Testing device

Abstract

The utility model relates to a testing device which comprises an adapter plate body, a slot, a fixing assembly and a plurality of through holes. The slot is arranged on the adapter plate body, is horizontally arranged on one side of the adapter plate body and is used for placing a chip; the through holes are respectively positioned on the adapter plate body; the adapter plate body is provided with at least two hollowed-out grooves, and the fixing assemblies are movably arranged in the hollowed-out grooves. Wherein the fixing assembly comprises a ring body and a fixing part; the ring body is located in the hollowed-out groove and can move along the hollowed-out groove. The fixing part is arranged on the ring body and is used for fixing the chip; the ring body is provided with at least one fixing column. According to the utility model, the adapter plate is provided with the fixing assembly and the through hole; and the fixing columns are inserted into the through holes, and then the fixing parts are pulled outwards, so that the fixing parts can clamp the chip, and the chip is fixed. The chip is fixed or taken out in a mode of pulling the fixing part, the operation mode is simple, the consumed time is short, the working efficiency can be greatly improved, and the chip testing device can be applied to chips of various lengths and is suitable for testing chips in large-scale mass production.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more particularly to a testing device. Background Art

[0002] During a chip burn-in test, the chip is inserted into an adapter board, which is then inserted into the test chamber. External force is required to secure the chip in place to prevent unstable insertion of the chip's gold fingers into the adapter board slot, which could cause test failure.

[0003] Existing adapter plates primarily secure chips with screws. While this method works, it requires screw removal before and after testing. This complicated and time-consuming process can reduce test efficiency and is unsuitable for large-scale chip testing. Utility Model Content

[0004] The technical problem to be solved by the present invention is that the chip fixing method of the existing adapter plate is complicated to operate, time-consuming and has low testing efficiency. In view of the above-mentioned defects of the existing technology, a testing device is provided.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A testing device is constructed, comprising: an adapter plate, a slot, a fixing assembly and a plurality of through holes; the slot is provided on the adapter plate, the slot is horizontally arranged on one side of the adapter plate, and is used to place a chip; the through holes are respectively located on the adapter plate; the adapter plate is provided with at least two hollow grooves, and the fixing assembly is movably arranged in the hollow grooves; wherein, the fixing assembly comprises a ring body and a fixing part; the ring body is located in the hollow groove and can move along the hollow groove; the fixing part is provided on the ring body and is used to fix the chip; the ring body is provided with at least one fixing column, and the fixing column is used to pass through the corresponding through hole to fix the ring body.

[0007] Furthermore, the fixing portion includes: a body and an elastic member; the body is fixed on the ring body, and the elastic member is sleeved on the outside of the body.

[0008] Furthermore, the ring body includes: an upper ring body and a lower ring body, and the main body is located on the upper ring body; the main body includes a first fixing part and a second fixing part, the first fixing part is located above the upper ring body, and the second fixing part is located below the upper ring body; wherein, the upper ring body is provided with a through hole, the first fixing part passes through the through hole, and is movably connected with the second fixing part; the elastic piece is sleeved on the outside of the first fixing part and is located above the upper ring body.

[0009] Furthermore, the elastic member is provided with a gap; when the fixing portion fixes the chip, the fixing column is located in the through hole; the chip is engaged in the gap; the lower surface of the upper ring body contacts the first surface of the adapter plate body, and the upper surface of the lower ring body contacts the second surface of the adapter plate body.

[0010] Furthermore, when the fixing portion is released, the first fixing portion and the elastic member tilt toward a side relative to the slot; the chip disengages from the gap; the fixing column disengages from the through hole; and the lower surface of the upper ring body moves away from the first surface of the adapter plate.

[0011] Furthermore, a groove is provided on the bottom surface of the first fixing portion, and the elastic member is located in the groove and abuts against the inner wall of the groove.

[0012] Furthermore, a movable column is provided at the bottom of the first fixing portion, and a placement groove corresponding to the movable column is provided at the second fixing portion, and the movable column is movably arranged in the placement groove.

[0013] Furthermore, the through hole is located between the hollow grooves or outside the hollow grooves.

[0014] The beneficial effects of the present invention are as follows: by arranging a fixing component and a through hole on the adapter plate; after moving the ring body according to the length of the chip, inserting the fixing column into the corresponding through hole, so that the ring body is fixed on the adapter plate, and then inserting the chip into the slot, and then bending the fixing part in the direction relative to the slot so that the fixing part clamps the end of the chip, thereby fixing the chip. After the test is completed, the chip can be easily taken out by bending the fixing part again. The chip can be fixed by moving the ring body to the end position of the chip, fixing the ring body on the adapter plate, and then bending the fixing part. Compared with the previous screw disassembly and fixation, the present application can easily fix or remove the chip by bending the fixing part. The operation method is simple, takes less time, can greatly improve work efficiency, and can be applied to chips of various lengths, suitable for large-scale mass production chip testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0016] Figure 1 This is an overall structural diagram of a testing device in one embodiment of the present utility model;

[0017] Figure 2 This is a three-dimensional schematic diagram of a fixing portion fixing a chip in one embodiment of the present invention;

[0018] Figure 3 This is a three-dimensional schematic diagram of an embodiment of the present invention when the fixing portion is released;

[0019] Figure 4 This utility model Figure 3 A partial enlarged schematic diagram of point I in the middle;

[0020] Figure 5 This is a schematic right side view of a testing device in one embodiment of the present utility model;

[0021] Figure 6 This utility model Figure 5 A partial enlarged schematic diagram of the middle Q;

[0022] Figure 7 This is a three-dimensional schematic diagram of the second fixing portion in one embodiment of the present utility model;

[0023] Figure 8 This is a three-dimensional schematic diagram of the first fixing portion in one embodiment of the present utility model;

[0024] Figure 9 This is a three-dimensional schematic diagram of a testing device in another embodiment of the present invention;

[0025] Figure 10 It is a three-dimensional schematic diagram of another embodiment of the present invention in which the chip is in a fixed state.

[0026] Explanation of the reference numbers: adapter plate 1, slot 2, gold finger 3, fixing component 4, through hole 5, chip 6, hollow groove 101, ring body 401, fixing part 402, fixing column 403, main body 404, elastic member 405, upper ring body 406, lower ring body 407, first fixing part 408, second fixing part 409, first surface 102, second surface 103, groove 410, extension part 411, through hole 412, placement groove 413, movable column 414, arc groove 601. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will be described clearly and completely in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The terms "first," "second," "third," "fourth," and so forth (if any) in the specification and claims of this application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0029] This application is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of this application, cross-sectional views of device structures may be partially enlarged and not to scale. Furthermore, these schematic diagrams are merely illustrative and should not limit the scope of this application. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0030] During burn-in testing, the chip is inserted into an adapter plate, which is then inserted into the test chamber. Currently, the adapter plate primarily secures the chip using screws. While this method can secure and remove the chip, it is complex and time-consuming, which can reduce test efficiency and make it difficult to adapt to the testing needs of large-scale mass production.

[0031] Please refer to Figure 1 In one embodiment of the present application, a test device is proposed, including an adapter plate 1, a slot 2, a fixing component 4 and a plurality of through holes 5; the slot 2 is provided on the adapter plate 1, the slot 2 is horizontally provided on one side of the adapter plate 1, and is used to place the chip 6; the through holes 5 are respectively located on the adapter plate 1; the adapter plate 1 is provided with at least two hollow grooves 101, and the fixing component 4 is movably provided in the hollow groove 101; wherein, the fixing component 4 includes a ring body 401 and a fixing portion 402; the ring body 401 is located in the hollow groove 101 and can move along the hollow groove 101; the fixing portion 402 is provided on the ring body 401 and is used to fix the chip 6; the ring body 401 is provided with at least one fixing column 403, and the fixing column 403 is used to pass through the corresponding through hole 5 to fix the ring body 401. Figure 2As shown, when the fixing part 402 fixes the chip 6, the ring body 401 is located at the end of the chip 6, the fixing column 403 is located in the through hole 5, and the fixing part 402 is engaged with the chip 6. By arranging the fixing component 4 and the through hole 5 on the adapter plate 1; after the ring body 401 can be moved according to the length of the chip 6, the fixing column 403 is inserted into the corresponding through hole 5, so that the ring body 401 is fixed on the adapter plate 1, and then the chip 6 is inserted into the slot 2, and then the fixing part 402 is bent in the direction relative to the slot 2 so that the fixing part 402 clamps the end of the chip 6, thereby fixing the chip 6. After the test is completed, the chip 6 can be easily removed by bending the fixing part 402 again. By moving the ring body 401 to the end position of the chip 6, fixing the ring body 401 on the adapter plate, and then bending the fixing part 402, the chip 6 can be fixed. Compared with the previous screw assembly and disassembly fixation, the present application can easily fix or remove the chip 6 by prying the fixing part 402. The operation is simple, time-saving, and can greatly improve work efficiency. It can also be applied to chips 6 of various lengths and is suitable for large-scale mass production chip 6 testing.

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0033] In one embodiment, it includes an adapter plate body 1, a slot 2, a fixing component 4 and several through holes 5; the slot 2 is provided on the adapter plate body 1, the slot 2 is horizontally provided on one side of the adapter plate body 1, and is used to place the chip 6; the through holes 5 are respectively located on the adapter plate body 1; the adapter plate body 1 is provided with at least two hollow grooves 101, and the fixing component 4 is movably provided in the hollow groove 101; wherein, the fixing component 4 includes a ring body 401 and a fixing portion 402; the ring body 401 is located in the hollow groove 101 and can move along the hollow groove 101; the fixing portion 402 is provided on the ring body 401 and is used to fix the chip 6; the ring body 401 is provided with at least one fixing column 403, and the fixing column 403 is used to pass through the corresponding through hole 5 to fix the ring body 401.

[0034] Specifically, such as Figure 1 As shown, the adapter board 1 is provided with a gold finger 3 and a slot 2, and the chip 6 is inserted into the slot 2 for aging test. Figure 2As shown, the ring body 401 is annular, which can be a square ring or an arc ring, and is arranged in a surrounding manner in the hollow groove 101, and can move along the hollow groove 101. In a specific embodiment, the ring body 401 is a spring steel sheet, and has good elasticity and windability, and can be deformed repeatedly. The adapter plate body 1 is provided with a hollow groove 101, and the hollow groove 101 is located on both sides of the chip 6, and the setting direction is the same as the chip 6. The ring body 401 is movably arranged in the hollow groove 101, and the length of the hollow groove 101 is greater than the length of each type of chip 6. In addition, a plurality of through holes 5 are provided on the adapter plate body 1, and the through holes 5 are arranged along the direction of the hollow groove 101, and can be located on both sides of the chip 6, or in the middle position below the chip 6. In a specific embodiment, the through holes 5 are provided in a row and are located in the middle position on the adapter plate body 1. In another specific embodiment, the through holes 5 are provided in two rows, and are respectively located on both sides of the chip 6. As Figure 3 As shown, the ring body 401 is provided with a fixing post 403 corresponding to the through hole 5. The fixing post 403 can be inserted into or removed from the through hole 5. The combination of the fixing post 403 and the through hole 5 can accommodate chips 6 of different lengths, thereby improving applicability and reducing production costs. The fixing portion 402 is provided on the ring body 401 and moves with the movement of the ring body 401.

[0035] Specifically, when the adapter plate 1 has two rows of through holes 5, the ring body 401 has two fixing posts 403. After the ring body 401 is moved to the end of the chip 6, the fixing posts 403 are inserted into the through holes 5, and then the fixing portion 402 on the ring body 401 is moved to secure the chip 6. When the adapter plate 1 has one row of through holes 5 located in the middle, the ring body 401 has one fixing post 403. After the ring body 401 is moved, the fixing post 403 is inserted into the through hole 5, and then the fixing portion 402 is moved to secure the chip 6.

[0036] More specifically, Figure 6As shown, when the chip 6 needs to undergo an aging test, the fixing assembly 4 is moved to the loading and unloading area, wherein the loading and unloading area is located in the hollow groove 101 away from the slot 2; then the ring body 401 is moved according to the length of the chip 6, and the fixing column 403 provided on the ring body 401 is inserted into the through hole 5 located at the end of the chip 6. At this time, the fixing column 403 is fixed in the through hole 5 corresponding to the adapter plate body 1, thereby fixing the ring body 401 on the adapter plate body 1, and then the chip 6 is inserted into the slot 2 provided on the adapter plate body 1, and then the fixing part 402 is bent so that the fixing part 402 limits the end of the chip 6. At this time, the fixing part 402 fixes the chip 6. After the chip 6 test is completed, the chip 6 can be taken out by bending the fixing part 402. The operation method of bending the fixing part 402 is relatively simple and can greatly improve the test efficiency.

[0037] Further, such as Figure 4 As shown, an arc-shaped groove 601 may be provided at the end of the chip 6 , and the arc-shaped groove 601 corresponds to the fixing portion 402 . The fixing portion 402 may be located in the arc-shaped groove 601 and clamp the chip 6 .

[0038] In one embodiment, the fixing portion 402 includes a body 404 and an elastic member 405 . The body 404 is fixed on the ring body 401 , and the elastic member 405 is sleeved on the outside of the body 404 .

[0039] Specifically, such as Figure 4 As shown, the elastic member 405 is a spring and is elastic and can produce elastic deformation. The elastic member 405 is sleeved on the outside of the body 404. After the body 404 is pried, the body 404 will tilt. At this time, the side of the elastic member 405 away from the chip 6 will be squeezed and accumulate elastic potential energy, while the side close to the chip 6 will open. When the chip 6 is inserted, the force applied to the elastic member 405 is released. At this time, the elastic member 405 will release the elastic potential energy and clamp the chip 6 to fix the end of the chip 6. When the chip 6 needs to be removed, the chip 6 can be easily removed by slightly prying the fixing part 402, thereby improving the operation efficiency.

[0040] Furthermore, the elastic member 405 can be adjusted and replaced according to the chip 6 of different thicknesses and sizes, so that the chip 6 can fit the slot 2 more firmly, avoiding looseness due to the chip 6 being too thin or failure to limit due to being too thick.

[0041] More specifically, the number of the fixing portions 402 can be set according to the size of the chip 6 , and can be single or multiple, so as to clamp and fix the chip 6 with a larger width.

[0042] In one embodiment, the ring body 401 includes: an upper ring body 406 and a lower ring body 407, and the main body 404 is located on the upper ring body 406; the main body 404 includes a first fixing portion 408 and a second fixing portion 409, the first fixing portion 408 is located above the upper ring body 406, and the second fixing portion 409 is located below the upper ring body 406; wherein, the upper ring body 406 is provided with a through hole 412, the first fixing portion 408 passes through the through hole 412, and is movably connected with the second fixing portion 409; the elastic member 405 is sleeved on the outside of the first fixing portion 408 and is located above the upper ring body 406.

[0043] Specifically, such as Figure 3 and Figure 4 As shown, the main body 404 is located on the upper ring body 406, the first fixing part 408 is located above the upper ring body 406, and the second fixing part 409 is located below the upper ring body 406. The first fixing part 408 and the second fixing part 409 are integrally formed or detachably connected. In a specific embodiment, the first fixing part 408 and the second fixing part 409 are detachably connected, and can be replaced by disassembling the first fixing part 408 or the second fixing part 409. In a specific embodiment, the end of the first fixing part 408 is provided with a thread, and the second fixing part 409 is provided with a placement groove 413. The first fixing part 408 is installed in the placement groove 413 and can be tilted. The elastic member 405 is located between the upper ring body 406 and the first fixing part 408 to engage the chip 6.

[0044] Specifically, if Figure 2 and Figure 4 As shown, the diameters of the first fixing portion 408 and the second fixing portion 409 are larger than the diameter of the through hole 412, so that the fixing portion 402 will not fall due to the movement of the ring body 401. During installation, the second fixing portion 409 is placed under the upper ring body 406 and facing the first fixing portion 408. Then, the first fixing portion 408 is passed through the through hole 412 and installed in conjunction with the second fixing portion 409. The installation method can be a snap-fit ​​installation; Figure 7 As shown, the first fixing portion 408 is engaged with the placement groove 413 provided in the second fixing portion 409 , so that the first fixing portion 408 can move in the placement groove 413 .

[0045] Further, such as Figure 7 As shown, the outer side of the second fixing portion 409 is provided with anti-slip grooves to facilitate the installation with the first fixing portion 408.

[0046] In one embodiment, the elastic member 405 is provided with a gap; when the fixing portion 402 fixes the chip 6, the fixing column 403 is located in the through hole 5; the chip 6 is engaged in the gap; the lower surface of the upper ring body 406 contacts the first surface 102 of the adapter plate body 1, and the upper surface of the lower ring body 407 contacts the second surface 103 of the adapter plate body 1.

[0047] Specifically, if Figure 6 As shown, when the fixing portion 402 fixes the chip 6, the fixing posts 403 on the ring body 401 are respectively installed in the through holes 5 on the adapter plate 1. The lower surface of the upper ring body 406 will contact the first surface 102 of the adapter plate 1 and the top surface of the second fixing portion 409, wherein the first surface 102 is the top surface of the adapter plate 1. The upper surface of the lower ring body 407 will contact the second surface 103 of the adapter plate 1, wherein the second surface 103 is the bottom surface of the adapter plate 1. Then, force is applied to the first fixing portion 408 to bend the first fixing portion 408, so that the first fixing portion 408 and the elastic member 405 tilt away from the chip 6, and the gap set by the elastic member 405 will become larger. Then, the force applied to the elastic member is released, and the gap of the elastic member 405 will gradually decrease until it engages with the chip 6. At this time, the end of the chip 6 will just engage in the gap.

[0048] In one embodiment, when the fixing portion 402 is released, the first fixing portion 408 and the elastic member 405 tilt toward a side relative to the slot 2; the chip 6 disengages from the gap; the fixing column 403 disengages from the through hole 5; and the lower surface of the upper ring body 406 moves away from the first surface 102 of the adapter plate 1.

[0049] like Figure 4 As shown, specifically, when the chip 6 needs to be taken out, the first fixing part 408 is bent again. At this time, the first fixing part 408 and the elastic member 405 are tilted to the side relative to the slot 2. The first fixing part 408 and the elastic member 405 will move away from the chip 6, so that the gap of the elastic member 405 becomes larger. At this time, the fixing part 402 releases the fixation of the chip 6, and the chip 6 can be taken out from the adapter board 1.

[0050] More specifically, the gap of the elastic member 405 can be set according to the thickness of the chip 6 so as to be suitable for chips 6 of different thicknesses, thereby better engaging the chip 6 .

[0051] In one embodiment, a groove 410 is defined on the bottom surface of the first fixing portion 408 . The elastic member 405 is located in the groove 410 and abuts against the inner wall of the groove 410 .

[0052] like Figure 8 Specifically, a groove 410 is provided on the bottom surface of the first fixing portion 408, and the elastic member 405 can be located in the groove 410 and contact the inner wall of the groove 410. In a specific embodiment, after the first fixing portion 408 is pried, the elastic member 405 will be deformed in the groove 410. The groove 410 can limit the elastic member 405, so that the elastic member 405 is better fixed between the first fixing portion 408 and the upper ring body 406 to prevent it from popping out or slipping.

[0053] In one embodiment, a movable post 414 is provided at the bottom of the first fixing portion 408 , and a placement slot 413 corresponding to the movable post 414 is provided at the second fixing portion 409 . The movable post 414 is movably disposed in the placement slot 413 .

[0054] Specifically, if Figure 7 and Figure 8 As shown, the cross-sectional area of ​​the movable column 414 is larger than the area of ​​the slot of the placement slot 413; the movable column 414 can be engaged in the placement slot 413 by pressing, and a reserved space is provided in the placement slot 413 so that the movable column 414 has enough space to move after being installed in the placement slot 413.

[0055] In one embodiment, the through hole 5 is located between the hollow grooves 101 or outside the hollow grooves 101 .

[0056] Specifically, if Figure 1 As shown, the through hole 5 is located between the hollow grooves 101; Figure 9 As shown, the through holes 5 are respectively located outside the hollow groove 101. At this time, the upper ring body 406 can be provided with an extension portion 411, and the fixing column 403 is provided on the extension portion and corresponds to the through hole 5. Figure 10 As shown, similarly, between tests, the ring body 401 is moved to the end area of ​​the chip 6, and the fixing column 403 provided on the extension part 411 is installed in the through hole 5 provided on the outside of the hollow groove 101 to fix the ring body 401; then the first fixing part 408 is bent to engage the chip.

[0057] In one embodiment, the length of the hollow groove 101 is greater than the length of the chip 6 , and the length of the through hole 5 is greater than the length of the chip 6 .

[0058] like Figure 1 As shown, specifically, the length of the hollow groove 101 is greater than the length of the chip 6, so that the chip 6 can be installed on the slot 2 of the adapter plate 1. More specifically, the ring body 401 is moved to the side of the hollow groove 101 away from the slot 2, so that the chip 6 has enough length space to be inserted into the slot 2. The through hole 5 is arranged along the direction of the hollow groove 101, and the length is set to be greater than the length of the chip 6, so that after the fixing column 403 provided on the ring body 401 is installed in the through hole 5, the fixing part 402 provided on the ring body 401 can be engaged with the end of the chip 6.

[0059] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the method embodiments are described briefly because they are generally similar to the structural embodiments. For relevant parts, refer to the description of the structural embodiments.

[0060] The above is a specific implementation of the present application. It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A testing device, characterized in that: It includes: an adapter plate, a slot, a fixing component and a plurality of through holes; The slot is provided on the adapter plate, the slot is horizontally provided on one side of the adapter plate, and is used to place the chip; the through holes are respectively located on the adapter plate; The adapter plate is provided with at least two hollow grooves, and the fixing assembly is movably arranged in the hollow grooves; The fixing assembly includes a ring body and a fixing portion; the ring body is located in the hollow groove and can move along the hollow groove; the fixing portion is provided on the ring body and is used to fix the chip; The ring body is provided with at least one fixing post, and the fixing post is used to pass through the corresponding through hole to fix the ring body.

2. The testing device according to claim 1, wherein: The fixing part includes: a body and an elastic member; the body is fixed on the ring body, and the elastic member is sleeved on the outside of the body.

3. The testing device according to claim 2, characterized in that The ring body comprises: an upper ring body and a lower ring body, and the main body is located on the upper ring body; The body includes a first fixing portion and a second fixing portion, the first fixing portion is located above the upper ring body, and the second fixing portion is located below the upper ring body; The upper ring body is provided with a through hole, the first fixing portion passes through the through hole and is movably connected to the second fixing portion; The elastic member is sleeved on the outside of the first fixing portion and is located above the upper ring body.

4. The testing device according to claim 3, characterized in that: The elastic member is provided with a gap; When the fixing portion fixes the chip, the fixing post is located in the through hole; The chip is engaged in the gap; The lower surface of the upper ring body contacts the first surface of the adapter plate body, and the upper surface of the lower ring body contacts the second surface of the adapter plate body.

5. The testing device according to claim 4, characterized in that: When the fixing portion is released, the first fixing portion and the elastic member are tilted toward a side relative to the slot; The chip is released from the gap.

6. The testing device according to claim 3, characterized in that: A groove is provided on the bottom surface of the first fixing portion, and the elastic member is located in the groove and abuts against the inner wall of the groove.

7. The testing device according to claim 3, characterized in that: A movable column is provided at the bottom of the first fixing portion, and a placement groove corresponding to the movable column is provided at the second fixing portion, and the movable column is movably arranged in the placement groove.

8. The testing device according to claim 1, wherein: The through hole is located between the hollow grooves or outside the hollow grooves.

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