One-main multi-sub type multichannel stress monitoring device

Abstract

The embodiment of the utility model relates to a one-main multi-sub type multichannel stress monitoring device. The device comprises a sensor assembly, an analog data acquisition and conversion assembly, a data storage control assembly and a power supply management and maintenance assembly, the sensor assembly is electrically connected with the analog data acquisition and conversion assembly, the analog data acquisition and conversion assembly is electrically connected with the data storage control assembly, and the data storage control assembly is electrically connected with the power supply management and maintenance assembly. Wherein the analog data acquisition and conversion assembly comprises a plurality of strain sub-modules, the data storage control assembly comprises a strain main module, the strain main module is connected with the plurality of strain sub-modules, and the strain sub-modules are connected with the sensor assembly. According to the one-main multi-sub-type multichannel stress monitoring device, each strain sub-module of the device can monitor electric signals of a plurality of strain gauges at the same time, when the number of test points is large, one main module can be connected with a plurality of sub-main modules, signals of a plurality of test points are tested, the number of connecting wire harnesses is small, and the anti-interference capability is high.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the technical field of stress and strain testing of structures, and in particular to a one-master-multiple-sub-type multi-channel stress monitoring device. Background Art

[0002] Currently, most stress data acquisition devices utilize a centralized design. Stress monitoring on a large structure often requires simultaneous monitoring of hundreds of points, all connected to a single data acquisition device. Some of these test points require long cables connecting them to the acquisition device. This long transmission distance can lead to significant signal attenuation and interference, compromising monitoring effectiveness.

[0003] Existing technologies for stress data monitoring and acquisition have been found: The patented "A Long-term Monitoring and Alarm System for Hull Structure Stress" features a simple data acquisition and transmission structure, with no relay process between the measured point and the data acquisition and storage unit. This makes the analog signal susceptible to interference and results in poor data accuracy during long-distance testing. The patented "A Multi-channel Integrated System and Method for Online Temperature and Stress-Strain Measurement" has a relatively fixed system configuration: the entire system is divided into four independent parts, all of which must be integrated into a single unit for operation, and each independent part cannot be operated or used independently. Furthermore, the front-end stress data acquisition device lacks multi-channel analog data acquisition capabilities. Utility Model Content

[0004] In order to avoid the shortcomings of the existing technology, the utility model provides a main-multiple-sub-type multi-channel stress monitoring device to solve the technical problems in the existing technology that there is no relay process between the measured point and the data acquisition and storage unit, which makes the analog signal easily interfered with and the data accuracy is poor during long-distance testing; and the existing stress monitoring device has a fixed usage form. For example, the entire device is divided into four independent parts, and all independent parts need to be assembled into a whole to work, and each independent part cannot be operated or used separately. At the same time, the stress data acquisition device at the front end does not have a multi-channel analog data acquisition function.

[0005] According to an embodiment of the present disclosure, a main-multiple-sub-type multi-channel stress monitoring device is provided, which includes: a sensor component, an analog data acquisition and conversion component, a data storage control component and a power supply management and maintenance component. The sensor component is electrically connected to the analog data acquisition and conversion component, the analog data acquisition and conversion component is electrically connected to the data storage control component, and the data storage control component is electrically connected to the power supply management and maintenance component. The analog data acquisition and conversion component includes several strain sub-modules, the data storage control component includes a strain main module, the strain main module is connected to several strain sub-modules, and the strain sub-module is connected to the sensor component.

[0006] Optionally, the power supply management and maintenance component includes a power supply and a host computer.

[0007] Optionally, the strain main module includes: a power failure detection and protection unit, a power distribution unit, a data processing and operation unit, a data storage unit, a communication unit, a main module interface, a power supply interface and a configuration interface. The power failure detection and protection unit and the power distribution unit are connected to the power supply interface, the power distribution module is connected to the main module interface, the data processing and operation unit is connected to the main module interface, the data processing and operation unit is connected to the data storage unit, the configuration interface is connected to the communication unit, the power supply interface is connected to the power supply, and the configuration interface is connected to the host computer.

[0008] Optionally, the host computer is a computer, and the computer and the configuration interface are connected via RJ45.

[0009] Optionally, each strain submodule includes: a strain sensor interface, a signal acquisition unit, an AD conversion unit, a microprocessor unit and a submodule interface, the strain sensor interface is connected to the signal acquisition unit, the signal acquisition unit is connected to the AD conversion unit, the signal acquisition unit and the AD conversion unit are connected to the microprocessor unit, the microprocessor unit is connected to the submodule interface, and the submodule interface is connected to the main module interface, wherein the strain sensor interface in each strain submodule has a maximum of 8 channels, each channel is connected to a strain gauge, and the sensor component and the analog data acquisition and conversion component interact through the strain sensor interface.

[0010] Optionally, the main module interface and the submodule interface are connected via an RS422 standard interface.

[0011] Optionally, the sensor assembly includes multiple strain gauges of different specifications, and each strain gauge can collect stress data within a corresponding range.

[0012] Optionally, any strain gauge is installed in any channel of the strain sensor interface.

[0013] Optionally, the analog data acquisition and conversion component includes at most 8 strain submodules.

[0014] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0015] In the embodiments of the present disclosure, through the above-mentioned one-master-multiple-sub-type multi-channel stress monitoring device, on the one hand, the device is highly practical and flexible in use, and is suitable for various stress monitoring occasions. The user can arrange the device and test points according to actual conditions. When there are few test points, only one strain sub-module is used, and the strain main module is not required; when there are many test points, the main and sub-modules can be built into a star-shaped stress data acquisition structure for large-scale structural stress and strain monitoring. On the other hand, the device has strong anti-interference ability and fewer connecting wires. The analog signal of the front-end strain sensor is connected to the strain sub-module nearby, thereby reducing the risk of radiation interference of the analog signal in the transmission line. Each strain sub-module can be connected to multiple strain sensors at the same time, thereby monitoring the analog signals of multi-channel stress, and after collecting the analog signals of the multi-channel, it is aggregated into a serial signal for transmission to the subsequent stage. This method reduces the complexity of the cable while also significantly enhancing the anti-interference ability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0017] Figure 1 A schematic diagram showing a one-master-multiple-sub-type multi-channel stress monitoring device in an exemplary embodiment of the present disclosure is shown;

[0018] Figure 2 A schematic diagram of the data acquisition structure of an independent strain submodule in an exemplary embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0019] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0020] In addition, the accompanying drawings are merely schematic illustrations of embodiments of the present disclosure and are not necessarily drawn to scale. Like reference numerals in the figures represent like or similar parts, and thus repeated descriptions thereof will be omitted. Some of the blocks shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically separate entities.

[0021] This exemplary embodiment first provides a multi-channel stress monitoring device with multiple sub-modules. Figure 1 As shown in , the one-main-multiple-sub-type multi-channel stress monitoring device may include:

[0022] A sensor component, an analog data acquisition and conversion component, a data storage control component and a power supply management and maintenance component. The sensor component is electrically connected to the analog data acquisition and conversion component, the analog data acquisition and conversion component is electrically connected to the data storage control component, and the data storage control component is electrically connected to the power supply management and maintenance component. The analog data acquisition and conversion component includes several strain sub-modules, the data storage control component includes a strain main module, one strain main module is connected to several strain sub-modules, and the strain sub-module is connected to the sensor component.

[0023] Specifically, such as Figure 1 As shown, the power supply management and maintenance component supplies power to the data storage control component and transmits acquisition instructions through the network port. The data storage control component communicates and supplies power to the analog data acquisition and conversion component. The analog data acquisition and conversion component collects the analog signal of the stress data of the strain gauge in the sensor component. The sensor component sends the analog signal of the stress data of the strain gauge to the analog data acquisition and conversion component. The analog data acquisition and conversion component includes several strain sub-modules. The data storage control component includes a strain main module. The strain main module is connected to several strain sub-modules, and the strain sub-module is connected to the sensor component.

[0024] Below, we will refer to Figure 1 The various parts of the above-mentioned one-main-multiple-sub-type multi-channel stress monitoring device in this exemplary embodiment are described in more detail.

[0025] In one embodiment, the power supply management and maintenance component includes a power supply and a host computer.

[0026] Specifically, the power supply management and maintenance component consists of two parts: a power supply and a host computer. The power supply adopts a dual DC power output of 12V and 110V; the host computer uses a computer with Windows operating system as a software carrier; it also has network communication function, and is connected to the configuration interface of the main module through RJ45, and uses the UDP protocol for data interaction.

[0027] In one embodiment, the strain main module includes: a power failure detection and protection unit, a power distribution unit, a data processing and operation unit, a data storage unit, a communication unit, a main module interface, a power supply interface and a configuration interface. The power failure detection and protection unit and the power distribution unit are connected to the power supply interface, the power distribution module is connected to the main module interface, the data processing and operation unit is connected to the main module interface, the data processing and operation unit is connected to the data storage unit, the configuration interface is connected to the communication unit, the power supply interface is connected to the power supply, and the configuration interface is connected to the host computer.

[0028] Specifically, the strain master module supplies power to the strain submodule. The strain master module can automatically complete the power on and off and data acquisition control of the strain submodule according to the configuration file, receive and store the stress data transmitted by the strain submodule, and cooperate with and accept remote communication control from the host computer.

[0029] The power-off monitoring and protection unit is used to monitor power-off events at the power supply interface. When the strain master module recognizes the event, it immediately stops the power supply to some power-consuming components, writes the cached data to the data storage unit (non-volatile memory), and then protects the data files, prohibiting file read and write operations to prevent the system file structure from being damaged, and waits for the system to complete power-off.

[0030] The power distribution unit is used to distribute power to the eight strain sub-modules. The strain main module controls the corresponding strain sub-modules to power on according to the configuration file.

[0031] The data processing unit is used to receive the stress data uploaded by the strain submodule, filter and convert the data into numerical values, and write the processed data into the data storage unit.

[0032] The data storage unit is mainly used to store the stress data collected by the strain submodule.

[0033] The communication unit is mainly used to realize data transmission and control interaction functions with the strain gauge module and the host computer. The communication method between the communication unit and the strain gauge module is serial communication, and the communication method between the communication unit and the host computer is network communication.

[0034] The strain master module interface can provide power and communication for the connected strain submodules. The power supply voltage is 12V, the communication method adopts RS422, and the communication rate is 1.5Mbps.

[0035] The power supply interface is used to receive energy from the power input, supports a power supply voltage input range of 12V to 110V, and supports dual power supply.

[0036] In one embodiment, the host computer is a computer, and the computer is connected to the configuration interface via RJ45.

[0037] In one embodiment, each strain submodule includes: a strain sensor interface, a signal acquisition unit, an AD conversion unit, a microprocessor unit and a submodule interface. The strain sensor interface is connected to the signal acquisition unit, the signal acquisition unit is connected to the AD conversion unit, the signal acquisition unit and the AD conversion unit are connected to the microprocessor unit, the microprocessor unit is connected to the submodule interface, and the submodule interface is connected to the main module interface. The strain sensor interface in each strain submodule has a maximum of 8 channels, each channel is connected to a strain gauge, and the sensor component interacts with the analog data acquisition and conversion component through the strain sensor interface.

[0038] Specifically, the analog data acquisition and conversion component includes up to eight strain gauge submodules. Each strain gauge submodule consists of a signal acquisition unit, an A / D converter unit, and a microprocessor unit. Data acquisition and signal conversion in the strain gauge submodules rely on communication command encoding and control from the strain gauge master module, and the strain gauge master module provides power for proper operation. The strain gauge submodules begin collecting data from the strain gauge sensor by receiving a data acquisition start command from the strain gauge master module. The analog stress signal collected by the strain gauge is amplified and modulated by the signal acquisition unit. The A / D converter unit converts the analog signal into a digital signal, which is read by the microprocessor unit, packaged, and sent to the strain gauge master module for storage via the submodule interface.

[0039] In one embodiment, the main module interface and the submodule interface are connected via an RS422 standard interface.

[0040] In one embodiment, the sensor assembly includes a plurality of strain gauges of different specifications, and each strain gauge is capable of collecting stress data within a corresponding range.

[0041] Specifically, the sensor assembly uses 120Ω and 350Ω strain gauges to monitor stress at test points. Different gauges can collect stress data in different ranges. Each submodule can simultaneously collect and monitor stress data from eight strain gauges.

[0042] In one embodiment, any one strain gauge is installed in any one channel of the strain sensor interface.

[0043] Specifically, the sensor assembly includes multiple strain gauges, which are used to collect stress changes at the test point and convert the physical signals related to the stress at the test point into electrical signals (analog signals), which are directly transmitted to the strain sub-module installed nearby. The strain sensor includes up to 8 channels.

[0044] In one embodiment, the analog data acquisition and conversion component includes at most 8 strain submodules.

[0045] In another specific embodiment, Figure 2 The following is a schematic diagram of the data acquisition structure of an independent strain submodule. When the collected data is small and the required strain sensor interface is less than or equal to 8 channels, a single strain submodule can be used to complete the data acquisition, such as Figure 2 As shown in Figure 2. The connection between the sensor component and the strain submodule is the same as Figure 1 Compared to remain unchanged, while Figure 1The data storage control component is removed from the device, and the power supply in the power management and maintenance component directly provides power to the strain sub-module, and the host computer directly communicates with the strain sub-module. At this time, the strain sub-module sends data directly to the host computer for storage.

[0046] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like in the above description indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0047] In the embodiments of the present disclosure, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," and the like should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present disclosure based on specific circumstances.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0049] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A multi-channel stress monitoring device with one main unit and multiple sub-units, characterized in that: The device includes: A sensor component, an analog data acquisition and conversion component, a data storage control component and a power supply management and maintenance component. The sensor component is electrically connected to the analog data acquisition and conversion component, the analog data acquisition and conversion component is electrically connected to the data storage control component, and the data storage control component is electrically connected to the power supply management and maintenance component. The analog data acquisition and conversion component includes several strain sub-modules, the data storage control component includes a strain main module, one strain main module is connected to several strain sub-modules, and the strain sub-module is connected to the sensor component.

2. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 1, characterized in that: The power supply management and maintenance components include power supply and host computer.

3. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 2, characterized in that: The strain main module includes: a power-off detection and protection unit, a power distribution unit, a data processing and operation unit, a data storage unit, a communication unit, a main module interface, a power supply interface and a configuration interface. The power-off detection and protection unit and the power distribution unit are connected to the power supply interface, the power distribution module is connected to the main module interface, the data processing and operation unit is connected to the main module interface, the data processing and operation unit is connected to the data storage unit, the configuration interface is connected to the communication unit, the power supply interface is connected to the power supply, and the configuration interface is connected to the host computer.

4. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 3, characterized in that: The host computer is a computer, and the computer and the configuration interface are connected via RJ45.

5. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 3, characterized in that: Each strain submodule includes: a strain sensor interface, a signal acquisition unit, an AD conversion unit, a microprocessor unit and a submodule interface. The strain sensor interface is connected to the signal acquisition unit, the signal acquisition unit is connected to the AD conversion unit, the signal acquisition unit and the AD conversion unit are connected to the microprocessor unit, the microprocessor unit is connected to the submodule interface, and the submodule interface is connected to the main module interface. Among them, the strain sensor interface in each strain submodule has a maximum of 8 channels, each channel is connected to a strain gauge, and the sensor component and the analog data acquisition and conversion component interact through the strain sensor interface.

6. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 5, characterized in that: The main module interface and the submodule interface are connected via the RS422 standard interface.

7. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 5, characterized in that: The sensor assembly includes multiple strain gauges of different specifications, and each strain gauge can collect stress data within a corresponding range.

8. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 7, characterized in that: Any strain gauge can be installed in any channel of the strain sensor interface.

9. The one-main-multiple-sub-type multi-channel stress monitoring device according to claim 1, characterized in that: The analog data acquisition and conversion component includes up to 8 strain submodules.

Images