Sensor packaging structure and sensor

Abstract

The utility model discloses a packaging structure of a sensor and the sensor. The packaging structure comprises a side plate, a top cover and a substrate. The top cover is connected to the tops of the side plates, the base plate is connected to the bottoms of the side plates, the side plates, the top cover and the base plate define a containing cavity, and a sensor module is arranged in the containing cavity; the side plate is provided with an outer side wall back to the accommodating cavity, and a first groove is concavely formed in the outer side wall; the top cover comprises a cover body and an extension part; the cover body covers the top of the accommodating cavity, one end of the extension part is connected with the cover body, and the other end extends towards the substrate; the extension part is arranged on the periphery of the side plate in a surrounding mode, a first protrusion is arranged on the wall face, facing the outer side wall, of the extension part, and the first protrusion is embedded in the first groove. According to the utility model, the integrally formed flexible material is used as the top cover, so that the sensitivity of the sensor can be improved; the top cover is adhered to the side plate in a covering manner, and the side plate and the substrate are matched to form the accommodating cavity, so that the sealing performance of the packaging structure of the sensor can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a packaging structure of a sensor and a sensor. Background Art

[0002] Pressure sensors can be classified into resistive, capacitive, piezoelectric, photoelectric, magnetoelectric and other types according to their measurement principles. As a resistive pressure sensor, the main feature of the medium-isolated pressure sensor is that it can effectively isolate the sensing element from the harsh medium environment while ensuring the accurate transmission of the pressure signal.

[0003] In the prior art, for media-isolated pressure sensors, their shells are usually made of materials such as metal and plastic. Due to the poor deformation ability of materials such as metal and plastic, the sensor has poor sensitivity to external pressure. At the same time, the process of connecting the metal shell with other structures also has defects such as high production cost and complex manufacturing process. Utility Model Content

[0004] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is how to improve the sensitivity of the sensor.

[0005] In order to solve at least one of the above-mentioned technical problems, the present invention discloses a sensor packaging structure and a sensor.

[0006] According to one aspect of the present disclosure, a sensor packaging structure is provided, comprising:

[0007] Side panels, top cover, and base plate;

[0008] The top cover is connected to the top of the side plate, the base plate is connected to the bottom of the side plate, and the side plate, the top cover and the base plate are arranged to form a receiving cavity; at least one sensor module is arranged inside the receiving cavity.

[0009] The side plate has an outer side wall facing away from the accommodating cavity, and a first groove is formed on the outer side wall;

[0010] The top cover includes a cover body and an extension portion; the cover body is arranged on the top of the accommodating cavity, one end of the extension portion is connected to the cover body, and the other end extends toward the base plate; at least a portion of the extension portion is arranged around the outer periphery of the side plate, and a first protrusion is formed on the wall surface facing the outer side wall, and the first protrusion is embedded in the first groove.

[0011] In some possible embodiments, the distance from the top of the side panel to the base plate is greater than the distance from the cover to the base plate;

[0012] One end of the extension portion at least partially covers the inner side wall of the side plate and is connected to one end of the cover body.

[0013] In some possible embodiments, the extension portion and the cover body are an integrally formed structure; the cover body and the extension portion are made of a flexible material.

[0014] In some possible embodiments, the packaging structure further includes a fixing ring; a second groove is formed on a wall surface of the extension portion facing away from the outer side wall; and the fixing ring is disposed in the second groove.

[0015] In some possible embodiments, an adhesive layer is formed between the top cover and the side panels; and the top cover is bonded to the side panels via the adhesive layer.

[0016] In some possible embodiments, a welding layer is formed between the side plate and the base plate; and the side plate is connected to the base plate through the welding layer.

[0017] In some possible embodiments, the side panels are made of hard material.

[0018] In some possible embodiments, the packaging structure further includes a dielectric liquid;

[0019] The dielectric liquid is used to fill the accommodating cavity, so that the external pressure is transmitted to the at least one sensor module through the dielectric liquid.

[0020] In some possible embodiments, the packaging structure further includes an injection hole; the injection hole is provided on the substrate; and the injection hole is used to fill the receiving cavity with a dielectric liquid.

[0021] In some possible embodiments, the packaging structure further includes a sealing material matching the injection hole; the sealing material is used to fill the injection hole so that the accommodating cavity is in a sealed state.

[0022] According to a second aspect of the present disclosure, a sensor is provided, comprising the packaging structure described in any one of the above embodiments.

[0023] The implementation of this utility model has the following beneficial effects:

[0024] In the present invention, the packaging structure of the sensor includes a top cover, a side panel, and a substrate. The top cover is bonded to the outer side of the side panel, and the side panel is arranged on one side of the substrate, thereby forming a closed accommodating cavity, which can improve the sealing performance of the sensor packaging structure. A first groove is provided on the side panel, and a first protrusion is correspondingly provided on the top cover, which can improve the firmness of the connection between the side panel and the top cover. In addition, the top cover is also formed with a second groove for accommodating a fixing ring. The secondary fixation of the fixing ring further improves the firmness of the connection between the side panel and the top cover. At the same time, since the top cover made of flexible material has good deformation ability, it can effectively improve the perception of external pressure, thereby improving the sensitivity of the sensor. Compared with the existing technology, the method of using a flexible top cover to bond the side panel can reduce the metal welding steps for fixing the top cover and the side panel during the packaging process of the sensor packaging structure, thereby simplifying the manufacturing process and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the present invention, the following will briefly introduce the drawings required for use in the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A cross-sectional view of a sensor packaging structure provided by an embodiment of the present utility model;

[0027] Figure 2 A partially enlarged cross-sectional view of a sensor packaging structure provided by an embodiment of the present utility model;

[0028] Figure 3 A top view of a sensor packaging structure provided by an embodiment of the present utility model;

[0029] Figure 4 A cross-sectional view of another sensor packaging structure provided by an embodiment of the present utility model;

[0030] Figure 5 A top view of another sensor packaging structure provided by an embodiment of the present utility model.

[0031] Among them, the above-mentioned figure marks correspond to: 100-side plate, 110-inner wall, 120-outer wall, 130-first groove, 200-top cover, 210-cover body, 220-extension part, 230-first protrusion, 240-second groove, 300-substrate, 310-welding layer, 400-accommodating cavity, 410-medium liquid, 500-fixing ring, 600-adhesive layer, 700-sensor module, 800-injection hole, 810-sealing material. DETAILED DESCRIPTION

[0032] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this utility model.

[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0034] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0035] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0036] The term "and / or" herein simply describes an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent the existence of three situations: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0037] In addition, numerous specific details are provided in the following detailed description to better illustrate the present disclosure. Those skilled in the art will appreciate that the present disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0038] Example 1

[0039] Figure 1 A cross-sectional view of a sensor packaging structure provided by an embodiment of the present utility model; Figure 2 A partially enlarged cross-sectional view of a sensor packaging structure provided by an embodiment of the present utility model; Figure 3 FIG. 1 shows a top view of a sensor packaging structure provided by an embodiment of the present invention; FIG. Figure 1-3 As shown, a packaging structure of a sensor includes:

[0040] Side panels 100, top cover 200, and base plate 300;

[0041] In a specific embodiment, the packaging structure of the sensor can be a packaging structure of a dielectric-isolated sensor, the substrate 300 can be a circuit board such as a ceramic circuit board, a printed circuit board, etc., and an electrical connection line (not shown in the drawings) can be provided inside the substrate 300 to realize electrical connection between the sensor and the outside.

[0042] The side plate 100 has an outer side wall 120 facing away from the accommodating cavity 400 , and a first groove 130 is formed on the outer side wall 120 ; the side plate 100 is made of a hard material;

[0043] A first groove 130 is provided on the outer side wall 120 of the side plate 100. Figure 1 or Figure 2 As shown, the groove is marked by a rectangular dotted frame in the figure, and a first groove 130 is provided on the outer side of the side plate 100. It should be noted that the position of the rectangular dotted frame corresponding to the first groove 130 does not represent the actual depth of the groove, but is used to mark the structure and facilitate the description of the structure position.

[0044] Regarding the selection of the side panel material, the side panel 100 is made of a hard material, and a hard material such as metal, hard plastic, etc. can be selected to play a supporting role for the sensor structure.

[0045] In addition, regarding the definition of the inner side and the outer side in the present invention, Figure 1 As shown, for a structure such as the side plate 100, the side used to cooperate with other structures to form the accommodating cavity 400 of the sensor is the inner side, and correspondingly, the side away from the accommodating cavity 400 is the outer side, that is, the side of the side plate 100 that forms the accommodating cavity 400 is the inner wall, and the side where the first groove 130 is recessed is the outer wall 120.

[0046] The top cover 200 includes a cover body 210 and an extension portion 220 ; the extension portion 220 and the cover body 210 are an integrally formed structure, and the extension portion 220 and the cover body 210 are made of a flexible material;

[0047] In order to improve the structural sealing of the sensor and the matching degree between structures, the cover body 210 and the extension part 220 included in the top cover 200 are set to be an integrally molded structure; as for the material of the top cover 200, any material with good deformation ability can be selected, such as a flexible material. In this embodiment, the material of the top cover 200 is preferably rubber; compared with the use of hard materials such as metal or hard plastic to make the top cover in the prior art, flexible materials have lower costs, better deformation ability and simpler manufacturing processes; when the sensor is subjected to pressure, the cover body 210 is concave inward, and returns to its original shape when the pressure is removed. Therefore, using flexible materials to make the top cover can improve the sensitivity of the sensor, and thus improve the measurement accuracy of the sensor.

[0048] The cover body 210 is arranged on the top of the accommodating cavity 400, one end of the extension portion 220 is connected to the cover body 210, and the other end extends toward the base plate 300; at least a portion of the extension portion 220 is arranged around the outer periphery of the side plate 100, and a first protrusion 230 is formed on the wall surface facing the outer side wall 120, and the first protrusion 230 is embedded in the first groove 130.

[0049] The distance from the top of the side panel 100 to the base plate 300 is greater than the distance from the cover 210 to the base plate 300 ; one end of the extension portion 220 at least partially covers the inner side wall 110 of the side panel 100 and is connected to one end of the cover 210 .

[0050] The cover 210 is provided to cover the top of the accommodating cavity 400, and one end of the extension portion 220 is connected to the cover 210, that is, one end of the extension portion 220 at least partially extends into the inner side wall 110 of the side plate 100 and is connected to one end of the cover 210, and the other end of the extension portion 220 extends toward the base plate 300, and at least a portion is disposed around the outer side wall 120 of the side plate 100 to cover a portion of the outer side wall 120, such as Figure 1 As shown, the covering length of the extension portion 220 on the outer wall 120 is less than the distance from the top of the side panel 100 to the base plate 300, and the covering length of the extension portion 220 on the inner wall 110 is also less than the distance from the top of the side panel 100 to the base plate 300, thereby increasing the contact area between the side panel 100 and the top cover 200, and improving the sealing and the firmness of the connection between the structures.

[0051] The extension 220 has a first protrusion 230 on the surface facing the outer wall 120 that mates with the first groove 130. The first protrusion 230 is embedded in the first groove 130, thereby connecting the top cover 200 to the side panel 100 and covering the outer side of the side panel 100. This reduces the impact of gaps in the structural connection on sealing performance. Furthermore, a certain gap is provided between the other end of the extension 220 and the base plate 300. This ensures structural sealing while reducing the number of manufacturing steps required to securely connect the top cover 200 and base plate 300, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0052] The top cover 200 is connected to the top of the side panel 100 , and the base plate 300 is connected to the bottom of the side panel 100 . The side panel 100 , the top cover 200 and the base plate 300 are arranged to form a receiving cavity 400 ; at least one sensor module 700 is provided inside the receiving cavity 400 .

[0053] The connection between the top cover 200 and the top of the side panel 100 can be: covering the top of the accommodating cavity 400 through the cover body 210, and covering at least a portion of the outer wall 120 and at least a portion of the inner wall through the extension portion 220; specifically, an adhesive layer 600 is formed between the top cover 200 and the side panel 100; the top cover 200 is bonded to the side panel 100 through the adhesive layer 600.

[0054] As for the connection method between the top cover 200 and the side panel 100, any method with good connection firmness and easy to achieve connection between materials can be selected for fixing. It is preferred to use bonding to seal the top cover 200 to the outside of the side panel 100; wherein, an adhesive layer 600 is formed at the position where the side panel 100 has a contact area with the cover body 210 and the extension part 220. The material forming the adhesive layer 600 can be an adhesive with good sealing effect and not easy to age, such as glue.

[0055] In the process of bonding the top cover 200 to the side panel 100, in order to improve the bonding strength between the side panel 100 and the top cover 200, the first protrusion 230 can be embedded in the first groove 130, and the groove and the protrusion are arranged to cooperate with each other to achieve the embedding and fixation of the two, which can further improve the bonding strength between the structures; in addition, compared with directly bonding the top cover 200 to the top of the side panel 100, the top cover 200 covers a part of the inner side of the bonding side panel 100, which increases the bonding area between the top cover 200 and the side panel 100, and can also improve the bonding strength between the structures.

[0056] Furthermore, the connection between the base plate 300 and the bottom of the side plate 100 may be: a welding layer 310 is formed between the side plate 100 and the base plate 300 , and the side plate 100 is connected to the base plate 300 through the welding layer 310 .

[0057] In order to improve the sealing performance of the sensor packaging structure, welding is selected to achieve a fixed sealing connection between the side plate 100 and the base plate 300, such as Figure 1 As shown, a welding layer 310 is formed between the bottom of the side plate 100 and the substrate 300; the side plate and the substrate are fixedly connected by welding, which can ensure the sealing performance of the sensor structure and prevent the medium liquid 410 stored in the accommodating cavity 400 from leaking, thereby improving the reliability and safety of the sensor.

[0058] Through the above connection, the top cover 200 and the base plate 300 respectively cover the two ends of the accommodating cavity 400 to form the accommodating cavity 400. Figure 1 As shown in the dotted rectangular frame, it can be seen that the accommodating cavity 400 becomes the accommodating cavity 400 after being covered by the top cover 200 and the substrate 300; the accommodating cavity 400 is set as a sealed structure for accommodating part of the packaging structure of the sensor, such as the medium liquid 410, the sensor module 700, etc. It should be noted that the accommodating cavity 400 is Figure 1 The position of the corresponding rectangular dotted box does not represent the actual position and volume of the accommodating cavity 400. The setting of the rectangular dotted box is to mark the structure and facilitate the description of the structure; the accommodating cavity 400 is composed of the inner surface of the top cover 200, the inner surface of the side plate 100 and the inner surface of the base plate 300, and its volume is related to the size and position settings of the top cover 200, the side plate 100 and the base plate 300.

[0059] In addition, the sensor packaging structure may further include: a dielectric liquid 410 and at least one sensor module 700;

[0060] The dielectric liquid 410 is used to fill the accommodating cavity 400 , so that external pressure is transmitted to the sensor module 700 through the dielectric liquid 410 .

[0061] The packaging structure of the sensor also includes a sensor module 700 for measuring changes in external pressure, and a dielectric liquid 410 for transmitting external pressure to the sensor module 700; when external pressure is applied to the sensor, the external pressure causes the top cover 200 to deform, and then transmits the external pressure to the sensor module 700 through the dielectric liquid 410.

[0062] At least one sensor module 700 is disposed within the accommodating cavity 400 and on a side surface of the substrate 300, so that the dielectric liquid 410 stored within the accommodating cavity 400 can transmit external pressure to the sensor module 700. The sensor module 700 is disposed on a side surface of the substrate 300 and can be electrically connected to the electrical connection circuitry disposed within the substrate 300 to achieve signal transmission. The connection method between the sensor module 700 and the electrical connection circuitry within the substrate 300 is not limited. Furthermore, the number of sensor modules 700 can be one or more, and this number can be adjusted based on specific application requirements.

[0063] For the dielectric liquid 410, a liquid with chemical stability, corrosion resistance, thermal stability and good fluidity can be selected. By preferably having non-toxic and harmless properties, the accuracy and reliability of the sensor packaging structure measurement can be ensured. In this embodiment, the dielectric liquid 410 can be silicone oil.

[0064] The filling amount of the dielectric liquid 410 can be less than or equal to the volume of the accommodating cavity 400. During the manufacturing process of the sensor packaging structure, the optimal filling amount can be calculated based on different actual application needs, combined with factors such as the sensor structure, measurement principle and working environment. As a specific implementation method, the accommodating cavity 400 can be filled with the dielectric liquid 410, and at this time, the filling volume of the dielectric liquid 410 is equal to the volume of the accommodating cavity 400.

[0065] In addition, the filling of the dielectric liquid 410 into the accommodating cavity 400 can be achieved by providing an injection hole for filling the dielectric liquid 410 into the accommodating cavity 400. Specifically, the packaging structure further includes an injection hole 800 and a sealing material 810 matching the injection hole 800.

[0066] The injection hole 800 is provided on the substrate 300 ; the injection hole 800 is used to fill the medium liquid 410 into the accommodating cavity 400 ; the sealing material 810 is used to fill the injection hole 800 , so that the accommodating cavity 400 is in a sealed state.

[0067] Specifically, an opening penetrating the substrate is provided on the substrate 300 as an injection hole 800, and the injection hole 800 is connected to the accommodating cavity 400; a sealed accommodating cavity 400 is formed between the side panel 100, the top cover 200 and the substrate 300, and a sensor module connected to the substrate 300 is provided inside the accommodating cavity 400. At this time, it can be considered that the structural packaging of the sensor is completed, and the medium liquid 410 can be injected into the accommodating cavity 400 through the injection hole 800. After the injection is completed, the accommodating cavity 400 is sealed again with the sealing material 810.

[0068] In addition, there is no specific limitation on the position and width of the injection hole 800 on the substrate 300, and it can be determined according to the overall structure and functional requirements of the sensor packaging structure; for example, in order to ensure that the dielectric liquid can be evenly distributed inside the sensor, the injection hole 800 should be set at a position that allows the liquid to flow smoothly into the sensor and is not prone to forming dead corners, and the position of the injection hole 800 should also take into account the installation method and use environment of the sensor to ensure that it will not be interfered with or affected by external factors when injecting the dielectric liquid.

[0069] like Figure 1 As shown, the injection hole 800 is provided on the substrate 300 and is marked by an oval rectangular frame. The position and size of the oval rectangular frame do not represent the actual position and size of the injection hole 800, but are used to mark the structure and facilitate the description of the position of the structure.

[0070] The material, shape, and size of sealing material 810 must match the injection hole 800. This is determined based on the width of injection hole 800, the pressure and pressure of dielectric liquid 410, and the overall structure of the sensor package. This reduces the risk of poor sealing performance or leakage of dielectric liquid 410 due to structural mismatch. Sealing material 810 can be made of materials such as solder paste and glue, or it can be a removable structure such as a sealing ring or a combined seal.

[0071] On the basis of the above, the packaging structure of the sensor may also include:

[0072] The packaging structure further includes a fixing ring 500 . A second groove 240 is defined on a wall surface of the extension portion 220 facing away from the outer wall 120 . The fixing ring 500 is disposed in the second groove 240 .

[0073] The extension portion 220 of the top cover 200 is provided with a second groove 240 for accommodating the fixing ring 500. The second groove is opened on the wall away from the outer wall, such as Figure 1 and Figure 2 As shown, the second groove 240 is shown in the rectangular dotted frame. Figure 1 The position of the second groove 240 can correspond to the first groove 130 and the first protrusion 230, so that the fixing ring 500 can perform secondary reinforcement on the fitting position of the top cover 200 and the side plate 100; the position of the second groove 240 can also be not set at Figure 1 or Figure 2 The position shown in FIG. 2 does not limit the position of the second groove 240 in this embodiment. It should be noted that the position of the dotted rectangular box corresponding to any groove does not represent the actual depth of the groove, but is used to mark the structure and facilitate the description of the structural position. There is no specific limitation on the position and depth of any groove.

[0074] To further strengthen the connection between the top cover 200 and the side panel 100, thereby enhancing the sealing of the sensor structure, a retaining ring 500 is disposed within the second groove 240. This retaining ring 500 acts as a secondary reinforcement. The retaining ring 500 further enhances the bond between the top cover 200 and the side panel 100, ensuring the structural stability of the sensor. The retaining ring 500 can be any device that does not damage the structure being secured and provides reinforcement, preferably a ring-shaped snap fastener.

[0075] Example 2

[0076] In another embodiment, the packaging structure of the sensor may not include the fixing ring 500; Figure 4 A cross-sectional view of another sensor packaging structure provided by an embodiment of the present utility model, Figure 5 A top view of another sensor packaging structure provided by an embodiment of the present invention, such as Figure 4 and Figure 5 As shown, the packaging structure includes:

[0077] Side panels 100, top cover 200, and base plate 300;

[0078] The top cover 200 is connected to the top of the side plate 100, and the base plate 300 is connected to the bottom of the side plate 100. The side plate 100, the top cover 200, and the base plate 300 enclose a receiving cavity 400; at least one sensor module 700 is disposed inside the receiving cavity 400;

[0079] The side plate 100 has an outer side wall 120 facing away from the accommodating cavity 400 , and a first groove 130 is formed on the outer side wall 120 ;

[0080] The top cover 200 includes a cover body 210 and an extension portion 220; the cover body 210 is covered on the top of the accommodating cavity 400, one end of the extension portion 220 is connected to the cover body 210, and the other end extends toward the base plate 300; at least a portion of the extension portion 220 is surrounded by the outer periphery of the side plate 100, and a first protrusion 230 is provided on the wall surface facing the outer side wall 120, and the first protrusion 230 is embedded in the first groove 130.

[0081] An adhesive layer 600 is formed between the top cover 200 and the side panel 100; the top cover 200 is bonded to the side panel 100 via the adhesive layer 600;

[0082] The connection between the base plate 300 and the bottom of the side plate 100 may be: a welding layer 310 is formed between the side plate 100 and the base plate 300, and the side plate 100 is connected to the base plate 300 through the welding layer 310;

[0083] The side panel 100 is made of a hard material; and the extension portion 220 and the cover body 210 are an integrally formed structure, and the extension portion 220 and the cover body 210 are made of a flexible material.

[0084] In addition, the sensor packaging structure may further include: a dielectric liquid 410 and at least one sensor module 700;

[0085] The dielectric liquid 410 is used to fill the accommodating cavity 400 , so that external pressure is transmitted to the sensor module 700 through the dielectric liquid 410 .

[0086] The structure, material, and function of the side panel 100, base plate 300, accommodating cavity 400, adhesive layer 600, and sensor module 700 are the same as those in the first embodiment and are not described in detail here. The top cover 200 is still constructed of a flexible, one-piece molded structure. Since a retaining ring is not required, the top cover 200 includes a first protrusion 230 that mates with the first groove 130, but does not include a second groove 240 for receiving the retaining ring.

[0087] The packaging structure described in Example 2 generally maintains the stability and reliability of the sensor structure without the need for a retaining ring for secondary reinforcement, and can also improve the sensor's sealing, sensitivity, and measurement accuracy. Compared to the use of a retaining ring, this approach provides a certain degree of secure bonding between the top cover and the side panels while reducing the sensor's manufacturing cost.

[0088] The present utility model also discloses a sensor, which may be a medium-isolated pressure sensor. The sensor may include the packaging structure disclosed in any of the above embodiments.

[0089] According to the embodiments provided by the above-mentioned utility model, it can be seen that the packaging structure of the sensor includes a top cover, a side plate and a substrate; the top cover is an integrally formed structure, the top cover is bonded to the outer side of the side plate, and the side plate is arranged on one side of the substrate, thereby forming a closed accommodating cavity, which can improve the sealing performance of the sensor packaging structure; a first groove is provided on the side plate, and a first protrusion is correspondingly provided on the top cover, which can improve the firmness of the connection between the side plate and the top cover; in addition, the top cover is also provided with a second groove for accommodating a fixing ring, and the firmness of the connection between the side plate and the top cover is further improved through the secondary fixation of the fixing ring; at the same time, since the top cover made of flexible material has good deformation ability, it can effectively improve the perception ability of external pressure, thereby improving the sensitivity of the sensor; compared with the existing technology, the method of using a flexible top cover to bond the side plate can reduce the metal welding steps for fixing the top cover and the side plate during the packaging process of the sensor packaging structure, thereby simplifying the manufacturing process and reducing production costs.

[0090] It should be noted that the various embodiments of the present disclosure have been described above. The above description is illustrative and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles, practical applications, or technical improvements to the market of the various embodiments, or to enable other persons skilled in the art to understand the various embodiments disclosed herein.

Claims

1. A packaging structure of a sensor, characterized in that: The packaging structure includes: Side panels (100), a top cover (200), and a base plate (300); The top cover (200) is connected to the top of the side plate (100), the base plate (300) is connected to the bottom of the side plate (100), and the side plate (100), the top cover (200) and the base plate (300) are arranged to form a receiving cavity (400); at least one sensor module (700) is arranged inside the receiving cavity (400); The side plate (100) has an outer side wall (120) facing away from the accommodating cavity (400), and a first groove (130) is concavely provided on the outer side wall (120); The top cover (200) includes a cover body (210) and an extension portion (220); the cover body (210) is arranged on the top of the accommodating cavity, one end of the extension portion (220) is connected to the cover body (210), and the other end extends toward the base plate (300); at least a portion of the extension portion (220) is arranged around the outer periphery of the side plate (100), and a first protrusion (230) is formed on the wall surface thereof facing the outer side wall (120), and the first protrusion (230) is embedded in the first groove (130).

2. The packaging structure of a sensor according to claim 1, characterized in that: The distance from the top of the side plate (100) to the base plate (300) is greater than the distance from the cover (210) to the base plate (300); One end of the extension portion (220) at least partially covers the inner side wall (110) of the side plate (100) and is connected to one end of the cover body (210).

3. The packaging structure of a sensor according to claim 1, characterized in that: The extension portion (220) and the cover body (210) are an integrally formed structure; The cover (210) and the extension portion (220) are made of flexible material.

4. The packaging structure of a sensor according to claim 1, characterized in that: The packaging structure further includes a fixing ring (500); A second groove (240) is formed on the wall surface of the extension portion (220) facing away from the outer side wall (120); and the fixing ring (500) is arranged in the second groove (240).

5. The packaging structure of a sensor according to claim 1, characterized in that: An adhesive layer (600) is formed between the top cover (200) and the side plate (100); The top cover (200) is bonded to the side panel (100) via the bonding layer (600).

6. The packaging structure of a sensor according to claim 1, characterized in that: A welding layer (310) is formed between the side plate (100) and the base plate (300); The side plate (100) is connected to the base plate (300) via the welding layer (310).

7. The packaging structure of a sensor according to claim 1, characterized in that: The side plate (100) is made of a hard material.

8. The packaging structure of a sensor according to claim 1, characterized in that: The packaging structure further includes a dielectric liquid (410); The dielectric liquid (410) is used to fill the accommodating cavity (400), so that external pressure is transmitted to the at least one sensor module (700) through the dielectric liquid (410).

9. The packaging structure of a sensor according to claim 1, characterized in that: The packaging structure further includes an injection hole (800); The injection hole (800) is provided on the substrate (300); the injection hole (800) is used to fill the medium liquid (410) into the accommodating cavity (400).

10. The packaging structure of a sensor according to claim 9, characterized in that: The packaging structure further includes a sealing material (810) matching the injection hole (800); The sealing material (810) is used to fill the injection hole (800) so that the accommodating cavity (400) is in a sealed state.

11. A sensor, characterized in that: The sensor comprises the packaging structure according to any one of claims 1 to 10.

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