor refrigeration plate are both arranged in the space between the inner liner and the shell.
[0055] When the semiconductor refrigeration device is a refrigerator, illustratively, the inner side of the inner tank defines a storage compartment, and the storage compartment can be a refrigerator or a freezer.
[0056] Exemplarily, the cooling fan may be installed on the inner tank and / or the shell.
[0057] The above describes in detail the heat exchange assembly and semiconductor refrigeration device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to facilitate understanding of the present application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation methods and scope of application may occur based on the principles of the present application. In summary, the contents of this specification should not be construed as limiting the present application.
Claims
1. A heat exchange component, characterized in that: It includes a heat transfer base, a heat pipe, a fin assembly and a cooling fan. The heat pipe includes a first pipe section and a second pipe section connected to the heat transfer base. The first pipe section is connected to the heat transfer base, and the second pipe section passes through the fin assembly and is connected to the fin assembly. A heat transfer medium is provided in the inner cavity of the heat pipe. The cooling fan is used to perform air cooling and heat dissipation on the fin assembly.
2. The heat exchange assembly according to claim 1, characterized in that: The heat transfer base comprises a first heat transfer portion and a second heat transfer portion which are connected and stacked, wherein the area of the first heat transfer portion is larger than that of the second heat transfer portion; The heat conducting pipe is connected to the first heat transfer part, and the surface of the second heat transfer part facing away from the first heat transfer part is used to connect to the hot end of the semiconductor refrigeration fin.
3. The heat exchange assembly according to claim 2, characterized in that: Steps are formed between both sides of the second heat transfer portion and the first heat transfer portion.
4. The heat exchange assembly according to claim 1, characterized in that: The fin assembly includes a plurality of fins that are spaced apart and parallel to each other, and the heat pipe passes through the plurality of fins and is connected to the plurality of fins.
5. The heat exchange assembly according to claim 1, characterized in that: There are multiple heat conduction pipes, and the multiple heat conduction pipes are arranged at intervals and parallel to each other.
6. The heat exchange assembly according to claim 1, characterized in that: The heat transfer medium includes ammonia.
7. The heat exchange assembly according to any one of claims 1 to 6, characterized in that: The heat transfer base, the heat pipe and the fin assembly are all made of metal; and / or, The fins are in a flat, arc-shaped, wavy or bent shape.
8. A semiconductor refrigeration device, characterized in that: It comprises the heat exchange component according to any one of claims 1 to 7 and a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate has a cold end and a hot end arranged opposite to each other, and the heat transfer base in the heat exchange component is connected to the hot end of the semiconductor refrigeration plate.
9. The semiconductor refrigeration device according to claim 8, characterized in that: The semiconductor refrigeration device further includes an inner liner and a shell, wherein the inner liner is arranged in the shell, and the inner liner and the shell are spaced apart, and the heat exchange component and the semiconductor refrigeration plate are both arranged in the space between the inner liner and the shell; and / or, A thermal conductive silicone grease layer is provided between the heat transfer base and the hot end of the semiconductor refrigeration plate.
10. The semiconductor refrigeration device according to claim 9, characterized in that: The cooling fan is installed on the inner container and / or the shell.