Efficient needle card testing device
By introducing a heat dissipation mechanism and a pick-and-place mechanism into the pin card test device, the problems of poor heat dissipation of the circuit board and low working efficiency are solved, efficient heat dissipation and fast wafer pick-and-place are achieved, and the service life and efficiency of the device are improved.
Patent Information
- Application Number
- CN202422542807.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-10-21
AI Technical Summary
The circuit board of the existing pin card test device has poor heat dissipation effect, resulting in damage due to excessive temperature, and low working efficiency.
The design of heat dissipation mechanism and pick-and-place mechanism is adopted, including the combination of heat dissipation slot, heat dissipation net, heat conduction plate and pick-and-place mechanism. The heat dissipation net is used for ventilation and cooling, the heat conduction plate is used for heat conduction, and the wave-shaped heat conduction plate is used to increase the heat dissipation area. The cooperation of hooks and hanging bolts can realize the rapid removal and placement of wafers.
The heat dissipation efficiency of the circuit board is improved, avoiding damage caused by excessive temperature, while also improving the rapid placement and testing efficiency of the wafer.
Smart Images
Figure CN223320429U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of pin card testing devices, in particular to a high-efficiency pin card testing device. Background Art
[0002] During the chip production process, testing methods are needed to ensure that the various functions of the chip meet the design requirements. Probe cards are needed for testing. The probe card is the interface between the automatic tester and the device under test. The probe card can be used to electrically connect the tester and the chip under test for testing.
[0003] When the pin card test device is in use, the circuit board will generate heat. However, the general pin card test device only conducts heat to the circuit board through the outer shell, and the heat dissipation effect is poor, which can easily cause the circuit board to be damaged due to excessive temperature when the pin card test device is in use; when the pin card test device is in use, the wafer to be tested must be positioned and placed first, and then the probe card must be positioned and placed above the wafer, which is relatively slow, thereby reducing the work efficiency when the pin card test device is in use. Utility Model Content
[0004] The purpose of the present invention is to provide an efficient pin card test device to solve the problems in the above background art that the circuit board is easily damaged due to over-high temperature when the pin card test device is used, as well as the low working efficiency.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an efficient pin card testing device, comprising an upper plate, a lower plate is arranged below the upper plate, the upper plate is rotatably connected to one side of the lower plate, a connecting plate is arranged inside the upper plate, a circuit board is installed inside the connecting plate, a probe seat is installed on the surface of the circuit board, a test probe is installed on the surface of the probe seat, a carrier is fixed on the surface of the lower plate, a wafer is placed inside the carrier, the wafer and the test probe cooperate with each other, a heat dissipation mechanism is arranged on the surface of the upper plate and the lower plate, the interior of the heat dissipation mechanism includes a heat dissipation groove, a heat dissipation net, a heat conduction plate and a heat conduction groove, a pick-up and place mechanism is arranged on the surface of the upper plate and the lower plate, and the pick-up and place mechanism is composed of an adjustment component, a hook and a hanging bolt.
[0006] Preferably, the surfaces of the upper plates are inlaid with heat dissipation meshes, and the surfaces of the connecting plates are provided with heat dissipation grooves at equal intervals.
[0007] Preferably, a heat conduction groove for accommodating a circuit board is opened inside the connecting plate, a heat conduction plate is fixed inside the heat conduction groove, the structure of the heat conduction plate is a wavy structure, the surface of the heat conduction plate is tightly fitted with the surface of the circuit board, and the heat conduction plate, circuit board and connecting plate are fixed by screws.
[0008] Preferably, a hook is rotatably connected at the center position of one side of the upper plate, a hanging bolt is fixed to one side of the lower plate, the hanging bolt and the hook are hooked and matched with each other, and an adjustment component is provided between the upper plate and the lower plate.
[0009] Preferably, the interior of the adjustment component includes a support spring, a receiving cavity and a slide groove. The interior of the upper plate is provided with a receiving cavity, and the receiving cavity is located on the outside of the lower plate. The inner walls of the receiving cavity are provided with slide grooves, and the slide grooves and the lower plate slide with each other.
[0010] Preferably, a support spring is fixed to the inner wall of the slide groove, and the support spring and the lower plate are slidably matched with each other. When the support spring is in a normal state, the test probe is away from the wafer.
[0011] Compared with the prior art, the beneficial effects of the present invention are: the high-efficiency pin card test device not only makes the circuit board less likely to be damaged due to excessive temperature, but also improves the working efficiency of the pin card test device when in use;
[0012] 1. By providing a heat dissipation mechanism, the circuit board can be ventilated and cooled under the action of the heat dissipation net. At the same time, the circuit board can be heat-dissipated under the action of the heat conduction plate. Since the heat conduction plate has a wavy structure, the heat dissipation area of the heat conduction plate can be increased, and the heat dissipation speed can be accelerated. The heat dissipation of the circuit board is further accelerated under the action of the heat dissipation groove, so as to realize the efficient heat dissipation function of the pin card test device and prevent the circuit board from being damaged due to excessive temperature.
[0013] 2. By setting up a pick-and-place mechanism, rotate the hook so that one end of the hook is away from the hanging bolt, and then rotate the upper plate to lift the upper plate, so that the upper plate drives the connecting plate to rotate synchronously. At this time, the support spring supports the connecting plate to keep the test probe away from the carrier, and then place the wafer to be tested inside the carrier, and then cover the upper plate, and fix the upper plate with the cooperation of the hook and the hanging bolt. Then the pin card test device can be connected to the test equipment, and the connecting plate is pressed by the driving structure to make the lower plate slide along the slide groove, driving the test probe to contact the wafer, and testing the wafer, so as to realize the function of quickly taking and placing wafers by the pin card test device, thereby improving the working efficiency when the pin card test device is used. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;
[0015] Figure 2 It is a side cross-sectional structural schematic diagram of the utility model;
[0016] Figure 3 This is an enlarged structural diagram of the heat dissipation mechanism of the present utility model;
[0017] Figure 4It is an enlarged structural diagram of the pick-and-place mechanism of the utility model.
[0018] In the figure: 1. Upper plate; 11. Lower plate; 12. Connecting plate; 13. Circuit board; 14. Test probe; 15. Probe holder; 16. Carrier; 17. Wafer; 2. Heat dissipation mechanism; 21. Heat dissipation slot; 22. Heat dissipation net; 23. Heat conduction plate; 24. Heat conduction slot; 3. Pick-and-place mechanism; 31. Adjustment assembly; 311. Support spring; 312. Accommodation cavity; 313. Slide; 32. Hook; 33. Hanging bolt. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0020] The structure of a high-efficiency pin card testing device provided by the utility model is as follows Figure 1 and Figure 2 As shown, it includes an upper plate 1, a lower plate 11 is arranged below the upper plate 1, the upper plate 1 is rotatably connected to one side of the lower plate 11, a connecting plate 12 is arranged inside the upper plate 1, a circuit board 13 is installed inside the connecting plate 12, a probe seat 15 is installed on the surface of the circuit board 13, a test probe 14 is installed on the surface of the probe seat 15, a carrier plate 16 is fixed on the surface of the lower plate 11, a wafer 17 is placed inside the carrier plate 16, and the wafer 17 cooperates with the test probe 14.
[0021] Furthermore, if Figure 3 As shown, the surfaces of the upper plate 1 and the lower plate 11 are provided with a heat dissipation mechanism 2, and the interior of the heat dissipation mechanism 2 includes a heat dissipation groove 21, a heat dissipation net 22, a heat conducting plate 23 and a heat conducting groove 24. The surface of the upper plate 1 is inlaid with a heat dissipation net 22, and the surface of the connecting plate 12 is provided with heat dissipation grooves 21 at equal intervals. The interior of the connecting plate 12 is provided with a heat conducting groove 24 for accommodating the circuit board 13, and the interior of the heat conducting groove 24 is fixed with a heat conducting plate 23. The structure of the heat conducting plate 23 is a wavy structure, and the surface of the heat conducting plate 23 is tightly fitted with the surface of the circuit board 13. The heat conducting plate 23, the circuit board 13 and the connecting plate 12 are fixed by screws.
[0022] During use, the circuit board 13 can be ventilated and cooled under the action of the heat dissipation net 22. At the same time, the circuit board 13 can be heat-conducted under the action of the heat conduction plate 23. Since the heat conduction plate 23 has a wavy structure, the heat dissipation area of the heat conduction plate 23 can be increased, and the heat dissipation speed can be accelerated. Under the action of the heat dissipation groove 21, the heat dissipation of the circuit board 13 is further accelerated to realize the efficient heat dissipation function of the pin card test device, so that the circuit board 13 is not easily damaged due to excessive temperature.
[0023] Furthermore, if Figure 4 As shown, the surfaces of the upper plate 1 and the lower plate 11 are provided with a pick-up and placement mechanism 3, which consists of an adjustment component 31, a hook 32 and a hanging bolt 33. The hook 32 is rotatably connected at the center position of one side of the upper plate 1, and the hanging bolt 33 is fixed on one side of the lower plate 11. The hanging bolt 33 and the hook 32 are hooked and cooperated with each other. An adjustment component 31 is provided between the upper plate 1 and the lower plate 11. The interior of the adjustment component 31 includes a supporting spring 311, a receiving cavity 312 and a sliding groove 313. The interior of the upper plate 1 is provided with a receiving cavity 312, and the receiving cavity 312 is located on the outside of the lower plate 11. The inner wall of the receiving cavity 312 is provided with a sliding groove 313. The sliding groove 313 and the lower plate 11 slide with each other. The inner wall of the sliding groove 313 is fixed with a support spring 311, and the support spring 311 and the lower plate 11 slide with each other. When the support spring 311 is in a normal state, the test probe 14 is away from the wafer 17.
[0024] When in use, rotate the hook 32 so that one end of the hook 32 is away from the hanging bolt 33, and then rotate the upper plate 1 to lift the upper plate 1 so that the upper plate 1 drives the connecting plate 12 to rotate synchronously. At this time, the support spring 311 supports the connecting plate 12 to keep the test probe 14 away from the carrier 16, and then place the wafer 17 to be tested inside the carrier 16, and then cover the upper plate 1, and fix the upper plate 1 under the hook cooperation of the hook 32 and the hanging bolt 33. Then the pin card test device can be connected to the test equipment, and the connecting plate 12 is pressed by the driving structure to make the lower plate 11 slide along the slide groove 313, driving the test probe 14 to contact the wafer 17, and testing the wafer 17, so as to realize the function of the pin card test device to quickly take and place the wafer 17.
[0025] Working principle: When in use, first rotate the hook 32 to make one end of the hook 32 away from the hanging bolt 33, and then rotate the upper plate 1 to lift the upper plate 1 so that the upper plate 1 drives the connecting plate 12 to rotate synchronously. At this time, the support spring 311 supports the connecting plate 12 to make the test probe 14 away from the carrier 16, and then place the wafer 17 to be tested inside the carrier 16, and then cover the upper plate 1, and fix the upper plate 1 under the hook cooperation of the hook 32 and the hanging bolt 33. Then the pin card test device can be connected to the test equipment, and the connecting plate 12 is pressed by the driving structure to make the lower plate 11 slide along the slide groove 313, driving the test probe 14 to contact the wafer 17, and testing the wafer 17, so as to realize the function of the pin card test device to quickly take and place the wafer 17, thereby improving the working efficiency of the pin card test device when in use.
[0026] During use, the circuit board 13 can be ventilated and cooled under the action of the heat dissipation net 22. At the same time, the circuit board 13 can be heat-conducted under the action of the heat conduction plate 23. Since the heat conduction plate 23 has a wavy structure, the heat dissipation area of the heat conduction plate 23 can be increased, and the heat dissipation speed can be accelerated. Under the action of the heat dissipation groove 21, the heat dissipation of the circuit board 13 is further accelerated to realize the efficient heat dissipation function of the pin card test device, so that the circuit board 13 is not easily damaged due to excessive temperature, and finally the use of the pin card test device is completed.
[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.
Claims
1. An efficient pin card testing device, comprising an upper plate (1), characterized in that: A lower plate (11) is provided below the upper plate (1), the upper plate (1) is rotatably connected to one side of the lower plate (11), a connecting plate (12) is provided inside the upper plate (1), a circuit board (13) is installed inside the connecting plate (12), a probe seat (15) is installed on the surface of the circuit board (13), a test probe (14) is installed on the surface of the probe seat (15), a carrier (16) is fixed on the surface of the lower plate (11), and a test probe (14) is placed inside the carrier (16). A wafer (17) is provided, and the wafer (17) cooperates with a test probe (14). The surfaces of the upper plate (1) and the lower plate (11) are provided with a heat dissipation mechanism (2). The interior of the heat dissipation mechanism (2) includes a heat dissipation groove (21), a heat dissipation net (22), a heat conduction plate (23) and a heat conduction groove (24). The surfaces of the upper plate (1) and the lower plate (11) are provided with a pick-up and placement mechanism (3), and the pick-up and placement mechanism (3) is composed of an adjustment component (31), a hook (32) and a hanging bolt (33).
2. The high-efficiency pin card testing device according to claim 1, characterized in that: The surface of the upper plate (1) is inlaid with a heat dissipation net (22), and the surface of the connecting plate (12) is provided with heat dissipation grooves (21) at equal intervals.
3. The high-efficiency pin card testing device according to claim 2, characterized in that: A heat conducting groove (24) for accommodating the circuit board (13) is provided inside the connecting plate (12); a heat conducting plate (23) is fixed inside the heat conducting groove (24); the heat conducting plate (23) has a wave-shaped structure; the surface of the heat conducting plate (23) is tightly fitted to the surface of the circuit board (13); the heat conducting plate (23), the circuit board (13) and the connecting plate (12) are fixed by screws.
4. The high-efficiency pin card testing device according to claim 1, characterized in that: A hook (32) is rotatably connected at the center position of one side of the upper plate (1), a hanging bolt (33) is fixed to one side of the lower plate (11), the hanging bolt (33) and the hook (32) are hooked and matched with each other, and an adjustment component (31) is provided between the upper plate (1) and the lower plate (11).
5. The high-efficiency pin card testing device according to claim 4, characterized in that: The interior of the adjustment component (31) includes a support spring (311), a receiving cavity (312) and a slide groove (313); the interior of the upper plate (1) is provided with a receiving cavity (312); the receiving cavity (312) is located outside the lower plate (11); the inner wall of the receiving cavity (312) is provided with a slide groove (313); the slide groove (313) and the lower plate (11) are slidably matched with each other.
6. The high-efficiency pin card testing device according to claim 5, characterized in that: A support spring (311) is fixed to the inner wall of the slide groove (313), and the support spring (311) and the lower plate (11) are slidably matched with each other. When the support spring (311) is in a normal state, the test probe (14) is away from the wafer (17).